DE102004049955B4 - Method for producing an optical component, in particular an OLED - Google Patents

Abstract

Method, which produces an optical component (1), comprising
providing a base substrate (10),
providing a lid (20),
creating an optical quality region (36) on the base substrate (10),
applying a frame-shaped first connecting element (12) to the base substrate (10) and / or the cover (20),
subsequent to these steps, bonding the base substrate (10) and the lid (20) by means of the first connecting element (12) to an arrangement in which the optical quality region (36) between the base substrate (10) and the lid (20) within the is encapsulated frame-shaped first connecting element (12), wherein
the first connecting element (12) comprises at least one of the following materials: a thermoplastic, a polymerizable thermoset, a solder, a glass and a toner; in which
the first connecting element (12) is printed by electrophotography.

Description

The The invention relates to a method for producing an optical Component, in particular an OLED and the optical component or the OLED in general and a hermetic method Encapsulation of an optical quality range, z. B. a light-emitting layer arrangement or such Device in particular.

Electro-optical Components, in particular organic electroluminescent light-emitting diodes (OLED) are of great interest in Display applications and in the field of lighting technology, as opposed to others Luminous and display means have versatile benefits. So OLEDs can be very thin and even made flexible. Own to liquid crystal displays OLEDs have the advantage of being bright for themselves. OLEDs are therefore the subject intensive development work.

Problematic However, OLEDs are above all their very limited lifespan. The product-relevant operating life of OLEDs has hardly been achieved to extend to more than 10,000 operating hours. This is below Another reason is that the electroluminescent materials used are light under the influence of water or oxygen change what can lead to significant destruction.

In addition will be used in these optical components reactive metals as cathodes, the also be destroyed by oxidation under the influence of oxygen and water. OLED components need therefore an extremely good encapsulation with low permeation rates for moisture and oxygen.

Technically relevant OLED components with a long service life become more typical Way deposited on glass substrates. The permeation of water vapor and oxygen through glass is sufficiently low. Continue to be usually the components to the back Protection of the OLED coating encapsulated by means of a solid lid.

Of the Lid is usually made of glass or metal and can be used as a plate or housing accomplished be. With the carrier substrate the lid is connected by adhesive, for example on an epoxy resin basis and sealed (see the article "Reliability and degradation of organic light emitting devices ", P.E. Burrows et al., Appl. Phys. Lett. 65 (23), 1994).

The Tightness of substrate and lid material is usually for OLED applications sufficiently high. However, let the glued seam between these two elements still too much oxygen and water diffuse through, so that for the currently known adhesive materials the durability of the encapsulation is not sufficient.

To increase the service life of OLED components, getter substances that chemically bind oxygen and mainly water are therefore included in the encapsulated volume. Different groups of substances are known as getter materials. So are solids, such. B. CaO used ( EP 776147 A1 ), Liquids ( US 5962962 A . US 5821692 A . JP 7211456 A ) or gases ( WO 99/031227 A1 ) used.

The curing the Epoxidharzstoffe (polyaddition) takes place partially at higher temperatures, the also for the OLED materials can be critical. Next has the use of liquid Adhesives for the encapsulation of OLED components significant disadvantages, such. B. the formation of relatively thick and broad adhesive dowels in the edge area or over the surface of the materials with appropriate thick glue joints. This is with an increased risk of oxygen penetration and water or correspondingly stronger Oxygen or water contamination of the adhesive material connected.

Further lead adversely known adhesives for release of reaction products in Harden what an undesirable Interaction of the adhesive components with the OLED materials by itself draws.

moreover let yourself a very thin one Adhesive seam or small cross-sectional area with correspondingly lower Oxygen or water diffusion only with great technical effort achieve reproducible.

Therefore is intensively working on alternative methods for epoxy resin encapsulation researched.

From the DE 102 19 951 A1 and the DE 198 45 075 A1 For this purpose, it is known to connect a substrate to an OLED with a lid by means of a glass solder seam.

The US 2002/0027625 A1 discloses electrophotographic printing of barrier elements.

From the document WO 00/36665 A1 For example, a method based on the application of a barrier coating is known. For this purpose, thin alternating polymer layers and ceramic layers, z. As SiO ₂ , Al ₂ O ₃ applied. Another disadvantage is a costly production process. Furthermore, the suitability of this encapsulation for OLED components long life is still questionable.

From the document US 5895228 A encapsulation coatings with siloxane or siloxane derivatives are known. These individual layers are indeed we niger consuming, but do not have a sufficient encapsulation effect, so that more additional encapsulation technologies are necessary.

From the document US 5952778 A For example, a method comprising a three-layer coating consisting of a metallic film, a thin layer of a dielectric material, and a polymer film to terminate the coating stack is known.

however Here are also costly and expensive vacuum coating processes necessary.

