DE102004016480B4 - Fully integrated hybrid optical-electrical circuit board - Google Patents

Abstract

The invention relates to a hybrid printed circuit board (16) having at least one optically conductive layer (15) and at least one electrical information transmitting layer (9) in which between optoelectronic, in the optically conductive layer (15) of the printed circuit board (16) integrated components ( 2) information can be transmitted by means of the optically conductive layer (15). In such a printed circuit board (16), the optoelectronic components (2) are substantially completely embedded in the optical information transmitting layer (15) and only the electrical connections (5) of the optoelectronic components (2) led to the outside, wherein the optoelectronic components ( 2) via a direct shock coupling to the optical information transmitting optical fiber (3) or the like. Are coupled. Furthermore, the invention describes a method for producing such a printed circuit board (16).

Description

The The invention relates to a hybrid optical-electrical circuit board according to the generic term of claim 1 and a method for producing such The optical-electrical circuit board according to claim 26.

The increasing clock speed of processors and the associated Increasing the data rate on boards, e.g. for computer applications a growing challenge to the signal transmission and the electrical In particular, signal integrity is at data rates in multi gigabit / s range only under great technical and financial To ensure expenses. The reason lies in the antenna effect of electrical lines in High frequency range, both what the transmission effect and what the reception effect As. Here is the problem of electromagnetic compatibility (EMC) of great Meaning of the ability to increase the Data rates. Also in EMC-stressed operating environments such as in Manufacturing areas or the like. Can corresponding disorders In the operation of the boards arise, the reliability the data transmission decisively reduce or impossible do. On the other hand, optical transmission is subject to high frequencies not in electrical transmissions inevitably occurring restrictions in terms of disproportionately occurring damping inside the electrical conductor.

Out For this reason, optical connection techniques have been used for years for the computer-internal data transfer examined, since light guides no antenna effect even at data rates to the terabit / s range show. A technical problem, which it for the realization of an optical connection technology between electrically working modules (processors) is to be solved, is the integration of optical and electrical line media in an assembly. For an industrial application is the so-called electrical-optical Printed circuit board (EOLP) is a preferred solution. from a conventional multilayer board, in which the electrical Layers an optical layer is added. The coupling and decoupling the light signals into the optical position can e.g. through micromirrors take place, which are located at the ends of the waveguides.

In the publication by S. Lehmacher and A. Neyer "Integration of polymer optical waveguides into printed circuit boards (PCB) ", Proceedings MICRO.tec 2000, vol. 1, Hanover, Sept. 2000, pp. 111-113 such an EOLP is described. This is the optical position by hot stamping techniques in thermoplastic materials such as e.g. Polycarbonate (PC) or Cyclo-olefin copolymers (COC, e.g., topaz) were prepared. There were also similar Concepts that are also using hot stamping techniques based on thermoplastic materials. Furthermore, it is known to use photopatternable epoxy resins as waveguide material.

Two the main problems in the production of electrical-optical circuit boards are the temperature stability the polymeric fiber optic materials used and the reliable coupling optoelectronic modules to the optical position.

To the Topic "temperature stability" is to be noted that this from the conventional manufacturing process of a multilayer board is given, i. the temperature during lamination at about 180 ° C must be over 2 hours and the reflow soldering temperature of 220 ° C must for About 2 minutes without damage survived become. These requirements are of the previously known thermoplastic Systems only inadequately met.

To the Topic "coupling the optoelectronic components to the optical position "is the current preferred solution the so-called micromirror solution, in which the ends of the waveguides are provided with 45 ° deflecting mirrors and the optical modules over dowels precisely on the Mirrors are adjusted. This solution is u.a. in the publication by E. Griese, A. Himmler, K. Klinke, A. Koske, J.-R. Kropp, S. Lehmacher, A. Neyer, and W. Süllau, "Self-aligned coupling of optical transmitters and receiver modules to board-integrated optical multimode waveguides ", in M. R. Taghizadeh et al. (Eds.), Micro and Nano-optics for Optical Interconnection and Information Processing, Proc. SPIE vol. 4455, July 2001, paper 32 and in the publication by S. Kopetz, S. Lehmacher, E. Rabe, A. Neyer, "Coupling of optoelectronic modules to optical layer in printed circuit boards (PCBs) ", Photonics Fabrication Europe, Brugge, Belgium, 2002, in Proc. SPIE vol. 4942, 2003, pp. 282-286 described.

problems resulting from this solution result, on the one hand, the required disclosure of the optical Location after completion of the entire board, the introduction of the precisely fitting Drilling for the dowels and unavoidable contamination of the optical entrance and exit surfaces above the mirrors in these processes and above In addition, the beam expansion and thus coupling losses through the distance between the optoelectronic components and the micromirrors. Such a solution, which may still be controllable in the production of individual parts, will no later than in mass production too big Cause problems.

