DE10147376A1 - Electronic component used in electronic devices comprises a plastic housing and a metallic support arranged in the housing with a semiconductor chip arranged on the metallic support using Flip-Chip technology - Google Patents

Abstract

Electronic component comprises a plastic housing (2) and a metallic support (3) arranged in the housing. A semiconductor chip (4) is arranged on the metallic support using Flip-Chip technology. The support has outer contacts (5) in complete material thickness (D) and outer contacts (6) of reduced material thickness (d). The outer contacts are connected directly to flip-chip contacts (7) of the active upper side (8) of the semiconductor chip (4). Independent claims are also included for (1) a system support for several electronic components; and (2) a process for the production of the system support.

Description

The invention relates to an electronic component and a System carrier and method for their production according to the Genre of independent claims.

Electronic components that have a plastic housing can accommodate a semiconductor chip that by means of Bond connections with a carrier within the plastic housing connected is. Such components, manufactured by Bonding technology, as described in the document DE 100 04 410 A1 are fundamentally different from electronic components that have a semiconductor chip with a have metallic carrier on which a semiconductor chip in flip Chip technology is arranged as it is from the document DE 199 21 867 C2 is known.

A difference between such a flip-chip assembly for a bond assembly is that the semiconductor chip at Flip-chip assembly is not applied to a chip island, but arranged on a complex rewiring plate is on the rewiring lines from the microscopic small flip-chip bumps to macroscopically large ones Terminal pads are made to be macroscopic arranged and correspondingly large external contacts of the to contact electronic component. It is about ensure that the microscopic flip chip contacts like Solder bump, when soldering onto appropriate metal surfaces Rewiring lines not uncontrolled on the side can flow apart, the rewiring plate with a Provide solder mask.

Both the manufacture of a rewiring board as well the structuring of a solder mask on the Rewiring boards require complex and costly Manufacturing steps. Thus, an electronic component with one Semiconductor chip in flip-chip assembly much more expensive than one Component in bond wire assembly. If the solder mask for Cheaper electronic component in flip-chip assembly omitted, there is not only a risk that the solder the flip chip solder bump dissolves and there is no contact comes, but also that short circuits occur because at Applying the semiconductor chip to the rewiring board Solder bumps flow into each other or because of solder in the gaps penetrates between adjacent connections and this Connections bridged electrically.

The object of the invention is an electronic component specify that a semiconductor chip in its plastic housing with flip-chip contacts in flip-chip assembly, without a solder mask or a rewiring plate in the Provide plastic housing and additional mechanical and thermomechanical loads on the flip-chip connection reduce and creepage distances for the penetration of ions and that Moisture penetration from outside to extend the chip.

This task is solved with the subject of the independent Expectations. Advantageous developments of the invention result itself from the dependent claims.

According to the invention, the electronic component has a Plastic housing with partly in the plastic arranged metallic carrier, being on the metallic Carrier a semiconductor chip is arranged in flip-chip technology. The metallic carrier has full external contacts Material thickness and contacts of reduced Carrier material thickness, with the connection contacts with reduced Carrier material thickness directly with flip-chip contacts Active top of the semiconductor chip are connected. To are the connection contacts on the microscopic flip Chip contacts through holding bars of diminished Carrier thickness positioned while the macroscopic External contacts of the electronic component with holding bars reduced thickness of the carrier material with the connection contacts are connected. In this context, under microscopic understood an order of magnitude <0.3 mm, which is only one Light microscope is measurable and under macroscopic one Size> 0.3 mm, which can be measured with the naked eye.

An advantage of this electronic component is that that the semiconductor chip with its flip chip contacts directly on the corresponding contacts metallic carrier is arranged so that a complex Rewiring board and the complex application of Solder resists on the rewiring plate are not required. Consequently is already through the dimensioning and manufacture of the metallic carrier rewiring via the holding bars of the metallic support. It is with the solution according to the invention requires no additional components, order from the flip-chip Contacts of a semiconductor chip on the in macroscopic Spacing the electronic contacts Component to pass. Even the thermal and mechanical Decoupling between the semiconductor chip with flip-chip contacts and the support structure is through in a very simple manner the retaining bars are loosened with reduced material thickness.

In a further embodiment of the invention, the External contacts on the underside of the plastic housing arranged. To do this, the holding bars that the external contacts with connect the connection contacts and the flip-chip contacts, are brought to half the material thickness in such a way that not visible from the bottom of the electronic component are and therefore completely in plastic housing are embedded. This embodiment of the invention has the Advantage that a connection of the external contacts with corresponding contact pads of a circuit board or one Ceramic substrate can be performed reliably because of a Melting of the connecting means between the external contacts of the electronic component and the contact pads a circuit board or a ceramic substrate becomes. Such an electronic component can thus extremely precise on a printed circuit board or one Ceramic substrate positioned and connected to it.

In another embodiment of the invention provided that external contacts on the side edges of the electronic component are arranged. Such external contacts the side edges are also called outer edge contacts and have the advantage that on these from the side edges of the electronic component can be accessed. At the same time, these external edge contacts of the electronic Access to the component from the bottom also. The has the advantage that such an electronic component extremely flexible in the different electronic Circuits and test devices can be installed.

Another embodiment of the invention provides that the contacts on the top of the plastic housing are arranged. Such a component results in advantageously the possibility of both the Bottom of the electronic component as well as from the top of the electronic component from on the contacts of the electronic component with the semiconductor chip with flip chip Contacts, from the top over the contacts and from the bottom of the To have external contacts access. This fulfills such a requirement electronic component an advantageous prerequisite for the possibility of stacking such components.

In a further embodiment of the invention, the Connection contacts on the contact base, one to the flip Chip contacts of the semiconductor chip congruent Have contact pad and with the flip-chip contacts are connected. By the on the contact pads attached contact base there is another way that Dimension of the connecting contacts to further reduce and to match the size of the flip chip contacts so that one congruent contact pad to the flip-chip contacts is realized on the connecting contacts. This Embodiment of the invention facilitates the connection of the metallic carrier with the semiconductor chip in flip-chip Technology and prevents the solder from spreading.

In a further embodiment of the invention, the External contacts with the connection contacts partly over electrically conductive holding bars mechanically and / or electrically connected. The holding bars have a reduced Backing material thickness. The holding bars therefore have two Functions in this embodiment. On the one hand, they stop the external contacts and the connecting contacts in position for a packaging of the electronic component in one Plastic housing compound and on the other hand connect the holding bars the external contacts with the connecting contacts, while this again with the flip-chip contacts of the semiconductor chip are connected.

Due to the reduced thickness of the support webs is advantageously a decoupling of the mechanical and thermomechanical loading of the flip-chip connection between connection contacts and flip-chip contacts realized the load on the sensitive flip-chip contacts greatly reduced. In addition, the creepage distances are for one Penetration of ions and / or moisture from the outside to the chip through the plastic housing compared to the known solutions extended. The advantage is that the lifespan such electronic components is improved.

In another embodiment of the invention it is provided that the carrier has a potential line, which at least partially a reduced substrate thickness has and is surrounded by plastic mass. Such Potential line has the advantage that it runs across the Plastic housing can be arranged and thus a additional anchoring for holding bars and connecting contacts and external contacts. In addition, from one such a line a potential, for. B. mass or supply different connection contacts and external contacts distributed become.

