DE10343323A1 - Stamp lithography method and device and stamp for the stamp lithograph - Google Patents

Abstract

In a stamp lithography method for producing a structure on a substrate by means of at least one stamp, the stamp has a stamp body with a three-dimensionally structured stamp surface for producing a three-dimensional stamp imprint in a layer of an embossed substance arranged on the substrate. In the method, a first punch is provided in a working position on a stamper lithography apparatus, and at least one stamp imprint is produced in the imprinting substance by means of the first punch. Then, an automatic replacement of the first punch by means of a punch changing device from the working position for the treatment of the first punch outside the working position and an automatic replacement of the first punch or a second punch using the stamp changing device is carried out in the working position. The treatment may include stamp inspection and / or cleaning to ensure a high-throughput, low-defect production process.

Description

The The invention relates to a stamp lithography process for production a structure on a substrate using at least one stamp, and a punch lithography apparatus for carrying out the Process. Furthermore, the invention relates to a stamp for stamp lithography and a method for its production, as well as a method according to the invention or using at least one stamp according to the invention manufactured, finely structured component.

Of the Term stamp lithography (imprint lithography) comprises a group of developing techniques for the cost-effective production of fine-structured Components and components. For lithograph lithographs include various Process variants with specific advantages and application areas. In the stamp lithograph, a structured stamp (stamp, template) used in a mounted on a substrate Layer of a substance to be structured, for example in a polymer layer on a semiconductor wafer, a relief with a three-dimensional To create structure. For this purpose, the stamp has a stamp body a three-dimensionally structured stamp surface, the the desired three-dimensional structure as "stamp impression" or negative image the stamp surface generated.

The Topography of the stamp surface becomes common with the help of electron beam lithography or conventional produced by optical lithography. After the structuring step becomes the structured imprinting substance in subsequent process steps for generating a corresponding Pattern used in the substrate material. As the structuring process with the help of a stamp can be done much faster than a direct structuring of the substrate material by electron beam lithography or the like can through the stamp lithography at comparable feature sizes much higher Throughput can be achieved, thereby reducing production costs for finely structured Components can be reduced.

The Stamp lithography achieves similar throughputs like optical lithography. However, the cost of the reticle much bigger than the price for a stamp. At best for reticles with simple binary Structures are achieved comparable manufacturing costs. A Microlithography projection exposure equipment costs significantly more than a comparable nanoimprint device. Especially Degradation of the optics over the lifetime represents an unsolved problem.

to Time essentially two different methods are used namely the hot stamp lithograph (Hot Embossing Lithography (HEL), also called Nanomprint Lithography (NIL)), and the lithographic stamp exposure or Exposure stamp lithography (Step and Flash Imprint Lithography (SFIL)).

Hot-stamp lithography employs high temperatures and high pressures to produce the structures in an embossing process. A stamp with a structured stamp surface is pressed into a thin thermoplastic layer which is heated above its glass transition temperature. There is a rearrangement of the molecules in particular at the interface to the stamp instead, a large-scale flow of the resist is not possible. After demolding and an ion etching step, the substrate is covered with the thermoplastic layer having apertures corresponding to the pattern of the stamp. Methods for embossing relatively solid polymer layers are described in the patents US 4,731,155 or US 5,772,905 shown.

at The lithographic stamp exposure is to be structured as Substance a low-viscosity liquid Polymer used, which is cured by means of ultraviolet light. The stamp body is out of one for UV light transparent material, such as quartz glass, produced. In a first step, the structured stamp surface with a Adhesion-reducing separating layer provided and with a small distance aligned with the substrate coated with a transfer layer. Then the low viscosity photopolymer gets into the narrow gap introduced between the stamp and the substrate. In a third step the gap is closed and the polymer is by means of by the Hardened incandescent UV light stamped. After separation of the stamp From the substrate, the transfer layer through the recesses of Polymers etched away which makes the recesses suitable for further treatments Substrates open become.

There also in this process variant of the substance to be structured the three-dimensional structure of the stamp surface, or a complementary structure "imprinted" is, in the following Also this method as "embossing" and to be structured Substance referred to as "imprint substance", too if e.g. No embossing applied becomes.

The lithographic stamp exposure is presented in detail in the following publications, among others: "Step and Flash Imprint Lithography: A Progress Report" by C. Grant Willson, SV Sreenivasan, JG Ekerdt, TC Bailey, S. Johnson, EK Kim, DJ Resnick, WJ Daukscher, D. Mansini, KJ Nordquist; "High Resolution Templates for Step and Flash Imprint Lithography" by DJ Resnick, WJ Daukscher, D. Manicini, KJ Nordquist, E. Ainley, K. Gehoski, JH Baker, TC Bailey, BJ Choi, S. Johnson, SV Sreenivasan, JG Ekerdt and CG Willson; "Step & stamp imprint lithography using a commercial flip chip bonder" by Tomi Haatainen, Jouni Ahopelto, Gabi Gruetzner, Marion Fink, Karl Pfeiffer.

The lithographic stamp exposure requires due to use a liquid embossing substance particular effort in controlling the shape and width of the too filling Gap and in the mutual alignment between stamp and substrate before and during the exposure. In the international patent applications WO 02/08835 A2, WO 02/10721 A2 and WO 02/067055 A2 are numerous proposals for solving these Problems indicated.

intensive Research in the field of stamp lithography has meanwhile led to numerous promising experiments in the laboratory scale Structures with typical feature sizes of 50 nm and below to create.

It is an object of the present invention, for the method mentioned above to provide stamp lithography techniques and equipment, which contribute to these processes for industrial mass production to make usable.

These Task is by a stamp lithography method with the features of claim 1, a stamp lithography apparatus having the features of claim 45 and by a stamp having the features of Claim 96 solved. Advantageous developments are specified in the dependent claims. The wording of all claims is incorporated by reference into the content of the description.

According to a formulation of the invention, this relates to a stamp lithography method for producing a structure on a substrate by means of at least one stamp. The stamp has a stamp body with a three-dimensionally structured stamp surface for producing a three-dimensional stamp impression in a layer of an embossed substance arranged on the substrate. The method comprises the following steps:
Providing a first stamp in a working position on a stamp lithography apparatus;
Generating at least one stamp imprint in the imprinting substance by means of the first stamp;
Automatic replacement of the first punch by means of a punch changing device from the working position for the treatment of the first punch out of the working position;
Automatic replacement of the first punch or a second punch with the help of the punch changing device in the working position.

The Invention allows thus automating the loading and unloading of a stamp lithography apparatus with stamps. This creates an essential prerequisite with the help of stamp lithography a high number of embossing processes per Perform time unit, so that a cost effective, continuous mass production of finely structured components possible is.

at an embodiment is a first punch in the working position and at least a second Stamp outside arranged the working position and there is an automatic exchange of the first punch against the second punch by replacing the first stamp and replacement of the second stamp with the help of a Stamp changing device instead. If necessary, a place swap be made between the first stamp and the second stamp, so before replacing the second stamp and after replacement the first stamp in an outside the working position lying external position is arranged. Of the first and second stamps can be constructed largely identical, especially with largely same topography of the stamp surface. This can help Replace the stamps. It can also be structured differently first and second stamps are changed.

Preferably replace the first stamp and replace the first second punch timed, i. synchronized performed. The both sub-operations the stamp change can be carried out in a time-delayed manner, for example, to create pauses in which in the stamp lithography apparatus no stamp is attached. These breaks can be used for maintenance or cleaning be used. A particularly high throughput of stamping products can be achieved by the working movements when replacing of the first stamp and replacement of the second stamp at least temporarily run at the same time, so that there is a replacement time interval and partially or completely overlap a replacement time interval. This can minimize the time required for a stamp change Time can be achieved.

In one embodiment, a treatment of the first punch in an out of working position treatment position after replacing the first punch from the working position as well as a replacement of the first punch provided in the working position after the treatment. In this case, an automatic transfer of the first stamp between the working position and the treatment position and back can be carried out with the aid of a stamp changing device, which may optionally be associated with further conveying or conveying devices for stamps. The time in which the first punch is out of the working position and thus can not be used for an embossing process, can be used to perform an embossing with the help of one or more second punch. It is also possible to use only the first punch which can be handled between different embossing operations outside the working position.

The Treatment of a stamp can be done directly in the outer position. It is also possible, that the outward position is a transfer position is, from which a stamp is fed to a further treatment or in the one stamp after one outside the place of delivery performed treatment supplied becomes.

at an embodiment the treatment includes an inspection of the first Stamp. Here, the first stamp, for example, impurities and / or damage in Area of the stamp surface and / or for transmission properties or the like, to avoid the generation of rejects. By the fast, automatic transfer between Working position and treatment position can be an inspection after a relatively small number of, for example, 1 to 10, 11 to 50 or 51 - 100 Embossing operations are performed to a stable mass production process with minimal failure rate sure.

at some embodiments A visual visual inspection is provided to the operating personnel directly with the eye or with the aid of suitable aids, such as magnifying glass, Microscope or the like, the stamp surface or the stamp as a whole qualified.

at some embodiments is preferably using a suitable camera or the like generated digital image of the stamp surface and this image is then evaluated. The evaluation can turn from an operator visually, e.g. on a screen, or with help computer-aided Bildverarbeitungsvertahren be performed. Especially the image processing allows one for the mass-production process advantageous, operator-independent inspection of stamps on suitability for reuse in one Embossing process.

The Inspection can be done with the help of comparison techniques. In one embodiment becomes a reference stamp surface provided and it is a comparison of the assessed stamp surface with the reference stamp surface carried out. It is a direct comparison possible. In one embodiment An image of the reference stamp surface is generated and this image becomes directly with the stamp surface to be assessed or with a picture of it Stamp surface compared. The reference stamp surface represents while the desired Target topography of the stamp surface and can be attached to a master stamp be captured or have been. For example, it is possible to enter Hologram of the reference substrate surface and this hologram interferometrically with each to be assessed substrate surface one for to compare the process provided stamp. Drive Vergleichver enable a particularly quick and reliable inspection, since there are deviations be particularly well recognized by an ideal target structure. This makes both a visual and a computer-aided evaluation with high reliability possible. In particular, pixel-by-pixel comparisons of binary brightness levels are to Comparative parts of the reference stamp surface and the stamp surface of the Reach work stamp quickly. A virtual comparison standard can also be stored in a computer and used for inspection.

at other embodiments an indirect inspection of the stamp surface to be evaluated is carried out. For this a stamp imprint of the stamp surface is created and the topography the stamp is inspected. It is basically possible that embossed image directly on the to be embossed Substrate to check. Preferably However, a separate stamp or stamp cast created, which is then examined. This makes it possible to complete the manufacturing process temporally and spatially independently continue from the inspection. The manufacturing process is also based on the current production controlled on the wafer. However, this is only after finishing one Wafer exposure cycle possible and represents an intervention in the production process.

at another embodiment For example, a mechanical inspection of the stamp surface is performed using a profilometer, mechanical-optical or by means of a Force microscope. Also using electro-optical examination methods suitable depth resolution, For example, the use of a scanning electron microscope for examination a stamp surface, are possible. For this purpose, a conductive layer has to be deposited on the surface or vapor-deposited become.

The Inspection of stamps removed from the manufacturing process can be regular, for example after predetermined time intervals or a predetermined number stamping operations carried out be or irregular, for example dependent on certain occasions, who have an inspection displayed. An inspection can be carried out directly after the replacement of a stamp, around the stamp in case of a positive inspection result immediately to be able to use again in the production process. It is also possible to stamp regularly or irregular to branch off from the production process and routinely inspect independently of the production process.

It has proven to be beneficial when treating Stamping includes a cleaning of stamps. This makes it possible with a or a few stamps about many embossing cycles a high quality ensure the generated structure.

Around damage the stamp surface to be cleaned reliable during the cleaning process to avoid, in some embodiments, a cleaning fluid used, which is so selected is that on the stamp surface Adhesive impurities, such as residues of the embossing substance, be solved mechanically and / or chemically using the cleaning fluid can. The removal of impurities in dissolved and / or undissolved form can also be achieved with the help of the cleaning fluid. When Reinigungsfuide are in particular such flowable or flowable substances which are able to chemically and / or contaminate the contaminant mechanically to solve.

Becomes cleaning with the help of one or more cleaning fluids carried out, so can for example deionized water, often distilled acetone, N-methyl-pyrolidine (NMP) or mixtures with these substances used become. Alternatively or in addition is also the use of gaseous Cleaning fluids possible. Here, especially ozone and ionized argon are effective for the removal of imprint substance residues exposed.

It is possible, too, the stamp surface to be cleaned immerse in a bath with a cleaning fluid to remove impurities to solve. A Cleaning with the help of ultrasound is likewise possible, whereby Ultrasound alone or in combination with other types of cleaning, For example, with the immersion cleaning or a thermal Treatment, can be used.

The Cleaning can include a plasma cleaning. For this purpose, for example Oxygen / ozone can be used, possibly mixed with noble gases, to adjust the cleaning effect and aggressiveness suitable.