As an alternative solution is a direct shock coupling between the optical transmitters and receivers with the waveguides conceivable. This was reported in S. Bargiel, F. Ebling, H. Schröder, H. Franke, G. Spickermann, E. Griese, A. Himmler, C. Lehnberger, L. Oberender, G. Mrozynski, D. Steck, E. Strake , and W. Süllau, "Electrical optical circuit boards with 4-channel transmitters and receiver modules", in Proc. 6th Workshop Optics in Computing Technology, LOCATION 2001, pp. 17-27. Paderborn, Germany, Apr. 2001 described. However, here the introduction of the optoelectronic assemblies on their own carrier boards done by slots in the upper layers of the multilayer structure of the boards. Problems of such a solution are a possible damage and contamination of the waveguide end surfaces when inserting the slots in the board as well as a snug and stable coupling to the waveguide.

A similar Idea of an optoelectronic connection integrated into the board is also described in R.T. Chen, L. Lin, C. Choi, Y.J. Liu, B. Bihari, L. Wu, S. Tang, R. Wickmann, B. Picor, M.K. Hibbs-Brenner, J. Bristow, and Y.S. Liu, "Fully embedded board-level guided-wave optoelectronic interconnect ", Proc. IEEE, vol. 88, pp. 780-793, 2000. Here is the VCSEL line (Vertical Cavity Surface Emitting laser) trained transmitting unit while in the board itself, however, the light coupling into the optical position continues to take place via 45 ° deflection mirrors. But here it is precisely the deflection mirrors that are involved in the production the optical situation require a special effort and the one very critical point throughout the entire manufacturing chain.

task The present invention is therefore an opto-electrical Circuit board and a manufacturing method to propose for this, in which a simple and reliable Coupling of optoelectronic assemblies to the optical position realized in electrical-optical circuit boards.

The solution the task of the invention arises with regard to the circuit board from the characterizing Features of claim 1 and in terms of the method of the characterizing features of claim 24 in cooperation with the characteristics of the associated Preamble. Further advantageous embodiments of the invention emerge from the dependent claims.

The invention is based on a generic printed circuit board having at least one optically conductive layer and at least one electrical information transmitting layer in which information can be transferred between optoelectronic components integrated in the optically conductive layer of the printed circuit board by means of the optically conductive layer. Such a circuit board is further developed in that the optoelectronic components completely embedded in the optical information transmitting layer and only the electrical connections of the optoelectronic components are led to the outside, the optoelectronic components coupled via a direct shock coupling to the optical information transmitting optical fiber or the like are. This ensures that the otherwise very störanfälli ge coupling and decoupling of the information transmitting light into or out of the example configured as a waveguide photoconductive element within the optically conductive layer can be avoided by means of the widespread 45 ° mirror, since the Optoelectronic components are substantially completely arranged in the optical information transmitting layer itself and are only by means of electrical connections to the rest of the circuit board functionally connected. In this way, a direct coupling in the form of an immediate impact between the optical fibers (in the following the term "optical fiber" is understood to mean any type of optical elements such as optical fibers or waveguides or the like familiar to the person skilled in the art) in the optical information transmitting layer and the optoelectronic components possible, which allows the best transmission without significant losses or attenuation and therefore the signal behavior least affected. Substantially completely arranged in the layer transmitting the optical information, in this context, means that, in one configuration of the light guides, for example as a waveguide, small sections of the optoelectronic components protrude from the layer formed by the waveguide cores into the underlying substrate layer or the superstate layer arranged above it In this case, waveguide cores typically form the optical information-transmitting layer together with the substrate layer and the superstate layer. Furthermore, it is ensured by the arrangement of the optoelectronic components such as optical transmitters and receivers that these components are not prone to failure or mechanically unstable outside attached to the circuit board or about large recesses in the circuit board must be arranged so that an input or Outcoupling into or out of the respective optoelectronic component of the light coming from the light guide or the like or entering it is possible in the first place. In addition, both the optoelectronic components and the light guide are mechanically securely received within the circuit board and safely protected against external influences such as contamination, mechanical stress or the like. Furthermore, it is achieved that the manufacturing process for the production of such circuit boards ge only slightly compared to the usual production of purely electronic printed circuit boards must be changed so that it can be built largely on existing technology with appropriate extensions in terms of the production of the photoconductive layer. The light guides can be formed in a basically known layered structure from a layer of laterally structured waveguide cores, which is surrounded on each side by a superstrate layer and a substrate layer and thus provides the required light-conducting properties. It is also conceivable to form the light-conducting layer of light-conducting fibers such as glass fibers, which are already designed to be light-conducting and are completely embedded in this form in the circuit board. Unless otherwise explicitly referred to one of the above-mentioned types of optical fiber, the term "optical fiber" should always refer to all these technical implementations. According to the respective context, the layer which transmits the optical information is understood to mean either the composite of waveguide cores, superstrate layer and substrate layer or the layer of the printed circuit board which contains light guides, for example in the form of fibers.