In a further embodiment, the plastic housing has of the invention on its underside cutouts that partly in holding bridges to contacts and / or in Retaining bars are arranged to external contacts and these cut. Such a severing of the holding webs with Using cutouts from the bottom of the Plastic housings are extremely useful when these holding bars only for positioning, but not for Making electrical connections. So can through a simple separation step after packing one Variety of electronic components on the bottom one mechanical connection between external contacts and Connection contacts or external contacts and ground line cut to insulated, single external contacts on the To create the bottom of the electronic component.

Such cutouts can be in one embodiment of the Invention on the underside of the plastic housing Saws are brought in so that the bottom of the case Saw grooves having a predetermined number of Interrupt the holding bars electrically. This interruption of Holding bars are only provided for the holding bars that just a mechanical function when packing the Provide electronic component in a plastic housing.

In a further embodiment of the invention it is provided that some external contacts also diminished Have carrier material thickness and one on the top Wear contact base that has a contact pad has, which is congruent to a flip-chip contact. With This embodiment achieves that provided Positions the flip-chip contacts directly into external contacts can pass by the flip chip contacts and their microscopic connection contact surfaces with the accordingly reduced and congruent contact pad one reduced or reduced to half the material thickness External contact can be applied. This can especially in Center of the electronic component for reasons of space Be an advantage. Only in the area of congruent Contact pads have these external contacts the full Material thickness of the carrier.

The electronic component has another Embodiment of the invention cranked retaining webs. This Retaining bars are between contacts on the top of the electronic component and external contacts on the bottom arranged of the electronic component and connect them electrical and mechanical. Thus, the cranked Retaining bars connect the contacts on the top of the electronic component mechanically fixed and electrical connected, which has the advantage that the electronic component access from both the top and the Bottom side to the flip-chip contacts of the semiconductor chip allows. In addition, in this embodiment, the Invention of the semiconductor chip with its flip-chip contacts arranged hanging on the connection contacts. simultaneously the cranked retaining bars offer limited protection the flip-chip connections when packaging the carrier in a plastic housing compound, because in this process the cranked ridges the edges of the semiconductor chip Protect mechanical damage from molds.

In a further embodiment of the invention is on the Top of the electronic component one Rewiring layer arranged. The redistribution layer connects via rewiring the connection contacts on the Top of the electronic component with external contacts the top of the component. That has the advantage that over very short lines another electronic component can be built directly on the first, e.g. B. a Memory component on a logic component. It is not a separate one Rewiring board in the form of an organic circuit board or ceramic carrier material with double-sided structured metallization and plated-through holes required, rather, the component surface itself is the carrier for rewiring lines. This allows several electronic components such. B. a chipset very compact and with fewer joints are vertically integrated with many advantages over extensive module integration, z. B. less space, short lines, simple Testability of the individual components, possibility of repair through Exchange components of a stack because it is not as a whole is encapsulated or potted.

Through the cranked retaining webs in this embodiment of the invention are the contacts on the top without corresponding rewiring not congruent with the External contacts arranged on the underside. In a Another embodiment of the invention are those with the Rewiring layer generated external contacts on the top to the External contacts are congruently arranged on the underside are. Such an electronic component now instructs identical places on the top and bottom External contacts for one flip-chip contact each Inside of the electronic component. This embodiment of the Invention has the advantage that with the same Test facilities and with the same test procedures both the bottom and also tested the top of the electronic component can be.

There is also the possibility of another Specify embodiment of an electronic component in which several electronic components are stacked on top of each other. The congruent external contacts on the Top and bottom of the electronic component can electrical in the vertical stack by simple measures be connected to each other. Such measures can in a conductive adhesive technique or a soldering technique, making a compact, electronic component from several stacked electronic components. The hallmark of this stack is that on the one hand Semiconductor chips with flip-chip contacts arranged in the stack are and on the other hand cranked holding webs electrically External contacts on the underside with connection contacts on the Connect top, which in turn over Rewiring cables with external contacts on the top electrical are connected.

In a further aspect of the invention, it is provided that that a system carrier for several electronic components is conceived. This system carrier has structured Component positions for each of the electronic components, each component position surrounded by a leadframe is. At the same time, the system carrier points in its Perforations on the edge, with which the position of each Component positions for a corresponding one Pick and place machines can be defined. Points in each of the component positions the system carrier frame retaining webs to external contacts and Holding bridges to connecting contacts towards a central one Area in the component position. All external contacts and all connection contacts are thus fixed in their position, so that a correct placement of a semiconductor chip with Flip-chip contacts can be made on the connection contacts. This is done in an automatic placement machine. there is not a chip island for attaching the Semiconductor chips are required, rewiring boards are also included To provide solder stop patterns. Such a system carrier thus cheaper the production of electronic components.

In a further embodiment of the invention, the External contacts have a full system carrier material thickness. The external contacts show a profile in cross section this system carrier material thickness, the projections in Center area of material thickness shows. These projections in Center of the material thickness improve the anchorage of the External contacts in the plastic housing compound during packaging of the electronic components.

In a further embodiment of the invention, the Terminal contacts a reduced system carrier material thickness on. The external contacts can thus be extremely delicate run and to the flip chip contacts of the Semiconductor chips that are at a microscopic distance from each other are arranged to be performed without it Short circuits between the holding bars and especially between the Connection contacts comes. It also makes them later completely encased by the plastic housing compound and protected.

In a further embodiment, the external contacts can of the invention in at least one component position in one Outer ring may be arranged. These external contacts in the Outer ring also have external contact surfaces on the Bottom and on the edges of the electronic component and thus allow access to these external contacts from several sides. You can also choose between for external contacts of an outer ring retaining webs of another inner ring can be arranged from external contacts.

In a further embodiment of the system carrier the retaining webs have a reduced base material thickness. This will make the holding bars more flexible and therefore also the External contacts or the connecting contacts with these Ties are connected. This has the advantage that the Connection to the flip-chip contacts of the semiconductor chip is less burdened.

In another embodiment of the invention it is provided that the system carrier has a potential line, which extends from one side of the lead frame to extends opposite side of the leadframe. On the one hand, this potential line can be used electrically are to be provided on external contacts or correspondingly provided connection contacts to a potential on the other hand, it can also simultaneously mechanical stability of the filigree structure in each Increase component position. This ensures the security of the positioning the flip-chip contacts of the semiconductor chip on the System carrier improved in every component position.

In another embodiment, the potential line has the invention at least partially a diminished System carrier material thickness and is there in the Plastic housing compound can be embedded. This has the advantage that the Potential line is anchored and even at least in critical Areas from the bottom of the electronic component can be contacted directly. Rather be Corresponding external contacts are provided which cross to the holding webs Earth line in connection with this. Furthermore, the Potential line on both sides of the housing component from be contacted outside, which is a functional test facilitated. In addition, a potential line also impedes reduced material thickness encasing with plastic housing compound fewer. In another embodiment of the invention it provided that the leadframe cranked retaining webs has a bulge against the Form system carrier frame. This creates one in each component position such bulge from cranked retaining webs, with what Connection contacts on the top and the external contacts on the Bottom when casting the system carrier in each Component position can be arranged to an electronic component.

In a further embodiment, the external contacts have the invention a reduced system material thickness and a contact base on a contact pad which is congruent to a contact surface of a flip-in Chip technology is to be arranged semiconductor chips. Thus leaves for a defined number of external contacts that directly opposite a flip-chip contact, in each case attach an external contact directly by the congruent, microscopic contact pad of the contact base of the external contact with the connection contact surface of an in Flip-chip technology connected semiconductor chips connected can be. This can be done especially in the center of the component Be advantageous for reasons of space.