Analogous approaches to multiple coating are also from the document WO 99/02277 A1 known. Here, the encapsulation coating consists of a metallic and the electrical layer, which are applied by means of vacuum processes.

The bonding of glass substrates with metallic cover substrates, as described in the document US 6080031 is proposed, has the disadvantage that the materials used here generally have very different coefficients of expansion, so that the composite can be under strongly changing mechanical stresses in thermal cycling. This can cause cracks in the encapsulation, which can contribute to increased diffusion of oxygen and water.

In the document US 4784872 A describes an encapsulation process in which a layer system consisting of a polymer layer over which a further film is deposited from a polymer-metal mixture. In addition, the component is poured into synthetic resin for sealing. Since typical process temperatures> 200 ° C must be used, this method can not be used for organic light-emitting diodes.

In the US 6,614,057 A an organic optoelectronic device is proposed, which has a first and second barrier layer, wherein a sealing portion between the two layers is provided, wherein in the sealing portion, a material is present, which is harmful to the optoelectronic device. In order to avoid damage, an additional inner barrier portion is provided which prevents the penetration of harmful substances into the optoelectronic device. For example, a solder or a low-viscosity epoxy resin is proposed for the sealing portion. However, such a double shielding with different materials is relatively expensive. In addition, the barrier layers must be placed exactly on top of each other during assembly, so that a part of the outer sealing portion does not come into the closed area with the optoelectronic device.

A similar two-stage seal is also used in the WO 03/065470 A1 and the WO 03/030272 A1 proposed. According to the WO 03/065470 A1 includes an inner seal of an encapsulation lid containing an adsorbent material, such as a getter or a desiccant. The WO 03/030272 A1 discloses a seal with an inner, preformed sealing dam. Even with these from the WO 03/065470 A1 and WO 03/030272 A1 known optoelectronic elements accordingly result in similar problems as in the of US 6,614,057 A known device.

In summary It should be noted that none of the previously known methods Ensures a satisfactory lifetime of OLEDs, allowing an efficient Mass production or its breakthrough in mass business yet could not be achieved.

From the DE 698 08 796 T2 Furthermore, polymeric charge transport materials are known, which can be used in OLEDs for elektrovorprographischen devices.

The The invention therefore has the task of providing a method for Production of an optical component and an optical component to provide which or which ensures a prolonged life.

A Another object of the invention is to provide such a method and Such a device with a low diffusion into the quality range, a low contamination of the quality range and with less Release of impurities from the materials used ready to deliver.

Yet An object of the invention is to provide such a method providing reproducible results and cost-effective Mass production is suitable.

Yet Another object of the invention is to provide such a method and to provide such a device, which or which avoids or at least reduces the disadvantages of known methods.

The object of the invention is achieved in a surprisingly simple way already by the subject matter of the independent claims. advantage Developments of the invention are defined in the subclaims.

It is a method for producing an optical component, in particular a light-emitting device, for. B. an organic light-emitting Device, more precisely diode (organic light emitting device or diode, OLED) and the optical component itself made available. According to the invention first a base substrate or a base and a lid or cover substrate provided and then an optical quality range produced on the base substrate or applied to this. The optical quality Department is in particular a light-emitting region, preferably formed by a light-emitting layer arrangement or an OLED layer arrangement.

Under "applying" to a substrate or another element is within the meaning of this description, so far not expressly otherwise used, an immediate application or an indirect application to understand with the interposition of further layers.

Of the Construction of an OLED layer arrangement is basically known to the person skilled in the art. In particular, it comprises at least one first and second conductive electrode layer and an intermediate layer with an organic, electroluminescent Material. It can but also more layers, z. B. a resistance layer be provided for producing a structured OLED.

Further According to the invention is a first connecting element, z. For example, a frame from a connection or encapsulating material on the base substrate and / or on the Cover substrate applied. Subsequently, the base substrate and the cover substrate by means of the first connection element in such a way connected to an arrangement that, the light-emitting layer arrangement lying inside between the base substrate and the cover substrate and encapsulated within the frame. The frame is z. B. closed rectangular and is formed by limiting sides or frame bars.

One Advantage of the frame-shaped Connecting element is that the light, at least when using of transparent electrodes in both directions through the base substrate and the cover substrate can be emitted because of the quality range is left free on both sides.

The Contains connecting element doing at least one of the following materials: A thermoplastic, a polymerizable thermoset, a solder, a glass and / or a toner.

The Inventors have found that the aforementioned materials by a common advantage over those conventionally used Materials, namely through a low permeability for impurities, in particular Oxygen and water, which reduce the lifetime of the OLED can.

One Another advantage of the proposed connecting materials their easy handling and processing. You can z. B. at least partially very precise and cost-effective which are in particular the mass production of OLEDs allows. The variety of applications and thus the market potential for inexpensive and durable, especially structured OLEDs are huge. The connecting materials fulfill at the same time two functions: they accomplish a fixed and / or permanent Connection of the two substrates and act as a sealing material against Diffusion.