In In a first advantageous embodiment, the invention provides that the optoelectronic components in the optical information transmitting layer in recordings forming preferably wells can be used are the optoelectronic components precisely relative to each other and to the light guides or the like. Position. This can be achieved be that without complicated adjustment work the e.g. as waveguides, optical fibers or the like configured light-conducting elements and the Optoelectronic components to each other can be arranged so that optimum transmission conditions over the optically conductive route can be achieved. This can be done with simple mounting options like the usual one assembly technology be achieved when the optical fibers or the like and the optoelectronic Components within corresponding structures in the photoconductive Layer of the circuit board inevitably recorded and held in fixed orientation to each other become. It must therefore no longer consuming any single assignment of optoelectronic Component and light guide or the like measured or readjusted but it is already after a simple assembly process a sufficient accuracy of assignment of optical fibers or the like and optoelectronic components achievable. such Can recordings by principle known method of microstructure technology in or on the optical be provided conductive layer of the circuit board, wherein here All the essential methods can be applied, for example from the field of microstructure technology for these or similar Purposes are used. The recordings position by appropriate Means the optoelectronic components relative to the circuit board and thus also relative to each other and to the light guides or such that the butt coupling between the optical fibers or the like and the opto-electronic Components is produced directly after assembly.

in this connection it is conceivable that in a first embodiment, the recordings before the production of the optical information transmitting layer are prefeasible. For example, can be separated from the optical Information transferring layer corresponding positioning devices and recesses in specially meant for Substrates are formed, which are then in the optically conductive layer introduced and there to determine the optoelectronic components and the light guide, preferably in the form of glass fibers used can be. This may be due to possibly specialized manufacturing process a cost effective way the prefabrication of such recordings can be realized.

In another conceivable embodiment is provided that the recordings simultaneously with the production of parts of the optical information transmitting Layer, preferably the waveguide cores or the like. Finished are. The basic idea here is that for the production of optical Transmitting information Layer used methods at the same time for the production of Again, a number of common methods such as casting techniques, molding techniques, Photolithographic process or abrasive or abrasive Microstructural technology can be used. This can also be used in a further embodiment, at the same time with the production of the recordings the recordings themselves from the same Material such as the waveguide cores or the like. To form and thus maybe also occurring inaccuracies in the subsequent mounting of the waveguide cores in the optically conductive layer to avoid the same. It is thus conceivable that the Waveguide cores or the like simultaneously with the recordings be made in a simultaneous manufacturing process and only to use the optoelectronic components in the recordings are because the waveguide cores or the like already exist and one piece are formed with the optically conductive layer.

It is advantageous here, when the images are formed as depressions within a common reference frame for a region of the optical information transmitting layer, the precisely arranged positioning elements for insertion and positioning of the associated op has toelektronischen components. Such a reference frame can also be used, for example, with great advantage in casting techniques also to serve as a border for doctoring and at the same time arrange all recordings or functional components arranged within the reference frame dimensionally and positionally. The reference frame and the receptacles serve as a kind of assembly mask for the components to be introduced into the optically conductive layer.

It is still conceivable, the recordings as positioning elements for the Receiving optical fibers, such as Provide glass fibers or the like. It is assumed that the light guides as separate Components such as fibers are produced and after manufacture only with the assembly about also the optoelectronic components in the optically conductive layer are introduced. By the exact Positioning of the light guides or the like by the positioning elements The recording is a positionally accurate assignment of the optical fiber or the like to the optically conductive layer and thus to the optoelectronic Components possible.

Farther can also recordings as positioning elements for additional components, preferably for cooling elements, Ladder elements or the like. Be provided for about additional functions may be needed within the optically conductive layer or are helpful. These will then be exactly the same over the recordings and simply positioned and held.

It is also conceivable in another embodiment that the optoelectronic Components in receptacles within additional components, preferably inside cooling elements, are receivable and positionable, which again by the Reference frame or its recordings within the transmitting the optical information Layer are positioned and fixed. This quasi-indirect positioning has the optoelectronic components based on the frame of reference the advantage of a simpler embodiment of the frame of reference, since not so many shots for the individual components to be introduced are to be provided, but These are about the additional Components may also be pre-assembled in the optically conductive layer can be inserted. At the same time is about for the cooling of the optoelectronic Components have a close connection with such cooling elements or the like advantageous, so that the in a cooling element formed recording at the same time improve the cooling effect of the optoelectronic component used therein. Here you can in a further embodiment as additional components cooling elements in the form of prefabricated heat-conducting elements, are preferably used as copper elements, the exact fit external shapes for insertion into the reference frame or the associated recordings and precisely fitting Recordings for having the optoelectronic components. So that's also in terms of the dimensional Assignment of optoelectronic components and reference frame To avoid loss of accuracy.