The Cleaning may include contact cleaning where the stamp surface is at least partially with a solid, but ideally compliant cleaning surface of a Cleaning device in touching contact is brought. These are damage-prone wiping, brushing or rubbing movements between cleaning device and substrate surface as possible to avoid. Ideally, the cleaning surface of the cleaning device optimized so that a bonding contact between the cleaning surface and the impurities to be removed is possible, so that the impurities after removal or separation of the cleaning device from the stamp surface of this can be lifted. The cleaning can be a pressing of the stamp surface to a plastic and / or elastically yielding, contaminant-dissolving cleaning surface of a Cleaning device include. As a cleaning device can a Cushion or a cleaning sheet can be used, for example a Polyethylene film, Polyvinyl chloride (PVC), of suitable silicones or polyvinyl alcohols.

Cleaning equipment, such as cleaning films, can be used for disposable cleaning which guarantees a particularly high operational safety. Another possibility is a used and possibly contaminated Cleaning device, for example, a film section, after the carried out with it Clean cleaning process and, where appropriate, to reactivate, that at least one further use is possible. Especially advantageous Here is the use of a revolving cleaning film, at the one cleaning section after the stamp cleaning one or passes through several cleaning and / or reactivation stations before the reactivated film section is returned to the stamp cleaning.

A Contact cleaning is also possible by the fact that on the stamp surface a layer a cleaning substance, for example, polyvinyl alcohol applied and then this layer after drying and curing again is deducted. In this case, contamination particles remain attached to the cured layer material and can deducted from the stamp.

The cleaning may include irradiation of the stamp surface with electromagnetic radiation to convert contaminant material. For example, UV radiation ver be used to harden or embrittle residues of imprinting substance to facilitate a subsequent detachment. Alternatively or additionally, the cleaning may include a thermal treatment of the stamp surface to, for example, spoil and / or char. The stamp material must be able to run through the temperature cycle with respect to form-true fully reversible. Suitable examples are Zerodur M or quartz glass.

The Treatment of a stamp outside the Working position can also be a stamp temperature, e.g. a preheat of the stamp include him for a thermally assisted one Embossing process on the appropriate working temperature or to a temperature close to it To bring working temperature. By preheating the residence time reduced in the working position and thereby the manufacturing process be accelerated.

The Treatment of a stamp outside the Working position can also be a storage or storage of the stamp include, e.g. in a magazine or other storage device.

A Geometry correction of the stamp surface by means of location-dependent temperature control may be advantageous for preventing or reducing deformations of the stamp surface be used. Such deformations can be detrimental to the quality affect the structure created by the stamp on the substrate. Deformations of the stamp surface can a change in size the entire stamp surface and / or location-dependent Include distortions or distortions. It can therefore both one over the whole stamp surface uniform as well as a location-dependent or spatially resolving Temperature influencing may be provided.

A Geometry control of the stamp surface, especially with help a measurement with a real-time geometry control unit allowed a quick and direct review of Stamp quality. If the control of the geometry proves to the stamp as too deformed, it can be replaced if necessary, or it can activities be initiated for geometry correction.

The Geometry control and geometry correction are preferred timely to the embossing process carried out, especially on a stamp, which is in its working position located.

The The invention also relates to stamps for stamp lithography and Process for producing such stamps.

Around use the stamp lithography up-to-date and cost-effectively in the future to be able to it should be possible be, structures with typical feature sizes of less than 150 nm to create. In this area, however, take the structural defects strong in the stamp lithography. The inventors have found that the surface texture of the Stamp surface, which also acts as an active stamping surface can be designated, this is particularly critical. Mechanical hardness and surface microstructure play a role here a crucial role.

To On the one hand, avoid the caking of residues of the imprinting substance on the stamp surface. This danger increases, the smaller the typical structural widths are and the more extreme the page-height ratio (aspect ratio) of the to be coined or structures to be structured. A typical defect exists in that an entire structural area sticks to the stamp, e.g. caked, and thereby lifted off the surface to be structured becomes. Another defect is the lifting of structural areas with unfavorable Sites height ratio. This Defect manifests itself especially in a break off of the structure within the imprinting substance. Also problematic are the so-called "Mäusezähnchen", which cause the to be formed Structures roughened on their structural edges or appear "eaten" a cause for this smallest particles of imprinting substance were identified, the process after the previous Abhebe remain in the corners of the stamp surface and to the next Embossing be transferred can. Another mistake is that the structures to be embossed are not fully formed, so that in place desired sharp edges create rounded corners. This error can due to an imperfectly formed negative image in the stamp arising or by an imprinting substance, their spatial Below the resolution limit became, since the long molecular chains of the embossing substance prevent the exact formation of sharp edges. These and other problems can with stamps according to the invention be mitigated or avoided.

A Class of inventive stamp records characterized in that the stamp surface has a low surface roughness has or microstructured for targeted ease of removability is and that the stamp surface itself substantially free of microcracks and adjacent to the stamp surface Material essentially free from the stamp surface directly reaching microcracks is. By a suitable microstructuring the surface, e.g. a wavy one or pimped surface with a peak-to-valley value of less than 5nm, may optionally the detachability can be increased by using the lotus effect.

The inventors have found that the provision of a very smooth or technically deliberately structured stamp surface in conjunction with the greatest possible avoidance of microcracks on the stamp surface contributes significantly to the reduction of rejects in the stamping process. The avoidance of microcracks means that extremely small structures no longer break off so easily during the embossing process. A low surface roughness or a surface fine structure with feature sizes well below the size of the embossed structures can also contribute to facilitated peeling.

In experiments, an average depth of roughness R _t (peak-to-valley) could be identified to be advantageous for the stamp surface area of less than 0.7 nm (RMS). The average microcracking length should be less than 150 nm, preferably less than 50 nm. It has been found that largely crack-free surfaces can be generated by the fact that the initially highly accurate and dimensionally pre-machined stamp surface is etched very deep in an etching process. As a result, micro-cracks can be visualized and it can be processed as fine as fine, especially fine-optical, until a substantially crack-free area is reached.

It has also been found to be advantageous if the stamp has a very high mechanical hardness in the region of the stamp surface, wherein preferably values of more than 400, 500, 600 or 700 kg / mm ² should be achieved. Obviously, this promotes a dimensional stability of the substrate surface which is conducive to a trouble-free embossing process and in particular to the avoidance of the abovementioned defects.

at some embodiments the stamp is made at least in the area of the stamp surface a hard material that provides the near-surface hardness. The near-surface Range can be made, for example, of cubic or hexagonal boron nitride, Silicon carbide, corundum, diamond or borazon or a suitable Heavy metal connection exist.

It has been found that in addition to the selection of materials and the Setting a suitable microstructure of the near-surface Area of the stamp can increase the process reliability. In some embodiments If the stamp is at least in the area of the stamp surface of a fine crystalline material having a mean grain size of less than 20% of a mean structural dimension of the stamp surface. Accordingly it may be a nanocrystalline material, with typical mean particle sizes in the range from 5 nm to 20 nm may be advantageous. For such materials can the fine crystalline structure or the high density of grain boundaries and other crystal defects to a high strength and hardness of Contribute material.

Embodiments are also provided in which the stamp, at least in the region of the stamp surface, consists of an amorphous material, in particular of an amorphous metal material. This also makes defect-free stamp surfaces of high hardness and low surface roughness possible. Even glasses, such as quartz glass, are usable. Favorable surface properties can also be achieved with layer-structured quartz glass which can be produced by burning silane with oxygen or silicon tetrachloride with oxygen to SiO ₂ .

Of the Stamp can look at least in the area of the stamp surface a single crystal material, whereby a low density of defects possible is.

Of the Stamp can be made from a single block of material, the die body and forms the stamp surface formed thereon. Some embodiments The invention are characterized in that the stamp a stamp body has a coating in the area of the stamp surface, the forms at least part of the stamp surface. It may be particular a wear-resistant Coating (wear layer) act. The use of such a coating makes it possible to change the properties the stamp in the area near the stamp surface regardless of the material of the punch body optimize.

at some embodiments the coating consists of a hard material, in order to be independent of Material of the stamp body a stamp surface high hardness provide. The coating can for example consist of a fine crystalline diamond material, a hard material with heavy metal compounds, Silicon carbide, boron nitride, borazon or other hard materials or combinations of these materials. The coating can consist of a finely crystalline material whose middle Grain size as above accomplished small against the typical structure size of the stamp surface is.

If a stamp is intended for use in the lithographic stamp exposure, it is preferred if the coating has such a small layer thickness that the coating for the light used in the exposure is at least partially transparent, so that an exposure through the coating is possible is. As material for the stamp body, for example, materials such as zirconium dioxide (ZrO ₂ ), alumina (Al ₂ O ₃ ), lanthanum fluoride (LaF ₃ ) or hafnium dioxide (HfO ₂ ) in a crystalline form can be used. In addition to these transparent materials, of which in particular LaF ₃ is very well transparent in the UV wavelength range, opaque materials are also possible, especially for stamp lithography methods which work without an exposure process. The use of very hard compounds such as silicon carbide (SiC), boron carbide (B ₁₈ C ₂ ) or (B ₂₄ C), diamond and mixed crystals, such as ZrO ₂ / HfO ₂ , HfO ₂ / Y ₂ O ₃ or ZrO ₂ / Y ₂ O ₃ for the punch body and / or a coating has also been found to be advantageous.

If the stamper body and / or a coating thereof consists essentially of a material having a linear expansion coefficient of less than 2.5 × 10 ^-6 , preferably less than 1.0 × 10 ^-6 , deformations of the stamper or of the stamper may occur Coating by external influences such as temperature fluctuations are largely avoided. Usable are, for example, glass ceramic or quartz glass.

at the design of the topography of the stamp surface has been used in some embodiments made sure that the stamp surface is one of the structuring the following separation of the stamp from the embossed substance facilitates. Has to do this a stamp of preferred embodiments a Stamping structure with a variety of recesses and protrusions, the in the area of flank surfaces merge, wherein at least a portion of the flank surfaces have a positive flank angle including a stamp plane. As a positive flank angle here is a deviating from 90 ° Understood angle between a flank and a punch plane, which leads that the flank area when looking at the stamp from the embossing side is visible. In particular, care must be taken that none of the flank surfaces has a negative flank angle, which avoided undercuts become. Cheap positive flank angles can in the range between 89 ° and 80 °.

A special embodiment A stamp is characterized by being at least partially consists of a piezoelectric material, which dimensions such is that at least part of a stroke movement of the stamp surface at an embossing process by controlling an electrical to be applied to the piezoelectric material Field is generated. The die itself can therefore change the external dimensions of the electrical signals be induced to emboss the movement contributes or by the the complete stamping movement the stamp surface are brought about can. In this case, a separate drive for lowering and Lifting of the stamp omitted and the stamp lithograph device can be very simple. As stamp material comes for this For example, crystalline quartz or other ionic crystal material or combinations of several materials into consideration. It is advantageous when the active piezoelectric material, which is shifted by the piezoelectric effect, not directly in the area the embossing surface is located.

has the stamp temperature measuring elements and / or tempering for temperature measurement and / or temperature control of the stamp, so it can be determined if the stamp one for the stamp lithograph Advantageous temperature range leaves and, where appropriate, countermeasures be taken, e.g. by using the stamping temperature with the help of Temperierungsmittel in the for the embossing process advantageous temperature range is returned. The measuring elements and the temperature control can thus be used as sensors or actuators use in a temperature control loop.

Become the temperature measuring elements and / or tempering in the stamp material continuous channels attached, so they are easily accessible from the outside. This can in particular be a wiring of the measuring elements or tempering much easier.

Becomes as tempering a liquid which can be conducted through the channels or a gas used, so can the channels especially advantageous for a temperature influence can be used. The construction effort for the Realization of the tempering is low in this case.

to position-sensitive, local temperature control of the stamp can each have a tempering agent and a temperature sensing element for forming a temperature control element be placed close to each other, with the temperature control elements Cover the stamp in a substantially grid-shaped arrangement can. This can be a location-dependent Temperature control of the punch is done, by the local over the temperature measuring elements certain temperature compared with a local setpoint and with the tempering is matched to this. The essentially grid-like On the one hand, arrangement ensures that a large part of the stamp is uniform from the temperature control is detected and on the other hand facilitated such an arrangement, the introduction of the temperature control elements into the stamp material, since these are e.g. in the above channels can be arranged.

If the stamp has a layer that is not transparent to infrared radiation, then it absorbs a radiation emitted by a light source in this spectral range. The radiation absorption leads to a heating of the layer, so that it can be used for a temperature control of the stamp. Such layers can be produced by targeted implantation of ions in the stamp material.

The Invention also relates to a method for producing a stamp, in particular a stamp for the stamp lithograph with a typical structural dimension of less than 250 nm, the stamp having a stamp body with a three-dimensionally structured stamp surface for the production a three-dimensional stamp imprint on a substrate arranged layer of an embossing substance having. For this purpose, the stamp body is processed in such a way that the stamp surface one for a replacement of the imprinting substance Optimized surface topography after producing a stamp impression and a material adjacent to the stamp surface material substantially free from the stamp surface reaching microcracks is.

