DE10121136B4 - LED module - Google Patents

LED module Download PDF

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Publication number
DE10121136B4
DE10121136B4 DE10121136A DE10121136A DE10121136B4 DE 10121136 B4 DE10121136 B4 DE 10121136B4 DE 10121136 A DE10121136 A DE 10121136A DE 10121136 A DE10121136 A DE 10121136A DE 10121136 B4 DE10121136 B4 DE 10121136B4
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Prior art keywords
led module
led chips
circuit board
led
micro
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Expired - Fee Related
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DE10121136A
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German (de)
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DE10121136A1 (en
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Wilhelm Jorzik
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V21/00—Supporting, suspending, or attaching arrangements for lighting devices; Hand grips
    • F21V21/02—Wall, ceiling, or floor bases; Fixing pendants or arms to the bases
    • F21V21/03—Ceiling bases, e.g. ceiling roses
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0756—Stacked arrangements of devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

LED-Modul für verschiedenste Beleuchtungserfordernisse, dadurchge kennzeichnet, dass das LED-Modul aus einer Leiterplatte (1) mit mindestens einem oder mehreren Micro-LED-Chips (2) besteht, welche so platziert sind, dass sie vorwiegend um 90° versetzt gegenüber der leiterbahnführenden Fläche, auf der Kante der Leiterplatte angeordnet sind, wobei eine hermetisch abgeschlossene Lage der Micro-LED-Chips (2) durch Versiegelung (3) einen besonderen Kantenschutz darstellt, und die Distanzsicherung der Micro-LED-Chips (2) untereinander dadurch gewährleistet ist.LED module for a wide variety of lighting requirements, characterized in that the LED module consists of a printed circuit board (1) with at least one or more micro LED chips (2), which are placed so that they are predominantly offset by 90 ° relative to the surface guiding the conductor track, are arranged on the edge of the circuit board, a hermetically sealed position of the micro LED chips (2) through sealing (3) providing special edge protection, and thereby ensuring the distance securing of the micro LED chips (2) from one another is.

Figure 00000001
Figure 00000001

Description

Gegenstand der Erfindung ist ein lichtemittierendes Beleuchtungsmodul (LED-Modul), The invention relates to a light-emitting lighting module (LED module),

LED-Module herkömmlicher Art wie zum Beispiel Segmentmodule weisen nach der DE 3320953 C2 zum elektrischen Kontaktieren Drahtfüßchen auf, welche verlötet oder in eigens konstruierten Fassungen platziert werden.LED modules of a conventional type, such as segment modules, have the DE 3320953 C2 for electrical contact wire feet, which are soldered or placed in specially designed sockets.

Diese Art der Justierung stellt eine kostenungünstige Lösung dar. Vom Handling her unpraktikabel durch hohen Filigranaufwand. This type of adjustment represents one cost unfavorable solution In terms of handling impractical due to high filigree work.

Hier will die Erfindung Abhilfe schaffen, nämlich ein LED-Modul ohne Drahtfüßchen, mit allseitigen elektrischen Kontaktmöglichkeiten, gut zu fixieren, in einer eigens bestimmten Verwahrung. Diese kann geklipst, oder nach Wahl des Fachmanns ausgeführt werden.The invention seeks to remedy this, namely an LED module without wire feet, with electrical contact options on all sides, easy to fix, in a special custody. This can be clipped, or carried out at the choice of a specialist become.

Es ist daher die Aufgabe der Erfindung ein OPTO-elektronisches Bauelement-System anzugeben. D. h. ein LED-Modul, für verschiedenste Beleuchtungserfordernisse, das kostengünstig, automatisierbar und materialsparend hergestellt werden kann, wobei eine sehr einfache Kontaktierung des LED-Moduls möglich sein soll. Weiterhin stellt das Handling-System, flächenbedingt durch die Ebenförmigkeit des Moduls, einen Montagevorsprung dar.It is therefore the object of the invention to specify an OPTO electronic component system. I.e. an LED module, for various Lighting requirements that are inexpensive, automatable and can be produced in a material-saving manner, being a very simple one Contacting of the LED module possible should be. Furthermore, the handling system, due to the flatness of the surface of the module, an assembly lead.

Diese Aufgabe wird bei einem LED-Modulsystem gemäß dem Oberbegriff des Anspruches 1 durch die kennzeichnenden Merkmale des Anspruches 1 gelöst.This task is done with an LED module system according to the generic term of claim 1 by the characterizing features of the claim 1 solved.

Wobei die in 1 und 2 schematisch dargestellten, oberflächenmontierbaren Micro-LED-Chips (2) vorwiegend um 90° versetzt gegenüber der leiterbahnführenden Fläche, auf der Kante der Leiterplatte (1) angeordnet sind.Where the in 1 and 2 schematically shown, surface-mountable micro-LED chips ( 2 ) predominantly offset by 90 ° from the surface guiding the conductor track, on the edge of the circuit board ( 1 ) are arranged.