A conceivable embodiment provides that each optoelectronic component a separate reference framework is provided to determine the exact location of associated optoelectronic component and optical fibers or the like. To each other pretends. With that you can for example, longer transmission paths over a Optical fiber or the like can be realized because the frame of reference only the respective contact point between optical fiber and optoelectronic component dimensionally sets and the light guide then within the dimension of the circuit board can be any length.

Conceivable but it is also that ever optical transmission path a separate reference framework is provided to determine the exact location of optoelectronic components and optical fibers or the like. Assigns to each other. Thus, for example, within a transmission distance with shorter transmission paths with a common frame of reference both the assignment of the optical Transmitter and the optical receiver with the common light guide to measure and with the highest Accuracy can be realized.

From Advantage is, if the frame of reference the same layer thickness as transmitting the optical information Layer has. This is for the further processing such as about pressing in the context of applying further layers of Printed circuit board full load capacity of the optically conductive layer the printed circuit board guaranteed.

To further secure the optically conductive layer can be provided that on the optical information transmitting layer, a cover layer is arranged, which protects the optical information transmitting layer. Such a layer may be another, for example, electrically conductive layer of the circuit board. In the case of multilayer boards, in particular, the at least one optically conductive layer is usually surrounded on both sides by one or more electrically conductive layers. Such an arrangement is useful, for example, in an embodiment of the light guide made of glass fibers, since the glass fibers are designed to be light-conducting and do not require any further optically effective layer for covering. In the embodiment of the light guides as waveguide cores applied to a substrate layer, the so-called superstrate layer is used as the cover layer is used, which together with the waveguide cores and the substrate layer also produces the optical conductivity of an optically conductive layer formed in this way. Of course, a further electrical signal-conducting layer can of course then be arranged thereon.

Within the optically conductive layer can in the context of this invention as the optical information transmitting Optical fiber integrated optical waveguide or fiber with optical Functions, preferably polymer fibers or glass fibers, or the like. functional assemblies be providable, which simplifies always is spoken by optical fibers or the like.

A advantageous embodiment of the invention provides that as optoelectronic Components VCSEL (Vertical Cavity Surface Emitting Laser), preferably transversely multi-mode on the front emitting VCSEL and / or Photodiodes, preferably GaAs-based pin-type photodiodes or MSM photodiodes are provided. Such optoelectronic components act as optical transmitters or optical receivers within optical transmission links and are basically known. In particular, in the field of VCSEL such commercial VCSEL in terms of their radiation behavior, their geometric configuration and their mechanical properties modified in order to be here to be used in the present invention. It is an advantage if both VCSEL and photodiodes are in one-dimensional array structures are arranged.

From Meaning of The invention is when the electrical contacting of the optoelectronic components perpendicular to the optical information transmitting layer with others electrically conductive layers of the circuit board via a film-like transparent Support material takes place, are applied to the corresponding electrical conductors, those with contacts of the optoelectronic components as well as contacts in at least one electrically conductive layer of the printed circuit board or another circuit board are connected. hereby it will be achievable that the optoelectronic components themselves completely within the optical conductive layer are arranged and nevertheless with about driver assemblies or power supply etc. in an electrically conductive layer the circuit board or another PCB simply in Can be connected. The use of the film-like transparent support material has the advantage that about through recesses adjacent to the optically conductive layer Layers of this film-like carrier material be passed can and by its flexibility for example, by bending back again in the plane of the circuit board bent back can be there to about existing solder contacts or other contacting options to be able to be launched. The flexibility of the film-like carrier material thus allows such a space-saving design. Here can for example, as a film-like transparent carrier material a Kapton film be used.

Farther it is conceivable that the foil-like transparent carrier material between the optoelectronic device and the waveguide or Like. In the field of shock coupling runs. This also contributes a further reduction in the size of this to the optoelectronic Component belonging In addition, since the film-like transparent design can be used to the carrier material in the area of the radiation exit of a VCSEL before this radiation exit in the area of the shock coupling to arrange and lead out of the optically conductive layer, without that the optical Properties of transmission via the shock coupling affected become. In another embodiment, it is also conceivable that the film-like transparent carrier material a recess in the region of the light passage between the optoelectronic Component and the light guide or the like. In the region of the shock coupling having. As a result, the optical properties in the field of the transition at the shock coupling not at all influenced so that even It is also conceivable to use here an opaque carrier material.

In Further embodiment, the film-like transparent carrier material also the carrier for on it form bonded VCSELs. This has the advantage that the VCSEL at the same time on the foil-like transparent carrier material are attached and contacted with this outward and simultaneously with this carrier material can also be mounted.