With the implementation Such a method for producing a stamp is intended on the one hand be ensured that in a stamping process as few residues of the embossing substance on the stamp surface stay behind and on the other hand, that in the three-dimensional structuring of stamp surface one possible exact correspondence of a given three-dimensional structure can be generated. The latter can only be achieved if the stamp surface has only a small number of microcracks, otherwise the with structures typically below 250 nm three-dimensional textured stamp surface already before the first embossing process an optionally not insignificant number of structural errors contains.

One Advantageous method for producing a stamp comprises a highly accurate and faithful preprocessing of a substantially flat stamp surface, such a deep etching the stamp area in a subsequent etching process, until a substantially micro-crack-free area is reached and the subsequent one Creation of a three-dimensional stamp surface. When using such Process is the emergence of errors due to microcracks strong in the production of the three-dimensional stamp surface reduced.

Becomes the stamp material in a method according to the invention by mechanical Processing, in particular by walking and / or hammering in its structure changed, so the hardness and Strength of the material increases and / or the microcracking length decreases, on the one hand when impressing the stamp surface on the substrate a more precise Imprint of the stamp surface be generated because the stamp surface due to their great hardness embossing process is not significantly deformed. On the other hand, due to the low micro crack length Generation of structural defects of greater magnitude the stamp surface avoided. A mechanical processing method is also available to carry out relatively little effort.

at an advantageous method for producing a stamp is this structured by means of laser scanning technology.

The The invention also relates to a finely structured component, in particular a semiconductor device, which with a method according to the invention and / or produced using at least one stamp according to the invention has been. Such a finely structured component has due to the use a method according to the invention or Stamp a high quality the embossed surface structure on and is inexpensive manufacture.

The invention also relates to a stamp lithography apparatus for producing a structure on a substrate by means of at least one stamp. The device comprises:
a frame;
at least one stamp holding device attached to the frame for holding at least one stamp in a working position;
a substrate holding device arranged on the frame for holding at least one substrate; and
a punch changing device for automatic replacement of punches from the working position and for automatic replacement of punches in the working position.

The punch holder should be designed so that the replacement and replacement of punches, for example the coupling of a punch to the punch holder and the removal or decoupling of punches from the punch holder is possible without manual assistance of an operator. There are forms of execution, in which the punch holding device is designed as a clamping device to hold one or more stamp non-positively or frictionally. For this purpose, for example, suitable clamping springs may be provided. The stamp holding device may also have locking means for non-positive and positive holding at least one stamp. Stamp holding devices with at least one magnet holder for holding a stamp by means of magnetic forces are also possible. In this case, both permanent magnets, as well as switchable electromagnetic magnet holder can be used. While the use of Per Manentmagneten favors a particularly simple structure, can be minimized by the switching on and off of magnetic holding forces in electromagnets the force exerted when replacing and replacing stamps on the stamp holder force.

one Support by means of fluid pressure, i. Negative pressure or overpressure, which is optionally switchable, is also possible. For example, can the stamp holding device as a vacuum holder or vacuum holder be formed, including at the stamp lithographic system a suitable Vacuum generator, be provided for example a suction pump can. The stamp holder may be at least one movable Have stored holding element, which between a locking configuration for Holding the stamp on the stamp holder and a Release configuration for releasing a punch is movable. The retaining element can, for example, be linearly displaceable or pivotable be. With appropriate attachment of a spring force to such Retaining element, the stamp holder as a snap device be formed, especially in the locking configuration a safe, backlash-free grip of a stamp on the stamp holder allows. There are also combinations of different holding devices possible. For example, the stamp holding device one or more electromag netic or permanent magnetic holders include to to magnetically hold an attached stamp, as well as a moving stamp Holding element to over a form fit to secure the stamp against displacement or detachment, even if the forces acting on the stamp were sufficient, the overcome magnetic holding force.

It is possible, too, to design the stamp changing device so that it simultaneously can serve as a stamp holder. Then a separate Piston holding device omitted.

The Stamp changing device should have a quick and safe change of punches between their working position and an outside allow the working position lying outside position, as a starting point for a treatment or processing of stamps outside the production process can be understood. The stamp changing device can a uniaxial or multiaxial bearing stamp manipulator for holding and moving at least one stamp between working position and Outsourcing include. The stamp manipulator can, for example be designed as a gripping arm, which grips and holds a stamp. there the term "gripping" should be interpreted broadly and includes different types of coupling of a stamp to the stamp manipulator. In addition to an active gripping movement with Help of movable gripping members are also other possibilities gripping and holding provided, for example by means of a permanent magnetic or electromagnetic field, using mechanical Spring forces, with the help of fluid pressure (overpressure or negative pressure) of gases or liquids, with the help of mechanical Facilities that have a form-fitting Allow bracket (For example, folding device) or otherwise. in principle can all also for the punch holder on the embossing device provided possibilities too for holding and possibly gripping a stamp by the stamp changing device be provided.

at some embodiments the stamp changing device is designed so that in the Working position moving stamp through the punch changing device can be released to his work independently or detached from the Stamp change device to perform. It is also possible, that the stamp changing device is designed so that they during the Working movement of the punch remains in engagement with the punch and in this way "join in" the work movement be designed for elastically resilient mounting of the punch for example, by the punch resiliently in the punch changer or stamp manipulator is held. Is such a punch change device provided, can account for a separate punch holder.

There are embodiments of stamp changing devices that have only a single punch holder, for example, to enable computer-controlled robotic stamp manipulation. There are also embodiments in which the stamp changing device has at least two stamp recordings. This makes it possible to run the working movements when replacing a punch and replacing the next punch with the help of a single stamp changing device simultaneously. For example, the stamp changing device can be designed as a linear changer, which alternately leads different stamp impressions to the region of the working position or to the outer position via a linear linear movement. In other embodiments, carousel devices or turret assemblies with at least two punch receiving devices are provided in order to carry out a punch change by means of a rotary movement. As a result, a particularly high change speed is possible. There are both planar or flat, as well as curved facilities possible. Stamp changing devices with at least two stamp recordings are particularly favorable for a tandem operation in which a stamp during production is used, while a substantially identical stamp can be in the outer position to either there or after another transfer process elsewhere, for example, cleaned, inspected or stored.

Of the Stamp lithography apparatus may include at least one cleaning device and / or at least one inspection device assigned.

Of the Stamp lithography apparatus may include at least one memory device, e.g. a magazine, assigned to a variety of storage spaces for stamps having. The memory device may be arranged such that They can be achieved directly from the stamp changing device to Introduce stamp or to be taken. It is also a remote arrangement possible, where then between the stamp change device and the magazine suitable transfer is provided, for example by means of a conveyor belt or similar.

A embodiment a punch lithography apparatus has a distance measuring device for measuring the distance between the substrate surface and the stamp surface for the whole Magnitude the advancing movement of the punch on. Such a distance measuring device allows a controlled approach and pressing the stamp to the Substrate surface. in this connection Is it possible, the sensitivity of the distance measurement to distance dependent vary, so when large intervals the stamp surface of the substrate surface the accuracy is low, but small at small distances. Will about the overall magnitude the advancing movement of the punch the distance measurement in the above described way, such is an embossing process both with high embossing speed as well as precise transmission the on the stamp surface existing structures on the substrate possible.

at a development of the stamp lithographic device has this an optical sensor device according to the principle of the telescopic sight or autocollimation. An optical sensor device for Distance measurement and / or angle measurement is useful, because the substrate is a closed, optically scannable surface.

The Stamp lithography apparatus may also include a distance measuring device using membranes according to the counterpressure method.

at a preferred embodiment the distance measuring device has at least one exposed one Nozzle for Delivery of gas under pressure to the surface of the substrate to be structured and a device for detecting the back pressure, from the one Distance signal is derivable. The incident on the surface of the substrate Gas can over the distance measurement also produces beneficial effects, for example this can be used to clean the substrate surface.

The Distance measuring device can also be an inductive or capacitive Be measuring arrangement or contain. Such measuring arrangements are easy to construct and reliable.

at an embodiment For example, the punch lithography apparatus has one for irradiating the stamp from his back in the direction of the stamp surface configured lighting device on. Such a lighting device can in the exposure stamp lithography UV radiation for curing a deliver low-viscosity photopolymer. But it is also possible that such a lighting device emits radiation in the IR range, with which the stamp material can be tempered.

If the stamp lithography apparatus is a vacuum generating apparatus for producing at least the one between the stamp and the substrate Having lying volume range comprehensive vacuum, so this can Area are kept substantially free of impurities. In the lithographic lithograph, in which a low viscosity Hardened photopolymer This can be done of the embossing process in a vacuum to help the formation of gas bubbles in the Polymer is avoided or greatly reduced.

A A development of the stamp lithography apparatus comprises a real-time geometry control unit for measuring the geometry of the stamp surface by measuring the position of stamps attached to the textured side of the stamp additionally to formative Structure, i. to the active stamp surface, are provided. By using such a control unit can during the Operating deformations of the stamp surface can be detected quickly. When exceeding one given predetermined limit, the stamp can be exchanged if necessary become. But it can also be an active correction of the deformation the stamp surface take place, for example by suitable, possibly spatially dissolving effective tempering.

The stamp lithography apparatus may comprise a reference transparent plate having reference marks in which the real-time geometry control unit having plural position optics ter of the reference plate is positionable so that the geometry of the stamp surface can be measured by comparing the position of the reference marks and the stamp marks. The use of a reference plate with reference marks makes the measurement of the geometry of the stamp surface independent of the positioning of the substrate on which the stamp is impressed. By using a plurality of positional optics, the deformation of the stamp surface at several locations can be measured in parallel, so that a multiple positioning of the stamp surface in relation to the real-time geometry control unit can be avoided.

has each positional optics of a development of the stamper lithographic device a first imaging optics for imaging the reference mark on a first detector surface and a second imaging optics for imaging the stamp mark a second detector surface on, so can the images on the two detector surfaces to determine the stamp deformations be compared. The reference plate becomes a measuring standard generated, with which the stamp geometry can be compared.

Of the Beam path of the first imaging optics and the second imaging optics can be largely parallelized by a collimation optics and following through a beam splitter in a first and second Split partial beam.

These and further features of preferred embodiments of the invention go out from the claims also from the description and the drawings, wherein the individual features each for alone or in the form of subcombinations an embodiment of the invention and in other fields be realized and advantageous also for protectable versions can represent.

embodiments The invention are illustrated in the drawings and are in following closer explained.

1 is a schematic representation of an embodiment of a stamp lithographic apparatus with a stamp lithography apparatus and a stamp changing device and an inspection device, a cleaning device and a memory device;

2 Fig. 12 is a schematic representation of details of an embodiment of a stamper lithography apparatus with three linear motors and one wafer stage;

3 Fig. 10 is a view of an embodiment of a distance measuring system with a plurality of exposed nozzles;

4 is a schematic representation of two embodiments of stamp holding devices in two partial images;

5 Fig. 10 is a schematic view of an embodiment of a vacuum plunger-holding device;

6 is a schematic representation of an embodiment of a dual changer with two punch holders;

7 is a schematic representation of another embodiment of a dual changer with two punch recordings;

8th is a schematic side view of a planar embodiment of a stamp changing device;

9 is a schematic side view of a conical embodiment of a stamp changing device;

10 is a schematic view of a equipped with eight stamp images stamp exchange device in a flat version (left part of the picture) and in a tire-like design (right part of the picture);

11 is a schematic view of an embodiment of an inspection device with a conveyor belt;

12 is a schematic representation of an embodiment of an inspection device with a reference stamp surface;

13 is a schematic view of an embodiment of an inspection device with a stamp imprint;

14 is a schematic representation of an embodiment of a cleaning device with a band-shaped endless cleaning film;

15 is a schematic view of an embodiment of a cleaning device with a UV irradiation device;

16 is a schematic view of an embodiment of a cleaning device for irradiating the active stamp surface with ionized cleaning gas;

17 is the schematic representation ei ner variant of a cleaning device with a liquid cleaning bath;

18 FIG. 2 illustrates a variant of a method for producing a stamp usable in embossing lithography; FIG.

19 shows various views of embodiments of stamps whose active stamping surface consists partly of a thin coating applied to a stamp body;

20 is a side view of an embodiment of a punch, in which open the openings of the stamp surface outwardly funnel-shaped;

21 is a schematic side view of a transparent stamp with a stamped body of crystalline quartz, which undergoes a dimensional change upon application of an electric field;

22 is a schematic plan view of an embodiment of a transparent stamp with channels for stamp temperature control;

23 is a schematic plan view of an embodiment of a transparent stamp with channels for Stempeltemperierung in the Temperierungsdrähte and temperature measuring wires are introduced;

24 is a schematic plan view of an embodiment of a transparent stamp with a grid-shaped arrangement of temperature control elements in channels;

25 is a schematic representation of an embodiment of a lighting device for locally irradiating a stamp from its back;

26 is a top view of the in 2 shown wafer days with an embodiment of a real-time geometry control unit;

27 is a schematic side view of an embodiment of a position optics of the real-time geometry control unit of 26 ,

In 1 is schematically an embodiment of a stamp lithographic system 1 shown, with the finely structured components in a continuous manufacturing process, such as semiconductor devices, can be produced quickly and inexpensively in small quantities with the help of a stamp lithography process in large quantities. The stamp lithographic equipment comprises a stamp lithography apparatus 10 , in which the structuring process for the components takes place, which is also referred to as "embossing process", irrespective of the method variant The stamp lithography apparatus, also referred to as "embossing apparatus" in the following, is associated with a plurality of peripheral stamp treating apparatuses were used in an active embossing process or are intended for such a process.

