DE10132385B4 - Electronic component, a utility and a system support for such a component with distributed on its undersides outer contacts, and method for producing the same - Google Patents

Abstract

electronic Component with on the bottom (2) distributed outer edge contacts (3) and with at least one semiconductor chip (4), which in a plastic molding compound (5) embedded on one side and on at least one external contact (300) forming chip island (6) is arranged, wherein partially between the external contacts (300) holding webs (10) are arranged, and wherein the electronic Component (1) on its underside (2) has recesses (9), in the retaining bars (10) for the external contacts (300) are arranged, wherein on the underside (2) of the chip island (6) between the external contact (300) the chip island (6) and the outer edge contact surfaces (19) the outer edge contacts (3) additional Output contact surfaces (8) additional Output contacts (11) are arranged, which by holding webs (10) in the plastic molding compound (5) are held in position, wherein at least a part of the outer edge contacts (3) and output contacts (11) with each other and with the chip island (6) are connected in a line by the holding webs (10), and wherein through the recesses (9) the output contacts (11), the chip island (6) and / or ...

Description

The The invention relates to an electronic component, a utility and a system carrier for a Such component with distributed on their undersides outer contacts as well as methods for producing the system carrier and the electronic Component according to the genus the independent one Claims.

electronic Components with distributed on the bottom outer contacts and with at least a semiconductor chip embedded in a Kunststoffpreßmasse one-sided and on an external contact forming chip island of a system carrier is arranged the disadvantage that possible external connections on the Edge and the chip island limited are. These external contacts are on the outer edge the electronic component arranged and from the bottom of the electronic component and from the edge sides for a contact accessible. The chip island for the receptacle of the semiconductor chip is provided is in each case in the center arranged and from the external contacts surrounded in the border area. To hold the chip island in the center becomes at least one external contact position needed so that with This position is an external contact in the edge region less in such an electronic component is connectable. So far, it is not possible for electronic components, the on a system carrier are reliant on this outer edge independently from the chip island or a large number of external contacts on the bottom of the electronic component, as it for example for BGA packages (Ball grid array packages) possible is to provide.

From the US 6,229,200 B1 For example, a chip carrier with a chip island and flat conductors is known, wherein the flat conductors form two rows of contacts, which are each connected to each other via a half-etched section. The chip island is held by webs in their four corners.

A similar Component with two rows of contacts and a chip island attached to is held in its four corners, is also from JP 2000-286377 A known.

The US 5,969,411 A discloses a leadframe with a number of flat conductors, wherein the flat conductors have inner and outer portions, wherein between the inner and the outer portion in each case a notch is arranged.

After this the semiconductor chip together with the inner sections with a Plastic housing composition is surrounded, for example, with the help of a laser each flat conductor be severed at the notch.

task The invention is an electronic component, a system carrier and to indicate a benefit with which a housing for an integrated circuit can be realized, which allows a higher number of external connections, at simultaneous area minimization the external connections and Method of cost-effective Production of such electronic components, system carriers and To indicate benefit.

Is solved This object is achieved by the subject matter of the independent claims. advantageous Further developments of the invention will become apparent from the dependent claims.

According to the invention comprises an electronic Component with distributed on the bottom outer contacts and with at least a semiconductor chip embedded in a Kunststoffpreßmasse one-sided and on an external contact forming chip island of a system carrier is arranged on his Bottom surfaces of External contacts. About that In addition, the electronic component has recesses on the underside on in the retaining bars for the external contacts are arranged. The external contacts are arranged by the on the bottom of the electronic component Recesses at correspondingly defined locations of each other electrically separated.

To a specially structured system carrier is used, which special Holding webs to the outside contact the chip island and the rest external contacts to hold in predetermined positions. The provided recesses on the bottom of the electronic component serve to the first on the system carrier via holding webs electrically connected external contact surfaces electrically to be separated from each other and are therefore as separation points in the Arranged holding webs.

Opposite the BGA package technology the electronic component of this invention has the advantage of being compatible with Help of the system carrier technology and thus is much cheaper to produce. Another advantage the electronic component lies in the fact that the external contact surfaces no cusp have to carry as with BGA package technology, but a flat one Enable contacting, since they are directly by structuring the system carrier and subsequent separation technology can be realized.

Of the Distance between the external contacts and the outside contact the chip island is essentially determined by the material thickness of the system carrier, by the structuring of the system carrier by double-sided selective etching of a Metal strip for producing a system carrier strip or a metal plate to produce a benefit. This two-sided etching leads to a Profiling the leadframe structure in cross-section, anchoring the external contact forming a chip island and the other external contacts in a Kunststoffpreßmasse improved.

The etching also allows the creation of special retaining bars for external contacts. These retaining bars can some have a reduced material thickness, by the Positions for the holding webs of the system carrier or the benefits one-sided from the top of a blank or is etched unilaterally from the bottom of a blank. The thus produced Semiconductor bridges can be invisible on the bottom of the electronic component, if the system carrier or has the benefit unilaterally etched from below holding webs, and are only visible on the underside of the electronic component, if holding webs by one-sided etching of the system tray or of the benefit from the top are made. simultaneously can by the reduced material thickness of these holding webs also the distance of the holding webs from each other are minimized.

The Recesses on the bottom of the electronic component can be isolated introduced separation points, which are isolated in the form of individual Recesses each for holding outer edge contacts, external contacts and cut through to hold the chip island provided holding webs. This means that the Bottom of the electronic invention Component has a number of recesses in the form of craters, which are a feature of this invention.

The Invention provides that the electronic component in the edge region of its underside outer edge contacts and in the center of the bottom has a chip island. On the Bottom between the outer contact surface of the Chip island and the external contact surfaces of Outer edge contacts are additional Output contact surfaces of additional Output contacts arranged by holding webs in the Kunststoffpreßmasse in Be held in position. Through the recesses are the extra Output contacts, the chip island and / or the external contacts to accordingly defined locations separated from each other electrically.

One Such electronic component has the advantage that on the entire underside of the electronic component minimized surfaces for external contacts for contacting the back page a chip can be arranged. With this embodiment Is it possible, to realize electronic components on their underside Offer external contact surfaces, in a density that is otherwise only possible with BGA packages.

A embodiment the invention provides that the Recesses are parting lines. Such joints can Sägespuren represent later for cutting the retaining webs transversely to the retaining webs in the bottom of the electronic component are introduced. Such a component has the advantage that such Dividing joints at the same time the heat dissipation can serve, because they are a rib-shaped Realize bottom of the electronic component.

A another embodiment the invention provides that the Recesses etching traces exhibit. Such etching traces can local and isolated directly at the separation points for the holding webs be introduced so that no Grooves or craters can be seen on the bottom, but that electronic component on the bottom due to the application an etching mask has defined exact interruptions of the holding webs. For introduction of etching traces the retaining bars on the underside are visible in the area of the separation point arranged, which is not absolutely necessary when introducing saw marks is because a saw blade too Completely can cut through embedded in plastic retaining webs.

In a further embodiment of the invention the recesses sputtering traces exhibit. To such atomized or sputtered recesses, are sputtering techniques Sputtering techniques applied, both the material metallic Haltstege as well as a lying Kunststoffpreßmasse can atomize it. Consequently are recesses, the sputtering traces have, independently from accessibility the holding webs on the underside of a component available.

A another embodiment the invention provides that the Recesses Evaporate traces. Such traces of evaporation can be introduced at defined individual separation points and both the metallic holding webs as well as a plastic mass lying thereon evaporate, so that such Recesses both low-lying retaining webs as well as on the bottom visible holding webs can electrically disconnect.

In a further embodiment The invention provides that the electronic component has on its underside parting lines arranged in a straight line are. Such joints can by simple sawing technique be introduced and longitudinal on the underside of the component run transversely to the retaining webs. With such rectilinear joints is on the bottom Ribbed pattern realizes that the heat dissipation of the electronic component, while providing a variety of external contact options on the bottom by a few saw steps.

In a further embodiment of the electronic component, the joints on the bottom are straight and arranged parallel to bottom edges of the electronic component. In this embodiment the electronic component is a variety of holding webs with a dividing line severed and at the same time a variety of isolated external contacts realized on the bottom of the electronic component.

A another embodiment the invention provides that the Chip island, the outer edge contacts and / or the additional Output contacts have a same material thickness, these Material thickness of the material thickness of the system carrier blank can correspond. This embodiment The invention then has a particular advantage when structuring of the system carrier by double-sided etching is done and thus form-fitting in the plastic molding compound anchorable profiles for the chip island, the outer edge contacts and / or the additional ones Output contacts are available. The holding webs can in Principle the same material thickness as the chip island, the outer edge contacts and the additional ones Have output contacts. The recesses in the retaining bars be in this embodiment the invention of material thickness customized.

According to the invention have the electrically separated by the recesses retaining webs one opposite the chip island, the outer edge contacts and / or the additional Output contacts lower material thickness. This lower material thickness is by one-sided etching either from the top of the system tray or from the bottom of the system carrier reached out. This reduced or reduced material thickness for the holding webs has the advantage that the Haltesteg either within the plastic mass on the top of the system carrier extends and thus is not visible from the bottom of the electronic component or the reduced material thickness is by one-sided etching of reached the top, so that the holding bar on the bottom the electronic component is arranged and thus from the bottom of the electronic component for a separation is visible.

If the holding webs visible at their separation points from the bottom have the advantage that, for example, etching masks or saw marks are precisely adjustable. In a further embodiment of the invention the retaining bars only in the places where they are to be separated, led to the bottom of the electronic component, and in the rest Areas they lie on the from the bottom of the electronic Component not visible top of the system carrier.

by virtue of the increasing storage capacity of electronic components and due to the increasing space requirement for logic circuits also for High frequency components with attached logic become the required chip areas constantly greater. In a further embodiment The invention provides that the chip island is smaller than the backside of the semiconductor chip is. That means that within the plastic molding compound the semiconductor chip projects beyond the chip surface. In such cases sees the present invention, also the bottom of the electronic Component for additional Use output contacts, which then below the semiconductor chip are arranged. In these areas where the semiconductor chip the chip island towers over Bonding surfaces or bonding fingers are provided on holding webs around the semiconductor chip, which have no separation points, but to additional output contacts to lead, which are arranged below the semiconductor chip. In such a Application, the holding webs are not alone for positioning and Holding the extra Output contacts used under the semiconductor chip, but at the same time used as a bonding finger, what a relatively dense packing of Bondverbin applications and a tight array of external contacts on the bottom an electronic component allows.