The invention further relates to a method for producing a printed circuit board with at least one optical information-transmitting layer and at least one electrically information-transmitting layer. Such a method, in particular also for producing a printed circuit board according to claim 1, has as method steps that in a first step a reference frame of a region of the optical information transmitting layer is formed on a substrate layer, the receptacles for the optoelectronic components and / or the light guides and / or has further components, in a second step, the optoelectronic components and possibly the light guide and / or other components used in the recordings and positioned on the recordings to each other and the electrical connections of the optoelectronic components are led out perpendicular to the circuit board level and then the optical information transferring layer shed and / or with a Cover is laminated. As a result, the positioning relevant to the position of the individual components and optoelectronic components relative to one another is determined with a uniform production method and at the same time a simple assembly of these components is achieved. As a result, complex adjustment work to tune the optical transmission behavior between the optoelectronic components and the optical fibers or the like can be avoided and a reliable function of the optical transmission links can be ensured with comparatively simple assembly methods or the like.

From It is advantageous if in the inventive method at a Embodiment of the optical waveguide waveguide waveguide cores or the like, and the frame of reference in one operation, preferably be made of the same material. This can be more increases the accuracy of it is enough that positional tolerances between about Waveguide cores and frames or the recordings not at all first arise.

From Another advantage is when the frame of reference and the ones formed therein Recordings as well as partially transmitting the optical information Layer by means of a casting process be prepared by doctor blade technology. This can be about as casting material temperature-stable polysiloxanes are used. Such methods are basically known and can applied to the present method modified accordingly become.

In Another embodiment, it is also conceivable that the reference frame and the formed therein recordings and partly transmitting the optical information Layer by means of a photolithographic process, in further Embodiment of, for example, laser direct writing or a mask exposure method getting produced. Here you can for example as photosensitive materials polysiloxanes, polyurethanes, Polyamides, acrylates or combinations thereof may be used.

Also it is conceivable that in another embodiment of the reference frame and the thus formed Recordings by means of applying and / or ablative laser processing methods made of a starting material and / or into which the optical information transmits Layer are introduced.

A particularly preferred embodiment the circuit board according to the invention shows the drawing.

It demonstrate:

1 A view of a printed circuit board according to the invention with reference frames arranged thereon and receptacles for the light guides in a first production state,

2 - the circuit board according to 1 in a further assembled state with cooling elements preassembled in the reference frame for receiving the optoelectronic components,

3 - the circuit board according to 2 with optoelectronic components mounted in the cooling elements,

4a - the circuit board according to 3 with optical fibers mounted in the associated receptacles as a connection between the optoelectronic components,

4b A modified printed circuit board with light guides in the form of waveguide cores produced at the same time as the receptacles, as a connection between the optoelectronic components,

5 - the circuit board according to 4 with introduced electrical connections between the optoelectronic components and an electrically conductive layer, not shown, of the printed circuit board or another printed circuit board,

6a + 6b - A section and a plan view of the connection of an optoelectronic device to waveguide according to 5 in an enlarged detail view.

In the 1 to 5 is shown in the form of an assembly and production schedule, a typical sequence of a method for producing a printed circuit board according to the invention, in which by means of recordings 12 . 11 optoelectronic components 2 and light guides 3 for the production of an optically conductive layer 15 positioned and fixed to each other. This is applied to two electrical circuit boards 9 with electrical conductors 8th a substrate layer 7 to be recognized as the substrate for the construction of the optically conductive layer 15 the circuit board 16 serves. On this substrate layer 7 is a frame of reference 1 Applied as a receptacle for cooling elements 6 and in the cooling elements 6 arranged optoelectronic components 2 serves. Between the optoelectronic components 2 are, like this in the 5 can be seen closer, light guide 3 in recordings 12 arranged and positioned so that a so-called shock coupling between the optoelectronic components 2 and the light guides 3 forms a particularly good transmission of light signals between the optoelectronic construction share 2 and the light guides 3 allows. As light guides here integrated optical waveguide, optical plastic fibers (POF) or glass fibers can be used.

Like in the 1 it can be seen on the substrate layer 7 first the frame of reference 1 and the recordings 12 for the light guides 3 applied or introduced before according to 2 the cooling elements 6 in the inner shape of the frame of reference 1 be used. The frame of reference 1 and the recordings 12 for the light guides 3 In this case, for example, casting techniques or molding techniques or other methods of microstructure technology can be used, advantageously using casting techniques by means of doctoring or photolithographic methods. Another advantageous embodiment is that instead of recording 12 for the light guides 3 when using such a method equal to the waveguide cores 3 ' to be made with, like this in the 4b can be seen closer. This eliminates possible inaccuracies in the positioning of a light guide 3 used fibers or the like.

The cooling elements 6 offer in accordance with 2 respectively. 3 shown way on the one hand by their outer shape a possibility relative to the frame of reference 1 exactly positioned in the frame of reference 1 on the other hand, they have recordings 11 for the optoelectronic components 2 a possibility on the optoelectronic components 2 very accurate relative to the pictures 12 for the optical fibers to be used 3 or the waveguide cores 3 ' to position and fix. For this purpose, the optoelectronic components 2 after mounting or manufacturing the cooling elements 6 in the recordings 11 used and thus relative to the recordings 12 or the waveguide cores 3 ' positioned so that the abovementioned shock coupling can be achieved.