Another embodiment of the invention provides that the connection contacts of a system carrier an embossing have, which has a base that one to one Connection contact surface of a to be arranged in flip-chip technology Has semiconductor chips congruent contact pad. With such an embossing, on the one hand Material thickness of the contacts further reduced and on the other hand, the material partially into one Terminal contact surfaces to be arranged in flip-chip technology Formed semiconductor chips adapted contact base. This stamping technique can still be used at the level of the system carrier, to such a formation of contacts to reach. The contact base also makes a wide one Prevents solder from flowing.

A system carrier is thus available for further processing Available, on the one hand, exactly positioned and mechanically provides held contacts of a special stamping, which exactly on the arrangement of microscopic flip Chip contacts are aligned and adjusted. on the other hand the system carrier sees macroscopically arranged External contacts before that immediately after potting the system carrier in a plastic housing compound for functional tests of the Bottom of the packaged in plastic case System carrier are available from.

• - Maskieren der Oberseite und der Unterseite des Systemträgerrohlings mit unterschiedlichen, zueinander unsymmetrisch strukturierten Ätzmasken,
• - doppelseitiges Ätzen des maskierten Systemträgerrohlings unter einseitigem Dünnätzen von Haltestegen und Anschlußkontakten, sowie einem vorbestimmten Anteil der Außenkontakte und/oder der Potentialleitungen,
• - Entfernen der unsymmetrischen Ätzmasken,
• - Strukturieren der Anschlußkontakte zu Anschlußkontakten verminderter Materialstärke mit Kontaktsockel, der eine Kontaktanschlußfläche aufweist, die kongruent zu einem Flip-Chip-Kontakt eines Halbleiterchips ist,
• - Strukturieren einer vorbestimmten Anzahl von Außenkontakten verminderter Materialstärke zu Außenkontakten mit Kontaktsockeln, die eine Kontaktanschlußfläche aufweisen, die kongruent zu einem Flip-Chip-Kontakt eines Halbleiterchips ist.

A method for producing a system carrier from a metal plate or a metal strip as a system carrier blank has the following method steps:

• Masking the top and bottom of the system carrier blank with different etching masks which are structured asymmetrically with respect to one another,
• double-sided etching of the masked system carrier blank with one-sided thin etching of retaining webs and connecting contacts, and a predetermined proportion of the external contacts and / or the potential lines,
• - removing the asymmetrical etching masks,
• Structuring of the connection contacts to connection contacts of reduced material thickness with a contact base which has a contact connection surface which is congruent with a flip-chip contact of a semiconductor chip,
• - Structuring a predetermined number of external contacts of reduced material thickness to external contacts with contact sockets that have a contact pad that is congruent with a flip-chip contact of a semiconductor chip.

Such a method has the advantage that with relative a complex system carrier at low cost a filigree pattern can be produced for each component position from holding bars, connecting contacts and external contacts having. Through the networking of the footbridges mechanically the position of the individual external contacts and Connections secured and thus enables that a reliable Semiconductor chip in flip-chip technology in every component position can be arranged. Only after attaching the Semiconductor chips and after potting in one Plastic housing compound is cut through this network of retaining webs, so that external contacts on the underside of the electronic component are accessible and within the Plastic compound a connection between contacts of the carrier and flip-chip contacts.

In a further embodiment of the invention, this is done Structuring the connection contacts and / or the predetermined Number of external contacts using stamping technology. This technique has the advantage that for several at the same time Connection contacts and external contacts can be stamped on a base, while the connection contacts continue to coincide at the same time be formed thin.

Another embodiment of the invention provides that structuring the predetermined number of external contacts using double-sided etching technology. At this double-sided etching technology can advantageously on the one On the side of the external contact, a socket is created reduced, microscopic contact pad which is congruent to the connection contact surfaces of the flip Chip contacts is while on the bottom of the electronic component an external contact surface provided that takes on macroscopic dimensions.

In another implementation of the procedure the holding bars partially cranked so that connecting contacts to be raised relative to the leadframe while doing so Bulges are formed in each component position, which hang the semiconductor chips in flip-chip technology can. Such bulges make it easier at the same time Adjustment of the component positions in an automatic placement machine and thus protect the sensitive semiconductor chips that are in hanging from the placement machine in the component positions be introduced. For this purpose, the connection contacts are such arranged that the arrangement of flip-chip contacts, the semiconductor chips to be assembled using flip-chip technology correspond.

While the flip-chip contacts of the semiconductor chip in one microscopic arrangement are present, the External contacts arranged in a matrix form with macroscopic distances and are mechanical and via holding bars electrically with the connection contacts that are congruent to the flip Chip contacts are arranged, connected. The transition from the matrix form of the external contacts of the system carrier to the microscopic arrangement of the flip-chip contacts is made over the thin-etched or thin-shaped holding webs realized, so that rewiring boards and other other components are not necessary to an inventive to realize electronic component.

• - Herstellen eines Systemträgers mit mehreren Bauteilpositionen, die von einem Systemträgerrahmen umgeben sind und eine Struktur mit Außenkontakten, Anschlußkontakten und dazwischen angeordneten Haltestegen verminderter Systemträgermaterialstärke aufweisen, wobei die Anschlußkontakte und eine vorbestimmte Anzahl von Außenkontakten mit Sockelansätzen strukturiert werden, die zu Flip- Chip-Kontakten des Halbleiterchips kongruente Kontaktanschlußflächen aufweisen,
• - elektrisches Verbinden eines Halbleiterchips mit seinen Flip-Chip-Kontakten in Flip-Chip-Technik mit den Kontaktanschlußflächen der Anschlußkontakte und/oder der vorbestimmten Anzahl von Außenkontakten in jeder Bauteilposition,
• - Verpacken der Bauteilpositionen in einer Kunststoffgehäusemasse,
• - Einbringen von Aussparungen auf der Unterseite des Systemträgers in jeder Bauteilposition zum Auftrennen von Haltestegen, die nicht für eine elektrische Verbindung vorgesehen sind, an entsprechend vorbestimmten Stellen,
• - Auftrennen des Systemträgers zu einzelnen elektronischen Bauteilen.

A method for producing an electronic component with a plastic housing and a semiconductor chip arranged in the plastic housing using flip-chip technology has the following method steps:

• - Manufacture of a system carrier with a plurality of component positions, which are surrounded by a system carrier frame and have a structure with external contacts, connecting contacts and interposed holding bars of reduced system carrier material thickness, the connecting contacts and a predetermined number of external contacts being structured with base attachments which form flip-chip contacts of the semiconductor chip have congruent contact pads,
• electrical connection of a semiconductor chip with its flip-chip contacts using flip-chip technology to the contact connection areas of the connection contacts and / or the predetermined number of external contacts in each component position,
• - packaging of the component positions in a plastic housing compound,
• Introducing cutouts on the underside of the system carrier in each component position in order to separate holding webs, which are not intended for an electrical connection, at correspondingly predetermined locations,
• - Unraveling the system carrier into individual electronic components.

