DE102004042154A1 - Radiator assembly has lateral sides of radiator having curved joint portion corresponding to bent portions of heat guiding tubes so that radiator and heat guiding tubes are joined without clearance - Google Patents
Radiator assembly has lateral sides of radiator having curved joint portion corresponding to bent portions of heat guiding tubes so that radiator and heat guiding tubes are joined without clearance Download PDFInfo
- Publication number
- DE102004042154A1 DE102004042154A1 DE200410042154 DE102004042154A DE102004042154A1 DE 102004042154 A1 DE102004042154 A1 DE 102004042154A1 DE 200410042154 DE200410042154 DE 200410042154 DE 102004042154 A DE102004042154 A DE 102004042154A DE 102004042154 A1 DE102004042154 A1 DE 102004042154A1
- Authority
- DE
- Germany
- Prior art keywords
- radiator
- cooling
- heat pipes
- guiding tubes
- cooling unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
- F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
- F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
- F28F1/32—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means having portions engaging further tubular elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4093—Snap-on arrangements, e.g. clips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- General Engineering & Computer Science (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Theoretical Computer Science (AREA)
- Geometry (AREA)
- Human Computer Interaction (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
Technisches Gebiettechnical area
Die Erfindung betrifft einen Kühler, bei dem die Wärmeleitrohre an den Kühlrippen anliegen können.The Invention relates to a cooler, in which the heat pipes on the cooling fins can be present.
Wie
aus
Wie
aus
Die
Kühlrippen
Nachfolgend werden die Nachteile der herkömmlichen Lösung zusammengestellt:
- 1. Die Wärmeleitrohre
12 haben im Bereich zwischen den gebogenen Abschnitten121 mit der gegenüberliegenden Planfläche123 der Kühlrippen11 einen Spalt122 , so daß die Kühlwirkung reduziert wird. - 2. Die Kühlwirkung
ist beschränkt,
wenn die Kühlrippen
11 mit dem zu kühlenden Gegenstand13 direkt in Kontakt stehen.
- 1. The heat pipes
12 have in the area between the bent sections121 with the opposite plane surface123 the cooling fins11 a gap122 so that the cooling effect is reduced. - 2. The cooling effect is limited when the cooling fins
11 with the object to be cooled13 directly in contact.
Aus diesem Grund hat der Erfinder in Anbetracht der Nachteile herkömmlicher Lösungen, basierend auf Langjährieger Erfahrung in diesem Bereich nach langem Studium, zahlreichen Versuchen und unentwegten Verbesserungen die vorliegende Erfindung entwickelt.Out For this reason, in view of the disadvantages of the present inventor Solutions, based on longtime Experience in this area after a long study, numerous experiments and unceasing improvements to the present invention.
Der Erfindung liegt die Aufgabe zugrunde, einen Kühler zu schaffen, bei dem die Wärmeleitrohre an den Kühlrippen anliegen können.Of the Invention is the object of the invention to provide a cooler in which the Heat pipes on the cooling fins can be present.
Der Erfindung liegt eine weitere Aufgabe zugrunde, einen Kühler zu schaffen, der eine höhere Kühlwirkung aufweist.Of the Another object of the invention is to provide a cooler create a higher cooling effect having.
Der Erfindung liegt eine nochmals weitere Aufgabe zugrunde, einen Kühler zu schaffen, der mittels Haken mit dem Sitz des zu kühlenden Gegenstandes verbunden ist.Of the Another object of the invention is to provide a cooler create by means of hooks with the seat of the to be cooled Object is connected.
Im folgenden wird die Erfindung anhand der bevorzugten Ausführungsbeispiele und der beigefügten Zeichnungen näher erläutert.in the The following is the invention with reference to the preferred embodiments and the attached Drawings closer explained.
