DE10196259T1 - Füllverfahren - Google Patents

Füllverfahren

Info

Publication number
DE10196259T1
DE10196259T1 DE10196259T DE10196259T DE10196259T1 DE 10196259 T1 DE10196259 T1 DE 10196259T1 DE 10196259 T DE10196259 T DE 10196259T DE 10196259 T DE10196259 T DE 10196259T DE 10196259 T1 DE10196259 T1 DE 10196259T1
Authority
DE
Germany
Prior art keywords
filling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE10196259T
Other languages
English (en)
Inventor
Jesse L Pedigo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Honeywell International Inc
Original Assignee
Honeywell International Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/752,629 external-priority patent/US6454154B1/en
Application filed by Honeywell International Inc filed Critical Honeywell International Inc
Publication of DE10196259T1 publication Critical patent/DE10196259T1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H05K3/1233—Methods or means for supplying the conductive material and for forcing it through the screen or stencil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10204—Dummy component, dummy PCB or template, e.g. for monitoring, controlling of processes, comparing, scanning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0139—Blade or squeegee, e.g. for screen printing or filling of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0156—Temporary polymeric carrier or foil, e.g. for processing or transferring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0182—Using a temporary spacer element or stand-off during processing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0548—Masks
    • H05K2203/0554—Metal used as mask for etching vias, e.g. by laser ablation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
DE10196259T 2000-05-31 2001-05-24 Füllverfahren Withdrawn DE10196259T1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US20845400P 2000-05-31 2000-05-31
US09/752,629 US6454154B1 (en) 2000-05-31 2000-12-28 Filling device
PCT/US2001/016986 WO2001093648A2 (en) 2000-05-31 2001-05-24 Filling device

Publications (1)

Publication Number Publication Date
DE10196259T1 true DE10196259T1 (de) 2003-05-15

Family

ID=26903209

Family Applications (1)

Application Number Title Priority Date Filing Date
DE10196259T Withdrawn DE10196259T1 (de) 2000-05-31 2001-05-24 Füllverfahren

Country Status (8)

Country Link
US (3) US6840425B2 (de)
JP (1) JP2003535465A (de)
KR (1) KR20030007755A (de)
CN (1) CN1444840A (de)
AU (1) AU2001264968A1 (de)
DE (1) DE10196259T1 (de)
TW (1) TW486782B (de)
WO (1) WO2001093648A2 (de)

Cited By (1)

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DE102012216101A1 (de) * 2012-09-12 2014-04-03 Festo Ag & Co. Kg Verfahren zum Herstellen einer in einem Substrat integrierten oder auf einem Substrat aufgebrachten Spule und elektronisches Gerät

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WO2001093648A2 (en) * 2000-05-31 2001-12-06 Honeywell International Inc. Filling device
WO2009147936A1 (ja) * 2008-06-02 2009-12-10 イビデン株式会社 多層プリント配線板の製造方法
TWI419282B (zh) * 2009-10-05 2013-12-11 Advance Materials Corp 形成窗式球柵陣列封裝預基板的方法
WO2012074563A2 (en) * 2010-01-21 2012-06-07 Henkel Corporation Ultrasonic assisted filling of cavities
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US9883597B2 (en) * 2013-12-05 2018-01-30 Fuji Machine Mfg. Co., Ltd. Solder supply device including a nozzle with a piston and a demarcating member that demarcates an air chamber in which air is supplied to move the piston relative to a solder container
EP3085484B1 (de) * 2013-12-18 2019-01-30 FUJI Corporation Lotbereitstellungsvorrichtung
EP3105300B1 (de) 2014-02-13 2019-08-21 Honeywell International Inc. Komprimierbare wärmeschnittstellenmaterialien
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US9974170B1 (en) * 2015-05-19 2018-05-15 Apple Inc. Conductive strands for fabric-based items
CN105499710B (zh) * 2016-01-13 2017-11-14 浙江大学台州研究院 具有复合轨迹的刮削工具
KR102554661B1 (ko) 2016-03-08 2023-07-13 허니웰 인터내셔널 인코포레이티드 상 변화 물질
US20170266948A1 (en) * 2016-03-16 2017-09-21 Intel Corporation Modular squeegee head apparatus for printing materials
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US11041103B2 (en) 2017-09-08 2021-06-22 Honeywell International Inc. Silicone-free thermal gel
US11072706B2 (en) 2018-02-15 2021-07-27 Honeywell International Inc. Gel-type thermal interface material
US11373921B2 (en) 2019-04-23 2022-06-28 Honeywell International Inc. Gel-type thermal interface material with low pre-curing viscosity and elastic properties post-curing
CN116217258B (zh) * 2023-01-03 2024-01-16 东阳东磁自动化科技有限公司 一种陶瓷基片全自动填孔设备及其填孔方法

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DE102012216101A1 (de) * 2012-09-12 2014-04-03 Festo Ag & Co. Kg Verfahren zum Herstellen einer in einem Substrat integrierten oder auf einem Substrat aufgebrachten Spule und elektronisches Gerät
DE102012216101B4 (de) * 2012-09-12 2016-03-24 Festo Ag & Co. Kg Verfahren zum Herstellen einer in einem Substrat integrierten Spule, Verfahren zur Herstellung einer mehrschichtigen Leiterplatte und elektronisches Gerät

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WO2001093648A3 (en) 2002-05-23
CN1444840A (zh) 2003-09-24
KR20030007755A (ko) 2003-01-23
US20020084306A1 (en) 2002-07-04
JP2003535465A (ja) 2003-11-25
US6840425B2 (en) 2005-01-11
US6832714B2 (en) 2004-12-21
AU2001264968A1 (en) 2001-12-11
US20020084305A1 (en) 2002-07-04
US20020088840A1 (en) 2002-07-11
TW486782B (en) 2002-05-11
WO2001093648A2 (en) 2001-12-06
US6995321B2 (en) 2006-02-07

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