In a further embodiment of the invention it is provided that below the semiconductor chip additionally arranged output contacts have a relation to the chip island reduced material thickness. This reduced material thickness can be achieved by etching at the positions of the additional output contacts from the top of the system carrier and simultaneously with the production of correspondingly shaped holding webs. Consequently, no additional structuring or etching steps are required; instead, the etching steps to be used for structuring a system carrier blank can be used and optimized for the positioning of additional output contacts underneath a semiconductor chip.

A another embodiment The invention provides that additional Output contact surfaces between the outer edge contact surfaces and the chip island offset and staggered on the bottom of the electronic Component are arranged. With such a staggered and staggered Arrangement can increase the density of the external contact surfaces the bottom of the electronic component optimized and thus the Number of external contact surfaces maximized become. Thus, it is possible with the invention, using the system support technology an external contact density to reach on the bottom of an electronic component, the previously only with the in terms of space requirements and costs consuming and complex BGA package technology is reachable.

One Another aspect of the invention provides for the component according to the invention a benefit for the simultaneous production of multiple electronic Components with distributed on the bottom outer edge contacts with each at least one semiconductor chip to provide. Such a Benefit has a system support structure in a metal plate, the positions for the electronic Components with semiconductor chips in rows and columns on the benefits are arranged. The benefit therefore has chip islands, which also are arranged in rows and columns and each of outer edge contacts are surrounded.

at the benefit of the invention holding webs are provided, which allow additional output contacts between the central chip island and arranged in the edge region outer edge contacts can be positioned. Across from isolated on a leadframe manufactured electronic component housings has the advantage of that for several in rows and columns arranged semiconductor chips first one common Kunststoffpreßmasse is applied, so that the Benefit in principle of a plastic housing layer on a structured Metal plate is made, wherein within the plastic housing layer the semiconductor chips are arranged on chip islands of the metal plate and the chips with their pads on their active tops via bonds with external contacts and in the present embodiment with additional Output contacts are connected.

One Such built-up benefit has the advantage that on its underside for several electronic components at the same time the recesses at the separation points for the Haltstege can be introduced. Thus, such a benefit has the advantage that the production of the inventive electronic Components cost-effective and at the same time for several components can be realized. The benefits are different Consequently, the individual electronic component in that only by Disconnecting the benefit in individual components the housing geometry of the individual Component is realized. A usual Separation technique is sawing, being with the sawing process the outer edge contacts also on the margins be exposed of the electronic component.

By profile saws can be achieved that the Plastic casing layer the unilaterally potted benefit is given a profiled shape, So that the Edge sides of the outer edge contacts from the Kunststoffpreßmasse of the individual housing protrude an electronic component. A special feature these benefits are the over the bottom of the benefit distributed recesses at the separation points for the Retaining bars that over the bottom are arranged distributed. These recesses can also are shown as joints and are then rectilinear and parallel aligned to the margins of utility. That has the advantage, that the Recesses for a variety of separation points by simply introducing a parting line can be realized on the bottom of the benefits. The Recesses can while saw marks, etching traces, Zerstäubungsspuren and / or have evaporation traces on the underside of the benefit.

In an embodiment the benefit of the chip island, the outer edge contacts and the additional Output contacts same material thicknesses, while the holding webs opposite to this Components are equipped with a smaller material thickness. The has the advantage that the Recesses only a depth of this lower material thickness have, which simplifies the production of the recesses.

In a further embodiment of the benefit, the semiconductor chip projects beyond the surface of the chip island, so that external contact surfaces can be provided below the semiconductor chip for such a benefit. This has the advantage of a larger number of external contacts, which can now also be arranged under the semiconductor chip. At the same time, however, it hampers the possibilities of bonding contact surfaces arranged on the edge of the semiconductor component to the additional output contact surfaces or to contact fingers of the outer edge contacts.

Around to stabilize the semiconductor chip during bonding, is in another embodiment the invention provides a tool that in the region of the contact surfaces of the Semiconductor chips supports this semiconductor chip from the bottom. One Such tool is in its dimensions and its supporting projections especially for adjusted the bonding process, So that the occurring forces over the Bonding tool can be intercepted and the loads of the semiconductor chip are reduced.

One Another aspect of the invention provides a system carrier, for many electronic components with distributed on the underside of the system carrier Outer edge contacts each associated with a semiconductor chip of the electronic components are. For the semiconductor chip has the system carrier chip islands. Furthermore owns the system carrier Outer edge contacts, the above Holding webs with a system carrier frame are connected, wherein the external contact the chip island at least one of the outer edge contacts via a Haltesteg is connected. This jetty has a diminished Material thickness on.

The Structure of the system carrier according to the invention has the advantage that they introduced into a metal strip or in a metal plate by etching on both sides can be. In this case, double-sided etching means etching from the top of a System carrier blank and at the same time from the bottom of this system tray blank, where top and bottom by different etching masks protected from etching in the places which the system carrier structure should represent. For Areas of reduced material thickness as for the holding webs, the etching masks for the Top and for the underside be structured such that the etchant is only from one side removes the material. This has the advantage that such diluted retaining webs between chip island and outer edge contacts and / or system carrier framework can be severed with little effort.

at that of the system carrier corresponds to the reduced material thickness of the holding webs about the half system carrier thickness. This has the advantage that the holding webs when used of the system carrier for the production of electronic components with plastic housing the bottom can be visible or from a thin one Covered plastic layer of Kunststoffpreßmasse the housing could be. This is optionally the reduced material thickness of the holding webs arranged to the bottom or top of the system carrier out.

A embodiment of the system carrier provides that the Haltstege with their reduced material thickness only in the areas towards the bottom of the system carrier are arranged, in which a recess for later electrical separation the semiconductor bridge is provided. The remaining Be rich of the semiconductor land with reduced material thickness, however, are towards the top of the system carrier arranged and can thus advantageously used as a bonding finger for the attachment of bonding wires become.

A another embodiment of the system carrier provides that the reduced thickness of the holding webs in the system carrier by means of selective etching of the top and / or bottom of a system tray blank ago introduced. Such a blank may be a metal band his or a metal plate.

is the structure of the system carrier from chip islands, outer edge contacts and additional Output contacts and retaining bars and with connections to the system carrier frame by double-sided selective etching in the system tray blank introduced, so forms a favorable etch profile in cross section, because of its projecting edge contour in the middle of the material a secure anchoring of the chip island, the outer edge contacts and the additional Output contacts in the one-side pressed-plastic mass in the housing production guaranteed.

• – Maskieren der Oberseite und der Unterseite des Systemträgerrohlings mit unterschiedlichen zueinander unsymmetrisch strukturierten Ätzmasken,
• – doppelseitiges isotropes Ätzen des maskierten Systemträgerrohlings unter einseitigem Dünnätzen von Haltestegen an entsprechend definierten Stellen,
• – Entfernen der unsymmetrischen Ätzmasken.

A method for producing a system carrier from a metal plate or a metal strip as a system carrier blank has, inter alia, the following basic method steps:

• Masking the upper side and the lower side of the system carrier blank with different asymmetrically structured etching masks,
• Double-sided isotropic etching of the masked system carrier blank with one-sided thin etching of holding webs at correspondingly defined locations,
• - Remove the asymmetrical etching masks.

The inventive introduction of unbalanced etching masks in the production of system carriers on the one hand has the advantage that holding webs reduced material thickness can be produced and even holding webs can be realized partly at the top and partly at the bottom of the leadframe run. A double-sided etching with asymmetrical etching masks has about it addition, the advantage that very tight increments and thus small distances between the additional Output contacts, the outer edge contacts, the chip islands and the holding webs can be realized.

In a further preferred embodiment of the method for the production of the system carrier the double-sided etching takes place by wet etching. there can through a relatively narrow slot in the etching mask a well-defined etch contour be reached under the slot. The etching effects under the slot a uniform two-sided undercutting, whereby a uniform enlargement of the Width of the etching trench across from the etch slot width can be achieved. The width of the etched trench corresponds to a maximum the double etch depth plus the width of the slot in the etching mask.

at the implementation of the process are by etching under asymmetrical etching masks Haltestege made, which are arranged offset in cross section to each other are and a reduced material thickness with a grid spacing of full material thickness of the system carrier plus etch slot width exhibit. For one-sided etching On the other hand, a grid spacing of at least twice results material thickness plus etch slot width. About that in addition, the double-sided etching the advantage that in the material center of the system carrier blank the chip islands, the outside edge contacts and partly the additional ones Output contacts form a sharp-edged etch profile. This projecting etch profile in the middle area of the material thickness makes for a secure anchoring of the individual components of the system carrier such as the later applied plastic molding compound for the casing the electronic components.

• – Bereitstellen eines strukturierten Systemträgers für mehrere in Zeilen und/oder Spalten angeordnete elektronische Bauteile mit Außenkontakten, die über Haltestege mit einem Systemträgerrahmen verbunden sind, wobei im Zentrum einer Bauteilposition eine einen Außenkontakt bildende Chipinsel angeordnet ist und von Haltestegen in Position gehalten wird, wobei die Haltestege gegenüber der Chipinsel eine verminderte Materialdicke aufweisen,
• – Aufbringen von Halbleiterchips auf die Chipinseln,
• – Herstellen von Bondverbindungen zwischen Kontaktflächen auf den Halbleiterchips und Kontaktanschlußflächen oder Kontaktfingern auf den Außenkontakten,
• – Aufpressen einer Kunststoffpressmasse auf den Systemträger bzw. auf einen entsprechenden Nutzen mindestens im Bereich der Bauteilpositionen,
• – Einbringen von Aussparungen auf der Unterseite des Nutzens unter Durchtrennen der Haltestege für die Außenkontakte,
• – Trennen des Nutzens in einzelne elektronische Bauteile.