An inspection facility 20 The purpose of the stamping process is to examine stamps intended for an embossing process for suitability for the embossing process after a preceding embossing process or before an imprinting embossing process. In particular, the structured stamping surfaces of stamps are examined for damage and / or contamination, and transparent stamping stamps can also be examined for sufficient transmission. Shown is a fully automatic, operator-independent optical inspection unit with digital image processing.

A cleaning device 30 is intended to clean from a previous embossing process or provided for a subsequent stamping process stamp so that the embossing process caused by impurities quality losses.

A storage device 40 , also referred to herein as a magazine, provides a variety of storage locations for stamps used in previous stamping processes or intended for future stamping processes. The individual stamps can be in cassettes 41 individually or in groups within the magazine.

For the transfer of punches between the embossing device 10 and the peripherals 20 . 30 . 40 an automatic conveyor system is provided, which in the example one of the embossing device 10 associated stamp changing device 50 and one between the embossing device 10 and the peripherals 20 . 30 . 40 arranged transfer robot 60 comprises, which in the example is rotatable about a vertical axis and horizontally movable.

The also called stamp changer punch change device 50 is formed in the example as a two-arm changer, which is rotatable about a central, vertical axis and in the end region of each arm a punch receiving device or stamp recording 51 each for receiving a single stamp 60 is configured. The stamp changer 50 serves to stamp between a working position 70 in the work area of embosser 10 and an outboard position outside this work area 80 to move. As a result of the working movement of the stamp changer, a stamp initially held in the outward position can be brought into the working position for an embossing process, while at the same time a stamp used in an embossing process is transferred from the working position to the outward position in order to be fed from there to a further treatment. All units of the stamp lithographic installation can be set up for a computer control and are in the example to a central control unit 90 connected, which controls and coordinates the operations of each unit.

In 2 FIG. 12 schematically shows details of an embodiment of a stamp lithography apparatus 100 shown. It includes a torsion-resistant frame 101 , on which a stamp holding device 120 mounted, which is configured to a single punch 120 with down-facing, active stamp surface 130 to keep in a working position at a short distance above a substrate to be structured. The substrate is a semiconductor wafer in the example case 141 , at the top of which a thin layer 142 is arranged from polymeric resist, which serves as a substance to be structured (imprinting substance). The substrate lies on one with the frame 101 coupled substrate holder 150 on, a wafer day 151 with a wafer chuck formed thereon as a needle bed 152 on which the wafer rests supported evenly with only about 20% of the surface.

The stamp lithograph device 100 includes a fine adjustment unit 160 which is configured to stamp 120 or whose active stamping surface is aligned for the embossing process parallel to the surface of the embossing layer and assumes its desired position in a plane (xy-plane) perpendicular to the embossing direction (z-direction) in a desired rotational position (angle α) about the z-axis. For this alignment process or orientation process are piezoelectric elements 161 provided, which are fixedly connected to the frame and are in driving connection with the punch, which by means of elastically deformable elements 162 is mounted slightly movable.

The correct positioning of the punch relative to the substrate is achieved by means of an optical alignment system 170 controlled. The alignment system uses existing alignment marks on the substrate 171 , which may be formed, for example, as diffractive structures in the form of gratings. To use these brands are on the stamp 120 corresponding stamp alignment marks 172 provided (see. 3 ). Preferably, these marks, two or more of which should be provided, are integrated in a one-piece die and outside the three-dimensionally structured active die surface 130 appropriate.

The alignment system shown here or its alignment marks work with the diffraction principle or interference principle. They are designed as small optical grids or mirrors. A sensor detects the relative position of the alignment marks of substrate and stamp via the intensity of the diffracted or interfered light. This information is processed computer-aided and to control the Feinjustiereinheit 160 used. This makes it possible for the stamping to determine the lateral positions (xy plane), the relative rotation around the stamping direction (z direction) and the coordinate systems for rotations about the x- and y-axis, ie tilting movements, and specifically with help the fine adjustment unit 160 to correct.

It Different alignment procedures are possible. For example, one is indirect alignment of the wafer to the stamp possible. This is the stamp aligned relative to a reference mark on the wafer day. The wafer becomes relative to suitable alignment marks in the alignment optics positioned. The essential thing is that the alignment spatial and in time for a wafer embossing process is stable. This type of alignment causes positional fluctuations of the substrate holder balanced. With every wafer change exists the possibility a new alignment process.

A second option is that the stamp is again aligned to Waferstage. The wafer becomes a punch by means of the stamp alignment marks positioned. This means that the wafer and the stamp are relative to a common point of reference, namely to one of several aligned on the wafer stage arranged reference marks. An important difference to the former method is that only a single reference point for the stamp and the substrate (the wafer), in contrast to the above method, in which there are always two reference points. This allows stability over one complete wafer embossing process guaranteed become.

at Demand can also be used a third option become. In this case, the punch and the wafer relative to a Aligned stationary alignment optics. Please note that in this method a dependence of the accuracy of the spatial Constancy of Alignmentsystems present relative to Waferstages.

In order to achieve a faithful reproduction (embossing dep pressure or stamp) of the stamp structure in the substance to be structured, it is necessary, for example, during hot stamping that the stamp is pressed exactly controlled into the embossing substance or exactly takes its relative position to the substrate in the stamp exposure before the substance to be structured introduced and is cured. To accomplish this, the stamp lithography apparatus has a controlled feed system including a distance measuring system and a logic unit for detecting the control parameters and generating control signals for the feed system. The feed system also includes the feed unit itself.

A belonging to the supply system Distance measuring device, also referred to as focusing unit The task is to provide distance measurements for the distance between substrate surface and stamp surface for the overall magnitude to allow the advancing movement of the punch. Typical distance ranges are between zero and about two millimeters. The smaller the distance is, the safer or more accurate should the distance information be. This will in some embodiments by an optical sensor device according to the principle of autocollimation achieved, this device in a wavelength range works in which the surface the substrate to be structured provides sufficient residual reflection. Therefor can known autocollimation devices are used.

Another possibility for distance measurement is the use of membranes according to the counter-pressure method. Another possibility is in the lower part of figure 3 shown schematically. The local distance measuring system 185 includes several exposed nozzles 186 , through which, under suitable pressure, a gas on the surface 187 the substrate to be structured is blown. The detection of the back pressure supplies a distance signal. This makes it possible to provide a distance measuring system whose sensitivity decreases with distance to the surface 187 increases.

Further measurement capabilities arise when using ultrasonic sensors. For the rest, can in the context of the invention, any known distance measuring method, optionally after suitable adaptation to the corresponding stamp lithography apparatus, be used. examples for Distance measuring systems are in the international patent applications WO 02/08835 A2, WO 02/10721 A2 and WO 02/067055 A2 discloses, whose Content of the disclosure by reference to the content of this specification is done.

The delivery system 180 allows a highly accurate approach and relative positioning of punch and substrate, in conjunction with the alignment and distance measurement system allows a controlled lowering of the punch and a controlled lifting. A drive system for larger, highly accurately controlled strokes of the punch comprises three linear motors in the embodiment 181 , which are arranged in a star shape with an angular distance of 120 ° symmetrically about a central axis of the punch or of the frame in order to initiate the resulting force centrally in the punch. In order to distribute the force symmetrically as uniformly as possible over all three linear motors, the electrically driven in the example linear motors are connected in series to produce the same linear force in the z-direction in each case. Each linear motor has a fixed to the frame 101 connected stator 182 and a relative to the stator linearly displaceable translator 183 in driving engagement with the stamp 120 stands. A relative mobility of the punch to the frame in the z-direction is achieved in the example by a built-in between the frame and stamp elasticity, which in 2 schematically by the elastically deformable elements 162 provided. To build the drive system with linear motors can be used on monolithic, ie one-piece components. A stator 182 can be connected to the housing or even part of the housing, so be formed integrally with this. A translator may, if appropriate articulated, be firmly connected to a punch receiving device, not shown, or be part of the punch holder itself. Linear motors allow very short travels up to the travel zero, so that in extreme cases only one (fully reversible) Hooke's compression within the components for the punch stroke can be sufficient. With proper design, a force directed in the z-direction is exerted on the ram, which allows a controlled movement towards the substrate or back from the substrate. This force can be anywhere between 500 N and 20,000 N. The series connection of the linear motors symmetrical force distribution and in conjunction with the star-shaped arrangement a tilt-safe drive in the z-direction is created.

If you want to work with less than three linear motors, so a single linear motor should be provided, which acts coaxially to a central punch axis and applies the full force. It is useful if as close as possible above the stamp a separate joint or a monolithic joint is provided to allow a slight pivotal movement between the translator and stamp. Before the full force of the linear motor is used during the structuring process, the underside of the stamp should be aligned with suitable alignment drives to the wafer surface. This can be done for example by a or several piezoelectric elements can be achieved, which are arranged between the stator or frame and stamp.

It is also possible to provide the stamping force required for the embossing process hydraulically via fluid pressure, in particular via fluid pressure. One or more pressure cylinders with pistons can provide the necessary force. Hydraulic cylinder, for example, three star-shaped cylinder analogous to 2 , can be connected in series in an analogous manner to allow a uniform pressure and a tilt-free feed.

The Lowering and raising the stamp is in a preferred variant the structuring process in several phases. The first phase is characterized by a relatively fast feed of the stamp towards the substrate until a relatively small distance of a few microns between the protrusions of the stamp surface and the surface to be structured is reached. This feed can be done by relative movement between Substrate holder and frame can be achieved in the z direction by the Frame lowered as a whole and / or raised the substrate holder becomes. In a second phase, the last few micrometers until the Contact between stamp surface and substrate surface with lower speed procedure, with the help of the distance measuring system and the Alignmentsystems a particularly intensive and accurate regulation the lateral position and the angular position of the stamp to the wafer carried out becomes. A structurally provided elasticity of the feed device in the feed direction limits the stamping force in the process of placing on the embossing substance very low values, for example to a few N. Thus are accelerations and vibrations affecting the substrate and the Damage substrate holder could minimized.

In a third phase, the actual stamping force necessary for the embossing process is introduced, which places the stamp under high pressure into the deformable and structurable embossed substance 142 presses. The pressure can reach values of the order of 200 bar or more. At the same time, the stamp can be heated by a heating device, not shown, so that, optionally supported by an exposure to high-energy UV radiation, the chemical process of curing in the embossing substance is initiated. Depending on the type of process management, this can lead to a curing process in which permanent crosslinking takes place in the resist material. In order to optimize the process, pressure and temperature can be additionally adjusted, normally combining lower pressures with higher temperatures. Suitable pressures may be for example between 10 and 25 bar, suitable temperatures between about 50 ° C and about 180 ° C.

At the in 2 As shown process control is completely dispensed with exposure to UV radiation. For stamp exposure lithography using transparent stamps, the stamp lithography apparatus may also include a lighting device configured to irradiate the stamp from its back toward the stamp surface.

There high temperatures during the matching process, i.e. the adaptation to subsequent process steps problematic could be, in the embodiment shown dispensed with a heating, so that the structuring process at Ambient temperature can take place. The required higher pressures can be achieved by the linear motors are provided. An intense UV exposure can be optionally provided.

To the patterning process, in which a negative shape of the stamp surface as embossing impression or arises as a stamp imprint in the imprinted substance, the Stamp again from the stamping substance solved become. This process can be performed as follows. First, will the size embossing force returned, until the above-mentioned holding force of a few N left remains, but the stamp is still in full contact with the imprinting substance stands. The lateral control and angle control remains active. Preferably becomes a release movement via piezoelectric Elements or other microdrives initiated. This is done carefully the avoidance of tilting and thus on the emergence of a uniformly wider pay attention to the gap. Does the gap have a gap width of reached a few microns, in a fifth phase, a faster return movement Completed until the punch to its starting position a few millimeters withdrawn above the wafer. This movement can both in the embodiment by the piezo elements, as well as by the linear motors or by a combination of both types of drive can be effected. By the return movement a safety distance between punch and substrate can be achieved which prevents unwanted protruding beyond the textured surface Remains remain on the stamp surface and contaminate it. In a sixth phase, finally, the wafer is moved away laterally, either to structure a new area of its surface or to replace the wafer completely.