It is of course also conceivable for the optoelectronic components 2 own recordings not shown within the frame of reference 1 to be provided directly on the substrate layer 7 applied or introduced into this. These images, not shown, would be analogous to the images shown 12 for the light guides 3 be constructed.

After inserting the optoelectronic components 2 according to 3 then become the light guides 3 in the recordings 12 according to 4a used and form the shock coupling with the optoelectronic components 2 ,

In the 4b is the alternative manufacturing method shown in the rather than separately in shots 12 to be introduced light guide 3 the light pipe through waveguide cores 3 ' takes place, which are optically effective by the connection with the substrate layer 7 and the superstrate layer 17 and in a common manufacturing process along with the frame of reference 1 and further, not shown in detail recordings are made. For this purpose, as a preferred manufacturing method by means of appropriate masking method or other methods known from the Mirostrukturtechnik corresponding counter-molds produced in the example, the material of the frame 1 and the waveguide cores 3 ' poured and can be doctored. The resulting cast negative mold in the waveguide cores 3 ' can one recognize then in the 4b in which the waveguide cores 3 ' integrated on the substrate layer 7 are shown applied. Inserting the cooling elements 6 as well as the optoelectronic components 2 takes place analogously to the description of the 1 to 4a , In such a configuration, under the optically conductive layer 15 then the entire substrate layer composite 7 , Waveguide cores 3 ' and superstrate layer 17 Understood.

Thereafter, in both embodiments according to 4a respectively. 4b the optoelectronic components 2 , as in 5 shown according to the embodiment according to 4b , via in each case a foil-like carrier material 4 with a region not shown outside of the optically conductive layer 15 connected in which the film-like carrier material 4 by means of conductors mounted thereon 5 on the one hand with the optoelectronic component 2 is contacted and the end portions of the tracks 5 in accordance with 6 then shown, for example, in an electrical circuit board layer 9 is placed on local contacts. For this, appropriate, in 5 not shown openings 18 in one in the 5 likewise not shown cover layer and possibly the superstrate layer 17 on the upper side of the optically conductive layer 15 be provided, through which the film-like carrier material 4 each can pass through and thus can enter the area in which the contact to the outside or to the electrically conductive layer 9 the circuit board 16 to be produced.

Finally, and not shown further after the production of the optically conductive layer 15 the remaining cavity in the region of the light guides 3 about encapsulated with a corresponding material and for protection a cover layer not shown above the optically conductive layer 15 on the circuit board 16 applied. This cover layer also has the function, the optically conductive layer 15 mechanically conceal and thus protect. Such a cover layer is usually used as another electrical layer 9 consequences.

In the 6a and 6 b is in one detail the type of coupling of the optoelectronic device 2 to the light guide 3 or the waveguide core 3 ' according to the preceding figures in a section and in a plan view again shown in more detail. It can be seen on average the electrical circuit board layer 9 below the substrate layer 7 on which the light guides 3 or the waveguide cores 3 ' as well as the optoelectronic component 2 and the heat sink 6 applied and top side with a superstrate layer 17 is covered. Upper side of the superstrate layer 17 sits another electrical layer of the circuit board 16 , over the foil-like carrier material 4 with a conductor track running there 8th about the contact 13 in conjunction with the optoelectronic component 2 stands. For this purpose, the film-like carrier material 4 on the optoelectronic component 2 via special contacts 13 brought into electrically conductive connection, passes through an opening 18 on the upper side of the substrate layer 17 in the region of the electrically conductive layer 9 and there is about a bend in the area of the tracks 8th or contact 8th brought for the electrical transmission of the signals from and to the optoelectronic component 2 serves. Rear of the optoelectronic device 2 is the cooling element 6 to recognize that a corresponding receptacle for the optoelectronic component 2 offers and at the same time for the heat dissipation of the heat loss of the optoelectronic device 2 responsible is. In the area of the cooling element 6 is a via 14 to recognize the heat dissipation in the cooling element 6 dissipated heat of the optoelectronic device 2 outside the circuit board 16 allows. In the plan view is still the frame of reference 1 to recognize, in turn, the cooling element 6 and thus indirectly also the opto-electronic component 2 positioned and relative to the recording not shown here 12 for the light guides 3 or the waveguide cores shown here 3 ' sets.