A method for producing an electronic component having external contacts distributed on the underside and having at least one semiconductor chip which is embedded on one side in a plastic molding compound and is arranged on a chip island of a system carrier forming at least one external contact comprises, inter alia, the following method steps:

• - Providing a structured system carrier for a plurality of arranged in rows and / or columns electronic components with external contacts, which are connected via holding webs with a system carrier frame, wherein in the center of a component position, an outer contact forming chip island is arranged and held by holding webs in position, the Holding webs opposite the chip island have a reduced material thickness,
• Application of semiconductor chips to the chip islands,
• Establishing bonding connections between contact surfaces on the semiconductor chips and contact pads or contact fingers on the external contacts,
• Pressing on a plastic molding compound onto the system carrier or on a corresponding use at least in the area of the component positions,
• - Inserting recesses on the underside of the benefit by cutting the holding webs for the external contacts,
• - Disconnecting the benefits in individual electronic components.

at an implementation example of the method are used to provide a structured system carrier Chip island and external contacts provided in the edge region of each component position additional output contacts. This has the advantage that the Number of external contacts with increasing area size of the semiconductor chip elevated can be. The number of external contacts grows with the area of the semiconductor chip in similar Way as with housings BGA technology, but much more expensive and costly as the system carrier technology is.

at another implementation example the method for producing an electronic component takes place the insertion of recesses on the bottom of the benefit or of each component by means of laser evaporation of the holding webs at predetermined Put. This can be a laser beam over the bottom of the benefit be rasterized and the separation points to which the retaining webs to are separated, isolated or individually scan.

A further embodiment of the method provides that the introduction of recesses on the underside of the benefit or of each component is carried out by sawing saw grooves transversely to the retaining webs. The introduction of Sägenuten on the bottom of the benefits, after it has been covered with a plastic compound on its top, is a relatively inexpensive method to elek in a short time with a few saw marks a large number of additional output contacts and outer edge contacts to separate from each other.

One further implementation example Provides that Inserting recesses on the bottom of the benefit or one each component by dry etching technique the holding webs at predetermined or correspondingly defined locations he follows. Such a dry etching technique can be done by reactive ion sputtering, in which the accelerated Ions with exposed surfaces The metal retaining strips react quickly and effectively a dry etching pit create in these places. This requires the underside To provide the benefit with a protective mask, so that the surfaces of Chip island, the outer edge contacts and the extra Output contacts should not be damaged in the dry etching step. An advantage of this dry etching is that undercuts be avoided.

One further implementation example of the procedure provides that the Inserting recesses on the bottom of the utility or of each component by means of wet etching technique of the holding webs predetermined places takes place. Even with the wet etching technique must be before the bottom of the benefit be protected by a protective layer, in the only the separation points for the production of recesses are exposed in the retaining bars.

One further implementation example of the procedure provides that the Inserting recesses on the bottom of the utility or of each component by means of atomization of the holding webs takes place at predetermined locations. For such a sputtering technique Inert gas ions become linear under high acceleration voltage shot at the bottom of the benefit, being exposed and unprotected Areas of the bottom of the benefits are atomized. Thus, defined Areas on the bottom of the utility are electrically isolated from each other become.

Finally, can the benefits in individual components are separated by means of sawing technology, being profiled saws ensure can, that the individual components a predetermined edge contour in the housing form receive. In the sawing technique be simultaneously on the edge sides of the electronic component the side surfaces the outer edge contacts exposed, so that the Outer edge contacts both on the margins of an electronic component as well can be contacted on the underside of an electronic component.

In front the casting Benefit from the top with a Kunststoffpreßmasse the contact surfaces on the active top of the semiconductor chip with contact pads or Bond fingers for the external contacts or for the outer edge contacts and additional Output contacts connected. This requires different bonding wire lengths, the closest to the semiconductor chip additional Output contacts a shorter Bonding wire length require than the outer edge contacts further away from the chip edge. additional Output contacts and outer edge contacts, the farther than the maximum allowable Bonding wire length are removed from the chip edge, have bonding fingers, which have a bonding surface near the chip.

In summary It should be noted that by etching, sawing or other separation techniques partly before, partly after the pressing of the component with a plastic mass of a metal sheet with terminal structures and Haltestegen a semiconductor package is generated, in which advantageously the chip island suspensions or the holding webs for the chip island opened and for that a wiring can be harnessed.

Further can multi-row external contact arrangements allows which are otherwise only possible with the BGA housing technology. After all can to a certain extent over Bond finger a rewiring inside under a semiconductor chip or outside to further away from the chip edge additional output contacts or outer edge contacts respectively. This allows the invention inexpensive, high-pole semiconductor packages, their connection geometry with inexpensive etching and separation methods can be generated without the use of expensive substrates or wiring boards. About that In addition, these new electronic components are in their thermal and electrical properties of the housings of substrate-based Superior BGA packages. These benefits are created by combining two ways namely Separation technology and system carrier structuring by etching technique, achieved, whereby further advantages can be achieved.

Furthermore, by supporting design measures, the structure of the underside of a semiconductor device can be further optimized. These advantages are achieved by introducing at least one additional separation process after the application of the plastic molding compound or the mold cap, for example, before the components are singulated to a benefit. Furthermore, these advantages can be achieved by accurate positioning and ge sent arrangement of the etching masks on the top and bottom of the metal sheet for the benefit or for the substrate carrier can be achieved. In this case, a cost-effective Naßätztechnik be fully exploited. Finally, in some cases, the benefits are achieved through special design, which allows the above measures to be partially enabled or efficiently performed.

The Invention will now be described with reference to embodiments and implementation examples with reference to the attached Figures closer explained.

1 shows a schematic view of a bottom side of an electronic component of a first embodiment of the invention,

2 shows a schematic cross-sectional view of the first embodiment of the invention along the section line AA in 1 .

3 shows a schematic view of the underside of an electronic component of a second embodiment of the invention,

4 shows a schematic cross-sectional view of the second embodiment of the invention along the section line AA in 3 .

5 shows a schematic view of the underside of an electronic component of a third embodiment of the invention,

6 shows a schematic cross-sectional view of the third embodiment of the invention along the section line AA in 5 .

7 shows a schematic view of the underside of an electronic component of a fourth embodiment of the invention,

8th shows a part of the fourth embodiment of the invention schematically in cross section along the section line AA of 7 before casting with a Kunststoffpreßmasse and after bonding different bonding wire lengths,

9 shows a schematic view of the underside of an electronic component of a fifth embodiment of the invention,

10 shows a schematic cross section through full-sided holding webs or lines that were prepared by dop pelseitigem etching under symmetrical etching masks,

11 shows a schematic cross section in which half-side holding webs alternate with full-sided external contacts under the action of non-symmetrical etching masks,

12 shows a schematic cross section with half-side holding webs on the upper and lower half of the material thickness,

13 shows a schematic cross-section of half-side holding webs, which are supported on the opposite sides.

1 shows a schematic view of a bottom 2 an electronic component 1 a first embodiment of the invention. On the bottom 2 of the electronic component 1 This embodiment is seventeen external contacts 300 Visibly arranged, of which sixteen outer edge contacts 3 in the edge region of the electronic component 1 sin and an external contact 300 through the one in the center of the bottom 2 arranged chip island 6 is formed, with two holding webs 10 initially connected to the chip island to hold it in place. While the outside edge contacts 3 and the chip island 6 have the same thicknesses D, the holding webs 10 etched down to a reduced material thickness d and on the bottom 2 of the electronic component 1 visible, noticeable. To the two outer edge contacts 3 , which have retaining bars 10 the chip island 6 hold in position as insulated outer edge contacts 3 are on the bottom 2 of the electronic component 1 this first embodiment, two elongated joints 13 pa parallel to the bottom edges 15 and 17 brought in. The sawing depth of these two saw marks 20 need only the reduced material thickness of the holding webs 10 match to make sure on the bottom 2 recesses 9 are introduced, electrically and mechanically the outer edge contacts 3 from the chip island 6 separate.

The first in 1 embodiment of the invention shown initially dispenses with the production of additional external contacts 3 that is between the chip island 6 and the outer edge contacts 3 can be arranged. The embodiment of the 1 already has the advantage over a standard VQFN-16 package, that each of the sixteen outer edge contacts 3 regardless of the potential of the chip island 6 can be used for electrical signaling. This was due to the inventive introduction of recesses 9 on the bottom 2 of the electronic component 1 possible and in particular by reducing the material thickness of the holding webs 10 so that through the saw marks 20 parallel to the bottom edges 15 and 17 the component 1 not weakened significantly. Rather, the saw marks 20 a rib-shaped profiling of the underside of the electronic component, which serves better heat dissipation.

2 shows a schematic cross-sectional view of the first embodiment of the invention along the section line AA in 1 , Components of the same functions as in 1 are marked with the same reference numerals and not explained separately.

On the bottom 2 of the electronic component 1 is on the right side of the cross section of the elongated recess 9 to see that for holding webs 10 represents a parting line and according to the profile of a saw blade 41 a saw track 20 on the bottom 2 of the electronic component 1 leaves. On the left side of the 2 is on the bottom 2 of the electronic component 1 the engagement of a saw blade 41 for the separation of the reduced to the material thickness d retaining web 10 shown. The saw blade 41 is part of a high-speed saw, in the direction of rotation B around the saw blade axis 42 a parting line 13 in the bottom 2 of the electronic component 1 incorporated. With this saw blade 41 becomes the jetty 10 for the chip island 6 , which has a reduced material thickness d, severed, so that the chip island 6 from the outer edge contact 3 is disconnected. Such recesses 9 can be introduced simultaneously for multiple electronic components of a benefit.

2 further schematically shows a semiconductor chip 4 in cross-section, by means of a solder layer 43 or an adhesive layer 44 on the chip island 6 was fastened before contact surfaces 29 on the active top side of the semiconductor chip via bonding wires 46 with the outer edge contacts 3 get connected. To ensure a good bond, the top of the outer edge contacts 3 partially with a bondable coating 48 covered. The entire chip structure is in a Kunststoffpreßmasse 5 packed on the margins 33 and 35 of the electronic component 1 by separating a utility may have a rectangular contour, as indicated by the dashed line 49 or can also achieve bevelled and other contours by profile sawing, as represented by the solid lines. By appropriate shaping of a tool shell can on the benefit of individual housing shapes in appropriate cavities with the help of Kunststoffpreßmasse 5 being represented. Even in these cases, it is possible to have the joints 13 on the bottom of the benefit for multiple components at the same time.

In the 1 and 2 schematically illustrating a first embodiment of the invention, the Chipinsellänge and the chip island widths a and b is brought to odd multiples of half the pitch or the half step size s of 0.25 mm. As a result, the chip island edges are aligned with the edges of the outer edge contact surfaces 19 , Is now according to the invention on one side of the chip island 6 an even number of outer edge contacts 3 positioned, then automatically the parting line between the chip island edges and the front sides of the outer edge contacts 3 largely straight up to the edge of the case. Thus, tracks for potential saw cuts in the housing bottom of the electronic component 1 for separating the connections of the holding webs 10 which in the embodiment of the 1 and 2 serve the island suspension, created.