Als Trägermaterial dienen Leiterplatten vorwiegend aus Epoxydmaterial.Printed circuit boards serve as carrier material mainly made of epoxy material.

Die Geometrie der Leiterplatte kann verschiedenartig ausgebildet sein.The geometry of the circuit board can be designed differently.

Die durch die Erfindung ermöglichten Vorteile sind, dass durch die Miniatur-Ausführung (1 mm) engste Beleuchtungsnischen erreicht werden. Der Abstrahlwinkel kann durch die Kantenpositionierung voll ausgeschöpft und die Wärmeabführung erheblich verbessert werden. Es ist gelungen, durch manuelle Schichtung der LED-Module eine Annährung ähnlich der Kettenbodentechnik zu erreichen, d. h. dass der Lichtstrom optimal bestimmbar wird.Those made possible by the invention The advantages are that the miniature version (1 mm) narrowest lighting niches can be achieved. The beam angle can be fully exploited by the edge positioning and the heat dissipation significantly be improved. It has been managed by manual stratification of the LED modules approximate similar to that To achieve chain floor technology, d. H. that the luminous flux is optimal can be determined.

Die hermetisch abgeschlossene Versiegelung der LED's bietet dazu einen unverzichtbaren Kantenschutz. Das vorab beschriebene Beleuchtungssystem bietet vollkommen neue Produktfelder durch bestes Handling-System, flächenbedingt durch seine Ebenförmigkeit.The hermetically sealed seal the LED's also offer indispensable edge protection. That in advance The lighting system described offers completely new product fields best handling system, due to space through its flatness.

Elektronische Ansteuerschaltungen werden bei sogenannten Intellegenten LED-Anzeigevorrichtungen eingesetzt, dieselben versorgen die LED-Chips derart mit Strom bzw. mit Stromimpulsen, dass sie nach einem vorgegebenen Muster aufleuchten.Electronic control circuits are used in so-called intellectuals LED display devices, they supply the LED chips with current or current pulses in such a way that they light up according to a given pattern.

Zur Vereinfachung der Darstellung wurde auf die Abbildung des Vorwiderstandes oder einer elektronischen Steuerung, sowie auf die ver schiedenen Möglichkeiten der Kontaktierungen der LED's auf der Kante der Leiterplatte verzichtet.To simplify the presentation was based on the illustration of the series resistor or an electronic Control, as well as on the various possibilities of contacting of the LEDs on the edge of the circuit board.

Sie sind durch den Fachmann jedoch in vielfältiger Weise ausführbar und können in geeigneter Weise miteinander verbunden werden. Hierdurch bieten sich konstruktiv für verschiedenste Applikationen größte Anwendungsfelder, genannt sei der Kfz-Sektor sowie diverse Automaten- und Displaybestückungen und Gebäude-/Flugtechnik sowie OPTO-Elektronik. However, they are by the specialist in many different ways Way executable and can be connected in a suitable manner. By doing so offer constructive for various applications, largest fields of application, the automotive sector and various vending machines and displays are worth mentioning and building / flight technology and OPTO electronics.

Vorzugsweise wird die Beleuchtungsvorrichtung mit Schwachstrom betrieben, insbesondere mit 12 V, wie sie im Bordnetz von Kraftfahrzeugen über die wiederaufladbare Batterie zur Verfügung steht. Beleuchtungsanlagen mittels Akkubetrieb sind denkbar. Dazu wäre zu nennen, Beleuchtungsanlagen über das normale Stromnetz (220V) zu betreiben, jedoch mit Vorschaltung entsprechender Z-Dioden.The lighting device is preferably operated with low current, in particular with 12 V, as is available in the vehicle electrical system via the rechargeable battery. Lighting systems using battery operation are conceivable. This would include lighting systems using the normal electricity network ( 220V ) to operate, but with appropriate Z-diodes upstream.

Weitere Einzelheiten, Merkmale sowie Vorteile der Erfindung sind dem nachfolgenden Beschreibungsteil unter Bezugnahme auf die Zeichnungen zu entnehmen.More details, features as well Advantages of the invention are the following description part with reference to the drawings.

Es zeigten: 1 Lichtemittierendes Beleuchtungsmodul Draufsicht, isometrischIt showed: 1 Light emitting lighting module top view, isometric

2 SMD-LED-Chip Vergröß.-Maßstab 2 SMD LED chip Enlarged scale

Bei dem in 1 dargestellten Beispiel der Erfindung handelt es sich um ein LED-Modul, bestehend aus einer Leiterplatte (1) und den oberflächenmontierbaren LED-Chips (2) in SMD-Technik verarbeitbar, jedoch so platziert, dass sie vorwiegend um 90° versetzt gegenüber der leiterbahnführenden Fläche auf der Kante der Leiterplatte positioniert werden.At the in 1 The example of the invention shown is an LED module consisting of a printed circuit board ( 1 ) and the surface-mountable LED chips ( 2 ) Can be processed in SMD technology, but placed in such a way that they are positioned on the edge of the circuit board, mainly offset by 90 ° to the surface that guides the conductor track.