With In other words, the two substrates by means of the connecting element sealed against each other.

When particularly suitable material for the first connecting element or connecting material have become thermally, more precisely by means of heating and on the other hand by means of electromagnetic, more precisely by means of UV irradiation polymerizable thermosets or thermo polymers, eg. B. UV coatings proven. These are easy to process and long-term stable. Alternatively suitable but also metal or Glass solders analogous to the ceramic colors as material for the first Connecting element, d. H. as a connecting material.

The proposed connecting materials are characterized by chemical Inertness and resistance to cleaning and solvents. they give furthermore, a sufficient amount of oxygen, water and polymerization products from. In particular, the thermosets and solders are characterized by thermal stability, what in processes with higher Temperatures is particularly advantageous.

Furthermore if the compound is sufficiently stable mechanically, e.g. B. against cleaning processes with brushes or in vacuum processes. Also the adhesion on the substrates or Intermediate layers is advantageously high. But also the good and fast availability, at moderate temperatures is beneficial.

According to a particular embodiment of the invention, the first connection element is a planar layer over the light-emitting layer arrangement, possibly with interposition weite applied layers. This has the advantage that a large-area bond between the two substrates can be created and that the connecting element can simultaneously serve as a passivation.

Especially in a flat Application, it may be advantageous, a translucent or transparent Insert connecting element, so that the emitted light through the connector layer can be transmitted.

Prefers is a material for the first connecting element, which is before the application and / or while the application in a solid state of aggregation, in particular in a powdery one State is.

The Applying a solid or powdery connecting material either directly to the OLED or indirectly with the interposition of a transfer element is particularly advantageous because established printing techniques can be applied and with these a precise structured application allows is. So it may be smearing or contaminating the highly sensitive light-emitting layer arrangement can be largely avoided.

According to one exemplary embodiment becomes a toner or a thermoplastic or under heat treatment melting bonding material by means of an electrophotographic process, as with a laser printer, on a transfer roller with an elastic surface powdery and patterned and applied by the transfer roller on the Transmit OLED. In this transfer the connecting material is melted and fixed with it (so-called computer-to-glass, CTG method). In this method is so the first connection element printed structured.

But also other printing methods, eg. Screen printing, gravure printing, offset printing, Pad printing, thermal transfer printing and jet printing are suitable in combination with the method according to the invention.

According to one preferred embodiment of The invention is the application of the light-emitting layer arrangement divided into at least two sub-steps, wherein in each sub-step at least one layer of the layer arrangement is applied. The application of the first connecting element is between the both sub-steps performed.

This can z. B. according to the following Order of the layer application are performed. First, will in a first of the two sub-steps, the first electrode or Electrode layer, z. B. a conductive transparent ITO anode and optionally further functional layers applied to the base substrate. The functional layers can z. As barrier layers or vapor-deposited glass and can with Getter layers are combined.

To the application of the aforementioned layers, but before the application the light-emitting layer with the electroluminescent material becomes the connecting element, in particular in the form of a frame applied to the previously applied layers on the base substrate. Only then In a second of the two substeps, the light-emitting Layer with the electroluminescent material and the second electrode or electrode layer applied.

Of the size Advantage of this process sequence is that contamination the light-emitting layer and the second electrode layer can be effectively avoided with the connecting material. The above-described order is particularly in connection with the printing of the connecting element advantageous because the light-emitting Layer can not be damaged when printing.

Though the layer deposition is preferably carried out under a protective atmosphere, nevertheless it is desirable to leave the electroluminescent material as short as possible unprotected. Therefore It is another advantage that the time between applying the light-emitting layer and the application of the second electrode layer above or the encapsulation of the layer arrangement according to the invention very short can be held.

Especially is the length of time between the application of the light-emitting or electroluminescent Layer and connecting the base substrate and the cover substrate less according to the invention than 10 minutes, preferably less than 1 minute and most preferred even less than 40 seconds. This is with conventional methods in which finally An adhesive is applied, hardly possible.

alternative or in addition The connecting element can also be applied to the cover substrate become. This has the advantage that also a contamination the light-emitting layer assembly with bonding material can be avoided.

It has proven to be advantageous, in each case one or more connecting elements, for. In the form of connecting frames on both substrates, applying or printing the base substrate and the cover substrate.

According to one more embodiment The invention is the optical quality range before joining the base substrate with the lid with a pre-encapsulation coating, in particular a single layer of vapor-deposited glass, a multiple layer covered with different materials or a gradient layer. With such a pre-encapsulation layer, the functional layers become of the optical quality range additionally protected, in particular also from damage the joining process.

The Connection frames on the two substrates are either the same large, so that they are pressed together when joining or are intertwined nested so that the edges of the Frame or frame at least partially offset laterally to lie to each other. This further increases the tightness of the Encapsulation.