The separation processes on the bottom 2 of the electronic component 1 for introducing recesses 9 in the retaining bars 10 , can be achieved by sawing, etching, laser evaporation or current pulses or by sputtering. These separation processes can then be carried out if the cohesion of the metal structures of the system carrier 7 as he is in 2 is shown is no longer necessary. That is, the separation operations are after Umpressen with a Kunststoffpreßmasse 5 and after possibly generating a suitable soldering surface on the metal surfaces of the metal structure visible from the underside.

For applying a soldering surface on the underside of the chip island 6 and the undersides of the outer edge contacts 3 In galvanic deposition of a solder alloy or a gold alloy a coherent metal structure erforder Lich. Therefore, the separation process on the bottom 2 a benefit or an electronic component 1 only performed when no coherent metal structure is required.

The in the 1 and 2 Sketched saw cuts can be carried out both in the longitudinal and in the transverse direction. In addition, now shows the advantage that the retaining webs 10 for the chip island suspension from the chip side are etched on one side, as shown in the schematic cross section of 2 can be seen, so that a sawing depth of slightly more than half the material thickness d of the system carrier 7 through the saw blade 41 is to be separated. With this procedure, also premature dicing of holding webs 10 between different components 1 prevented if the semiconductor devices were molded separately in individual cavities of the injection mold with plastic compound and are held together only on the metal strip of the system carrier in a series or matrix composite.

Although it is in the 1 and 2 is not shown, in principle, deeper cuts are possible when the IC packages are previously applied to an adhesive film or when pressing with a Kunststoffpreßmasse plastic connecting webs between the housings are molded with, which hold the composite independently of the metal strip of the system carrier. Such a manufacturing process with holding the individual components together via an adhesive film or via plastic connecting webs is applicable in the production of LFBGA housings. In this case, a closely packed matrix of components with a common large Preßmassenkappe is wrapped, which is completely sawed by the separation of the components, as the dashed lines 49 in 2 represent.

With the above and following measures will be a minimization of the required separation steps or separation processes achieves and at the same time maximizing the usable terminal numbers allows.

3 shows a schematic view of the bottom 2 an electronic component 1 a second embodiment of the invention. Components with the same functions as in the preceding figures are identified by the same reference numerals and are not explained separately.

In this embodiment of the invention, the edge lengths a and b of the electronic component 1 up to 3 mm long. The edge length k of the chip island 6 is greater than the edge length h of the chip island 6 applied semiconductor chips 4 whose outlines are indicated by a dashed line. The repeat distance or the step size or the grid dimension s of the outer edge contacts 3 is 0.5 mm in this embodiment, while the length 1 the outer edge contacts 3 0.4 mm. In this embodiment of the invention is the chip island 6 over three holding bridges 10 one-sided on the right side of the electronic component 1 held, so that with only one Sägespur 20 in the direction of arrow C a parting line 13 can be introduced. At the same time, despite the same outer dimensions of the second embodiment of the invention as in the first embodiment of the invention, the number of outer edge contacts 3 on 18 has been increased, with the same pitch s and the same edge lengths a and b. This is achieved by eliminating the possibility of cross-sawn joints. This makes it possible, on the longitudinal sides, the bottom edges 15 and 17 correspond, two more outer edge contacts 3 accommodate.

The chip island suspension with the help of the holding webs 10 differs in the second embodiment of the invention over the first embodiment of the invention not only in that the chip island 6 one-sided on outer edge contacts 3 is suspended, but also that the holding webs 10 on the bottom 2 of the electronic component 1 be made narrower than the outer edge contacts 3 , This embodiment has the advantage that in the system carrier 7 as he is in 4 you can see the robbery and projecting etched edge 50 around the corners 54 the outer edge contacts 3 on the connection ends 55 in addition, partially wraps around what the outside edge contacts 3 anchored better in the Kunststoffpreßmasse, especially because of rougher Ätzoberflächen. Another advantage of the reduced width of the holding webs 10 for the chip island 6 is that when soldering the electronic component 1 on a printed circuit board, the solder pulls away from the narrower residual retaining web rather than that it wets the narrower residual retaining web. Thus, the risk of solder bridges on the bottom of the electronic component 1 reduced. This allows the saw track or the recess 9 at the separation points 12 be made narrower.

Another advantage of the second embodiment of the invention with its narrower webs 10 is that open metal surfaces and metal / plastic interfaces, which are potential attack surfaces for corrosion or as entry ports for the penetration of ions and moisture, are greatly reduced. Further may be considered as an advantage that zones of reduced cross-section can be evaporated as fuses with a surge. This means that the separation process by a simple surge between outer edge contact 3 and chip island 6 can be carried out. The smaller the remaining metal cross-section, the easier and gentler an electrical and mechanical separation can be. This is a supply voltage on the holding webs 10 shorted. This can be done via spring contacts on external contacts 300 done, which are switched through in rapid succession. There can be any number of island suspensions or holding bars 10 between outer edge contacts 3 and additional output contacts are disconnected in this way. The separation process by means of surge has the advantage that no continuous rectilinear Sägebahn is provided on the underside of the electronic component, but rather separating recesses at the correspondingly defined separation points 12 arise.

4 shows a schematic cross-sectional view of the second embodiment of the invention along the section line AA in 3 , Components with the same functions as in the preceding figures are identified by the same reference numerals and are not explained separately.

The schematic cross section of 4 shows the one-sided introduction of a sawing track 20 on the bottom right 2 of the electronic component 1 that is sufficient to the one-sided to holding webs 10 suspended chip island 6 from the outer edge contacts 3 on the bottom right 2 of the electronic component 1 to separate. On the left side are with the reference number 50 projecting Ätzkonturen shown that arise in the manufacture of the system carrier 7 from the bottom 25 of the system carrier and at the same time from the top 23 of the system carrier 7 Etching profiles are introduced. The projecting etch edge 50 improves the anchoring of the outer edge contacts 3 and the chip island 6 in the plastic molding compound 5 ,

5 shows a schematic view of the bottom 2 an electronic component 1 a third embodiment of the invention. Components with the same functions as in the preceding figures are identified by the same reference numerals and are not explained separately.

In this embodiment of the invention are between chip island 6 and outer edge contacts 3 two more rows of additional output contacts 11 arranged. Here is the bottom 2 of the electronic component 1 optimized so that with a few separation steps a variety of additional output contacts 11 on the bottom 2 of the electronic component 1 be produced. In this embodiment, there are six joints 13 in the longitudinal direction, on the bottom 2 are introduced, and two joints 13 in the transverse direction, bringing a number of connection options in the form of outer edge contacts 3 and additional output contacts 11 is created, which in this embodiment is sixty-three, the area of the underside 2 of the electronic component 1 is not significantly increased over the first and second embodiments. It will only point towards each of the bottom edges 14 . 15 . 16 . 17 two grid dimensions s added.

The chip island 6 is of large-scale external contacts 51 . 52 . 53 surround. Here is the large-area external contact 51 designed as a right angle and can supply the electronic circuit with a ground potential over its entire length, although a half-sided parting line 13 the angular outer contact 51 from the bottom 2 Her through half Mate rialdicke d in the arrow direction C severed. The further large-area connection contact 52 can for the positive potential supply of the semiconductor chip 4 be provided and the large-scale external contact 53 serve for a corresponding negative potential. The remaining connections from small-area additional output contacts 11 and outer edge contacts 3 can be provided for signal connections. With the help of the total of eight joints 13 that from the bottom 2 out into the electronic component 1 can be introduced, this variety of connection variants on the bottom of an electronic component 1 , which can be produced with the aid of system carrier technology. Thus, this technology can compete with the now introduced BGA package technology quite.

While the geometry of the outer edge contacts 3 of the second embodiment of the invention are maintained at a regular pitch of 0.5 mm in the area between chip islands 6 and outer edge contacts 3 additional output contacts 11 inserted. Furthermore, the large-area external contacts form 51 . 52 . 53 a supply ring around the chip island 6 , which is here for three possible potentials, namely a ground potential and a negative and a positive supply potential, separated. The retaining bars 10 This third embodiment is etched continuously from the chip side to a reduced material thickness d, as it is the schematic cross section of 6 shows. Thus, these holding webs exist 10 only in the lower half of the metal sheet for the system carrier 7 , Thus, they can with the help of sawdaws or sowing gespuren 20 or by evaporation by means of an impulse or by selective etching after printing of an etching mask.

6 shows a schematic cross-sectional view of the third embodiment of the invention along the section line AA in 5 , Components with the same functions as in the preceding figures are identified by the same reference numerals and are not explained separately.

That with the 5 and 6 The design principle shown allows the extension and enlargement of the underside of an electronic component 1 to a plurality of open and closed supply rings and any number of terminal rows in a predetermined pitch, which is 0.5 mm in this embodiment. A maximum limitation results initially only from the maximum possible and producible bond wire length, as in 6 with the reference numbers 38 . 39 . 40 to be shown. Farthest from the contact surfaces 29 on the active top 45 of the semiconductor chip 4 are the outside edge contacts 3 which has the largest bond length 40 in this embodiment. The contact surfaces 29 on the active top 45 of the semiconductor chip 4 can contrary to the schematic sketch of the 6 in a row along the edges of the semiconductor chip 4 be arranged. Despite this possibility of equalization of the bonding wire lengths are the bonding wire lengths 40 to the outer edge contacts 3 in the area of the corners of the electronic component 1 longest, so that these bonding wire lengths 40 the size of the bottom 2 an electronic component 1 according to the construction principle according to the invention and thus the maximum number of possible external contacts 300 on the bottom 2 limit in this embodiment.

The schematic cross section of 6 shows that all retaining webs 10 have a reduced material thickness d. Furthermore, the schematic view shows the underside 2 of the electronic component 1 With 5 in that the width of the retaining webs 10 less than the width of the external contacts 300 So that the above-mentioned advantages for the design of the holding webs 10 in the third embodiment of the invention as well as in the second embodiment of the invention is fully exhausted.

7 shows a schematic view of the bottom 2 an electronic component 1 a fourth embodiment of the invention. Components with the same functions as in the preceding figures are identified by the same reference numerals and are not explained separately. Black marked areas in the 5 . 7 and 9 identify metal structures with full material thickness of a system carrier. Striped and checkered areas are below the plane of the drawing. With solid lines limited holding webs 10 lie in the drawing plane and have a reduced material thickness. With dashed lines limited retaining bars 10 lie below the drawing plane and have a reduced material thickness.