This procedure has the advantage of several Process steps simultaneously for a variety of electronic Components can be carried out. While loading of the system carrier with semiconductor chips in one Pick and place machines can be carried out, with individual Semiconductor chips in flip-chip technology on or in the component positions can be installed, the plastic housing compound as one entire layer can be applied to the system carrier, so that a plastic plate with built-in system carrier for multiple component positions and fully connected Semiconductor chips in flip-chip technology are created. This Plastic plate can hold several components on the bottom can be structured by using cut-outs or Laser technology can be introduced to the external contacts on the Separate bottom of the electronic component and all To cut holding bars, which are only mechanical Positioning of external contacts. With such a Technology is linked to savings as the Process steps for several electronic components at the same time can be carried out.

Another example of implementation of the method provides that the separation of holding bars by introducing Saw grooves on the underside of the system carrier and / or on the Bottom of the electronic component is carried out. These saw grooves have the advantage that they are very precise their depth of cut can be adjusted and that the Saw grooves can be introduced with a relatively simple technique.

Another implementation example of the method is provided that the separation of holding bars by Making recesses on the bottom of the electronic component for separating the holding webs at predetermined Places is carried out by laser ablation. This Laser ablation technology has the advantage that the components cannot pass through Saw grooves are weakened on the bottom, but only selective cutouts by laser ablation there be attached where holding bars that are only mechanical purposes serve, to be separated.

In another embodiment of the method provided that in the system carrier in each component position a bulge introduced by cranking the retaining webs in which the semiconductor chip in flip-chip technology is arranged. Such bulges caused by cranking the Holding bars also have the advantage that they are limited the semiconductor chip from damage when introducing the Protect the plastic housing compound.

In another implementation example of the method when packaging the arrangement of semiconductor chip and Component position with bulges in a plastic housing compound Mold used, the mold a Has mold cavity, in which the external contacts in a lower Sealing film and the contacts in an upper sealing film emboss so that after the injection molding process Connection contacts from the top of the plastic housing by a few Stick out micrometer and the external contacts on the bottom of the plastic housing protrude a few micrometers. at This double-film potting technique offers the possibility that the exposure of the external contacts on the bottom and of the connection contacts on the top by pressing in the contacts in the sealing film is guaranteed. So can the function of the individual electronic components the system carrier and after introducing the above Cutouts can be tested immediately.

In another implementation examples of the method are additional procedural steps are envisaged to take place on the To create the top of the plastic housing compound external contacts for the direct construction of at least one further electronic Component. To do this, the tops of the electronic Components after packaging the electronic components the lead frame with a rewiring structure coated. This rewiring structure has Rewiring lines that differ from those located on the top Contacts to contact pads on the top extend. These contact pads on the top of the electronic component are end faces of the Rewiring.

The contact pads are made with external contacts a selective application of these external contacts on the Top of the electronic component is populated in positions that the positions of the external contacts on the underside of a correspond to the second electronic component. Through this additional process steps is advantageously achieved in that on such electronic components with cranked Retaining bars, flip-chip-mounted semiconductor chips and with rewired connection contacts to external contacts others electronic components can be assembled directly with short Connections and without additional rewiring plates the rewiring can thus be stackable electronic Components are formed. It can therefore have multiple components vertically one above the other to a new, complex electronic Component or module can be stacked.

Another implementation example provides that the External contacts on the top selectively applied in positions the positions of the external contacts on the Correspond to the bottom of the electronic components.

This process creates components with the same size positioned external contacts on the top and on the Underside that electrically with the same flip chip contact are connected. This has the advantage that the component is both from above as well as from below with the same test equipment can be tested and that very simply several similar components can be stacked vertically one above the other, for example memory components. This can be very flexibly different storage capacities on the same Realize installation space on a printed circuit board.

See another implementation example of the method before that the application of rewiring lines and External contacts on the top of the electronic components for several components of a system carrier at the same time he follows. Because the rewiring lines at the same time applied for several components on one system carrier considerable costs can be saved that otherwise arise when reworking individual components would.

Summarize with the component according to the invention and the inventive method a flip chip assembly in "leadless" QFN housings enabled. In addition, you can Housing shapes are created that have a high density External contacts on the underside of an electronic component in Have matrix form, as is the case with BGA housings (ball grid arrey housings) is possible. However, with this technology no rewiring plate used and none Solder mask required. Also on elongated solder columns and elastic connections between external contacts and flip Chip contacts can be made with the technology according to the invention to be dispensed with, since retaining webs with reduced Material thickness can be provided, which is an elastic Connection between external contacts and flip-chip contacts of the Realize semiconductor chips.

The shape of the connection contacts with a contact base can be done by embossing or by etching. A targeted local passivation against solder wetting, for example by oxidation of a zone heated by a laser done easily. A flat passivation can be carried out to solder the system carrier to prevent, by subsequently opening Contact connection areas on the connection contacts respectively Contact socket z. B. using a laser connecting with the flip chip contacts of the semiconductor chip to limited Areas of the contacts can be concentrated.

Wherever possible and sensible, it is used as protection against mechanical stress and moisture an external contact of the Housing not immediately under a flip-chip contact arranged, but not offset to one if possible rectilinear retaining web, the thickness of the Retaining webs to a smaller material thickness of the System carrier is reduced and wherein at least the embossed part of the Bridges with the contact base in the soldering zone for the flip Chip contact is thinner than the rest of the web thickness. On such connecting web, which is electrically the external contacts connects to the contacts, runs after Possibility within the plastic molding compound to get it in front To protect damage and to prevent outside unintentional short circuits can be introduced.

By inserting or stamping contact bases in connection with the retaining webs of reduced material thickness created a flexible connection, the mechanical and thermomechanical loads on the flip-chip contacts reduced. According to the invention, a technology is created which the creation of a defined solder wetting area for a Allows flip-chip mounting on metal structures. This Technology is especially for finely structured and metal structures not necessarily in one plane suitable. In addition, the technology to manufacture of "leadless" housings of the QFN type. The technical possibilities of the new technology, like both and half-sided etching of the system carrier blanks, embossing and Tapping off contacts or making Lead bars are used in such a way that both a encapsulated flip chip including underfill materials as CSP (chip-sized package) can be made as well Substrate-free "fan-out or fan-in" solutions for rewiring.

The invention will now be described with reference to embodiments explained in more detail on the accompanying drawings.

Fig. 1 is a schematic cross-sectional view showing an electronic component of a first embodiment of the invention,

Fig. 2 shows a schematic cross section through a system carrier with etch profiles of electronic components according to FIG. 1,

Fig. 3 is a schematic view showing an underside of an electronic component to a second embodiment of the invention,

FIG. 4 shows a schematic cross-sectional view of the electronic component of the second embodiment of the invention along the section line AA in FIG. 3,

Fig. 5 shows a section of a schematic top view of a part position of a leadframe with a positioned semiconductor chip in a flip-chip technique before packaging of the component position for an electronic component of a third embodiment of the invention,

Fig. 6 shows a schematic cross-section through an electronic component of the third embodiment of the invention taken along section line BB in Fig. 5,

Fig. 7 shows a schematic cross-section through an electronic component of a fourth embodiment of the invention,

Fig. 8 shows a schematic cross-section through an electronic component, comprising a stack of electronic components of the fourth embodiment of the invention.