According to a preferred Embodiment of Invention are at least a first and a second connecting element, z. B. two nested connection frames, which order the light-emitting layer arrangement are arranged around, applied. In this case, the two connecting elements contain in particular different materials with different curing behavior.

For example is a frame made of thermoset and a second frame made of thermoplastic applied. In the ongoing manufacturing process ("inline"), z. B. on a conveyor belt first activates the first connection element and thus the two substrates first provisionally but quickly connected to the thermoplastic and subsequently the so provisionally encapsulated device taken from the assembly line, delayed or more specifically in a second step the second connecting element slowly, z. B. under heat to activate or harden. The second step can then z. B. under controlled conditions in a warming cabinet accomplished become. Furthermore, a connecting element, the sealing function and another connector fulfills the connection function.

With this procedure leaves on the one hand a high quality but slowly hardening Use connecting material and still have a fast hermetic, essentially fluid-tight encapsulation of the electroluminescent Material or the light-emitting area.

Further preferably has one of the two substrates, in particular the Cover substrate a circumferential recess or frame-shaped groove in which the connecting element or material is pressed during connection becomes. Thus, a reduced distance of the two substrates can be achieved so that the attack surface for diffusion is reduced by impurities.

Preferably has the first connection element in the connected component a thickness of 1 micron up to 50 μm on. The distance between the two substrates, preferably glass substrates lies likewise preferably in the range from 1 μm to 50 μm. If additional getter introduced is, the distance can also be chosen larger, z. B. 300 to 500 microns.

Even though the inventive electro-optical Component already an elevated Impermeability to diffusion, it may be advantageous additionally to provide a getter or getter material. The getter material can be gaseous within the connection frame or within the substrate connection be formed encapsulated area and / or between the connection frame be arranged. Alternatively or additionally, a getter material, which z. As oxygen and / or water absorbs the material of the or the connecting elements are mixed. Next alternative or in addition For example, the light-emitting layer arrangement may be a getter layer include. The getter material can instead of gaseous liquid, powder or compact, z. B. in tablet, pillow, platelet or disc shape or be as adhesive pads.

The first and possibly further connecting elements preferably contain a chemically inert and / or solvent resistant Material which is in particular impermeable to oxygen and / or water, to increase the life span further.

It is also advantageous, and therefore preferred, electrical connections to external contact of the light emitting area between the first connection element and the first or second substrate lead out of the light emitting area, wherein the first connecting element a contains electrically insulating or dielectric material or consists of such.

Preferably be at least part of the process steps described above, especially including the connection of the two substrates in an efficient manner at the substrate level. To activating or curing the Connecting materials, the components or OLEDs are then isolated.

• – Leucht- und/oder Beleuchtungsanwendungen der Displaytechnik bzw. Lumineszenztechnologie, insbesondere OLEDs,
• – Backlights von Mobiltelefonen, PDAs oder LCD displays in der Dispalytechnologie,
• – Hinweis- und Leuchttafeln, z. B. für die Werbung,
• – Hinweis- und Leuchttafeln, insbesondere variable Anzeigen für Signage,
• – Schalter- und Sensorbeleuchtung im Haushalt, z. B. für ein Kochfeld, Leuchtböden, Spezialbeleuchtung etc.,
• – Lichtflächen
• – Hinweis- und Leuchttafeln, Schalter- und Sensorbeleuchtung in der Automobiltechnik oder Avionik,
• – Notbeleuchtung, transportable batteriebetriebene Leuchten für Outdooranwendungen,
• – elektronische Anwendungen,
• – biotechnische Anwendungen,
• – optoelektronische Anwendungen und
• – Photovoltaik.

The invention opens up by its simplicity a variety of application fields, these are z. B .:

• Illumination and / or illumination applications of display technology or luminescence technology, in particular OLEDs,
• - Backlights of mobile phones, PDAs or LCD displays in display technology,
• - Note and light panels, z. For advertising,
• - information and light panels, in particular variable signage displays,
• - Switch and sensor lighting in the home, z. B. for a hob, lighting floors, special lighting, etc.,
• - light surfaces
• - Information and light panels, switch and sensor lighting in automotive or avionics,
• - Emergency lighting, portable battery-operated lights for outdoor applications,
• - electronic applications,
• - biotechnical applications,
• - Optoelectronic applications and
• - Photovoltaic.

in the The following is the invention with reference to embodiments and below Reference to the drawings closer explains being same and similar Elements are provided with the same reference numerals and the features the various embodiments can be combined with each other.