The fourth embodiment of the invention differs from the third embodiment of the invention as shown in FIG 5 is shown, in that the surface of the semiconductor chip 4 larger than the area of the chip island 6 , Thus, the semiconductor chip protrudes 4 the chip island 6 so that now the possibility exists, more rows and columns of additional output contacts 11 below the semiconductor chip 4 to arrange. These additional output contacts 11 are partially below the semiconductor chip 4 and are supported by retaining bars 10 between chip island 6 and outer edge contacts 3 held.

In this fourth embodiment of the invention, the advantages of the invention reduction in the thickness of the holding webs 10 fully exhausted, so that the majority of the holding webs 10 from the bottom are not visible, which is indicated by the dashed lines of the holding webs 10 is marked. An area of the retaining bars 10 , which simultaneously serves as a bonding finger, is made in full thickness D, which is indicated by black stripes. These retaining bars 56 with a dual function are directly in the edge region of the semiconductor chip 4 arranged on both sides. These areas where the retaining bars 56 serve as bond fingers at the same time, are referred to as bond areas 57 characterized. In these hatching areas shown hatched 57 arises over the solid material retaining webs 56 a connection to the additional output contacts 18 below the semiconductor chip 4 ,

In the fourth embodiment of the invention are thus eighteen additional external contacts 300 created without the bond length must be increased compared to the third embodiment. The web areas, which are executed in full material thickness D, are black in 7 characterized. Only in the extreme right and left Sägenuten the saw depth is adjusted so that the system carrier is cut through in full material thickness. For the further separation processes, the holding webs 10 only with half the material thickness d in the area of the joints 13 Visibly arranged from the bottom of the electronic component. The remaining area of the joints is with a correspondingly reduced material thickness d from the underside of the system carrier 7 etched out so that most of the areas of the retaining bars 10 from the sub page 2 is not visible, and is therefore indicated by dashed lines.

This fourth embodiment of the invention has due to the holding webs 10 that are only partially in the separation areas on the bottom 2 Visible are where the retaining bars 56 serve simultaneously as a bonding finger, the advantage that a reliable and on the additional output contact surfaces 8th and outer edge contact surfaces 19 limited attachment of solder joints is possible.

The fourth embodiment again has a pitch of 0.5 mm, the length 1 the outer edge contact is 0.4 mm and the width of the outer edge contacts is 0.25 mm. The additional output contacts 11 can as round additional output contact surfaces 8th or be executed as polygons. Important for an electrical insulation of many output contacts 11 and outside edge contacts 3 with a few joints 13 as well as for the simple implementation of retaining bars 10 between additional output contacts 11 and outer edge contacts 3 through is their staggered arrangement. The accommodation of additional output contacts 11 below the semiconductor chip 4 and contacting via bond finger allows additional connections. Thus, in the im 7 Example achieved a 118-pin four-row external contact geometry, with only four saw cuts on the bottom 2 of the semiconductor device 1 is produced.

With the grid dimension s = 0.5 mm with a sheet thickness of 0.2 mm, this example shows the possibilities of a high density of external contacts 300 on the bottom 2 of the electronic component 1 , In the case of the etched system carrier 7 is operated with an etch gap of 230 microns, so that 0.25 mm wide additional output contacts 11 and outside edge contacts 3 let produce. The webs in between only have a width of 50 - 100 microns.

The retaining bar connections between the additional output contacts 11 lie substantially in the upper half of the material in the fourth embodiment, while the island suspension exclusively on retaining webs 10 is executed in the lower half of the material. Thus, this area must be near the chip island 6 sawed in only half the metal depth. In the two outer Sägespuren the full material thickness D is severed, since the retaining webs 10 run alternately in the upper and lower half. Although it would be conceivable, even this holding webs 10 to move into the lower half of the material, however, would then give a residual width for the webs of only 20 microns at the given pitch, which is critical etching at a total material thickness of 200 microns.

If a transition is made to larger contact patterns with s = 0.65 mm, 0.8 mm or 1 mm, then there are no problems with respect to the remaining width for retaining webs passing downwards 10 , Also, by a smaller sheet thickness such as 150 microns with etch slots of 180 microns and thus with 70 microns residual material width or a sheet thickness of 100 microns with Ätzschlitzbreiten of 120 - 130 microns and thus also a 120 to 130 microns thick residual material width at a pitch of 0, 5 mm can be achieved. These examples show that quite smaller grid sizes are possible if the material thickness D of the system carrier 7 is reduced.

When separating the retaining webs 10 Sawing results in non-optimized design a relatively high number of sawing traces, which makes the process quite expensive. Instead of sawing you can after making the plastic housing an etching mask on the bottom 2 imprinting, which initially covers the terminal areas, but the holding web areas, which are wegzutätzen leaves free. With this etching mask all separation points can be carried out in an etching process, so that instead of elongated Sägespuren individual recesses 9 on the bottom 2 of the electronic component 1 become visible. After the etching, the etching mask can be removed. Thus, the etching technique allows the separation of many holding webs 10 at the same time and increases the possibilities of constructive design, because largely arbitrary geometries can be subsequently separated by etching and it is not necessary in the draft linear gaps between the external contacts 11 to be considered for a later sawing step.

By the offset grid pattern employed in the fourth embodiment of the invention, the saw marks can be reduced and, as shown in this example, only four saw marks are used 118 additional output contacts 11 and outside edge contacts 3 made isolated from each other.

The fourth embodiment of the invention also shows that a two-row offset connection grid etching technology without separation steps after Umpressen with Kunststoffpreßmasse 5 is feasible by the holding webs 10 for the additional output contacts 11 as well as the chip island 6 only between the outer edge contacts 3 through to the system carrier frame. Furthermore, the fourth embodiment Form of the invention also that additional output contacts 11 can be arranged under the chip surface, as it is already realized in substrate-based BGA packages.

Since in the inventive concept, an insulating redistribution layer, as it is arranged in BGA packages, missing, the isolation between the semiconductor chip 4 and the external contacts 18 below the semiconductor chip 4 ensured by other measures, for example, the chip back 22 is isolated by an oxide, a nitride or a polyimide layer. In the island area, where an electrical backside contact may be required for the chip, this passivation layer may be on the back side 22 of the semiconductor chip 4 be removed. Other ways of isolation of the additional output contacts 18 towering back 22 of the semiconductor chip 4 can be done by inserting insulating adhesive films during chip assembly or by installing an insulating intermediate carrier such as a ceramic plate or a thin insulating coated sheet metal plate.

For cost reasons, however, a design of additional output contacts 18 performed so that the semiconductor chip 1 can be mounted conventionally and no additional process steps are required. This is possible if it is ensured that between the additional output contacts 18 and the back of the chip 22 a distance g remains, when pressing with the Kunststoffpreßmasse 5 can be filled.

8th shows a part of the fourth embodiment of the invention schematically in cross section before casting with a Kunststoffpreßmasse and after bonding different bonding wire lengths 38 . 39 . 40 , Components with the same functions as in the preceding figures are identified by the same reference numerals and are not explained separately.

In this embodiment of the 8th becomes a distance between the semiconductor chip 4 and the additional output contacts 18 that under the semiconductor chip 4 are arranged, achieved in that bulges 59 or cusp in the area of the chip island 6 are impressed. These bumps have the same material thickness D of the chip island 6 on and worry because of their bulge 59 that the semiconductor chip 4 a small distance g from the top 23 of the system carrier 7 , which at the same time also top 23 the under the semiconductor chip 4 arranged additional output contacts 18 is, has. When defined attachment of the semiconductor chip 4 on the thus preformed chip island 6 is an adhesive layer, which is provided in this case with an electrically conductive filler fixed.

For bonding can be under the substrate carrier 7 a tool 60 be arranged, the projections 61 in the edge region of the chip, by the semiconductor chip 4 contact surfaces 29 on its active top 45 having. These projections 61 directly support the area of the semiconductor chip that passes over the chip island 6 protrudes. The bond fingers 56 in this embodiment have the same material thickness D as the chip island 60 on, but have a small width, the width of the holding webs 10 corresponds, via which the additional output contacts 18 are electrically connected to the bond fingers. Thus, the contact surfaces 29 of the semiconductor chip 4 on the active top 45 of the semiconductor chip 4 over the bonding wires 28 , the bond finger 56 , which is designed as a holding web area with full material thickness D, the holding web 10 which has half a material thickness d and partly under the semiconductor chip 4 is arranged, with the output contact 18 below the semiconductor chip 4 electrically connected.

The cavities 62 and 63 under the semiconductor chip 4 can be filled in the subsequent casting with a Kunststoffpreßmasse after the tool 60 with its projections 61 removed and replaced by a lower mold half. The contact surfaces 29 are in 8th staggered in the image depth and have different bonds 28 . 36 and 37 on that with different bond lengths 38 . 39 and 40 to the arranged at different distances additional output contacts 11 and outer edge contacts 3 to lead.

Is with the in the 7 and 8th shown embodiments, sufficient space available to support webs alone in the lower half of the material 10 between two contact connections or output contacts 11 To execute, the variant shown in Figure 8 in cross section can also be produced purely by etching. Such a variant can then without a support tool 60 get along. The support of the chip island 6 protruding portions of the semiconductor chip 4 then takes place via blind webs 64 as in the fifth embodiment in FIG 8th shown. Such a variant could still be realized for a 0.5 mm pitch with a sheet thickness of 100 μm and an external contact width of 220 μm. With larger grid size can correspondingly larger sheet thicknesses for the system carrier 7 be used.

9 shows a schematic view of the bottom 2 an electronic component 1 a fifth embodiment of the invention. Components with the same functions as in the preceding figures are identified by the same reference numerals and are not explained separately.

The bottom 2 This housing shows a connection geometry for 120 external contacts 300 as well as with a chip island 6 , The retaining bars 10 between the additional output contacts 11 . 18 , the outside edge contacts 3 and the chip island 6 have been etched to reduced material thickness d. Likewise on reduced material thickness d are the additional output contacts 18 below the semiconductor chip 4 etched. In addition, a part of the holding webs 10 be made in full material thickness D to the over the chip island 6 protruding portion of the semiconductor chip 4 to support. The blind bridges serve the same purpose 64 , which are directly to the chip island 6 connect and are made in full material thickness D and fulfill neither a holding function nor a function as a bonding finger or conductor track.