Fig. 1 is a schematic cross-sectional view showing an electronic component 1 of a first embodiment of the invention. The reference number 2 denotes a plastic housing. The reference symbol 3 denotes a metallic carrier on which a semiconductor chip 4 is positioned. The reference number 5 denotes external contacts on the underside of the electronic component 1 , which protrude by a few micrometers from the plastic housing mass 16 of the plastic housing 2 . The reference number 6 denotes a connection contact and the reference number 7 flip-chip contacts of the semiconductor chip 4 , which are connected to the connection contacts 6 of the metallic carrier 3 via contact connection surfaces 13 of the connection contacts 6 .

The reference numeral 8 denotes an active upper side of the semiconductor chip, on which the flip-chip contacts 7 are arranged, the size and spacing of the flip-chip contacts 7 being microscopic, which in this context relates to an order of magnitude that can only be achieved with the aid of of a light microscope becomes measurable. In contrast, the external contacts 5 are arranged on the underside 9 at intervals which are of a macroscopic order, that is to say these intervals can be measured and recognized with the naked eye.

The reference number 9 denotes the underside of the plastic housing and thus also the underside of the electronic component 1 . The reference number 10 identifies the side edges of the electronic component and thus also the side edges of the plastic housing. The reference symbol 11 denotes the top of the plastic housing and thus also the top of the electronic component 1 .

The reference numeral 14 designates holding webs which hold the external contacts 5 and the connecting contacts 6 in position until the packaging of the electronic component 1 in a plastic housing compound 16 has been completed. In this first embodiment of the invention, the holding webs 14 have half the material thickness D of the carrier 3 . This material thickness, reduced to half the material thickness, is marked with the letter d. The height of the electronic component is thus composed of the material thickness D of the system carrier in the range between 0.05 and 1.2 mm and the semiconductor chip 4 mounted in flip-chip technology on the connection contacts 6 of the electronic component. This contributes to the height of the electronic component in the range between 0.05 and 1.2 mm, so that a total height H of the electronic component results in the range from approximately 0.1 to 2.4 mm. Due to the low material thickness of the holding webs 14 , these can be produced in an extremely filigree and elastic manner, so that the stresses which act on the connection between the microscopic flip-chip contacts 7 and the connecting contacts 6 due to expansion differences are reduced.

With Fig. 1 are four differently arranged external contacts 42, shown 43, 44 and 45 in cross-section, each representing a particularly advantageous embodiment of external contacts. The external contact 42 is arranged on the underside of the electronic component and at the same time has an external contact surface on the side edge 10 of the electronic component. All external contacts 42 , which at the same time also have edge-side contacts, form an outer ring of external contacts on the underside 9 of the electronic component 1 and are connected via holding bars 14 to individual, microscopic flip-chip contacts 7 via the connecting contacts 6 .

The external contact 43 is an example of an external contact of a second ring of external contacts on the underside of the electronic component and has a special profile of the external contact. This profile is characterized by protrusions in the middle of the cross section. These projections arise during the manufacture of the carrier 3 for the electronic component 1 . The external contact 43 from the second ring of external contacts is connected to a connection contact 6 via a relatively long elastic holding web 14 of reduced carrier material thickness d.

The connection contact 6 of this embodiment is formed from the material of the holding web 14 by embossing, an embossing die further reducing the connection contact 6 compared to the material thickness of the holding web 14 and at the same time forming a contact base 12 on the connection contact 6 . The contact base has on its outer end a contact pad 13 which is congruent with the contact pad of the flip-chip contact 7 . An electrical connection from macroscopic external contacts 42 or 43 to microscopic connecting contacts 6 can thus be created with the aid of the contact base 12 .

While the external contacts 42 and 43 are arranged in an area of the plastic housing mass 16 which is kept free from the semiconductor chip 4 , the connection contact 44 lies below the semiconductor chip 4 and has a holding web 14 which extends from the predetermined position within an external contact matrix to the position a flip-chip contact 7 of the semiconductor chip 4 leads. At the end of the holding web 14 , this is in turn formed into an external contact 6 with a contact base 12 .

A further version of an external contact on the underside 9 of the electronic component 1 is shown by the reference symbol 45 . In this external contact 45 , the positions of the external contact 45 and the flip-chip contact 7 are congruent, so that a specially shaped external contact 45 is formed here, which has a macroscopic surface on the underside of the electronic component 1 and in the upper region of the external contact 45 is reduced to the microscopic area of the flip-chip contact 7 . Such an external contact, which is directly connected to a flip-chip contact 7 , can only be used at locations where the flip-chip contacts are at macroscopic distances from one another.

In addition to the different versions of the external contacts 42 , 43 , 44 and 45 , FIG. 1 shows a buried potential line 15 which is arranged across the electronic component 1 below the semiconductor chip. This potential line 15 can, on the one hand, connect contacts of the same potential to one another and to the semiconductor chip 4 and, on the other hand, it serves for the mechanical stabilization and holding of external contacts and connection contacts via corresponding holding bars, which are separated again after packaging the system carrier 23 with the semiconductor chip 4 applied.

For this purpose, recesses 17 are introduced from the underside of the electronic component 1 into the plastic housing compound 16 at the points at which retaining webs 14 , which had only mechanical functions, are separated. In contrast, retaining bars, which also establish an electrical connection, are not separated, as is shown, for example, in FIG. 1 between the external contact 43 and the connection contact 6 . The metallic carrier 3 , which has both external contacts 5 and retaining webs 14 and ends of retaining webs 14 which are embossed with connection contacts 6 , is formed from a system carrier 23 which has a plurality of component positions and within each component position 50 of the system carrier 23 such a metallic carrier 3 for a forms individual electronic component 1 .

FIG. 2 shows a schematic cross section through a system carrier 23 with etching profiles for components 5 , 6 , 14 and 15 of an electronic component 1 according to FIG. 1. Components with the same functions as in FIG. 1 are identified by the same reference symbols and are not discussed separately.

For this purpose, Fig. 2 shows a schematic cross section through a detail of an etched to form a system carrier 23 system carrier blank 22 alternate in which unilateral holding webs 14 with fully-side outer contacts 5. The half-sided webs 14 are achieved by means of non-symmetrical etching mask technology. The spacing s strong for the unilateral holding webs 14, alternating with one-sided widened part fully-side external contacts is w 14 with the narrower width:

s = p + w,

where the etching gap p

p = m + D

is. In this schematic representation, the holding webs 14 are arranged alternately with full-sided external contacts 5 , which have a reduced width w for holding webs 14 or for contact connecting surfaces 13 , 20 of a connecting contact 6 or an external contact 5 on the upper side of the system carrier on the upper side 31 of the system carrier 23 is compatible with the width of flip-chip contacts 7 of the semiconductor chip 4 . In this embodiment of the invention, a larger width W for the external contacts 5 is to be realized on the underside 32 of the system carrier 23 . When each unilateral holding rib 14 is provided on the top side 31 of the lead frame 23 between the fully-side external contacts 5, so a pitch for the external contacts 5 can be achieved 23 on the underside 32 of the leadframe, which in the embodiment of Fig. 1 and Fig. 2 has the following size:

S = W + w + 2m + d,

where W is the width of the external contact 5 on the underside 32 of the system carrier 23 , w is the width of the half-sided holding web 14 on the top 31 of the system carrier 23 , m is the width of the etching opening and D is the material thickness of the system carrier blank 22 .

Thus, with suitable structuring of non-symmetrical etching masks 33 and 34, sufficiently large external contacts 5 can be created, with at the same time minimal space requirement for the holding webs 14 and minimal width w for contact connection areas 13 , 20 for flip-chip contacts 7 of the semiconductor chip 4 , as shown in FIG Fig. 1 are shown.

By means of asymmetrical etching masks 33 and 34 at the top and bottom, an electrical line, such as a potential line 15 or in the form of holding bars 14 , can be widened in regions with half the material thickness D / 2 on the top or bottom at the expense of neighboring bars. For example, this widening can take place in the area of the external contacts 5 on the underside 32 of the system carrier, so that the widened areas make it easier to make contact with a circuit board (not shown). On the upper side 31 of the system carrier 23 , the grid size remains unchanged at a minimal size, so that on the underside 32, for example, three times the width for external contacts 5

W = 3w

can be realized. In addition, the asymmetrical etching of two etching masks 33 and 34 provides a profile of the external contacts 5 in cross section and the holding webs 14 in cross section, which have protrusions in the central region of the carrier 3 and the system carrier 23 , respectively, which anchor the components 5 , 14 and 15 effect in the plastic housing compound. With such an etching technology, an external contact 5 can thus be produced, which in its upper material area has a contact socket 19 with a reduced contact pad 20 , the width w of which corresponds to the width of the flip-chip contacts of a semiconductor chip.

Fig. 3 of an electronic component 1 is a schematic view of a bottom 9 of a second embodiment of the invention. Components with the same functions as in the previous figures are identified by the same reference symbols and are not discussed separately.

In this second embodiment of the invention, a plurality of external contacts 5 are arranged in rings 25 , 26 , 27 and 28 on the underside 9 of the electronic component 1 , the ring 25 not only having an external contact surface on the underside 9 but also as an outer ring 24 Has external contact surfaces on the side edges 10 of the electronic component 1 . The dashed line shows the size of the semiconductor chip 4 , with all the outer contact rings 25 , 26 , 27 and 28 being arranged below the semiconductor chip 4 . In this embodiment of the invention, the connection contacts are buried in the plastic housing compound 16 and are therefore not visible in this illustration.

The position of two connection contacts 46 and 47 is marked in this example and shows that these connection contacts, which are arranged congruently with the flip-chip contacts, do not correspond to the positions of the external contacts 5 . Rather, retaining webs 14 are required to connect the external contact areas to the connection contacts. In this embodiment of the invention, the holding webs 14 serve to position the external contacts 5 and to connect the external contacts 5 to the buried connection contacts. Insofar as the holding webs 14 do not serve as an electrical connection, they are separated from the underside 9 of the electronic component 1 after packaging of the electronic component 1 . In this embodiment of the invention according to FIG. 3, the underside has cutouts 17 in the form of saw grooves 18 , which extend across the underside of the new electronic component 1 and cut through all the holding webs 14 as far as they represent a mechanical holder and no electrical connection produce.

FIG. 4 shows a schematic cross-sectional view of the electronic component 1 of the second embodiment of the invention along the section line AA in FIG. 3. Components with the same functions as in the previous figures are identified by the same reference numerals and are not discussed separately.

In this embodiment of the invention, part of the external contacts 5 are arranged directly in positions of flip-chip contacts 7 . The matrix of the flip-chip contacts 7 , as far as they are not in the section line AA, is marked by dashed lines. In this embodiment of the invention, the holding webs 14 lie on the underside of the electronic component 1 and are severed by the saw grooves 18 , insofar as they are only of mechanical importance. The cross section of FIG. 4 also shows a potential line 15 , from which, as can be seen in FIG. 3, a plurality of holding webs 29 are arranged transversely, which serve to hold or connect the potentials of external contacts 5 . This potential line 15 is completely embedded in plastic housing compound 16 and has the advantage that it forms an additional stabilizing web in each component position, on which retaining webs 14 for external contacts 5 and connection contacts can be supported.

Fig. 5 shows a section of a schematic top view of a part position of a leadframe 23 with a positioned semiconductor chip 4 in flip-chip technique, prior to packaging of the device position 50 to an electronic component 1 of a third embodiment of the invention. Components with the same functions as in the previous figures are identified by the same reference symbols and are not discussed separately.

In this system carrier 23 , a cranking area 53 is provided between the edge of the semiconductor chip 49 and the first two rows 51 and 52 of external contacts 5 , in which the retaining webs 21 are cranked in such a way that they connect the contacts 6 on the top 11 of a packaging electronic component 1 position. This crimping of the holding webs 21 can be carried out during the manufacture of the system carrier 23 and has the effect that the electronic component 1 of this third embodiment of the invention enables access to the flip-chip contacts 7 on the underside 9 through the external contacts 5 , as well as from the top 11 through the connection contacts 6 arranged there.

FIG. 6 shows a schematic cross section through an electronic component 1 of the third embodiment of the invention along the section line BB in FIG. 5. Components with the same functions as in the previous figures are identified by the same reference numerals and are not specifically explained.

In contrast to the previous embodiments of the invention, in the third embodiment of the invention the semiconductor chip 4 is arranged in a hanging manner on the connection contacts 6 . In the offset region 50 , the semiconductor web 21 extends from the external contact 5 on the underside 9 of the electronic component 1 to the top 11 of the electronic component 1 and the associated connection surfaces 6 . The offset region 53 of the holding web 21 etched to a reduced material thickness d is completely embedded in plastic housing compound 16 after the electronic component 1 has been completed . Such a component has the advantage that the flip-chip contacts 7 of the semiconductor chip 4 can be accessed electrically both from the top 11 and from the bottom.

Fig. 7 shows a schematic cross-section through an electronic component 1 of a fourth embodiment of the invention. Components with the same functions as in the previous figures are identified by the same reference symbols and are not discussed separately.

The electronic component 1 of the fourth embodiment of the invention is based on the principles of the third embodiment of the invention, that is to say of the external contacts 5 , the external contact 5 on the underside of the electronic component is connected to connection contacts 6 on the top of the electronic component via cranked retaining webs 21 , so that there is an upper contact possibility in a microscopic arrangement for access to the flip-chip contacts 7 in the plastic housing compound 16 . A redistribution structure can now be arranged on the plastic housing compound 16 by applying a structured redistribution layer 36 . This rewiring layer 36 has rewiring lines 40 which connect the connection contacts 6 on the upper side of the electronic component to external contact surfaces 41 of the rewiring lines.

External contacts 37 are arranged on the external contact surfaces 41 on the upper side of the electronic component and are distributed congruently with external contacts 5 on the lower side of the electronic component on the upper side 11 of the electronic component 1 . Such an electronic component 1 with congruent external contacts 37 on the top 11 of the electronic component 1 and external contacts 5 on the underside of the new electronic component is capable of being stacked into larger units.

Fig. 8 shows a schematic cross-section through an electronic component 1 having a stack of electronic components of the fourth embodiment of the invention. Components with the same functions as in the previous figures are identified by the same reference symbols and are not discussed separately.