Kurze Beschreibung der ZeichnungenShort description the drawings
Wege zur Ausführung der ErfindungWays to execute the invention
In
den
Bei
der Montage werden die Wärmeleitrohre
In
den
Bei
der Montage werden die Wärmeleitrohre
In
den
Bei
der Montage werden die Wärmeleitrohre
Nachfolgend werden die Vorteile der Erfindung zusammengestellt:
- 1. Da die Wärmeleitrohre
21 ,31 ,41 an den Verbindungsstellen223 ,323 ,423 anliegen können, wird der Spalt122 zwishcen den Kühlrippen11 und den Wärmeleitrohren12 vermieden, so daß die Kühlwirkung erheblich erhöht wird. - 2. Da die Wärmeleitrohre
21 ,31 ,41 über eine Befestigungsplatte23 oder direkt mit dem zu kühlenden Gegenstand25 ,35 ,45 in Kontakt stehen, kann die Abwärme des zu kühenden Gegenstandes25 ,35 ,45 , schnell absorbiert werden. - 3. Durch den ersten Kühlbereich
(
226 ,326 ) und den zweiten Kühlbereich (227 ,327 ) kann die Kühlwirkung erhöht werden.
- 1. Since the heat pipes
21 .31 .41 at the connection points223 .323 .423 can lie, the gap is122 between the cooling fins11 and the heat pipes12 avoided, so that the cooling effect is significantly increased. - 2. Since the heat pipes
21 .31 .41 via a mounting plate23 or directly with the object to be cooled25 .35 .45 can be in contact, the waste heat of the object to be kissed25 .35 .45 to be absorbed quickly. - 3. Through the first cooling area (
226 .326 ) and the second cooling area (227 .327 ), the cooling effect can be increased.
Aufgrund der obengenannten Tatsachen entspricht die Erfindung in ihrer Verfügbarkeit, Fortschrittlichkeit und Neuheit vollauf den Anforderungen.by virtue of the above facts, the invention corresponds in its availability, Progressiveness and novelty fully on the requirements.
Die vorstehende Beschreibung stellt nur die bevorzugten Ausführungsbeispiele der Erfindung dar und soll nicht als Definition der Grenzen und des Bereiches der Erfindung dienen. Alle gleichwertige Änderungen und Modifikationen gehören zum Schutzbereich dieser Erfindung.The The above description represents only the preferred embodiments of the invention and should not be used as a definition of boundaries and serve the scope of the invention. All equivalent changes and modifications are included to the scope of this invention.
Claims (19)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102004042154A DE102004042154B4 (en) | 2004-08-31 | 2004-08-31 | cooler |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102004042154A DE102004042154B4 (en) | 2004-08-31 | 2004-08-31 | cooler |
Publications (2)
Publication Number | Publication Date |
---|---|
DE102004042154A1 true DE102004042154A1 (en) | 2006-03-02 |
DE102004042154B4 DE102004042154B4 (en) | 2011-01-05 |
Family
ID=35745695
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE102004042154A Expired - Fee Related DE102004042154B4 (en) | 2004-08-31 | 2004-08-31 | cooler |
Country Status (1)
Country | Link |
---|---|
DE (1) | DE102004042154B4 (en) |
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102006011333A1 (en) * | 2006-03-09 | 2007-09-13 | Behr Industry Gmbh & Co. Kg | Device for cooling, in particular electronic components |
EP2016813A2 (en) * | 2006-05-04 | 2009-01-21 | Cooligy, Inc. | Gimballed attachment for multiple heat exchangers |
DE102009047206A1 (en) * | 2009-11-26 | 2011-06-01 | Scythe Eu Gmbh | Cooler for cooling CPU of computer system, has secondary finned cooling unit with heat guiding pipes inserted into grooves of primary finned cooling unit, where pipes are attached to base plate and thermally coupled at secondary unit |
US8157001B2 (en) | 2006-03-30 | 2012-04-17 | Cooligy Inc. | Integrated liquid to air conduction module |
US8254422B2 (en) | 2008-08-05 | 2012-08-28 | Cooligy Inc. | Microheat exchanger for laser diode cooling |
US8250877B2 (en) | 2008-03-10 | 2012-08-28 | Cooligy Inc. | Device and methodology for the removal of heat from an equipment rack by means of heat exchangers mounted to a door |
US8464781B2 (en) | 2002-11-01 | 2013-06-18 | Cooligy Inc. | Cooling systems incorporating heat exchangers and thermoelectric layers |