Thus, in particular, a stamp lithography process can be performed in which lateral control with little force, the contact is made to the embossing substance surface on the substrate and only then uses a greater effective press-in force, ie a multi-stage, in particular two-stage approach. Accordingly, lifting can be performed under lateral control with controlled force after the large press-in force has been withdrawn. In this case, the approach process can be performed at a non-constant speed, wherein preferably a fast approach over a greater distance and a slower, controlled approach can take place over a smaller distance. Lifting can also be done at non-linear speed. It is favorable if a small distance correlates with a lower speed and a larger distance with a larger speed. For example, fast feed or retracting movements may take place at speeds in the range between 10 and 27 m / s, for slow, regulated, possibly contact-making and contact-releasing movements on average speeds between 0.05 m / s and 0.8 m / s can be advantageous be. The contact movement can be carried out with a passive force of less than 35 N, while the embossing forces for a surface pressure are conveniently so large that surface pressures between 12 and 270 bar can occur. Embossing operations at room temperature, for example between 20 and 24 °, in particular between 21.5 and 22.5 °, are possible. The drive axis of the single drive and the punch axis should be aligned co-linearly in the direction of gravity.

Stamp lithography equipment according to the invention characterized by an efficient system for fast and highly accurate Stamp replacement from. The inventors have realized that an efficient, automatable change an essential requirement for a Flexible use of stamp lithography equipment and for cost-effective mass production is structured components. The corresponding components On the one hand are the stamps, if necessary, by special constructive measures for one rapid replacement and replacement can be optimized, and on the other hand a suitable punch holder to a punch in the working position to keep.

4 shows in two separate sub-images various embodiments of stamp holding devices, which are designed as a magnet holder and allow a position-secured recording of a stamp on the stamp holding device exclusively via magnetic forces. The magnetic stamp holder 200 includes holding elements 201 . 202 which can be fixedly connected to the frame of the embossing device or can be flexibly coupled to the frame with elasticity. In the left part of the picture has the holding element 201 a permanent magnet 202 , whose north pole points to the lower, flat holding surface of the stamp holder. A corresponding stamp 220 has in its outer area outside the active punch surface a corresponding permanent magnet 222 , which is poled so that when approaching the permanent magnets an attractive, magnetic force develops, the reliable and secure retains the stamp on the punch holder and holds there. To support a positionally accurate coupling suitable form-fitting elements, such as locking lugs and corresponding recesses may be provided on the holding element and on the stamp. The right part of the figure shows an alternative in which in a recess of the punch 230 outside the active stamp surface an element 232 is built in, for example, an iron-containing, magnetizable material. In the corresponding holding element 202 is an electrically controllable from the outside electromagnet 234 arranged in the on state, the stamp with the help of the magnetizable element to the holding device and releases the stamp in the off state.

Other embodiments work over mechanical holding forces between die holder and stamp, for example, one exclusively via frictional engagement acting clamping bracket is just as possible as exclusively form-fitting working Brackets, e.g. with swivel lever or the like. Also holding devices, in which positive engagement and frictional connection cooperate, are possible. Farther the holding force can be generated by means of fluid pressure.

Based on the schematic representation in 5 is an embodiment of a vacuum-stamp holding device 300 explained. This has a stamp holder block 301 with a flat bottom 302 , which serve as a suction surface for a (in the example slightly flexible) stamp 320 serves. Inside the block 301 There are numerous channels 303 attached to the punch holder surface 302 open in a regular grid and lead to a common vacuum generator, such as a connected vacuum pump. In each of the channels is an electrically controllable valve 304 attached, wherein the valves are independently switchable between blocking configuration and passage configuration.

The corresponding stamp must be one to the holder bottom 302 complementary, in the example, flat back 321 have, where appropriate, on the punch holder and on the stamp corresponding projections and recesses may be provided to a position-secured coupling of the punch and a twisting protection cause. For coupling a punch to the free punch holder underside, the suction channels are switched to passage, so that a supplied to the underside of the punch holder stamp is sucked large area and firmly held on the punch holder. For a release by closing the valves, the suction can be turned off, so that the stamp can be removed with little force from the punch holder. Optionally, a switch between suction and blowing effect can be made to assist in decoupling a stamp from the holder.

at Using a thin, in itself easily bendable punch is with the help of such a holder also a very cheap Replacement process between the stamp and the stamped Substance after the embossing step possible. This is a kind of Abschälbewegung (peeling) allows. For this purpose, all suction channels closed except for a row in the edge area on the left. It takes place now a lift-off movement in the μm range. Gradually, the other suction channels are opened again from left to right and the thin one Peeling stamp matrix released from the resist. This will make it possible the stamp successively along a relatively narrow, linear transfer area from the embossed structure deduct, with the separation area slowly over the embossed Structure wanders. Unlike one concurrent in all places Withdrawal, the relatively large Lifting forces required, here are the for a detachment required forces much lower, allowing a gentle withdrawal, the by area tear prevents caused structural defects on the embossed structure.

For one fast, continuous manufacturing process it is necessary Stamp fast and reliable to bring to the working position on the stamp lithographic device and remove from this. For this purpose, stamp lithography apparatuses according to the invention have a stamp changing device, allowing a quick and safe change allows. This is for example possible because of a uniaxial or multiaxially mounted gripper arm a punch in the working position, e.g. by means of vacuum and takes him outward, for example, in a Magazine, relocated to another, for example the same shaped stamp to grab and in the working position bring to.

Particularly favorable are multi-changer with at least two punch recordings, which make it possible to bring a stamp from the working position to an outer position and at the same time to reload the Stempel lithography device by a second punch is brought in time parallel to the removal of the first punch to the working position. The 6 and 7 show various embodiments of two changers with exactly two stamp recordings. The stamp changer device 400 is designed as a two-way changer, the one about a vertical axis of rotation 401 rotatable double arm 402 has, at its ends counter-trained punch receiving devices 403 to sit. The punch receiving devices are designed as gripping devices and each comprise one integral with the change arm 402 trained support section 404 and a linearly movable relative to the support portion gripping arm 405 which can be moved by a (not shown) drive transversely to the radial direction of the changer so that in cooperation with the support portion an opening and closing gripping movement in the manner of a pincer movement is possible. Between the mutually facing, planar support surfaces of the gripping member formed thereby a punch 420 as defined by the job.

The stamp changer 400 can be operated so that it releases the scheduled for the embossing process, displaced in the working position stamp for the stamping process by opening his pliers. It is also possible that the changer during the embossing process remains in engagement with the punch and participates in the stroke movement during the embossing process. For this purpose, the punch changer can be mounted axially resiliently to a movement along its axis of rotation 401 to enable.

7 schematically shows other possibilities of the punch holder on a dual changer 500 , wherein here on both sides of the changer different constructions for a resilient mounting of punches on the stamp changing device are shown. The stamp holder shown on the left 503 has two guide rails in a U-shaped opening of the changer arm 504 , whose inner contours facing each other in such a manner on corresponding outer contours of a punch 520 adapted that a punch when loading the punch changer can be inserted from the outside between the rails and moved in unloading the punch changer from the rail guide in the radial direction of the punch changer. The guide rails 504 are opposite the two arm changer arm 502 mounted resiliently or elastically yielding, which by the springs shown schematically 505 or by another suitable resilient mount, for example via monolithic joints or the like, can be achieved.

In the stamp holder shown on the right 510 are the guide rails 511 , which allow a removal and insertion of a punch on the changer arm, directly to the changer arm connected, wherein the advantageous elasticity between Wechslerarm and stamp by spring elements 512 or other elastically yielding bearings are made possible with those attached to the stamp holding elements 515 be stored movable relative to the exchange arm.

Both embodiments of a stamp changing device offer during the embossing process substantially no acting in the direction of stamping or transverse thereto holding forces. Nevertheless, they enable positionally accurate positioning of punches in the working position and secure and quick docking with the fine adjustment unit. The punch is fed, the feed unit can perform an active gripping movement and sets the punch in the Feinjustiereinheit and releases it. The stamp can remain connected to the fine adjustment unit during the stamping process. Then, a lowering operation of the stamp changing device is displayed in the fine adjustment unit. The self-weight of the punch surpassing forces can in the embodiment according to 7 be implemented in a relative movement between the punch and stamp changing device, because the stamp is held substantially resiliently in the changer.

In the stamp changing devices according to 1 . 6 and 7 the stamps are each stored in a carousel-like manner, with exactly two carousel places each being provided. However, it is also possible for more than two punch receiving devices to be provided on a stamp changing device (cf. 10 ). Such carousel or revolver directions offer particularly high changing speeds. In addition to a planar or planar carousel device (stamp change device as in 8th ) also conical or cylindrical devices are possible, which can bring spatial advantages, because the lying outside the working position elements of the punch changer can have a greater distance to the sensitive substrate. In the schematic representations of stamp changing devices 550 and 570 in 8th and 9 the working position of the punch is shown on the left and the outer position provided for a stamp feed or punch removal respectively on the right.

The left part of fig 10 shows a equipped with eight stamp images stamp change device 580 in planar design, in which the stamping direction (z-direction) of the associated embossing device parallel to the axis of rotation 581 the changer runs. In the right part of the figure is a tire-shaped punch changing device 590 shown in which two or more punches are arranged with radially outwardly directed punch surfaces, wherein the punch changer about a horizontal axis of rotation 591 can turn. This is perpendicular to the stamping direction 592 , If an exposure-assisted embossing is desired, a mirror can be inside the ring 593 be provided, which is the exposure radiation 594 in the direction 592 to the active, located in the working position stamp directs.

In 11 is an inspection device 600 shown, which is used for the ongoing quality control of stamps. In a housing with clean room atmosphere, not shown, is a forward and zurückbewegbares conveyor belt 601 installed, with the stamp 620 . 620 ' between a robotic transfer point 602 and the detection range of various optical inspection modules reciprocated. In one embodiment, an inspection module 610 provided in which the active stamp surface of a stamp 620 with the help of a lens 611 high magnification and typical numerical apertures of more than 0.5 to 0.95 operator-independently optically detected. A telecentric test beam path is advantageous here in order to generate identical test conditions within the field of view of the test device. An image of the stamp surface falls onto a CCD chip 612 to an evaluation unit 613 is connected to produce a digital, enlarged image of the stamp surface or areas of the stamp surface. The evaluation unit 613 is connected to an image processing computer in which the stamp 620 image information is analyzed to determine whether the stamp surface impurities, damage or other damage affecting the stamp quality has. The evaluation process is automated in some embodiments. In other embodiments, an image, optionally processed by false colors or other techniques, is displayed on a screen so that a trained operator can perform the analysis. Depending on the result of the analysis, the stamp 620 assigned an inspection value. If this corresponds to an impeccable stamp quality, the stamp can pass over the transfer point 602 be returned directly to the embossing process by means of a robot or the like. Caching intact stamps in a magazine or the like is also possible. If the inspection value corresponds to a contaminated and / or damaged stamp, the equipment is controlled so that this stamp is either supplied for cleaning or is diverted from the stamping circuit.

For highest resolutions of the inspection module 610 this can work with operating wavelengths in the UV range, for example at 193 nm, 248 nm, 365 nm, 405 nm or with broadband UV radiation or excimer radiation. Visible light inspections are also possible.

The inspection module 630 , which also allows an operator-independent inspection, includes a transmitter 631 for dispensing inspection radiation directed onto the stamp surface and a detector 632 for detecting the inspection radiation reflected from the stamp surface. The transmitter and the receiver are connected to an evaluation unit 613 connected, which works up the information about the stamp quality for forwarding to a central computer. The inspection modules 610 . 630 may be used alternatively or in combination.

In other embodiments, the inspection exclusively or additionally includes visual control over a suitably trained operator 640 , the stamp surface either with the naked eye or optical aids, such as a microscope 641 observed and qualified. To better detect damage and contamination, a special lighting can be provided. A tilting manipulator for multi-axis pivoting a punch can simplify the investigation.

Based on 12 a particularly efficient method of stamp inspection is explained schematically. At the inspection facility 700 is a user-independent comparison between the stamp surface of a stamp to be examined 720 and a reference stamp surface of a pattern stamp, which is one to the inspected stamp 720 has identical structure of the stamp surface and is free from contamination and damage. A holographic image of the target stamp surface is in a hologram 721 coded. For inspection, the stamp surface to be examined becomes perpendicular with collimated laser light 722 irradiated. The obliquely irradiated examination light 723 pass through the hologram 721 and is reflected on the stamp surface. The image information stored in the hologram is superimposed in phase with the stem surface and falls onto the rotating ground glass 726 , The comparison image acquired interterometrically in this manner is provided via suitable optics 724 in a camera 725 which prepares the image information for further processing. As a result of the comparison process, impurities, damage and other defects that are not present in an undamaged reference surface are particularly reliable and easy to identify in the image information obtained. The evaluation of the image information coming from the camera can be done visually or computer-aided, wherein a digital image processing for a fast and good reproducible inspection is particularly advantageous.

Based on 13 a possibility of an indirect inspection of the stamp surface is shown schematically. In this process variant, a casting or impression is made by suitable replication technique 821 the active stamp surface of the stamp 820 generated. After detachment of the negative shape of the stamp surface from the stamp, the surface of the replica structured by the stamp becomes 821 examined. For the examination of the stamp imprint, all techniques also provided for the direct examination of stamp surfaces can be used.

Based on 14 to 17 A selection of options for efficient stamp cleaning is explained. The cleaning device 900 in 14 allows efficient cleaning of the active stamp surface of a stamp 920 via intensive contact with a band-shaped cleaning foil 921 whose stamp facing surface is optimized so that impurities adhere to the cleaning surface. The cleaning device comprises a circulating cleaning film 921 , which itself is continuously cleaned and reactivated for further cleaning processes. In the stamp cleaning area, on the side of the active cleaning surface of the film, there is a stamp pressing device 922 and on the opposite side a counter-pressure element 923 provided with a flat, elastically easily yielding pressure surface. For a stamp cleaning, the intermittently drivable cleaning film is briefly stopped and the stamp with its active stamp surface to the cleaning side of the film 921 pressed so strong that the film material in large-scale contact with the textured stamp surface device and can detect there existing impurities. After lifting the stamp, the film movement is continued and the film carries in a contaminated film section, the impurities 924 with himself.

After this physical cleaning of the stamp surface, the circulating film is worked up again. For this purpose, the cleaning device comprises a film cleaning device in the direction of passage of the film 925 , For example, in the form of a cleaning bath, a drying section 926 in which the film material is heated and stretched, and a subsequent upsetting stretch 927 in which the film material is returned to a state optimized for further cleaning. In the cleaning bath 925 First, the impurities coming from the stamp are physically and / or chemically released from the film, this cleaning process can be supported by ultrasound. The subsequent restoration of the cleaning film makes it possible to reorient the crosslinked molecules of the film material. The process can be assisted by a slightly reversible mechanical stretching of the foil material and by heating it. That way you can in particular thermoplastic plastics, such as polyethylene, can be used for multiple use as a cleaning film.

15 schematically shows an embodiment in which the cleaning of the active punch surface of a stamp 940 irradiation with hard UV light, that of a UV lamp 941 is irradiated. As a result of this irradiation, residues of polymeric resist material adhering to the stamp surface can be embrittled, so that subsequent removal of the contaminants, for example by the film cleaning described above, can be eliminated by blowing away or in some other way.

16 schematically shows the irradiation of an active stamp surface of a stamp 960 with ionized cleaning gas, for example ionized argon.

In 17 is the variant of a cleaning device 970 shown in a stamp 980 with the help of a liquid cleaning bath 981 is cleaned. This is the stamp 980 with punch surface directed downwards on a punch holder 982 attached and in a cleaning fluid 981 immersed, which can chemically dissolve contaminant material, eg, acetone, NMP, or the like. The cleaning process can be physically assisted by means of ultrasound, which is provided by an ultrasonic generator 983 is produced. After completion of the cleaning, the stamp is removed from the cleaning liquid, dried and forwarded for further processing.

Based 18 A preferred variant of a method for producing a stamp usable in the embossing lithography is explained, which is particularly distinguished by the fact that its active stamping surface is substantially free of microcracks reaching the stamp surface. First, a stamp blank 1000 on its intended to create the stamp surface page 1001 worked on flatness. This is achieved by trimming, subsequent lapping and subsequent polishing. This first process step is first optimized for fast polishing of the surface topography with plastic polishing, with reference to a measuring wavelength of 632 nm typical surface defects in the range of a few wavelengths λ or below the wavelength λ should be achieved. The micro-roughness is initially secondary. This is followed by a smoothing process, preferably on pitch, resulting in a very smooth surface 1002 leads. It is quite permissible that the form fidelity of the surface remains in the range of the wavelength λ. So that the extremely small structures of the stamp surface, which can reach into the range of 20 or 10 nm, do not break off due to microcracks during an embossing process, particular importance is attached to avoiding microcracks. There is a check for microcracks. This is achieved in the method in that the smoothed surface in a subsequent process step with the aid of a suitable acid 1003 , For example, hydrofluoric acid, is very deeply etched. Here, etching depths of a few microns to 0.1 to 0.2 mm may well be useful. This etching process leads to microcracks reaching the surface 1004 visible, noticeable. Subsequently, by fine-optical removal of the microcracks interspersed surface area 1005 a substantially crack-free and substantially flat initial surface, for example, be achieved from λ / 5 to λ / 20, in which then the three-dimensional structure of the stamp surface is introduced.

Around To obtain a low-defect starting material, materials can be used be with cheap Material specifications regarding inclusions Air bubbles, grain boundaries or the like are available, e.g. Silicon, Germanium, gallium arsenide or other semiconductor materials. The monocrystalline Material does not need to be doped. Another solution to the material question are highly glassy, ie extremely amorphous optically transparent materials.

Especially advantageous may be flame-deposited silicon dioxide, its layer structure as possible be even should. Preferably, the active stamp surface works in one preferably unbroken quartz deposition layer, so that the quartz layers as parallel as possible to the active stamp surface should lie. The processing captures the layer structure and sets the processing depth and angular position to match the layer structure of the quartz glass. Cheap Properties of such silica glass materials are average hardness, relative Low defect, small mechanical-thermal expansion and a large spectral Passband down to about 175 nm.

Also possible is the use of single crystal quartz, which has even greater hardness and is characterized by a down to 157 nm reaching transmission range. Magnesium fluoride, sapphire and lanthanum fluoride also belong to this type of crystals with good transmission and useful hardness. The birefringence of these crystals does not matter for this application. Single-axis crystals are preferably oriented so that they have the same extent under pressure and / or temperature along the active stamp surface in both spatial directions. Preferably, the stamp is made of a uniaxial crystal so that the optical crystal axis is almost perpendicular to the Stempeleinpressfläche, so that it does not come under pressure to different transverse strains. For isotropic crystals, there are several suitable orientations.

An essential prerequisite for a cost-effective mass production using the stamp lithograph are long service life of the stamp. Here, the use of aluminum oxide (Al ₂ O ₃ or sapphire) may be advantageous. This is a single-axis, birefringent crystal of high hardness and wear resistance. In addition, at stamp thicknesses up to about 10 mm, it is sufficiently transparent for a 193 nm exposure wavelength. Mixed crystals can also be used. Mixed crystals of ZrO ₂ + Y ₂ O ₃ or HfO ₂ + Y ₂ O ₃ have proven to be advantageous. ZrO ₂ and HfO ₂ are cubically stabilized by the proportion of Y ₂ O ₃ .

Based 19 Embodiments of punches are described, the active stamp surface consists in part of a thin coating applied to a stamp body, which decisively co-determines above all the mechanical properties of the stamp surface. In the production of the stamp 1100 in 19 (a) is first on a transparent stamp body 1101 a few nanometers thick layer 1102 made of a finely crystalline, very hard material whose average grain diameter is small compared to the typical structure sizes of the stamp surface and may for example be in the range between 5 nm and 10 nm. After the layer has been applied to a planar carrier surface, the three-dimensional structure of the stamp surface is produced lithographically, wherein the processing depth is greater than the layer thickness, so that the exposed protrusions of the stamp surface are coated, while the exposed recesses are coating-free. At the in 19 (b) shown variant of a stamp 1110 becomes first the punch body 1111 textured before applying a coating to the textured surface 1112 is applied. This ensures that both the projections, as well as the recesses are covered with a coating, optionally flank areas may remain uncoated. In the variant of a stamp 1120 according to 19 (c) is on a stamp body 1121 first a coating 1122 applied. During the structuring process for the stamp surface, only the coating is removed locally, so that the protrusions of the stamp surface are formed by the coating, while at the bottom of the recesses the stamp body 1121 exposed.

The use of coatings, especially finely crystalline coatings, allows the production of stamps with stamp surfaces of highest hardness, maximum wear resistance and low defect. For example, the coating may be a low-wear layer of extremely fine polycrystalline diamond. It is also possible to deposit a fine-grained wear layer of suitable heavy metal compounds. Fine-crystalline layers of silicon carbide, silicon nitride, boron nitride or other hard materials or mixtures of these materials are possible. As a result, stamps can be created whose surfaces have the highest mechanical hardness in the range of more than 500, 600 or 700 kg / mm ² or significantly more.

are the stamp for the lithographic stamp exposure provided so is sufficient Transparency of the stamp to pay attention. For such cases, for example zirconium dioxide, Alumina or hafnium dioxide be chosen as a transparent material for the punch body. The coatings like diamond can so thin with just a few nanometers be that they are sufficiently transparent and an exposure through the coatings, although in a thickness of a few mm for the intended wavelength as impermeable be considered.

For coated and uncoated stamp surfaces, it is advantageous if the structured stamp surface 1151 is undercuts to avoid a detachment of structured embossed substance after the embossing process. It is favorable if the recesses of the stamp surface open in a funnel shape towards the outside, as is the case for the stamp 1150 in 20 is shown schematically. This can be achieved by having some or all of the side edges of the stamp structure having a positive flank angle.

In 21 is schematically a transparent stamp 1200 shown, whose stamp body 1201 is made of crystalline quartz, which upon application of an electric field due to the reverse piezoelectric effect, a dimensional change in the direction perpendicular to the structured stamp surface 1202 experiences. The punch thickness is dimensioned such that the exclusively piezoelectrically generated stroke of the punch surface is in the order of magnitude required for the stamping process, for example of the order of magnitude between approximately 10 and approximately 100 nm. The punch body has electrical contacts on opposite side surfaces 1203 when in contact with the punch in a stamp holder in contact with spring-loaded contacts 1204 of the stamp holder can come to an electrical connection of the piezoelectric stamp 1200 to allow the control of the Prägelithographievorrichtung. By virtue of the fact that, in the embodiment shown, the entire lifting movement required for the embossing process can be generated by the stamp material, can account for a separate drive for the lifting movement of the punch. Due to the transparency of the stamp material also for short-wave UV radiation, at least down to 193 nm, stamps of this type can be used both in embossing lithography, in particular in hot stamp lithography, and in lithographic stamp exposure.

In 22 is a schematic plan view of a transparent stamp 1300 shown. This has the stamp material longitudinally traversing, cylindrical channels 1301 . 1302 on, through which in the stamping operation for temperature control purposes, a liquid can be passed. The liquid is in this case passed through the channels according to the counterflow principle, so that in adjacent channels 1301 . 1302 the direction of flow of the liquid is directed opposite. As a result, a uniform temperature distribution in the stamp material and on the stamp surface can be generated to avoid deformation. Of course, alternatively, a gas can be passed as tempering through the channels.

23 schematically shows a plan view of a transparent stamp 1400 in which the stamp material is arranged in longitudinal direction, cylindrical channels 1401 is pulled through. In neighboring channels 1403 . 1404 are each acting as Temperierungsmittel Temperierungsdrähte 1403 as well as temperature measuring elements serving temperature measuring wires 1404 integrated. With the help of temperature measuring wires 1404 the temperature distribution of the punch can be measured in the transverse direction and by using the tempering wires 1403 be specifically influenced. It may prove beneficial, if some channels Temperierungsdrähte 1403 while passing through a liquid for temperature control by others. It may also be appropriate to cool certain areas of the stamp while heating others at the same time.

24 shows a schematic plan view of a transparent stamp 1500 in which longitudinal channels 1501 are introduced into the stamp material. In each individual channel is a sequence of equidistant temperature control elements 1504 arranged, each consisting of a closely spaced temperature measuring element 1503 and tempering element 1502 consist. The entirety of the temperature control elements 1504 is in this case mounted in a grid-shaped arrangement, so that the punch 1500 is evenly covered by these. With this arrangement, local deformations of the punch can be corrected up to a maximum upper spatial frequency, which depends on the number of temperature control elements and the distance to the active punch surface.

When electric tempering agents may e.g. Resistance wires, resistance foils or Peltier elements (for cooling) be used. A combination of electric heating and Intermittent or permanent fluid cooling by means of gas or liquid is also possible.

25 shows an embodiment of a lighting device 1600 for irradiating a stamp 1606 from his back. The lighting device 1600 includes a focusing device 1601 for focusing the radiation to a small area compared to the overall size of the back of the stamp and an infrared light source 1602 , By shifting the illumination device 1600 or using a scanner mirror, any location on the back of the stamp for the focused radiation is achievable. The Stamp 1606 has a stamp body 1604 , an active stamp surface 1605 and a layer which is not transparent to infrared radiation 1603 on. The of the lighting device 1600 emitted radiation is absorbed in this layer and leads there to a local warming. This heating is by the preferably 0.5 mm or thinner punch body 1604 on the active stamp surface 1605 transferred so that their temperature is increased locally and thereby deformations of the same can be compensated. The infrared radiation impermeable layer 1603 can when using quartz glass as the material for the stamp body 1604 be realized for example by implantation of OH ions. The Stamp 1606 is permeable to UV radiation in all parts, so that the arrangement can be used for the exposure stamp lithography and the UV radiation illustrated by arrows in the figure can be used to cure a low-viscosity photopolymer.

26 shows a plan view of the wafer stage 151 from 2 with a semiconductor wafer positioned on it 141 of which, in plan view, only a thin layer covering it 142 is visible from polymeric resist. The Waferstage has two mirrors 1710 . 1711 and a lighting sensor 1712 on. In the waffle days 151 is a circular opening 1715 attached, which is a completely covering this, transparent reference plate 1725 having. Under this reference plate 1725 is a real-time geometry control unit 1720 positioned. The unillustrated punch can be used to control its surface geometry over the opening 1715 be positioned by the unit 1720 is moved by the Waferstage method under the stamp held in its working position. The geometry control unit 1720 has several positional optics, each with a stamp on the stamp surface and a Reference mark are assigned to the reference plate, so that the geometry of the stamp surface and deformations thereof can be determined by comparing their position.

In 27 is a schematic side view of an embodiment of a positioning optics 1860 the real-time geometry control unit 1720 shown. This forms one on the surface of a stamp 1800 stamp set outside of its active stamp surface 1810 on a first detector surface 1854 and a corresponding, on the reference plate 1725 attached reference mark 1820 on a second detector surface 1856 from. The stamp has stamp reference marks for positioning 1830 which are positioned outside the active stamp surface. Suitable detectors are, for example, CCD arrays or four-quadrant detectors.

The shape of the stamp marks on the stamp surface 1810 as well as on the reference plate 1820 can be selected from a variety of possible shapes. As in 27 A stamp can be shown 1810 for example, a full cross, a hole cross, a line cross, a circle, a ring, a triangle target or a rhombus of appropriate orientation (up or down). When using four-quadrant detectors, a circular mark shape is particularly well suited. The stamp brand 1810 and the reference mark 1820 can be arranged centrally above one another, with the reference mark 1820 a smaller dimension than the stamp mark 1810 typically less than 50%. This has metrological benefits, as the high aperture markers must be resolved. However, it is also possible to arrange the stamp mark and the reference mark slightly laterally offset, so that both can have the same dimensions.

The position optics 1860 has a collimator 1850 up, the two of the brands 1810 . 1820 parallel rays of light coming. The parallel rays hit a deflecting mirror 1851 and are at a subsequent to this beam splitter 1851 split into two sub-beams. The first, from the stamp 1810 originating partial beam is with a focusing lens 1853 on the detector surface 1854 focused. The second, from the reference mark 1820 Coming partial beam is through a second focusing lens 1855 on the second detector surface 1856 focused.

An evaluation unit 1870 compare the two of the detectors 1854 . 1856 recorded images and calculated from the offset deformations of the stamp surface, which would be transferred during the embossing process in the applied to a substrate, to be structured substance. With the help of a spatially resolving tempering, eg according to the representations in connection with 22 to 25 , these geometry errors can be compensated and the compensation can be monitored by the geometry control unit. If the stamp geometry is optimally adjusted again, the next embossing process can follow. Thus, a short term "real time" geometry analysis and geometry optimization of the stamp surface is possible, whereby significant improvements in quality and yield can be achieved.

In order to achieve the best possible spatial resolution, the positional optics 1860 small compared to the stamp surface, so that a sufficiently large number of these optics in the real-time geometry control unit 1720 can be attached. Even with five optics, the most important distortion errors can be determined very precisely. If work is carried out at very high and fluctuating temperatures, the refractive lens elements can also be made in quartz glass and with inking or, alternatively, be replaced by mirrors in glass-ceramic technology. The real-time geometry control unit 1720 can also be used without the use of a reference plate for measuring the geometry of the stamp surface, however, then possibly occurring positioning errors of the wafer days fully into the measurement result.

Claims (128)