As can be seen, the optically conductive layer 15 the circuit board 16 almost completely except the opening 18 for the film-like carrier material 4 towards the environment of the circuit board 16 closed, with only the foil-like carrier material 4 electrical signals from and to the optoelectronic component 2 can reach. The optical transmission of information happens completely within the optically conductive layer 15 favored by the type of shock coupling between optoelectronic component 2 and light guides 3 ,

1

frame of reference

2

optoelectronic component

3

optical fiber

3 '

Waveguide cores

4

sheetlike Support material

5

conductor tracks

6

cooling element

7

substrate layer

8th

electrical conductor tracks

9

electrical PCB layers

10

insertion

11

admission opto-electronic component

12

admission optical fiber

13

contact opto-electronic component

14

via

15

optical conductive circuit board layer

16

hybrid electrical-optical circuit board

17

Superstrate layer

18

opening

Claims (34)

Hybrid circuit board ( 16 ) with at least one optically conductive layer ( 15 ) and at least one electrical information transmitting layer ( 9 ), in which between optoelectronic, in the optically conductive layer ( 15 ) of the printed circuit board ( 16 ) integrated components ( 2 ) by means of the optically conductive layer ( 15 ) Information is transferable, characterized in that the optoelectronic components ( 2 ) completely in the optical information transmitting layer ( 15 ) and only the electrical connections ( 5 ) of the optoelectronic components ( 2 ) are guided to the outside, wherein the optoelectronic components ( 2 ) via a direct shock coupling to the optical information transmitting optical fiber ( 3 . 3 ' ) are coupled. Printed circuit board ( 16 ) according to claim 1, characterized in that the optoelectronic components ( 2 ) in the optical information transmitting layer ( 15 ) in preferably depressions images ( 11 . 12 ) can be used with exact fit, which the optoelectronic components ( 2 ) precisely relative to each other and to the light guides ( 3 . 3 ' ) or the like. Printed circuit board ( 16 ) according to claim 2, characterized in that the recordings ( 11 . 12 ) prior to the production of the optical information transmitting layer ( 15 ) are vorfertigbar. Printed circuit board ( 16 ) according to claim 2, characterized in that the recordings ( 11 . 12 ) simultaneously with the production of parts of the optical information transmitting layer ( 15 ), preferably the waveguide cores ( 3 ' ) or the like. Are manufacturable. Printed circuit board ( 16 ) according to claim 4, characterized in that the recordings ( 11 . 12 ) itself from the same material as the waveguide cores ( 3 ' ) or the like are formed. Printed circuit board ( 16 ) according to one of claims 2 to 5, characterized in that the recordings ( 11 . 12 ) as wells within a common frame of reference ( 1 ) for a region of the optical information transmitting layer ( 15 ) are formed, the exactly arranged positioning elements for the insertion and positioning of the optoelectronic components ( 2 ) having. Printed circuit board ( 16 ) according to one of the preceding claims, characterized in that recordings ( 11 . 12 ) as positioning elements for receiving the optical fibers ( 3 ) or the like. Are provided. Printed circuit board ( 16 ) according to one of the preceding claims, characterized in that recordings ( 11 . 12 ) as positioning elements for additional components, preferably for cooling elements ( 6 ), Conductor elements or the like are provided. Printed circuit board ( 16 ) according to one of the preceding claims, characterized in that the optoelectronic components ( 2 ) in recordings ( 11 . 12 ) within additional components, preferably within cooling elements ( 6 ), are receivable and positionable, themselves by the frame of reference ( 1 ) or its recordings ( 11 . 12 ) within the optical information transmitting layer ( 15 ) are positioned and fixed. Printed circuit board ( 16 ) according to claim 9, characterized in that as additional components cooling elements ( 6 ) can be used in the form of prefabricated heat conducting elements, preferably as copper elements, the precisely fitting outer shapes for insertion into the frame of reference (US Pat. 1 ) or the associated recordings ( 11 . 12 ) and snapshots ( 11 . 12 ) for the optoelectronic components ( 2 ) exhibit. Printed circuit board ( 16 ) according to one of the preceding claims, characterized in that each optoelectronic component ( 2 ) a separate frame of reference ( 1 ), which determines the exact position of the associated optoelectronic component ( 2 ) and light guides ( 3 . 3 ' ) or the like. Pretends to each other. Printed circuit board ( 16 ) according to one of claims 1 to 10, characterized in that each optical transmission path has its own reference frame ( 1 ), which determines the exact position of opto-electronic components ( 2 ) and light guides ( 3 . 3 ' ) or the like. Pretends to each other. Printed circuit board ( 16 ) according to one of the preceding claims, characterized in that the frame of reference ( 1 ) the same layer thickness as the optical information transmitting layer ( 15 ) having. Printed circuit board ( 16 ) according to one of the preceding claims, characterized in that above the optical information transmitting layer ( 15 ) a cover layer is arranged, the optical information transmitting layer ( 15 ) protects. Printed circuit board ( 16 ) according to one of the preceding claims, characterized in that as the optical information transmitting layer ( 15 ) in the form of integrated optical waveguides ( 3 ' . 7 . 