Die wasserdichte und optisch reine Versiegelung (3) bietet einen gesicherten Kantenschutz. Leiterbahnen (4) meist in serieller Schaltung, dienen den Verbindungen der LED-Chips untereinander. Nach 2 wird die Abschrägung zum Kenntlichmachen der Kathodenseite dargestellt.The waterproof and optically pure seal ( 3 ) offers secure edge protection. Conductor tracks ( 4 ) mostly in serial connection, serve to connect the LED chips to each other. To 2 the chamfer to identify the cathode side is shown.

Die Kontaktierungsverbindung (7) stellt den Anodenanschluss dar, (6) den Kathodenanschluss. Die elektrischen Anschlusspunkte (8) ± sind freiwählbar.The contact connection ( 7 ) represents the anode connection, ( 6 ) the cathode connection. The electrical connection points ( 8th ) ± are freely selectable.

Claims (1)

LED-Modul für verschiedenste Beleuchtungserfordernisse, dadurch ge kennzeichnet, dass das LED-Modul aus einer Leiterplatte (1) mit mindestens einem oder mehreren Micro-LED-Chips (2) besteht, welche so platziert sind, dass sie vorwiegend um 90° versetzt gegenüber der leiterbahnführenden Fläche, auf der Kante der Leiterplatte angeordnet sind, wobei eine hermetisch abgeschlossene Lage der Micro-LED-Chips (2) durch Versiegelung (3) einen besonderen Kantenschutz darstellt, und die Distanzsicherung der Micro-LED-Chips (2) untereinander dadurch gewährleistet ist.LED module for different lighting requirements, characterized in that the LED module of a printed circuit board ( 1 ) with at least one or more micro LED chips ( 2 ), which are placed in such a way that they are predominantly offset by 90 ° from the surface guiding the conductor track, on the edge of the circuit board, with a hermetically sealed layer of the micro-LED chips ( 2 ) by sealing ( 3 ) represents a special edge protection, and the distance protection of the micro-LED chips ( 2 ) is guaranteed with each other.
DE10121136A 2001-04-30 2001-04-30 LED module Expired - Fee Related DE10121136B4 (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE202006005045U1 (en) 2006-03-24 2007-08-09 Würth Elektronik Rot am See GmbH & Co. KG Printed circuit board module, has connecting device provided at printed circuit board for direct mechanical or electrical connection with another printed circuit board module comprising similar connecting device

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3320953C2 (en) * 1983-06-10 1989-10-12 Telefunken Electronic Gmbh, 7100 Heilbronn, De
US5226723A (en) * 1992-05-11 1993-07-13 Chen Der Jong Light emitting diode display
DE69202254T2 (en) * 1991-01-18 1995-09-07 Nippon Sheet Glass Co Ltd Brake light mounted on the rear window of a vehicle.
US5539623A (en) * 1994-10-12 1996-07-23 General Signal Corporation Lighting device used in an exit sign
US5564819A (en) * 1994-04-04 1996-10-15 Rohm Co., Ltd. LED lamp and arrangement for mounting LED lamps on a substrate
DE19851265A1 (en) * 1998-11-06 2000-05-18 Harting Elektrooptische Bauteile Gmbh & Co Kg Integrated optical module has micro-structured alignment piece on circuit board for positioning optical element
DE69423176T2 (en) * 1993-09-17 2000-11-09 Agilent Technologies Inc Module containing several light emitting diodes

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3320953C2 (en) * 1983-06-10 1989-10-12 Telefunken Electronic Gmbh, 7100 Heilbronn, De
DE69202254T2 (en) * 1991-01-18 1995-09-07 Nippon Sheet Glass Co Ltd Brake light mounted on the rear window of a vehicle.
US5226723A (en) * 1992-05-11 1993-07-13 Chen Der Jong Light emitting diode display
DE69423176T2 (en) * 1993-09-17 2000-11-09 Agilent Technologies Inc Module containing several light emitting diodes
US5564819A (en) * 1994-04-04 1996-10-15 Rohm Co., Ltd. LED lamp and arrangement for mounting LED lamps on a substrate
US5539623A (en) * 1994-10-12 1996-07-23 General Signal Corporation Lighting device used in an exit sign
DE19851265A1 (en) * 1998-11-06 2000-05-18 Harting Elektrooptische Bauteile Gmbh & Co Kg Integrated optical module has micro-structured alignment piece on circuit board for positioning optical element

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Free format text: PATENTANSPRUCH 7, SPALTE 3, ZEILE 14 "SMID-LED-CHIPS" AENDERN IN "SMD-LED-CHIPS"

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