The blind webs 64 fulfill a support function for the semiconductor chip 4 that is significant about the chip island 6 protrudes. With only eight parting lines 13 become in this embodiment of the invention one hundred and twenty external contacts 300 created on a housing edge length a, b of 6 mm. Except the terminal row of outer edge contacts 3 in the electronic component and the terminal row of additional output contacts 11 around the edge of the semiconductor chip 4 Around this embodiment, there are two inner rows of additional output contacts 18 under the semiconductor chip 4 placed. These inner rows are over holding webs 56 , which simultaneously act as bond fingers in full material thickness D in bond areas 57 around the semiconductor chip 4 are formed with the active top of the semiconductor chip 4 connected.

In this embodiment of the invention, the edge length k of the chip island 6 much smaller than the edge lengths h, i of the semiconductor chip 4 , Furthermore, after all four side edges of the electronic component 1 only three different bond lengths required to four external contact rows with the contact surfaces on the active upper surface of the semiconductor chip 4 connect to. Within the individual rows, the bond lengths are those in the corners of the electronic component 1 located outer edge contacts 3 larger than to the outer edge contacts 3 at the edge.

General are in this design principle in addition to the edge row of outer edge contacts 3 and the first row of additional output contacts 11 immediately under the edge of the semiconductor chip 4 which the semiconductor chip 4 immediately surrounded, always so many more internal connection rows of additional output contacts 11 . 18 each outside and below the semiconductor chip 4 possible, like retaining bars 10 can be performed between the external contact surfaces. For a large pitch such as 1 mm with 400 microns external contact surface size remain 600 microns gap, through which two lines at 200 micron plate thickness or three lines at 100 micron plate thickness inside under the semiconductor chip 4 let pass through.

With a large pitch, it is also important, holding webs 10 provide to the outside to widen the terminal grid, because in the range of maximum bond length only a few connections for additional output contacts 11 . 18 lie directly in the bondable zone. Outwardly, however, the full material thickness D is available, so that the pure dimension of the grid can be reduced to the value of the material thickness D. Accordingly, through a 600 micron gap between external contact surfaces in the bonding zone through three lines or holding webs 10 at a material thickness of 200 microns, to six lines with a material thickness of 100 microns from this zone out to corresponding outer contact rows outside the semiconductor chip 4 be guided.

The retaining bars visible from below 10 or supply lines can be covered as in the LBGA technology with a mask of solder resist, so that only the metallic outer contact surfaces remain exposed to accommodate corresponding Lötanschlußkontakte. When introducing solder mask, all recesses can be used at the same time 9 or joints 13 be filled with solder mask, which gives the overall structure a higher stability. On the exposed in the solder resist additional output contact surfaces 8th and outer edge contact surfaces 19 can be applied as in an LBGA housing solder balls, which can be formed in a tempering process to solder bumps.

10 shows a schematic cross section through full-sided holding webs 10 or lines 65 by double-sided etching under symmetrical etching masks 26 and 27 can be produced. Components with the same functions as in the preceding figures are identified by the same reference numerals and are not explained separately.

The section shown in 10 shows a system carrier 7 with a material thickness D, on the top side 23 an etching mask 26 is arranged, and on its underside 25 another etching mask 27 is arranged, wherein the two etching masks 26 and 27 aligned with each other. The etching patterns of these etching masks are identical, so that the upper etching mask 26 and the lower etching mask 27 be referred to as symmetrical etching masks. In the etching masks are embedded Ätzmaskenöffnungen 66 with a width m, resulting in the symmetrical arrangement of the etching masks 26 and 27 opposite each other.

• – beidseitiges Aufbringen von Ätzmasken 26, 27 auf eine Metallfolie, wobei die Ätzmasken 26, 27 durch Drucktechnik oder durch Fotolacktechnik aufgebracht werden können,
• – Durchlaufen der mit einer Ätzmaske abgedeckten Metallfolie eines Ätzbades, bei dem die Metallfolie von beiden Seiten entlang der Ätzschlitze in der Ätzmaske durchgeätzt wird,
• – Reinigung des geätzten Produktes vom Ätzmittel,
• – Entfernen der beidseitigen Ätzmasken 26, 27 durch Auflösen in einer entsprechenden Lösung oder durch Veraschen der Ätzmaske mittels Plasmaverfahren,
• – erneutes selektives Aufbringen einer Maske auf der Oberseite des fertigen Systemträgers zum Aufbringen, Aufdampfen oder Aufsputtern einer bondaren Beschichtung aus einem Metall wie Gold, Silber oder Legierungen derselben auf die Drahtbondflächen oder Bondfinger des Systemträgers 7.

A method for producing a suitable system carrier 7 can be done by the following process steps:

• - Double-sided application of etching masks 26 . 27 on a metal foil, with the etching masks 26 . 27 can be applied by printing technique or by photoresist technique,
• Passing through the metal foil of an etching bath covered with an etching mask, in which the metal foil is etched through from both sides along the etching slots in the etching mask,
• Cleaning of the etched product from the etchant,
• - Remove the two-sided etching masks 26 . 27 by dissolution in a suitable solution or by ashing of the etching mask by means of a plasma process,
• - Re-selectively applying a mask on the top of the finished system carrier for applying, vapor deposition or sputtering a bondaren coating of a metal such as gold, silver or alloys thereof on the Drahtbondflächen or bonding fingers of the system carrier 7 ,

Between the etching masks is first a system carrier blank 24 arranged from a metal foil or a metal plate or a metal strip whose thicknesses D are between 100 microns to 300 microns. The width m of the etching mask opening 66 is between 10 μm and 50 μm. In the case of isotropic etching, the etching solution etches material uniformly on all sides under the etching mask opening 66 away so that the etch fronts of the isotropic etch from the bottom 25 with the etching mask 27 and from the top 23 with the etching mask 26 from about in the middle of the material meet. This creates a sharp-edged profile, especially in the middle region of the system carrier blank 67 , conductor tracks 65 and holding webs 10 , which are equipped with such a contour, are in the Kunststoffpreßmasse with its sharp edge 50 embedded and anchored. The etching gap width p, which arises in this case, is approximately in the case of symmetrical etching masks p = D + m, where m is the width of the etch slot opening 66 and D is the material thickness.

At a remaining material thickness w on the top 23 of the system carrier 7 and on the bottom 25 of the system carrier can thus a minimum grid s s = w + p or s = w + m + D will be realized.

The retaining bars 10 , Cables 65 and output contacts, outer edge contacts and chip islands, not shown, which are used to produce a system carrier 7 in a system tray blank 67 be introduced by symmetrical Ätzmaskentechnologie always full-sided structures of full material thickness D from.

wobei D die Materialdicke ist, m die Breite der Ätzöffnung, p die erzeugte Ätzlücke durch isotropisches Ätzen und s das Rastermaß.Assuming realistic minimum values for the etching mask opening m of approximately 25 μm to 30 μm and a value for the width of the holding webs w of approximately 60 μm to 70 μm as the minimum required width, which is also suitable for bonding, the following values result. With a holding web width of w = 70 μm.

where D is the material thickness, m is the width of the etch hole, p is the generated etch gap by isotropic etching and s the pitch.

This pitch s applies to symmetric etching masks, as they are in 10 are shown and is only required if lines 65 or holding webs 10 be formed in bondable width with full material thickness D in both the upper and in the lower half of the material.

In an embodiment of the invention at a material thickness of D = 200 microns etching gaps p of 230 μm produced, which exactly corresponds to the upper minimum values. Considering, that process tolerances as well as the minimum value of the mask gap m and also for the path width w working at the dimension boundary for isotropic etching would not allow can as mentioned above assume that no ideal isotropic etching present and the undercut the etching mask not exactly the etching depth corresponds, so that a weak anisotropy during the etching, So an etching ratio <1, is present. By this weak anisotropy, which is the etch depth over the undercut preferred, then arise cheaper Situations, so that sufficient the necessary process tolerances for the Mask gap m and the web width despite working with minimum values of isotropic etching can be compensated.

11 shows a schematic cross section through a section of a system tray 7 etched system carrier blank 24 in which half-sided retaining webs 10 with full-sided output contacts 11 alternate. Here are the half-sided webs 10 achieved by non-symmetric Ätzmaskentechnik. The grid dimension for the half-sided holding webs 10 alternating with unilaterally greatly widened partly full-sided external contacts 11 is like in 10 s = p + m, wherein the etch gap p p = m + D is. The retaining bars 10 are alternating with full-page output contacts 11 arranged on the top 23 the system carrier also have only one width w. On the bottom 25 of the system carrier 7 intended in this embodiment of the invention, a greater width W for the external contacts 11 will be realized. If between the full-page external contacts 11 in each case a half-sided holding bridge 10 at the top 23 of the system carrier 7 is provided, so can a grid for the external contacts 11 on the bottom 25 of the system carrier 7 achieved in the embodiment according to 11 has the following order of magnitude: S = W + w + 2m + D where W is the width of the output contact 11 on the bottom 25 of the system carrier 7 , w is the width of the half-sided support bar 10 on the top 23 of the system carrier 7 , m is the width of the etch opening and D is the material thickness.

Thus, with suitable structuring of non-symmetrical etching masks sufficiently large output contacts 11 be created, while minimizing the space requirement for the holding webs 10 ,

By asymmetric etching masks 26 . 27 At the top and at the bottom half of the thickness of the material can be used for the upper and lower sides of a pipe 65 or a jetty 10 widen at the expense of the neighboring webs, eg in the area of the output contacts 11 on the bottom 25 the system carrier, so that the contact with a circuit board is facilitated with the widened areas. On the top 23 the system carrier remains the grid size unchanged at minimum size, but you can on the bottom, for example, the triple width for external contacts 11 realize, so that W = 3 w becomes.

12 shows a schematic cross section of a part of a system carrier 7 with half-sided holding webs 10 on the top 23 and on the bottom 25 of the system carrier 7 , wherein the holding webs 10 are arranged in the upper and lower half of the material thickness D. Here were on the left side half-sided lines 65 or holding webs 10 made with a material thickness d, which has a smaller width aufwei sen, as the retaining webs 10 or lines 65 on the right side of the picture. At the extreme right edge is also the contour of one side of a chip island 6 shown.

With the in 12 shown on the right half-sided support webs 10 , which still have the same bondable minimum width on one side 2 as in 10 own, can be a minimum pitch for the holding webs of s = p = m + 2 d ≈ m + p reach, where s the grid dimension for the holding webs 10 , w the entire still bondable width of the holding webs 10 , m is the width of the etch openings or etch slots, and d is about one-half the material thickness of D.

In areas where a continuous full-sided material layer is not required, thus also a smaller pitch for the metal tracks or holding webs can be 10 achieve only half the material thickness d by completely etching away the metal on one side. Practically this means that on one side w = 0 and on the other side the width w is realized.

If this width w itself is not required on one side, the etching openings with the width m can be brought closer together, at m <w, for example by m. As a result, the amount of the grid s s can be further reduced by the amount m as in 12 shown on the left, so that approximately a grid s of s = D is reached when producing holding webs 10 or wires 65 Both upper and lower halves of the material are available.

13 shows a schematic cross-sectional view of a part of a system carrier 7 with half-sided holding webs 10 or lines 65 , however, on the opposite sides as the top 23 of the system carrier 7 or the bottom 25 of the system carrier 7 support.

In this technique again non-symmetric etching masks 26 and 27 used and it is achieved a grid s, the s between the achievable grid s 12 and the 10 lies as a non-symmetrical cross-section of the lines 65 or holding webs 10 in the system tray 7 is structured. Thus presents 13 an intermediate form that does not reach the minimum pitch s, as in 12 is shown, but a smaller pitch s compared to the example in 10 ,

Thus, the partial partial support of a conductor or a line 65 or a jetty 10 can be achieved with a relatively narrow bridge on one side but full contact width on the other side. This can serve for example for support on the ground during bonding. With such an intermediate form, for example, one achieves a width of the holding web on the support side of w / 2 = 30-40 μm and on the other half wins a reduction of the grid dimension by w / 2. This means for a material thickness of 200 microns that the pitch decreases to 260 microns to 270 microns instead of 300 microns in the embodiment of 10 , Thus can be offset by alternately supported on one side support webs 10 or lines 65 as it is in 13 is shown, a grid of s = p + w / 2 to reach.

• – eine minimale Breite p der Ätzlücke bei ideal isotroper Ätzung von p = m + D (1)oder kleiner bei einem Ätzverhältnis < 1, wobei m die Breite der Ätzöffnung und D die Materialdicke ist;
• – ein Rastermaß s für die Haltestegführung oder Leitungsführung bei voller Materialdicke D von s = p + w (2)
• – ein Rastermaß s bei reiner Leitungsführung bzw. Konstruktion der Haltestege 10 auf der oberen und der unteren Materialhälfte von s = D (3)und schließlich
• – ein Rastermaß s, wenn für abgestützte Bondbereich mit versetzt abwechselnd halbseitig gestützten Haltestegen oder Leitungen gearbeitet wird, von s = p + w/2 (4),

In summary, the structure of a system carrier can be 7 optimize by exploiting the possibilities according to the invention of a wet etching technique acting on both sides, so that the following values can be achieved:

• A minimum width p of the etch gap with ideal isotropic etching of p = m + D (1) or smaller at an etching ratio <1, where m is the width of the etching hole and D is the material thickness;
• - a grid dimension s for the retaining web guide or cable routing at full material thickness D of s = p + w (2)
• - A grid s with pure wiring or construction of the holding webs 10 on the upper and lower half of the material s = D (3) and finally
• - A grid dimension s, if it is used for supported bonding area with offset alternately half-supported support webs or lines of s = p + w / 2 (4),

In addition, all can also large-scale external contacts 11 . 18 or outside edge contacts 3 or the chip island ( 6 ) are produced with a reduced material thickness d by one side by non-symmetrical masking techniques, the one half of the material, for example from the top 23 of the system carrier is removed from.

1

electronic component

2

bottom the electronic component or the

Use

3

Outer edge contacts

4

Semiconductor chip

5

plastic molding

6

chip island

7

system support

8th

additional Output contact surfaces

9

recesses

10

retaining webs

11

additional output contacts

12

separation points

13

joints

14 15, 16, 17

Bottom edge

18

additional Output contacts below the

Semiconductor chips

19

Outer edge contact surfaces

20

saw marks

21

bottom the chip island

22

back of the semiconductor chip

23

top of the system carrier

24

System insert blank

25

bottom of the system carrier

26 27

etching masks

28

bonds

29

Contact surfaces on the semiconductor chip

30

Contact pads on external contacts and

Outer edge contacts

31

Sägenuten

32 33, 34, 35

 edge sides of the component

36 37

bonds

38 39, 40

Bond wire lengths

41

sawblade

42

blade axis

43

solder layer

44

adhesive layer

45

active Top of the semiconductor chip

46

Bond wires

47

top the outer edge contacts

48

bondable coating

49

dashed line

50

sharp edged edge

51 52, 53

large external contacts

54

corners the outer edge contacts

55

Connector end faces

56

Bond finger

57

Bond areas

59

Buckle or cusp the chip island

60

Tool

61

projections

62 63

cavities

64

blind lands

65

cables

66

etch mask

300

external contacts

B

direction of rotation a saw

C

arrow

D

material thickness

d

low material thickness

a, b

Edge length of the electronic component 1

s

increment or pitch of System support structure

l

Length of Outer edge contacts

k

Edge length of the chip island

H, i

Edge lengths of the Semiconductor chip

G

distance between the semiconductor chip and external contacts

unerhalb of the semiconductor chip

b

width the outer edge contacts

m

width the etching mask opening

p

Ätzlückenbreite

S

Pitch for an arrangement of retaining bars and

Outer edge contacts alternately

W

width an external contact on the bottom of the

leadframe

Claims (40)

Electronic component with on the bottom ( 2 ) distributed outer edge contacts ( 3 ) and with at least one semiconductor chip ( 4 ) embedded in a plastic molding compound ( 5 ) embedded on one side and on at least one external contact ( 300 ) forming chip island ( 6 ) is arranged, wherein partially between the external contacts ( 300 ) Retaining bars ( 10 ) are arranged, and wherein the electronic component ( 1 ) on its underside ( 2 ) Recesses ( 9 ), which in the retaining webs ( 10 ) for external contacts ( 300 ) are arranged, wherein on the underside ( 2 ) of the chip island ( 6 ) between the external contact ( 300 ) of the chip island ( 6 ) and the outer edge contact surfaces ( 19 ) of the outer edge contacts ( 3 ) additional output contact surfaces ( 8th ) of additional output contacts ( 11 ) are arranged by retaining webs ( 10 ) in the plastic molding compound ( 5 ) are held in position, wherein at least a part of the outer edge contacts ( 3 ) and output contacts ( 11 ) with each other and with the chip island ( 6 ) in a line through the holding webs ( 10 ), and wherein through the recesses ( 9 ) the output contacts ( 11 ), the chip island ( 6 ) and / or the outer edge contacts ( 3 ) at correspondingly defined places ( 12 ) are electrically isolated from each other, whereby through the recesses ( 9 ) electrically separated holding webs ( 10 ) opposite the chip island ( 6 ), the outer edge contacts ( 3 ) and / or the additional output contacts ( 11 ) have a smaller material thickness (d). Electronic component according to Claim 1, in which at least a part of the outer edge contacts ( 3 ) and output contacts ( 11 ) Retaining bars ( 56 ), which at the same time bond fingers or lines ( 65 ) to bond areas ( 57 ) form. Electronic component according to Claim 1 or Claim 2, characterized in that the recesses ( 9 ) Parting lines ( 13 ) are. Electronic component according to one of Claims 1 to 3, characterized in that the recesses ( 9 ) Have saw marks. Electronic component according to one of Claims 1 to 3, characterized in that the recesses ( 9 ) Have etching traces. Electronic component according to one of Claims 1 to 3, characterized in that the recesses ( 9 ) Show signs of sputtering or erosion. Electronic component according to one of Claims 1 to 3, characterized in that the recesses ( 9 ) Have traces of evaporation. Electronic component according to one of Claims 1 to 7, characterized in that the recesses ( 9 ) on the bottom ( 2 ) of the electronic component ( 1 ) are arranged in a straight line. Electronic component according to one of Claims 1 to 8, characterized in that the recesses ( 9 ) on the bottom ( 2 ) of the electro-American component ( 1 ) straight and parallel to bottom edges ( 14 . 15 . 16 . 17 ) of the electronic component ( 1 ) are arranged. Electronic component according to one of the claims, characterized in that the chip island ( 6 ), the outer edge contacts ( 3 ) and / or the additional output contacts ( 11 ) have the same material thickness (D). Electronic component according to one of the preceding claims, characterized in that the openings ( 9 ) electrically separated holding webs ( 10 ) one opposite the chip island ( 6 ), the outer edge contacts ( 3 ) and / or the additional output contacts ( 11 ) have a smaller material thickness (d). Electronic component with on the bottom ( 2 ) distributed outer edge contacts ( 3 ) and with at least one semiconductor chip ( 4 ) embedded in a plastic molding compound ( 5 ) embedded on one side and on at least one external contact ( 300 ) forming chip island ( 6 ) is arranged, and wherein partially between the external contacts ( 300 ) Retaining bars ( 10 ) are arranged, and wherein the electronic component ( 1 ) on its underside ( 2 ) Recesses ( 9 ), which in the retaining webs ( 10 ) for external contacts ( 300 ) are arranged, and wherein the external contacts ( 300 ) by the on the bottom ( 2 ) of the electronic component ( 1 ) arranged recesses ( 9 ) at correspondingly defined places ( 12 ) are separated from each other, characterized in that - the underside ( 21 ) of the chip island ( 6 ) smaller than the back ( 22 ) of the semiconductor chip ( 4 ), - additional output contact surfaces ( 18 ) of external contacts ( 11 ) on the bottom ( 2 ) of the electronic component ( 1 ) in one the chip island ( 6 ) projecting portion of the semiconductor chip ( 4 ), - the additional output contact surfaces ( 18 ) and staggered between chip island ( 6 ) and outer edge contacts ( 3 ), and - the additional output contacts ( 11 ) Retaining bars ( 56 ), which at the same time bond fingers or lines ( 65 ) to bond areas ( 57 ) form. Electronic component according to one of the preceding claims, characterized in that underneath the semiconductor chip ( 4 ) arranged additional output contacts ( 11 ) one opposite the chip island ( 6 ) have reduced material thickness (d). Benefits for multiple electronic components ( 1 ) with on their undersides ( 2 ) external contacts ( 300 ) for each component position and each with at least one semiconductor chip ( 4 ), wherein the semiconductor chips ( 4 ) in rows and columns on chip islands ( 6 ) of the benefit are arranged and on one side in a plastic molding compound ( 5 ) and on external contacts ( 300 ) forming chip island ( 6 ) are arranged, wherein partially between the external contacts ( 300 ) Retaining bars ( 10 ), with which the external contacts ( 300 ) are held in position with respect to a frame of utility and where the utility on its underside ( 2 ) Recesses ( 9 ), which in the retaining webs ( 10 ) for external contacts ( 300 ) are arranged, wherein on the underside ( 2 ) between the outer contact surface of the chip island ( 6 ) and the external contact surfaces of the outer edge contacts ( 3 ) additional output contact surfaces ( 8th ) of additional output contacts ( 11 ) are arranged by retaining webs ( 10 ) in the plastic molding compound ( 5 ) are held in position, wherein at least a part of the outer edge contacts ( 3 ) and output contacts ( 11 ) with each other and with the chip island ( 6 ) are connected in a line by the holding webs, and wherein through the recesses ( 9 ) the output contacts ( 11 ), the chip island ( 6 ) and / or the outer edge contacts ( 3 ) at correspondingly defined places ( 12 ) are electrically isolated from each other, where the through the recesses ( 9 ) electrically separated holding webs ( 10 ) one opposite the chip island ( 6 ), the outer edge contacts ( 3 ) and / or the additional output contacts ( 11 ) have lower material thickness (d). Use according to claim 14, characterized in that the recesses ( 9 ) Parting lines ( 13 ) which are rectilinear and parallel to the side edges of the utility on the underside of the utility. Use according to claim 14, characterized in that the recesses ( 9 ) Have saw marks. Use according to claim 14, characterized in that the recesses ( 9 ) Have etching traces. Use according to claim 14, characterized in that the recesses ( 9 ) Show signs of sputtering or erosion. Use according to claim 14, characterized in that the recesses ( 9 ) Have traces of evaporation. Use according to one of Claims 14 to 19, characterized in that the chip island ( 6 ), the outer edge contacts ( 3 ) and / or additional output contacts ( 11 ) have the same material thickness (D). Use according to one of claims 14 to 20, characterized in that - the undersides ( 21 ) of the chip islands ( 6 ) smaller than the backsides ( 22 ) of the semiconductor chips ( 4 ), - additional output contact surfaces ( 18 ) of external contacts ( 11 ) on the bottom of the benefits in the the chip islands ( 6 ) projecting areas of the semiconductor chips ( 4 ), - the additional output contact surfaces ( 18 ) and staggered between chip island ( 6 ) and outer edge contacts ( 3 ), and - the additional output contacts ( 11 ) Retaining bars ( 56 ), which at the same time bond fingers or lines ( 65 ) to bond areas ( 57 ) form. Use according to one of claims 14 to 21, characterized in that below the semiconductor chips ( 4 ) arranged additional output contacts ( 11 ) one opposite the chip islands ( 6 ) have reduced material thickness (d). System carrier for several electronic components ( 1 ), their positions in rows and columns on the system tray ( 7 ) in a system carrier frame ( 24 ) are arranged, wherein for each component position on the underside ( 2 ) distributed outer edge contacts ( 3 ) and wherein in the center of each component position an at least one external contact ( 300 ) forming chip island ( 6 ) is arranged, and wherein partially between the external contacts ( 300 ) Retaining bars ( 10 ) are arranged at correspondingly defined locations relative to the material thickness (D) of the chip island ( 6 ) have a reduced material thickness (d), wherein between the outer contact surface of the chip island ( 6 ) and the external contact surfaces of the outer edge contacts ( 3 ) additional output contact surfaces ( 8th ) of additional output contacts ( 11 ) are arranged by retaining webs ( 10 ) are held in position, wherein at least a part of the outer edge contacts ( 3 ) and output contacts ( 11 ) with each other and with the chip island ( 6 ) in a line through the holding webs ( 10 ), and the reduced material thickness (d) of the retaining webs ( 10 ) corresponds approximately to half the system carrier thickness (D). A system carrier according to claim 23, characterized in that the reduced material thickness (d) of the holding webs ( 10 ) optionally to the underside ( 25 ) or to the top ( 23 ) of the system carrier ( 7 ) is arranged. System support according to claim 23 or 24, characterized in that the reduced material thickness (d) of a retaining web ( 10 ) in the area to the bottom ( 25 ) of the system carrier ( 7 ), in which a separation point ( 12 ) for the electrical separation of the retaining web ( 10 ) is provided while in the remaining area of the retaining web ( 10 ) the reduced material thickness (d) to the top ( 23 ) of the system carrier ( 7 ) is arranged. System support according to one of claims 23 to 25, characterized in that the reduced thickness (d) of the retaining webs ( 10 ) in the system carrier ( 7 ) by selective etching from the top ( 23 ) and / or from the bottom ( 25 ) of a system carrier blank is introduced. System carrier according to one of Claims 23 to 26, characterized in that the structure of the system carrier ( 7 ) from chip island ( 6 ), Outer edge contacts ( 3 ) and additional output contacts ( 11 ), which via retaining webs ( 10 ) with the system carrier frame ( 24 ) are introduced by means of double-sided selective etching in a system carrier blank. system support according to claim 26 or claim 27, characterized in that the system carrier blank a metal plate or a metal band with a constant Material thickness (D) is. Method for producing a system carrier from a metal plate or a metal strip as a system carrier blank, comprising the following method steps: masking the top side ( 23 ) and the underside ( 25 ) of the system carrier blank with different asymmetrically structured etching masks ( 26 . 27 ), - double-sided isotropic etching of the masked system carrier blank with one-sided thin etching of holding webs at correspondingly defined locations ( 12 ), - Generation of mutually offset in cross section holding webs ( 10 ) of reduced material thickness (d) with a grid spacing of full material thickness (D) of the system carrier ( 7 ) plus etch slot width (p) - removing the unbalanced etch masks ( 26 . 27 ). A method according to claim 29, characterized in that in a double-sided etching under full material thickness (D) of the system carrier blank chip islands ( 6 ), Outer edge contacts ( 3 ) and / or between chip islands ( 6 ) and outer edge contacts ( 3 ) arranged additional output contacts ( 11 ) a sharp-edged etch profile in the middle region of the material thickness (D) of the system carrier ( 7 ) form. Method for producing an electronic component ( 1 ) with on the bottom ( 2 ) external contacts ( 300 ) and with at least one semiconductor chip ( 4 ), in a plastic molding compound ( 5 ) is embedded on one side and on at least one external contact ( 300 ) forming chip island ( 6 ) of a system carrier ( 7 ) is arranged, between the surfaces of the external contacts ( 300 ) on the bottom ( 2 ) of the electronic component ( 1 ) Retaining bars ( 10 ) and recesses ( 9 ), the method comprising the following steps: providing a structured system carrier ( 7 ) for a plurality of electronic components arranged in rows and columns ( 1 ) with external contacts ( 300 ), which via retaining webs ( 10 ) with a system carrier frame ( 24 ), wherein in the center of each component position one external contact ( 300 ) forming chip island ( 6 ) is arranged between chip island ( 6 ) and outer edge contacts ( 300 ) in the edge region of each component position additional output contacts ( 11 ) are provided, wherein at least a part of the outer edge contacts ( 3 ) and output contacts ( 11 ) with each other and with the chip island ( 6 ) in a line through the holding webs ( 10 ), - application of semiconductor chips ( 4 ) on the chip islands ( 6 ), - manufacture of bonds ( 28 . 36 . 37 ) between contact surfaces ( 29 ) on the semiconductor chips ( 4 ) and contact pads ( 30 ) on external contacts ( 300 ) and the additional output contacts ( 11 ), - pressing a plastic molding compound ( 5 ) on the system carrier ( 7 ) or to a corresponding benefit at least in the area of the component positions, - introduction of recesses ( 9 ) on the bottom ( 2 ) of the benefit by cutting the holding webs ( 10 ) for external contacts ( 300 ) and the additional output contacts ( 11 ), whereby through the recesses ( 9 ) electrically separated holding webs ( 10 ) opposite the chip island ( 6 ), the outer edge contacts ( 3 ) and / or the additional output contacts ( 11 ) have a smaller material thickness (d). - separating the benefits into individual electronic components ( 1 ). Method according to claim 31, characterized in that the introduction of the recesses ( 9 ) By means of an erosion process in which a fluid is sprayed on the position to be picked at high pressure. Method according to claim 31, characterized in that the introduction of recesses ( 9 ) on the bottom ( 2 ) of the benefit or of each component ( 1 ) by laser evaporation of the holding webs ( 10 ) at correspondingly defined places ( 12 ) he follows. Method according to claim 31, characterized in that the introduction of recesses ( 9 ) on the bottom ( 2 ) of the benefit or of each component ( 1 ) by sawing Sägenuten ( 31 ) transversely to the retaining bars ( 10 ) he follows. Method according to claim 31, characterized in that the introduction of recesses ( 9 ) on the bottom ( 2 ) of the benefit or of each component ( 1 ) by dry etching technique of the holding webs ( 10 ) at predetermined locations ( 12 ) he follows. Method according to claim 31, characterized in that the introduction of recesses ( 9 ) on the bottom ( 2 ) of the benefit or of each component ( 1 ) by wet etching technique of the holding webs ( 10 ) at predetermined locations ( 12 ) he follows. Method according to claim 31, characterized in that the introduction of recesses ( 9 ) on the bottom ( 2 ) of the benefit or of each component ( 1 ) by means of sputtering (sputtering) of the holding webs ( 10 ) at predetermined locations ( 12 ) he follows. Method according to one of Claims 31 to 37, characterized in that, when separating the use into individual components ( 1 ) the outer edge contacts ( 3 ) on the margins ( 32 . 33 . 34 . 35 ) of the components ( 1 ) are exposed. Method according to one of claims 31 to 38, characterized in that in the manufacture of bonds ( 28 . 36 . 37 ) between additional output contacts ( 11 ) and Rußenrandkontakten ( 3 ) on the one hand and contact surfaces ( 29 ) on the semiconductor chip ( 4 ) on the other hand different bonding wire lengths ( 38 . 39 . 40 ) are introduced. Electronic component according to Claim 1, characterized in that chip island ( 6 ), Outer edge contacts ( 3 ) and / or between chip island ( 6 ) and outer edge contacts ( 3 ) arranged additional output contacts ( 11 ) a sharp-edged etch profile in the middle region of the material thickness (D) of the system carrier ( 7 ) form.