Brief description of the figures

It demonstrate:

1 - 3 Top views of substrates each having a connecting element according to various embodiments of the invention,

4 a top view of a substrate with a plurality of fasteners,

5 - 7 Cross sections through substrates each having a connecting element according to various embodiments of the invention,

8th - 10 Cross sections through two substrates to be connected according to various embodiments of the invention,

11 a cross section through an arrangement of two substrates to be joined,

12 a cross section through the arrangement 11 after connecting,

13 a cross section through a further arrangement of two substrates to be joined,

14 a cross section through the arrangement 13 after connecting,

15 a cross section through a further arrangement of two substrates to be joined,

16 a cross section through the arrangement 15 after connecting,

17 a cross section through an arrangement to be connected under a defined atmosphere,

18 a cross section through the arrangement 17 after connecting,

19 - 21 Cross sections through two substrates to be connected according to various embodiments of the invention,

22 a cross section through an arrangement to be connected with getter element,

23 a cross section through the arrangement 22 after connecting,

24 a cross section through an arrangement to be connected with a structured cover substrate,

25 a cross section through an arrangement to be connected with different connecting elements and

26 a cross section through another arrangement to be connected with different connecting elements.

Detailed description of the invention

1 shows a solid substrate 10 with a first connecting element 12 in the form of a connecting frame made of a connecting material, for. B. from a thermoplastic. The connection frame is from the edge of the substrate or base substrate 10 spaced, but close to the edge directly on the substrate 10 applied. The frame 12 is essentially square shaped. It has been shown that with a width of the frame 12 from about 0.1 mm to 5 mm, preferably about 1 mm and a thickness of about 3 microns to 15 microns, a satisfactorily low diffusion can be achieved.

Particularly preferred is the substrate 10 pretreated to a good and tight adhesion of the frame 12 or of the bonding material on the substrate. Furthermore, by suitable pretreatment the wetting of the substrate 10 be improved by the bonding material. The pretreatment may include washing, plasma treatment, UV and / or ozone loading act and / or a mechanical pretreatment, such. B. rubbing or roughening.

For a safe Adhesion of the bonding material on the substrate may also be a separate pre-coating, z. B. a primer layer, before the Applying the connecting material or between this and the Substrate be advantageous.

The connecting material or the frame 12 is z. B. by screen printing, gravure, offset printing, flexographic or pad printing printed. In particular thermosets are selected so that as little additives or solvents are released. The abovementioned printing processes are particularly suitable for absorbent and porous substrates.

alternative is the bonding material by means of a nozzle jet method or a spray coating, z. B. electrospray method, printed. This method is also used for inkjet printers and is therefore generally known to the person skilled in the art. The spray coating is also suitable due to the good drying of the spray medium or connecting material especially for absorbent and porous Substrates. Further advantageous is the low material consumption.

Further alternatively, a digital printing method, e.g. B. Electrophotography used and z. B. a toner printed.

One Advantage of the CTG method is that solvent used in the encapsulation of the component can, not or only slightly available. Furthermore, can be uniforme produce homogeneous and laterally limited coatings.

Further alternatively, the structure of the connecting element 12 by exposure processes z. B. be made by means of a laser from liquid coating or by melting films.

The Slides are selected that possible little aggregates, eg. As plasticizers, resulting in contamination to lead and damage the components can are included.

Further Alternatively, the frame by means of subcarrier, z. B. as a decal with Transfer wet or thermal transfer.

The Use of digital techniques has the advantage of being on the creation of individual and expensive workpieces waived can be so that high tooling costs are avoided.

The inventive method has a number of other advantages. In particular with electrophotographic coating, a large-area rapid application of the plastic or solder is possible. With the method used by the inventors, a feed of up to 10 m / min was achieved at a width of 600 mm. This corresponds to a capacity of 6 m ² / min. But already coating performance with respect to the bonding material of 0.1 m ² / min or 1 m ² / min can already be considered advantageous.

Further Individual structures or individual pieces can be easily and cost-effective realize.

Furthermore is the application of even complex structures, defined in position and width with a lateral resolution smaller than 200 μm, preferably of up to about 60 microns possible.

The thickness of the connecting element 22 is predefined over the entire surface at least in the range of 3 microns to 15 microns adjustable. As a result, the use of defined amounts of material is guaranteed without excess, so that problems with the discharge of excess material can be avoided.

Further is the inventive method a big Span of said connecting materials applicable. Furthermore is the use of moderate temperatures allows, due to the sensitivity of OLED materials from is particular advantage.

2 shows a further embodiment of the invention, in which the frame 12 flush with the edge 14 of the substrate 10 completes the frame 12 outside the quality range or the optically active range 36 of the component is arranged. The outer dimensions of the frame 12 are therefore equal to those of the base substrate 10 ,

3 shows a further embodiment of the invention with a flat on the substrate 10 applied connecting element 22 , The connecting element 22 forms a homogeneous surface on the cover substrate and / or over the finished coated base substrate of the light-emitting device or of the optical component 1 , It is thus free of cavities under the transparent connecting element a light-emitting layer arrangement located (not shown in this illustration).

optional is the connecting material dyed, to the light coloring to influence. This can be z. B. depending on the joining technique by admixing of additives, dyes or absorbers to the bonding material for local and targeted energy intake.

4 shows a twelve frame arrangement on a large unitary substrate 10 for the parallel processing of several optical components or OLEDs 1 , Finally, or after joining the two substrates, the components are separated.

5 shows a glass substrate 10 with one directly onto the uncoated substrate 10 applied connection frame 12 ,

The Applying the connecting element at the beginning of the processing or before applying the light-emitting layer arrangement or on the uncoated base and / or cover substrate has the advantage that the adhesive properties on the carriers are good and the others Processing of the substrates is not or only slightly influenced.

6 shows a glass substrate 10 with an electrode layer applied immediately thereafter 16 in the form of an anode of transparent conductive material. For visible light, transparent conductive oxides (TCO), such as, for example, tin oxide or indium tin oxide (ITO), are suitable as the anode material. But even non-transparent materials, such as metals, such as gold or silver, with a sufficiently small layer thickness or by suitable structuring, for example in the form of a shadow mask transparent or partially transparent to the emitted light, so that this down through the glass substrate 10 can be emitted.

After coating the substrate 10 with the electrode layer 16 becomes the connection frame 12 on the electrode layer 16 ie indirectly to the at least pre-coated or partially coated substrate 12 applied.

The connection frame 12 may even affect the final coated base substrate 10 provided that sufficient liability is ensured.

Again referring to 6 show the bars 12a . 12b of the connection frame 12 a substantially circular segmental cross-section with a slope angle α of 5 ° to 75 °, preferably 10 ° to 60 ° and most preferably less than 45 °. The flat slope angle has the advantage that traces of liquid coating can be effectively avoided. As a result, the potentially negative influence of the bonding material on the light-emitting layer arrangement is reduced, which is particularly advantageous when the one shown below at least the electroluminescent layer is applied to the substrate, directly or indirectly. Furthermore, sticking of the coating during annealing processes is avoided.

7 shows the arrangement 6 with a subsequently applied layer of the light emitting layer arrangement, e.g. B. a layer of electroluminescent material 18 , So it will be after the application of the connection frame 12 still applied further layers of the light-emitting layer arrangement. Advantageously, can now immediately the cathode layer 17 and the solid, in this example essentially flat, top substrate 20 be applied so that the electroluminescent layer 18 only for a short time. Is due to the coating process used for the functional layer also the connection frame 12 Covered, it may be advantageous to remove the functional layer on the connection frame before the connection to achieve a solid connection. Such overlapping of the connection frame may arise, for example, in a dip coating, when the connection frame is not covered. Furthermore, there is also the possibility that the covering with the functional layer is destroyed or removed during the joining process and does not hinder the connection thereby. This can be done, for example, by applying a temperature and / or melting the connecting material with cracking / destroying the functional layer covering, so that a good connection is achieved without removing the functional layer.

8th shows the planar base substrate 10 with the light-emitting layer arrangement 30 comprising the anode layer 16 , a cathode layer 17 and the intermediate electroluminescent layer 18 as well as possibly further functional layers. It's just a connection frame 24 on the uncoated top substrate in this example 20 appropriate. The two solid and in this example essentially flat substrates 10 . 20 are now moved toward each other and joined together with activation of the connecting material against each other to make a permanent connection.

9 shows an embodiment in which only a connection frame 12 on the light-emitting layer arrangement 30 is applied.

10 shows a particularly preferred embodiment of the invention, wherein in each case a connection frame 12 . 24 are mounted on the base substrate or the light-emitting layer arrangement and the uncoated cover substrate. The two connection frames 12 and 24 lie facing each other in such a way that they come into contact during the assembly and thus produce a particularly secure connection.

• – Lokales Abwaschen des Verbindungsmaterials,
• – mechanisches Entfernen von überhöhten Abschnitten des Verbindungselemente 12, 24,
• – thermische Behandlung des Bautelements und/oder
• – Inkorporation von Beschichtungsrückständen in das Verbindungsmaterial während des Fügeprozesses, z. B. bei Thermoplasten.

Possibly. finds before joining the at the dielectric substrates 10 . 20 another post-processing of the fasteners 12 and or 24 instead of. The post-processing, in particular for cleaning residues of the connecting material, comprises the following steps:

• - local washing of the connecting material,
• - Mechanical removal of excessive portions of the fasteners 12 . 24 .
• - Thermal treatment of Bautelements and / or
• - Incorporation of coating residues in the bonding material during the joining process, eg. For example, in thermoplastics.

11 shows schematically a particular embodiment of the assembly. For this purpose, the joining process can be carried out in a normal atmosphere but also, depending on the requirement of the component, under an inert gas atmosphere (dry air, protective gas). The two substrates are first adjusted and subsequently under force, which is illustrated by the arrows F, assembled or -gepresst. This has, in particular over liquid adhesives, the advantage that the connecting material or the connecting frame 12 . 24 be compacted. After joining, the application of force is reduced again.