Stamp lithography method for producing a Structure on a substrate using at least one stamp, the one stamp body with a three-dimensionally structured stamp surface for the production a three-dimensional stamp imprint in one on the substrate arranged layer of an embossing substance comprising: Providing a first stamp in one Working position on a stamp lithography apparatus; Produce at least one stamp imprint in the imprinting substance with the aid of the first stamp; Automatic replacement of the first stamp with Help of a stamp changing device from the working position to Treatment of the first stamp outside the working position; automatically Replacing the first stamp or a second stamp with Help the stamp changing device in the working position. A stamp lithography method according to claim 1, wherein a first punch in the working position and at least one second stamp outside the working position is arranged and an automatic exchange of the first punch against the second punch by replacing of the first stamp and replacement of the second stamp with help a stamp changing device is performed. A stamp lithography method according to claim 1 or 2, in which a place swap between the first stamp and a second stamp is made, so before replacing the second stamp and after replacing the first stamp in an outside the working position lying external position is arranged. Stamp lithography method according to one of the preceding Claims, in which the replacement of the first stamp and the replacement of the second stamp are synchronized. Stamp lithography method according to one of the preceding Claims, during the working movements when replacing the first punch and replacing of the second stamp run at least temporarily simultaneously, so that a replacement time interval and a Einwechselzeitintervall partially or completely overlap. Stamp lithography method according to one of the preceding Claims, in which a treatment of the first stamp in an outside the working position lying treatment position after replacement of the first punch from the working position and / or before replacement of the first punch provided in the working position after the treatment is. Stamp lithography method according to one of the preceding Claims, in which an automatic transfer of the first stamp between the working position and the treatment position and back with help a stamp changing device is performed. A stamp lithography method according to claim 7, wherein the automatic transfer by means of a stamp change device and at least one further, the stamp changing device associated Conveyor for stamps is carried out. Stamp lithography method according to one of the preceding Claims, in which the treatment of a stamp directly in a through the Stamp changing device errreichbaren external position is performed. Stamp lithography method according to one of the preceding Claims, in which an errreichbare by the punch changing device outer position a transfer position is, from which a stamp is fed to a further treatment or in the one stamp after one outside the place of delivery conducted Treatment supplied becomes. Stamp lithography method according to one of the preceding Claims, where the treatment involves an inspection of the first stamp, in which the first stamp in particular on impurities and / or damage in the area of the stamp surface and / or for transmission properties. A stamp lithography method according to claim 11, wherein for the inspection, the generation of a, preferably digital, Image of the stamp surface and an evaluation of the image is provided. A stamp lithography method according to claim 12, wherein an evaluation of an image of the stamp surface with Help at least one computerized image processing method is carried out. A stamp lithography method according to any one of claims 11 to 13, in which an inspection of a stamp surface or an evaluation of a Image of the stamp surface is done visually by an operator. A stamp lithography method according to any one of claims 11 to 14 with the following steps: Providing a reference stamp surface, which is a Desired topography of the stamp surface represented; comparison of to be assessed stamp surface with the reference stamp surface. A stamp lithography method according to claim 15, comprising: generation an image of the reference stamp surface; Comparison of the picture the reference stamp surface with the stamp surface to be assessed or with a picture of this Stamp surface. A stamp lithography method according to claim 15 or 16, with: Generating a hologram of the reference substrate surface; interferometric Comparison of this hologram with the substrate surface to be assessed. A stamp lithography method according to any one of claims 11 to 17, with: Creating a stamp imprint of the stamp surface; inspection the topography of the stamp. A stamp lithography method according to any one of claims 11 to 18, in which a mechanical inspection of the stamp surface is performed, in particular with the help of a profilometer. A stamp lithography method according to any one of claims 11 to 19, wherein an inspection is performed with Hil Fe of an electro-optical examination method is carried out with suitable depth resolution, in particular using a scanning electron microscope or a laser scanner. Stamp lithography method according to one of the preceding Claims, in which the treatment of stamps is a cleaning of stamps includes. A stamp lithography method according to claim 21, wherein for cleaning a cleaning fluid is used, which is so selected is that on the stamp surface adhering contaminants using the cleaning fluid mechanically and / or chemically soluble are. A stamp lithography method according to claim 21 or 22, in which the cleaning with the help of one or more cleaning fluids is carried out. A stamp lithography method according to claim 23, wherein as a cleaning fluid deionized water, many times distilled acetone, N-methyl-pyrolidine (NMP) or mixtures with at least one of these substances becomes. A stamp lithography method according to any one of claims 22 to 24, wherein at least one gaseous Cleaning fluid is used, in particular ozone or ionized Argon. A stamp lithography method according to any one of claims 21 to 25, during which cleaning the stamp surface to be cleaned in a bath with a cleaning liquid is immersed. Stamp lithography method according to one of claims 21 to 26, in which a cleaning is performed by means of ultrasound. Stamp lithography method according to one of claims 21 to 26, where the cleaning includes a plasma cleaning. A stamp lithography method according to any one of claims 21 to 28, wherein the cleaning comprises a contact cleaning of the stamp surface. A stamp lithography method according to claim 29, wherein the stamp surface at the contact cleaning at least partially with a fixed, preferably compliant cleaning surface of a cleaning device in touch is brought, preferably without wiping, brushing or rubbing movements between Cleaning device and substrate surface. A stamp lithography method according to claim 30, wherein the cleaning surface the cleaning device is optimized so that an adhesive contact between the cleaning surface and the impurities to be removed is possible. Stamp lithography method according to one of claims 21 to 31, wherein the cleaning is a pressing of the stamp surface to a plastically and / or elastically yielding, contamination-dissolving cleaning surface of a Cleaning device comprises. A stamp lithography method according to claim 32, wherein as a cleaning device for a contact cleaning a cleaning film is used, in particular a film of polyethylene, Polyvinyl chloride (PVC), made of silicone or a polyvinyl alcohol. Stamp lithography method according to one of claims 30 to 33, in which a cleaning device for disposable cleaning is used. A stamp lithography method according to any one of claims 30 to 33, in which a used cleaning device after a so conducted Cleaning process is reactivated so that at least one further use possible is. A stamp lithography method according to claim 35, wherein which uses a circumferential cleaning film as a cleaning device is a film section after a stamp cleaning a or passes through several cleaning and / or reactivation stations before the reactivated film section is returned to the stamp cleaning. A stamp lithography method according to any one of claims 29 to 36, in which for contact cleaning on the stamp surface a Layer of a cleaning substance, in particular polyvinyl alcohol, applied and this layer is removed again after curing. A stamp lithography method according to any one of claims 21 to 37, wherein the cleaning involves irradiation of the stamp surface electromagnetic radiation outside the working position includes, in particular irradiation with ultraviolet radiation. A stamp lithography method according to any one of claims 21 to 38, in which the cleaning is a thermal treatment of the stamp surface outside includes the work item. A stamp lithography method according to any one of the preceding claims, wherein the treat ment of a stamp comprises a stamp temperature outside the working position. Stamp lithography method according to one of the preceding Claims, When treating a stamp, store the stamp outside the working position in a storage device comprises. Stamp lithography method according to one of the preceding Claims, in which a geometry correction of the stamp surface by means of Temperature influencing the stamp surface is performed, the temperature influencing preferably being location-dependent. Stamp lithography method according to one of the preceding Claims, in which a geometry control of the stamp surface is performed, in particular with the help of a measurement of the stamp surface with a real-time geometry control unit. A stamp lithography method according to claim 42 or 43, in which the geometry correction and / or the geometry control is performed on a located in its working position stamp. A lithographic lithography apparatus for producing a Structure on a substrate using at least one stamp, the one stamp body with a three - dimensionally structured stamp surface for Creation of a three-dimensional stamp imprint in one the layer of an embossing substance arranged on the substrate comprises: one Frame; at least one attached to the frame stamp holder for holding a first punch in a working position; at least a substrate holding means arranged on the frame for holding at least one substrate; and at least one stamp changing device for automatic replacement of the first punch from the working position and for automatic replacement of the first stamp or a second punch in the working position. A stamp lithography apparatus according to claim 45, in which the stamp holder is constructed so that the Replacement and replacement of punches on the stamp holder without manual support an operator is feasible. A stamp lithographic apparatus according to claim 45 or 46, wherein the punch holding device is designed as a clamping device is A stamper lithographic apparatus according to any one of claims 45 to 47, wherein the punch holding device latching means for power and positive Holding at least one stamp has. A stamper lithographic apparatus according to any one of claims 45 to 48, wherein the punch holding device at least one magnet holder for holding a stamp by means of magnetic forces. A stamper lithographic apparatus according to any one of claims 45 to 49, wherein the punch holding device formed as a vacuum holder is. A stamper lithographic apparatus according to any one of claims 45 to 50, wherein the punch holding device at least one movable having stored retaining element, which between a locking configuration for holding the stamp on the stamp holder and a Release configuration for releasing a punch is movable. A stamper lithographic apparatus according to any one of claims 45 to 51, wherein the stamp holding device is designed as a snap device is. A stamper lithographic apparatus according to any one of claims 45 to 52, wherein the stamp changing device is constructed so that it can also be used as a stamp holder. A stamper lithographic apparatus according to any one of claims 45 to 53, wherein the punch holding device by the punch changing device is formed. A stamper lithographic apparatus according to any one of claims 45 to 54, wherein the stamp changing device is constructed so that the replacement and replacement of stamps on the stamp changing device without manual support an operator feasible is. A stamper lithographic apparatus according to any one of claims 45 to 55, in which the punch change device as uniaxial or multiaxial stored stamp manipulator to hold and move at least a stamp between the working position and an outer position is trained. A stamper lithographic apparatus according to any one of claims 45 to 56, wherein the punch changing device as a gripper for performing a active gripping movement by means of at least one movable gripping member is trained. A stamp lithographic apparatus according to any one of claims 45 to 57, wherein the stamp changing means for detecting at least one stamp by means of a permanent magnetic or electro magnetic field is formed. A stamper lithographic apparatus according to any one of claims 45 to 58, wherein the stamp changing device for detecting at least a stamp is formed by means of negative pressure. A stamper lithographic apparatus according to any one of claims 45 to 59, wherein the stamp changing device designed as a clamping device is A stamper lithographic apparatus according to any one of claims 45 to 60, in which the punch change device locking means for power and interlocking Holding at least one stamp has. A stamper lithographic apparatus according to any one of claims 45 to 61, wherein the stamp changing device is formed so that the moving in the working position stamp by the punch changing device is releasable to his work movement independent of the punch change device perform. A stamper lithographic apparatus according to any one of claims 45 to 62, wherein the stamp changing device is designed so that she while the working movement of the punch remains in engagement with the punch and join in the labor movement of the stamp. A stamper lithographic apparatus according to any one of claims 45 to 64, wherein the punch changing device for elastically yielding Holder of the punch is formed, wherein preferably the punch resiliently receivable on the stamp changing device. A stamper lithographic apparatus according to any one of claims 45 to 64, in which the punch changing device only a single punch holder Has. A stamper lithographic apparatus according to any one of claims 45 to 64, wherein the stamp changing device at least two, preferably exactly two, has stamped recordings. A stamper lithographic apparatus according to any one of claims 45 to 66, in which the punch changing device as a carousel device is formed with at least two punch receiving devices to to perform a stamp change by means of a rotary motion. A stamper lithographic apparatus according to any one of claims 45 to 67, in which the punch change device as a two-arm changer with exactly two stamp recordings is formed. A stamper lithographic apparatus according to any one of claims 45 to 68, the at least one treatment device for treating at least one Stamp in an outside assigned to the working position lying treatment position, wherein a stamp using the stamp changing device between the working position and the treatment position is movable. A stamp lithographic apparatus according to claim 69, in which the treatment device is arranged so that it directly can be reached by the stamp changing device to introduce stamp or to remove. A stamper lithographic apparatus according to any one of claims 45 to 70, the at least one stamp transport device for transfer at least one stamp between the stamp changing device and associated with at least one treatment facility. A stamper lithographic apparatus according to any one of claims 45 to 71, the at least one serving as a treatment device cleaning device is associated with the treatment of at least one stamp. A stamp lithography apparatus according to claim 72, in which the cleaning device for cleaning by means of at least a cleaning fluid is formed, which is selected so that on the stamp surface adhering contaminants using the cleaning fluid mechanically and / or chemically soluble are. A stamper lithographic apparatus according to claim 72 or 73, in which the cleaning device designed for a plasma cleaning is. A stamper lithographic apparatus according to any one of claims 72 to 74, wherein the cleaning device for a contact cleaning the stamp surface is formed, wherein the cleaning device is preferably at least a solid or compliant cleaning surface that optimizes so is that a bonding contact between the cleaning surface and the impurities to be removed is possible, wherein the cleaning device especially a cleaning sheet. A stamper lithographic apparatus according to any one of claims 72 to 75, wherein the cleaning device is an irradiation device for irradiating the stamp surface with electromagnetic radiation includes, in particular for an irradiation with ultraviolet radiation. A stamp lithography apparatus according to any one of claims 45 to 76, which comprises at least one inspection device serving as a treatment device for inspection of at least one stamp on impurities and / or damage in the area of the stamp surface and / or transmission properties is assigned. A stamp lithography apparatus according to claim 77, in which the inspection device is an imaging device for generating a, preferably digital, image of the stamp surface. A stamper lithographic apparatus according to claim 78, in which the inspection device is an evaluation device for Evaluation of the image includes, wherein the evaluation preferably with a computerized Image processing works. A stamper lithographic apparatus according to any one of claims 77 to 79, in which the inspection device a the target topography the stamp surface representing Reference stamp surface or an image of the reference stamp surface and a comparator for comparing the stamp surface to be evaluated or an image of the stamp surface with the reference stamp surface includes. A stamper lithographic apparatus according to any one of claims 77 to 80, at which the inspection device for a mechanical inspection the stamp surface is formed, in particular by means of a profilometer. A stamper lithographic apparatus according to any one of claims 76 to 81, the at least one serving as a treatment means storage means a variety of memory locations assigned for stamp is. A stamper lithographic apparatus according to any one of claims 45 to 82, in which a distance measuring device for measuring the distance between the substrate surface and the stamp surface for the entire Magnitude the advancing movement of the punch is provided. A stamper lithographic apparatus according to claim 83, wherein the distance measuring device is an optical sensor device according to the principle of autocollimation. A stamp lithographic apparatus according to claim 83 or 84, wherein the distance measuring device for distance measurement under Use of membranes formed by the counter-pressure method is. A stamper lithographic apparatus according to any one of claims 83 to 85, wherein the distance measuring device at least one exposed Nozzle for dispensing of gas under pressure on the surface of the structure to be structured Substrates and means for detecting the back pressure includes from which a distance signal can be derived. A stamper lithographic apparatus according to any one of claims 83 to 86, wherein the distance measuring device is an inductive or capacitive Measuring arrangement is. A stamper lithographic apparatus according to any one of claims 45 to 87, in which a drive system for Strokes of the punch is provided, the three linear motors which is star-shaped symmetrical with an angular distance of 120 ° are arranged about a central axis of the punch, wherein the linear motors are preferably connected in series. A stamper lithographic apparatus according to any one of claims 45 to 88, the one for irradiated a stamp from its back towards the stamp surface Lighting device contains. A stamper lithographic apparatus according to any one of claims 45 to 89, which is a vacuum generating device for producing at least the encompassing the area between the stamp and the substrate Has vacuum. A stamper lithographic apparatus according to any one of claims 45 to 90, which is a geometry correction device for influencing the Geometry of the stamp surface a punch, which is preferably in the working position located. A stamper lithographic apparatus according to claim 91, in the case of the geometry correction device for spatially resolving geometry correction the stamp surface with the help of a location-dependent Temperature influencing is formed. A stamper lithographic apparatus according to any one of claims 45 to 92, which is a real-time geometry control unit for measuring the Geometry of the stamp surface in particular by measuring the position of at the Stamp attached stamp marks. A stamper lithographic apparatus according to claim 93, which comprises a transparent reference plate with reference marks and a real-time geometry control unit having multiple position optics is positionable behind the reference plate, so that by comparison the position of the reference marks and the stamp marks the geometry the stamp surface is determinable. A stamper lithographic apparatus according to claim 94, wherein each position optics is a first image comprises optics for imaging the reference mark on a first detector surface and a second imaging optics for imaging the stamp mark on a second detector surface. Stamp, in particular for the stamp lithograph with a typical structure dimension of less than 250 nm, with one stamp body with a three-dimensionally structured stamp surface for the production a three-dimensional stamp imprint on a substrate arranged layer of an embossing substance, the stamp surface one for a replacement of the imprinting substance Optimized surface topography after producing a stamp impression has and the stamp surface itself free of microcracks and adjacent to the stamp surface Material substantially free from the stamp surface directly reaching Microcracks is. The stamp of claim 96, wherein the stamp surface has an average roughness R _t (peak-to-valley) of less than 0.7 nm (RMS). A stamp according to claim 96 or 97, wherein the stamp surface a wavy one or nubbed surface texture with a peak-to-valley value of less than 5 nm for generation has a lotus effect. A stamp according to any one of claims 96 to 98, wherein the stamp surface an average microcrack length of less than 150 nm, preferably less than 50 nm. A stamp according to any one of claims 96 to 99, which has a mechanical hardness of more than 400, 500, 600 or 700 kg / mm ² in the area of the stamp surface. A stamp according to any one of claims 96 to 100, which is at least in the area of the stamp surface consists of a hard material that provides the near-surface hardness. A stamp according to claim 101, wherein the near-surface Area essentially made of boron nitride, silicon carbide, diamond or a hard material heavy metal compound exists. A stamp according to any one of claims 96 to 102, at least in the area of the stamp surface consists of a finely crystalline material, which has a medium Grain size of less than 20% of a mean structural dimension of the stamp surface. A stamp according to any one of claims 96 to 100, which is at least in the area of the stamp surface is made of an amorphous material, in particular of an amorphous material Metal material. A stamp according to any one of claims 96 to 100, which is at least in the area of the stamp surface consists of layered quartz glass, the layers the layer structure preferably substantially parallel to one through the stamp surface run defined stamping plane. A stamp according to any one of claims 96 to 100, which is at least in the area of the stamp surface consists of a monocrystalline material. A stamp according to any one of claims 96 to 106, which consists of a single block of material is made, which the punch body and forms the stamp surface formed thereon. A stamp according to any one of claims 96 to 106, which has a stamp body, the in the area of the stamp surface wearing a coating, which forms at least part of the stamp surface. A stamp according to claim 108, wherein the coating a wear-resistant Coating is. A stamp according to claim 108 or 109, wherein the Coating consists of a hard material. A stamp according to any one of claims 108 to 110, wherein the Coating of a fine crystalline diamond material, a Hard material with heavy metal compounds, silicon carbide, boron nitride or a combination of these materials. A stamp according to any one of claims 108 to 111, wherein the Coating consists of a finely crystalline material whose mean grain size less than 20% of a typical feature size of the stamp surface. A stamp according to any one of claims 108 to 112, wherein the Coating has such a small layer thickness that the Coating for the light used in an exposure is at least partially transparent is. A stamp according to any one of claims 96 to 113, wherein the stamp body and / or a coating consists essentially of uniaxial crystals such as zirconium dioxide (ZrO ₂ ), alumina (Al ₂ O ₃ ), hafnium dioxide (HfO ₂ ), lanthanum fluoride (LaF ₃ ) or Quartz crystal (SiO ₂ ) consists and whose optical crystal axis is almost perpendicular to the stamp surface. A stamp according to any one of claims 96 to 114, in which the stamp body and / or a coating consists essentially of a hard cubic solid solution, in particular of ZrO ₂ / HfO ₂ / Y ₂ O ₃ or HfO ₂ / Y ₂ O ₃ or ZrO ₂ / Y ₂ O ₃ . A stamp according to any one of claims 96 to 115, wherein the stamp body and / or a coating thereof is substantially made of a material having a linear expansion coefficient of less than 2.5 x 10 ^-6 , preferably less than 1.0 x 10 ^-6 consists. A stamp according to any one of claims 96 to 116, comprising a stamp surface has a variety of recesses and protrusions ranging from flank surfaces merge, wherein at least a portion of the flank surfaces have a positive flank angle with a stamping plane, preferably at the stamp surface no undercuts occur. A stamp according to any one of claims 96 to 117, which is at least partially made of a piezoelectric material, which is dimensioned such that at least part of a lifting movement the stamp surface during a stamping process by controlling a to be applied to the piezoelectric material electric field is generated. A stamp according to any one of claims 96 to 118, which is one or more several temperature measuring elements for temperature measurement and / or tempering for influencing the temperature of the stamp. A stamp according to claim 119, wherein the temperature sensing elements and / or tempering agent passing through the stamp material channels are attached. A stamp according to claim 119 or 120, wherein as Temperierungsmittel a conductive through the channels liquid or a gas is used. A stamp according to any one of claims 119 to 121, wherein each a tempering agent and a temperature measuring element for formation a temperature control element are placed close to each other, and wherein the temperature control elements substantially stamp the punch grid-like Cover arrangement. A stamp according to any one of claims 96 to 122, which is at least one for having infrared radiation absorbing layer. Method for producing a stamp, in particular a stamp for the stamp lithograph, wherein the stamp a stamp body with a three-dimensionally structured stamp surface to produce a three-dimensional Stamp imprint in a arranged on a substrate layer an imprinting substance comprising, with: Edit the stamp body such that the stamp surface a for one replacement of the imprinting substance Optimized surface topography after producing a stamp impression and a material adjacent to the stamp surface essentially free of microcracks reaching the stamp surface is. The method of claim 124, wherein a substantially flat stamp surface initially highly accurate and is faithfully preprocessed, then the stamp area in an etching process so deeply etched is reached until a substantially micro-crack-free area is reached and then the three-dimensional stamp surface is created. A method according to claim 124 or 125, wherein the Stamping material by mechanical processing, in particular by Walking and / or hammering changed in its structure will, so the hardness of the material increases and / or the microcracking length decreases. A method according to any one of claims 124 to 126, wherein the stamp surface is structured by means of laser scanning technology. Finely structured component, in particular semiconductor component, prepared by a process according to any one of claims 1 to 44 and / or using at least one stamp according to one the claims 96 to 123.