For the vertical stacking of the electronic components 1 of the fourth embodiment of the invention, only the external contacts 37 on the top of each electronic component are connected to external contacts 5 on the underside of the component above, so that a stack of any number of electronic components 1 of the fourth embodiment of the invention can arise. This complex, highly integrated electronic component has the advantage of saving space through vertical stacking. Reference Signs List 1 electronic component
2 plastic housings
3 metallic supports
4 semiconductor chip
5 external contacts
6 connection contacts
7 flip-chip contacts
8 active top of the semiconductor chip
9 underside of the plastic housing
10 side edges of the electronic component
11 Top of the plastic case
12 contact bases of the contacts
13 congruent contact pads
14 holding bars
15 potential line
16 plastic housing compound
17 recesses
18 saw grooves
19 contact base of the external contacts
20 contact pads of the external contacts
21 cranked retaining bars
22 system carrier frame
23 system carrier
24 outer ring
25 , 26 , 27 , 28 rings of external contacts
29 holding bars on the potential line
30 bulge
31 Top of the system rack
32 Bottom of the system rack
33 upper etching mask
34 lower etching mask
35 System blank
36 Redistribution layer
37 external contacts on the top of the electronic component
38 stacked electronic components
39 Rewiring structure
40 rewiring lines
41 external contact surfaces of the rewiring lines
42 , 43 , 44 , 45 external contacts on the underside of the electronic component
46 , 47 contacts
48 Crank area
49 Edge of the semiconductor chip
50 component position
51 , 52 rows of external contacts on the underside of the electronic component
53 Crank area
h component height
d reduced material thickness of the carrier or system carrier
D Material thickness of the carrier or system carrier

Claims (40)