At least temporarily during joining or joining, the connecting material becomes 12 . 24 from above or through the cover substrate 20 activated locally by energy input, in particular in the case of a thermoplastic by means of a local heat input heated. The heat input is represented by the arrows L. Alternatively, from the side of the base substrate 10 or activated on both sides.

Of the local heat input is z. B. with a laser, a microwave, ultrasound, electromagnetic, incoherent Achieved light, infrared radiation or a heating contact. hereby a homogeneous connection of the entire component can be achieved.

alternative in the case of a thermoset, this is cured by means of UV light or it is cold-welded.

In order to protect the light-emitting layer arrangement, the two substrates are at least temporarily during the joining by means of a respective cooling element 32 . 34 in the area of quality surface or optical quality range 36 cooled. The cooling elements work conductive heat dissipating as metal blocks and / or are active, for. B. cooled by Peltier elements or in contact with coolants.

12 shows the connected optical component or the light-emitting device, more precisely an OLED 1 comprising the substantially parallel and by means of connecting frames 12 and 24 connected substrates 10 . 20 ,

13 shows a component to be connected 1 with a similar construction as in 11 , Additionally, within the connection frame 12 . 24 a layer 38 of getter material on the light-emitting layer arrangement 30 applied. The getter material is z. For example, calcium metal. 14 shows the connected component 1 out 13 ,

Referring to 15 can the getter layer 38 also, in particular directly, be applied to the cover substrate. 16 shows the connected component 15 ,

Referring to 17 the device to be connected is under a controlled atmosphere of gaseous getter material 40 joined together. Referring to 18 is the getter gas 40 in a cavity, passing through the two substrates 10 . 20 and the connected fasteners or frames 12 . 24 is formed, hermetically enclosed.

• – Es wird ein Gettermittel in das Verbindungsmaterial eingebracht oder eingemischt.
• – Es werden metallische, kristalline, organische oder anorganische Pulver aus Gettermaterialien, wie z. B. CaO, Ca, Phosphorpentoxid aufgestaubt.
• – Es wird eine Getterflüssigkeit aufgebracht.
• – Es werden Klebepads, enthaltend Gettermittel, z. B. CaO-Klebepads auf die lichtemittierende Schichtenanordnung innerhalb des Verbindungsrahmens aufgebracht.
• – Es werden Plättchen aus Gettermitteln auf auf die lichtemittierende Schichtenanordnung innerhalb des Verbindungsrahmens, z. B. CaO-Plättchen eingelegt.
• – Es werden Getterschichten oder -filme auf das Basissubstrat 10 und das Decksubstrat 20 aufgebracht.

Alternatively or additionally, the following processes are proposed for the use of a getter agent:

• - A getter is introduced or mixed into the bonding material.
• - There are metallic, crystalline, organic or inorganic powders of getter materials, such as. B. CaO, Ca, phosphorus pentoxide dusted.
• - A getter liquid is applied.
• - There are adhesive pads containing getter, z. B. CaO adhesive pads applied to the light-emitting layer assembly within the connection frame.
• - There are plates of getter on the light-emitting layer assembly within the connection frame, z. B. CaO platelets inserted.
• Getter layers or films are applied to the base substrate 10 and the cover substrate 20 applied.

Referring to 19 have the base substrate 10 and the cover substrate 20 in the not yet connected state each have a separate connection frame 12 respectively. 24 on. The connection frame 12 is smaller than the connection frame 24 so that an offset arises. Due to the offset in the connected state, the diffusion path is extended.

Referring to 20 this advantage is further enhanced by the fact that the cover substrate has a further connection frame 42 has, wel within the outer connection frame 24 is arranged. When joining, the three connection frames merge into a unitary connection element.

Another embodiment is in 21 shown in which on the base substrate 10 and the cover substrate 20 two nested connecting frames 12 . 44 . 24 . 42 are applied. Two frames each, namely the frame 12 and 24 on the one hand and 44 and 42 on the other hand, they face each other, so that they form a connection during assembly and in the assembled state, two nested and laterally spaced connection frames are formed.

Referring to 22 is another embodiment of the invention with a getter element 46 on the bass substrate 10 shown. The getter element is located between the connection frames 12 and 44 ,

23 shows the arrangement 22 in assembled or connected condition, in which the getter element 46 in the form of a frame laterally between the connecting frames 48 and 50 which are from the frame 12 and 24 respectively. 44 and 42 originated, arranged or enclosed. Advantageously, this is on the diffusion path from outside to inside, represented by the arrow D, an effective diffusion-blocking sequence connecting element getter connection element.

Referring to 24 has the top substrate 20 a frame-shaped depression or groove 52 on which the connection frame 12 is opposite. As a result, in the connected state, the connection frame bears 12 not so strong, what with a reduced and thus diffusion-reduced distance between the two substrates 10 . 20 accompanied.