17 ) or optical fiber ( 3 ), preferably in the form of fibers with optical functions, preferably polymer fibers or glass fibers, or the like. Functional assemblies are providable. Printed circuit board ( 16 ) according to one of the preceding claims, characterized in that as the optical information transmitting layer ( 15 ) integrated-optical waveguides made of waveguide cores ( 3 ' ), Substrate layer ( 7 ) and superstrate layer ( 17 ), all of these layers being transparent to the drive wavelength and the refractive index of the waveguide core layer ( 3 ' ) larger than that of the substrate layer ( 7 ) and the superstrate layer ( 17 ) are. Printed circuit board ( 16 ) according to one of the preceding claims, characterized in that as optoelectronic components ( 2 ) VCSEL (Vertical Cavity Surface Emitting Laser), preferably transversely multi-mode front-emitting VCSEL and / or photodiodes, preferably GaAs-based pin-type photodiodes or MSM photodiodes are provided. Printed circuit board ( 16 ) according to claim 17, characterized in that the VCSELs emit at about 850 nm. Printed circuit board ( 16 ) according to one of claims 17 or 18, characterized in that VCSEL and / or photodiodes are arranged in one-dimensional array structures. Printed circuit board ( 16 ) according to one of the preceding claims, characterized in that the electrical contacting of the optoelectronic components ( 2 ) perpendicular to the optical information transmitting layer ( 15 ) with other electrically conductive layers ( 9 ) of the printed circuit board ( 16 ) via a film-like transparent carrier material ( 4 ) takes place on the corresponding electrical conductors ( 5 ), which are connected to contacts of the optoelectronic components ( 2 ) as well as contacts in at least one electrically conductive layer ( 9 ) of the Printed circuit board ( 16 ) or another circuit board are connectable. Printed circuit board ( 16 ) according to claim 20, characterized in that as a film-like transparent carrier material ( 4 ) a Kapton foil is usable. Printed circuit board ( 16 ) according to one of claims 20 or 21, characterized in that the film-like transparent carrier material ( 4 ) through an opening in the over the optical information transmitting layer ( 15 ) attached cover layer or superstrate layer ( 17 ) to the outside of the circuit board ( 16 ) or in another electrically conductive layer ( 9 ) of the printed circuit board ( 16 ) or another printed circuit board is performed. Printed circuit board ( 16 ) according to one of claims 20 to 22, characterized in that the film-like transparent carrier material ( 4 ) between the optoelectronic component ( 2 ) and the light guide ( 3 . 3 ' ) or the like. Runs in the region of the shock coupling. Printed circuit board ( 16 ) according to one of claims 20 to 23, characterized in that the film-like transparent carrier material ( 4 ) a recess in the region of the passage of light between the optoelectronic component ( 2 ) and the light guide ( 3 . 3 ' ) or the like. Has in the region of the shock coupling. Printed circuit board ( 16 ) according to one of claims 20 to 24, characterized in that the film-like transparent carrier material ( 4 ) also forms the support for VCSEL bonded thereto. Method for producing a printed circuit board ( 16 ) with at least one optical information transmitting layer ( 15 ) and at least one electrically information transmitting layer ( 9 ), in particular a printed circuit board ( 16 ) according to claim 1, characterized in that in a first step on a substrate layer ( 7 ) a frame of reference ( 1 ) of a region of the optical information transmitting layer ( 15 ), the recordings ( 11 . 12 ) for the optoelectronic components ( 2 ) and the light guides ( 3 ) and / or further components ( 6 ), in a second step, the optoelectronic components ( 2 ) and the light guides ( 3 ) and / or further components ( 6 ) in the recordings ( 11 . 12 ) and about the recordings ( 11 . 12 ) and the electrical connections ( 5 ) of the optoelectronic components ( 2 ) are led out perpendicular to the circuit board level and then the optical information transmitting layer ( 15 ) and / or laminated with a cover. Method according to claim 26, characterized in that, in one embodiment, the optical waveguides serve as waveguides, the waveguide cores ( 3 ' ) or the like and the frame of reference ( 1 ) in one operation, preferably made of the same material. Method according to one of Claims 26 or 27, characterized in that the optoelectronic components ( 2 ) by means of conventional loading procedures in the ready-made recordings ( 11 . 12 ) are used. Method according to one of Claims 26 to 28, characterized in that the reference frame ( 1 ) and the images formed therein ( 11 . 12 ) as well as partly the optical information transmitting layer ( 15 ) are produced by means of a casting method by means of doctor blade technology. Method according to claim 29, characterized in that as casting material temperature-stable polysiloxanes are used. Method according to one of Claims 26 to 28, characterized in that the reference frame ( 1 ) and the images formed therein ( 11 . 12 ) as well as partly the optical information transmitting layer ( 15 ) are produced by a photolithographic process. Method according to claim 31, characterized in that as photolithographic process the laser direct writing or a Mask exposure method is used. Method according to one the claims 31 or 32, characterized in that as the photosensitive materials Polysiloxanes, polyurethanes, polyamides, acrylates or combinations used the same. Method according to one of Claims 26 to 33, characterized in that the reference frame ( 1 ) and the images thus formed ( 11 . 12 ) produced by means of applying and / or ablative laser processing method of a starting material and / or in the optical information transmitting layer ( 15 ) are introduced.