1. Electronic component with a plastic housing ( 2 ) and a partially in the plastic housing ( 2 ) arranged metallic carrier ( 3 ), wherein on the metallic carrier ( 3 ) a semiconductor chip ( 4 ) is arranged in flip-chip technology, and wherein the carrier has external contacts ( 5 ) in full carrier material thickness (D) and connecting contacts ( 6 ) of reduced carrier material thickness (d), the connecting contacts with reduced carrier material thickness (d) directly having flip-chip contacts ( 7 ) on the active top side ( 8 ) of the semiconductor chip ( 4 ) are connected. 2. Electronic component according to claim 1, characterized in that the external contacts ( 5 ) on the underside ( 9 ) of the plastic housing ( 2 ) are arranged. 3. Electronic component according to claim 1 or claim 2, characterized in that the external contacts ( 5 ) on the side edges ( 10 ) of the electronic component ( 1 ) are arranged. 4. Electronic component according to one of the preceding claims, characterized in that the connection contacts ( 6 ) on the top ( 11 ) of the plastic housing ( 2 ) are arranged. 5. The electronic component according to any one of the preceding claims, characterized in that the connecting contacts (6) have contact base (12) having a to the flip-chip contacts (7) of the semiconductor chip (4) congruent contact pad (13) and with the flip-chip contacts ( 7 ) are connected. 6. The electronic component according to any one of the preceding claims, characterized in that the outer contacts (5) are mechanically electrically connected to the connecting contacts (6) partially electrically conductive holding webs (14) and / or wherein the holding webs (14), a reduced substrate strength (d). 7. Electronic component according to one of the preceding claims, characterized in that the carrier ( 3 ) has a potential line ( 15 ) which at least partially has a reduced carrier material thickness (d) and is surrounded by plastic housing compound ( 16 ). 8. Electronic component according to one of the preceding claims, characterized in that the plastic housing ( 2 ) on its underside ( 9 ) has recesses ( 17 ), some of which are in retaining webs ( 14 ) for connecting contacts ( 6 ) and / or in retaining webs ( 14 ) are arranged to external contacts ( 5 ) and cut them. 9. Electronic component according to one of the preceding claims, characterized in that the underside ( 9 ) of the plastic housing ( 2 ) has saw grooves ( 18 ) as recesses ( 17 ) which electrically interrupt a predetermined number of retaining webs ( 14 ). 10. Electronic component according to one of the preceding claims, characterized in that external contacts ( 5 ) have a reduced carrier material thickness (d) and a contact base ( 19 ) which has a contact connection surface ( 20 ) which is congruent to flip-chip contacts ( 7 ) of the semiconductor chip ( 4 ) and is directly connected to the flip chip contact ( 7 ). 11. Electronic component according to one of the preceding claims, characterized in that the electronic component ( 1 ) has cranked retaining webs ( 21 ), the connection contacts ( 6 ) on the top of the electronic component ( 1 ) with external contacts ( 5 ) on the underside ( 9 ) of the electronic component ( 1 ) electrically and mechanically connect. 12. Electronic component according to claim 11, characterized in that the electronic component on ( 1 ) on its top ( 11 ) has a rewiring layer ( 36 ), the rewiring layer ( 36 ) having the connection contacts ( 6 ) on the top ( 11 ) Connects external contacts ( 37 ) on the top ( 11 ). 13. Electronic component according to claim 12, characterized in that the external contacts ( 37 ) generated with the rewiring layer ( 36 ) on the upper side ( 11 ) to the external contacts ( 5 ) on the underside ( 9 ) are arranged congruently. 14. Electronic component according to claim 12 or 13, characterized in that a plurality of electronic components ( 1 ) are arranged vertically one above the other to form a stacked electronic component, the external contacts ( 37 ) on the top ( 11 ) having the external contacts ( 5 ) on the underside ( 9 ) of the electronic component ( 1 ) arranged above them are electrically connected. 15. system carrier for a plurality of electronic components, which has structured component positions ( 50 ) for each electronic component ( 1 ), each component position ( 50 ) being surrounded by a system carrier frame ( 22 ) and the system carrier ( 23 ) having a perforation in its edge regions, wherein, extending from the system support frame (22) in each device position (50) retaining webs (14) to external contacts (5) and retaining webs (14) to connecting contacts (6) in the direction of a central portion in the component position (50) where the external contacts (5) are arranged in a matrix and are connected by retaining webs (14) electrically connected to terminal contacts (6) having an arrangement of the array of flip-chip contacts (7) of a to be arranged in flip-chip in the component positions (50) semiconductor chips (4) equivalent. 16. System carrier according to claim 15, characterized in that the external contacts ( 5 ) have a full system carrier material thickness (D). 17. System carrier according to claim 15 or claim 16, characterized in that the connection contacts ( 6 ) have a reduced system carrier material thickness (d). 18. System carrier according to one of claims 15 to 17, characterized in that the outer contacts ( 5 ) are arranged in at least one component position ( 50 ) in an outer ring ( 24 ), the outer contacts ( 5 ) of which have contact surfaces on the edge sides. 19. System carrier according to one of claims 15 to 18, characterized in that between retaining webs ( 14 ) for external contacts ( 5 ) of an outer ring ( 24 ) retaining webs ( 14 ) of a further inner ring ( 26 , 27 , 28 ) made of external contacts ( 5 ) are arranged. 20. System carrier according to one of claims 15 to 19, characterized in that the holding webs ( 14 ) have a reduced carrier material thickness (d). 21. System carrier according to one of claims 15 to 20, characterized in that the system carrier ( 23 ) has a potential line ( 15 ) which extends from one side of the system carrier frame ( 22 ) to the opposite side of the system carrier frame ( 22 ) and retaining webs ( 14 ) has, how extend from the ground line ( 15 ) transversely to the longitudinal direction of the ground line ( 15 ) and mechanically position external contacts ( 5 ) and / or connection contacts ( 6 ) and / or electrically connect to the potential line ( 15 ). 22. System carrier according to claim 21, characterized in that the potential line ( 15 ) at least partially has a reduced system carrier ( 23 ) material thickness and can be embedded in plastic housing compound ( 16 ). 23. System carrier according to one of claims 15 to 22, characterized in that the system carrier ( 23 ) in each component position ( 50 ) one of a matrix of retaining webs ( 14 ), connection contacts ( 6 ) and / or external contacts ( 5 ) and / or Has potential lines ( 15 ) shaped bulge ( 30 ) opposite the system carrier frame ( 22 ). 24. System carrier according to one of claims 15 to 23, characterized in that external contacts ( 5 ) have a reduced system carrier material thickness (d) and a contact base ( 19 ) which has a contact connection surface ( 20 ) which is congruent to a flip chip contact ( 7 ) Has semiconductor chips ( 4 ) to be arranged using flip-chip technology. 25. System carrier according to one of claims 15 to 24, characterized in that the system carrier ( 23 ) has cranked retaining webs ( 21 ) which form a bulge ( 30 ) relative to the system carrier frame ( 22 ). 26. System carrier according to one of claims 15 to 25, characterized in that the connection contacts ( 6 ) have an embossing which has a contact socket ( 12 ) which has a congruent contact pad to a flip chip contact ( 7 ) of a semiconductor chip ( 4 ) to be arranged using flip chip technology ( 13 ). 27. A method for producing a system carrier ( 23 ) from a metal plate or a metal strip as a system carrier blank ( 22 ), the method comprising the following method steps: Masking the top ( 31 ) and the bottom ( 32 ) of the system carrier blank ( 22 ) with different etching masks ( 33 , 34 ) which are structured asymmetrically with respect to one another, - double-sided etching of the masked system carrier blank ( 22 ) with one-sided thin etching of retaining webs ( 14 ) and connecting contacts ( 6 ), and a predetermined proportion of the external contacts ( 5 ) and / or potential lines ( 15 ), Removing the asymmetrical etching masks ( 33 , 34 ), - Structuring the connection contacts ( 6 ) to connection contacts ( 6 ) of reduced material thickness (d) with a contact base ( 12 ) which has a contact connection surface ( 13 ) which is congruent with a flipchip contact ( 7 ) of a semiconductor chip ( 4 ) to be arranged using flipchip technology, - Structuring the predetermined number of external contacts ( 5 ) of reduced material thickness (d) to external contacts ( 5 ) with a contact base ( 19 ) which has a contact connection surface ( 20 ) which is congruent high with a flipchip contact ( 7 ) of a semiconductor chip ( 4 ) is. 28. The method according to claim 27, characterized in that the connection contacts ( 6 ) and / or the predetermined number of external contacts ( 5 ) are structured by means of embossing technology. 29. The method according to claim 27 or claim 28, characterized in that the structuring of the predetermined number of external contacts ( 5 ) is carried out by means of double-sided etching technology. 30. The method according to any one of claims 27 to 29, characterized in that the retaining webs ( 11 ) are partially cranked so that connection contacts ( 6 ) relative to the system carrier frame ( 22 ) are raised and bulges ( 30 ) are formed in each component position ( 50 ) be, which can hold the semiconductor chips ( 4 ) hanging in flip-chip technology. 31. The method according to any one of claims 27 to 30, characterized in that the connection contacts ( 6 ) are arranged such that they correspond to the arrangement of flip-chip contacts ( 7 ) of the semiconductor chips ( 4 ) to be mounted using flip-chip technology. 32. The method according to any one of claims 27 to 31, characterized in that the external contacts ( 5 ) are arranged in a matrix form and are mechanically and electrically connected to terminal contacts ( 6 ) via retaining webs ( 14 ). 33. A method for manufacturing an electronic component (1) with a plastic housing (2) and, disposed in the plastic housing (2) in flip-chip semiconductor chip (4), wherein the plastic housing (2) external contacts (5) in full carrier material thickness (D) and Has connection contacts ( 6 ) of reduced material thickness (d) of a system carrier ( 23 ) and the connection contacts ( 6 ) are directly connected to flip-chip contacts ( 7 ) of the active top side ( 8 ) of the semiconductor chip ( 4 ), the method having the following method steps: Producing a system carrier ( 23 ) with a plurality of component positions ( 50 ) which are surrounded by a system carrier frame ( 22 ) and have a structure with external contacts ( 5 ), connecting contacts ( 6 ) and holding webs ( 14 ) of reduced system carrier material thickness (d) arranged between them, wherein the connection contacts ( 6 ) and a predetermined number of external contacts ( 5 ) are structured with base contacts ( 12 , 19 ) which have contact connection surfaces ( 13 ) congruent with flipchip contacts ( 7 ) of the semiconductor chip ( 4 ), - Electrical connection of a semiconductor chip ( 4 ) with its flipchip contacts ( 7 ) using flipchip technology to the contact connection surfaces ( 13 ) of the connection contacts ( 6 ) and / or the predetermined number of external contacts ( 5 ) in each component position ( 50 ), - Packing the component positions ( 50 ) in a plastic housing compound ( 16 ), - Providing recesses ( 17 ) on the underside ( 9 ) of the system carrier ( 23 ) in each component position ( 50 ) for separating retaining webs ( 14 ), which are not intended for an electrical connection, at correspondingly predetermined locations, - Unraveling the system carrier ( 23 ) into individual electronic components ( 1 ). 34. The method according to claim 33, characterized in that the separation of retaining webs ( 14 ) by introducing saw grooves ( 18 ) on the underside ( 9 ) of the system carrier ( 23 ) and / or on the underside ( 9 ) of the electronic component ( 1 ) is carried out. 35. The method according to claim 33 or claim 34, characterized in that the opening of holding webs ( 14 ) by introducing cutouts ( 17 ) on the underside ( 9 ) of the electronic component ( 1 ) for separating the holding webs ( 14 ) by means of predetermined points Laser ablation is carried out. 36. Method according to one of claims 33 to 35, characterized in that a bulge ( 30 ) is introduced into the system carrier ( 23 ) at each component position ( 50 ) by cranking the holding webs ( 21 ) in which the semiconductor chip ( 4 ) is arranged in flip-chip technology. 37. The method according to any one of claims 33 to 36, characterized in that when packaging the arrangement of semiconductor chip ( 4 ) and component position with bulges ( 30 ) in a plastic housing compound ( 16 ), a mold is used which has a mold cavity in which the external contacts (5) in a lower sealing film and the connecting contacts (6) in an upper sealing foil memorize so that the plastic housing (2) protrude in accordance with the injection molding process, the connecting contacts (6) from the upper side (11) to a few micrometers, and the outer contacts ( 5 ) protrude on the underside ( 9 ) of the plastic housing ( 2 ) by a few micrometers. 38. The method according to any one of claims 33 to 37, characterized in that after the packaging of the electronic components ( 1 ) on the system carrier ( 23 ) the top sides ( 11 ) of the electronic components ( 1 ) are coated with a rewiring structure ( 39 ) , wherein the rewiring structure ( 39 ) has rewiring lines ( 40 ) which extend from the connection contacts ( 6 ) arranged on the surface ( 11 ) to contact connection surfaces ( 41 ) on the top side ( 11 ), and external contacts ( 37 ) on the top side ( 11 ) of the electronic components ( 1 ). 39. The method according to claim 38, characterized in that the external contacts ( 37 ) on the top ( 11 ) are selectively applied in positions corresponding to the positions of the external contacts ( 5 ) on the underside of the electronic components ( 1 ). 40. The method according to any one of claims 38 or claim 39, characterized in that the application of rewiring lines ( 40 ) and external contacts ( 37 ) on the top ( 11 ) of the electronic components ( 1 ) simultaneously for several components ( 1 ) of a system carrier ( 23 ) takes place.