In relation to 25 are similar 21 on each substrate two pairs opposite and facing fasteners 52 . 54 and 42 . 44 , applied to create a double structure in the connected state. The connecting elements contain this 42 and 44 in this example a thermoplastic material to make a fast connection in the running process. The connecting elements 52 and 54 contain a different material than the fasteners 42 and 44 , in this example, a slow-curing epoxy adhesive or pressure-sensitive adhesive. The epoxy adhesive is cured after removal from the current production process in a heating cabinet. Due to the fast fixation of the substrates or component halves with the plastic or solder in the running process and the slow curing of the adhesive in the cabinet, the process is "inline" suitable. The inventive method can also be used with other edge coater processes z. B. Low Temperature Bonding (LTB) can be combined.

Advantageously, the device 1 So hermetically sealed before the adhesive is cured. Furthermore, by the connecting element 42 . 44 Prevents adhesive contamination of the Lichemittierenden layer assembly indoors.

As in 26 is shown, the connecting elements 42 and 44 on the one hand and 52 and 54 on the other hand also be arranged interchanged.

Further can also a connection frame with a laminar connection layer or flat bonding be combined so that high forces can be absorbed and Nevertheless, the production process is simplified as described above becomes.

Claims (15)

Method which is an optical component ( 1 ), comprising providing a base substrate ( 10 ), providing a lid ( 20 ), generating an optical quality range ( 36 ) on the base substrate ( 10 ), applying a frame-shaped first connecting element ( 12 ) on the base substrate ( 10 ) and / or the lid ( 20 ), following these steps, bonding the base substrate ( 10 ) and the lid ( 20 ) by means of the first connecting element ( 12 ) to an arrangement in which the optical quality range ( 36 ) between the base substrate ( 10 ) and the lid ( 20 ) within the frame-shaped first connecting element ( 12 ) is encapsulated, wherein the first connecting element ( 12 ) comprises at least one of the following materials: a thermoplastic, a polymerizable thermoset, a solder, a glass and a toner; wherein the first connecting element ( 12 ) is printed electrophotographically. Method according to claim 1, characterized in that the generation of the optical quality range ( 36 ) applying a light-emitting layer arrangement ( 30 ) on the base substrate ( 10 ). Method according to one of the preceding claims, characterized in that as the first connecting element ( 12 ) a thermally polymerized bar thermoset is used. Method according to one of the preceding claims, characterized in that as the first connecting element ( 12 ) a thermosetting polymerizable by electromagnetic radiation is used. Method according to one of the preceding claims, characterized in that as the first connecting element ( 12 ) a metal or glass solder is used. Method according to one of the preceding claims, characterized in that the first connecting element ( 12 ) on the base substrate ( 10 ), the lid ( 20 ) and / or a transfer element is applied in powder form. Method according to one of claims 2 to 6, characterized in that the application of the light-emitting layer arrangement ( 30 ) applying a layer of electroluminescent material ( 18 ) and the application of the first connecting element ( 12 ) before applying the layer with the electroluminescent material ( 18 ) is carried out. Method according to one of claims 2 to 7, characterized in that the application of the light-emitting layer arrangement ( 30 ) applying a light-emitting layer ( 18 ) and the time duration between the application of the light-emitting layer ( 18 ) and bonding the base substrate ( 10 ) and the lid ( 20 ) is less than 10 minutes. Method according to one of the preceding claims, characterized in that in addition to the application of the first connecting element ( 24 ) on the lid a second connecting element ( 12 ) is applied to the base substrate. Method according to claim 9, characterized in that in the bonding of the base substrate ( 10 ) and the lid ( 20 ) the first and second connecting element ( 24 . 12 ) and connected. Method according to one of claims 9 or 10, characterized in that the first and second connecting element ( 24 . 12 ) are arranged laterally offset at least in sections. Method according to one of claims 9 to 11, characterized in that the first and second connecting element ( 12 . 44 ) are activated with a time delay. Method according to one of the preceding claims, characterized in that the bonding of the base substrate ( 10 ) and the lid ( 20 ) is subdivided into at least a first and second sub-step, in which the respective first and second connecting element ( 12 . 44 ), wherein the generation of the optical quality range ( 36 ) and the first and second connecting element ( 12 . 44 ) as well as activating the first connection element ( 12 ) is carried out in a continuous flow-band-like process, subsequently the arrangement thus produced is taken out of the running production line-like process and subsequently the second connecting element ( 44 ) is activated. Method according to one the preceding claims, characterized in that the optical quality range prior to bonding the base substrate to the lid with a pre-encapsulant coating is covered. Method according to claim 14, characterized by the pre-encapsulation coating a single layer of vapor deposition glass, a multiple layer with different materials or a gradient layer.