US8602092B2 (en) | 2003-07-23 | 2013-12-10 | Cooligy, Inc. | Pump and fan control concepts in a cooling system |
US9297571B1 (en) | 2008-03-10 | 2016-03-29 | Liebert Corporation | Device and methodology for the removal of heat from an equipment rack by means of heat exchangers mounted to a door |
EP3006885A1 (en) * | 2014-10-08 | 2016-04-13 | Mersen Canada Toronto Inc. | Hybrid heat pipe assembly with bonded fins on the baseplate |
EP2933593A4 (en) * | 2012-12-11 | 2016-11-02 | Furukawa Electric Co Ltd | Cooling device |
CN108870801A (en) * | 2018-08-09 | 2018-11-23 | 江苏热声机电科技有限公司 | Refrigeration motor conduction structure |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2996843B2 (en) * | 1993-09-14 | 2000-01-11 | 株式会社東芝 | Heat pipe cooler |
JPH0942870A (en) * | 1995-07-31 | 1997-02-14 | Hitachi Cable Ltd | Heat pipe type heat sink |
US5699853A (en) * | 1996-08-30 | 1997-12-23 | International Business Machines Corporation | Combined heat sink and sink plate |
US6394175B1 (en) * | 2000-01-13 | 2002-05-28 | Lucent Technologies Inc. | Top mounted cooling device using heat pipes |
JP3819316B2 (en) * | 2002-04-15 | 2006-09-06 | 株式会社フジクラ | Tower type heat sink |
TW537437U (en) * | 2002-06-28 | 2003-06-11 | Shuttle Inc | CPU heat dissipating fastener |
-
2004
- 2004-08-31 DE DE102004042154A patent/DE102004042154B4/en not_active Expired - Fee Related
Cited By (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8464781B2 (en) | 2002-11-01 | 2013-06-18 | Cooligy Inc. | Cooling systems incorporating heat exchangers and thermoelectric layers |
US8602092B2 (en) | 2003-07-23 | 2013-12-10 | Cooligy, Inc. | Pump and fan control concepts in a cooling system |
DE102006011333A1 (en) * | 2006-03-09 | 2007-09-13 | Behr Industry Gmbh & Co. Kg | Device for cooling, in particular electronic components |
US8157001B2 (en) | 2006-03-30 | 2012-04-17 | Cooligy Inc. | Integrated liquid to air conduction module |
EP2016813A2 (en) * | 2006-05-04 | 2009-01-21 | Cooligy, Inc. | Gimballed attachment for multiple heat exchangers |
EP2016813A4 (en) * | 2006-05-04 | 2010-11-03 | Cooligy Inc | Gimballed attachment for multiple heat exchangers |
US8250877B2 (en) | 2008-03-10 | 2012-08-28 | Cooligy Inc. | Device and methodology for the removal of heat from an equipment rack by means of heat exchangers mounted to a door |
US9297571B1 (en) | 2008-03-10 | 2016-03-29 | Liebert Corporation | Device and methodology for the removal of heat from an equipment rack by means of heat exchangers mounted to a door |
US8299604B2 (en) | 2008-08-05 | 2012-10-30 | Cooligy Inc. | Bonded metal and ceramic plates for thermal management of optical and electronic devices |
US8254422B2 (en) | 2008-08-05 | 2012-08-28 | Cooligy Inc. | Microheat exchanger for laser diode cooling |
DE102009047206A1 (en) * | 2009-11-26 | 2011-06-01 | Scythe Eu Gmbh | Cooler for cooling CPU of computer system, has secondary finned cooling unit with heat guiding pipes inserted into grooves of primary finned cooling unit, where pipes are attached to base plate and thermally coupled at secondary unit |
EP2933593A4 (en) * | 2012-12-11 | 2016-11-02 | Furukawa Electric Co Ltd | Cooling device |
EP3006885A1 (en) * | 2014-10-08 | 2016-04-13 | Mersen Canada Toronto Inc. | Hybrid heat pipe assembly with bonded fins on the baseplate |
CN108870801A (en) * | 2018-08-09 | 2018-11-23 | 江苏热声机电科技有限公司 | Refrigeration motor conduction structure |
Also Published As
Publication number | Publication date |
---|---|
DE102004042154B4 (en) | 2011-01-05 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8110 | Request for examination paragraph 44 | ||
8125 | Change of the main classification |
Ipc: F28D 15/02 AFI20051017BHDE |
|
R020 | Patent grant now final |
Effective date: 20110405 |
|
R082 | Change of representative |
Representative=s name: ELBPATENT - MARSCHALL & PARTNER PARTGMBB, DE Representative=s name: MARSCHALL & PARTNER, DE |
|
R119 | Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee |