DE10392603D2 - Leuchtstoffpulver, Verfahren zum Herstellen des Leuchtstoffpulvers und Leuchtstoffkörper mit dem Leuchtstoffpulver - Google Patents

Leuchtstoffpulver, Verfahren zum Herstellen des Leuchtstoffpulvers und Leuchtstoffkörper mit dem Leuchtstoffpulver

Info

Publication number
DE10392603D2
DE10392603D2 DE10392603T DE10392603T DE10392603D2 DE 10392603 D2 DE10392603 D2 DE 10392603D2 DE 10392603 T DE10392603 T DE 10392603T DE 10392603 T DE10392603 T DE 10392603T DE 10392603 D2 DE10392603 D2 DE 10392603D2
Authority
DE
Germany
Prior art keywords
phosphor
phosphor powder
powder
producing
phosphor body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE10392603T
Other languages
English (en)
Other versions
DE10392603B4 (de
Inventor
Frank Jermann
Markus Richter
Wolfgang Rossner
Martin Zachau
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Osram GmbH
Ams Osram International GmbH
Original Assignee
Osram Opto Semiconductors GmbH
Patent Treuhand Gesellschaft fuer Elektrische Gluehlampen mbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Opto Semiconductors GmbH, Patent Treuhand Gesellschaft fuer Elektrische Gluehlampen mbH filed Critical Osram Opto Semiconductors GmbH
Priority to DE10392603.8T priority Critical patent/DE10392603B4/de
Publication of DE10392603D2 publication Critical patent/DE10392603D2/de
Application granted granted Critical
Publication of DE10392603B4 publication Critical patent/DE10392603B4/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
    • C09K11/7766—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing two or more rare earth metals
    • C09K11/7774—Aluminates
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
DE10392603.8T 2002-05-29 2003-05-28 Leuchtstoffpulver, Verfahren zum Herstellen des Leuchtstoffpulvers und Verwendung eines Leuchtstoffpulvers Expired - Lifetime DE10392603B4 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE10392603.8T DE10392603B4 (de) 2002-05-29 2003-05-28 Leuchtstoffpulver, Verfahren zum Herstellen des Leuchtstoffpulvers und Verwendung eines Leuchtstoffpulvers

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
DE10223988A DE10223988A1 (de) 2002-05-29 2002-05-29 Leuchtstoffpulver, Verfahren zum Herstellen des Leuchtstoffpulvers und Leuchtstoffkörper mit dem Leuchtstoffpulver
DE10223988.6 2002-05-29
PCT/DE2003/001749 WO2003102113A1 (de) 2002-05-29 2003-05-28 Leuchtstoffpulver, verfahren zum herstellen des leuchtstoffpulvers und leuchtstoffkörper mit dem leuchtstoffpulver
DE10392603.8T DE10392603B4 (de) 2002-05-29 2003-05-28 Leuchtstoffpulver, Verfahren zum Herstellen des Leuchtstoffpulvers und Verwendung eines Leuchtstoffpulvers

Publications (2)

Publication Number Publication Date
DE10392603D2 true DE10392603D2 (de) 2005-02-03
DE10392603B4 DE10392603B4 (de) 2018-01-18

Family

ID=29557395

Family Applications (2)

Application Number Title Priority Date Filing Date
DE10223988A Ceased DE10223988A1 (de) 2002-05-29 2002-05-29 Leuchtstoffpulver, Verfahren zum Herstellen des Leuchtstoffpulvers und Leuchtstoffkörper mit dem Leuchtstoffpulver
DE10392603.8T Expired - Lifetime DE10392603B4 (de) 2002-05-29 2003-05-28 Leuchtstoffpulver, Verfahren zum Herstellen des Leuchtstoffpulvers und Verwendung eines Leuchtstoffpulvers

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE10223988A Ceased DE10223988A1 (de) 2002-05-29 2002-05-29 Leuchtstoffpulver, Verfahren zum Herstellen des Leuchtstoffpulvers und Leuchtstoffkörper mit dem Leuchtstoffpulver

Country Status (4)

Country Link
US (1) US7481951B2 (de)
JP (1) JP2005527692A (de)
DE (2) DE10223988A1 (de)
WO (1) WO2003102113A1 (de)

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FR2855169B1 (fr) 2003-05-23 2006-06-16 Rhodia Elect & Catalysis Composes precurseurs d'aluminates d'alcalino-terreux ou de terre rare, leur procede de preparation et leur utilisation comme precurseur de luminophore notamment
DE20308495U1 (de) 2003-05-28 2004-09-30 Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH Konversions-LED
US7088038B2 (en) 2003-07-02 2006-08-08 Gelcore Llc Green phosphor for general illumination applications
US7094362B2 (en) 2003-10-29 2006-08-22 General Electric Company Garnet phosphor materials having enhanced spectral characteristics
US7252787B2 (en) 2003-10-29 2007-08-07 General Electric Company Garnet phosphor materials having enhanced spectral characteristics
US7442326B2 (en) 2003-10-29 2008-10-28 Lumination Llc Red garnet phosphors for use in LEDs
JP4374474B2 (ja) 2004-04-23 2009-12-02 独立行政法人物質・材料研究機構 蛍光体
JP4583076B2 (ja) * 2004-06-11 2010-11-17 スタンレー電気株式会社 発光素子
US7648649B2 (en) 2005-02-02 2010-01-19 Lumination Llc Red line emitting phosphors for use in led applications
US7329371B2 (en) 2005-04-19 2008-02-12 Lumination Llc Red phosphor for LED based lighting
JP5205724B2 (ja) * 2006-08-04 2013-06-05 日亜化学工業株式会社 発光装置
WO2009012301A2 (en) 2007-07-16 2009-01-22 Lumination Llc Red line emitting complex fluoride phosphors activated with mn4+
KR101421719B1 (ko) * 2007-09-18 2014-07-30 삼성전자주식회사 금속 하이드록시 탄산염을 이용한 나노 형광체의 제조방법및 그로부터 제조된 나노 형광체
FR2943333B1 (fr) 2009-03-20 2011-08-05 Baikowski Alumine, luminophores et composes mixtes ainsi que procedes de preparation associes
TWI501926B (zh) * 2010-07-23 2015-10-01 Baikowski 氧化鋁、發光團及混合化合物，以及相關製備方法
TWI583625B (zh) * 2010-07-23 2017-05-21 貝柯夫斯基公司 氧化鋁、發光團及混合化合物，以及相關製備方法
US8865022B2 (en) * 2011-01-06 2014-10-21 Shin-Etsu Chemical Co., Ltd. Phosphor particles and making method
US9617469B2 (en) * 2011-01-06 2017-04-11 Shin-Etsu Chemical Co., Ltd. Phosphor particles, making method, and light-emitting diode
US9472731B2 (en) * 2012-12-28 2016-10-18 Shin-Etsu Chemical Co., Ltd. Phosphor-containing resin molded body, light emitting device, and resin pellet
JP6261196B2 (ja) * 2013-06-12 2018-01-17 信越化学工業株式会社 発光装置
JP6543492B2 (ja) * 2015-03-20 2019-07-10 株式会社カネカ Ｙａｇ蛍光体の製造方法
DE102015113360A1 (de) 2015-08-13 2017-02-16 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung eines Konversionselements
JP6428813B2 (ja) * 2017-03-13 2018-11-28 信越化学工業株式会社 発光装置
JP2019147968A (ja) * 2019-06-13 2019-09-05 株式会社カネカ Ｙａｇ蛍光体用複合粒子、ｙａｇ蛍光体及び発光装置
US10950773B1 (en) * 2019-12-02 2021-03-16 Bruce H Baretz Light emitting diode devices

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US4034257A (en) * 1975-06-05 1977-07-05 General Electric Company Mercury vapor lamp utilizing a combination of phosphor materials
GB1589964A (en) * 1976-09-03 1981-05-20 Johnson Matthey Co Ltd Luminescent materials
GB1600492A (en) * 1977-01-19 1981-10-14 Johnson Matthey Co Ltd Luminescent materials
NL7809555A (nl) * 1978-09-20 1980-03-24 Philips Nv Werkwijze voor het bereiden van een luminescerend alu- minaat.
FR2469477A1 (fr) * 1979-11-09 1981-05-22 Rhone Poulenc Ind Procede de fabrication de grenat polycristallin, grenat polycristallin et monocristal correspondant
KR920010085B1 (ko) * 1988-07-30 1992-11-14 소니 가부시기가이샤 이트륨 · 알루미늄 · 가넷미립자의 제조방법
FR2679242A1 (fr) * 1991-07-19 1993-01-22 Rhone Poulenc Chimie Phosphate mixte de lanthane, terbium et cerium, procede de fabrication de ceux-ci a partir de sels insolubles de terres rares.
JPH05294722A (ja) * 1992-04-10 1993-11-09 Kurosaki Refract Co Ltd 固体レーザ用多結晶透明ｙａｇセラミックスの製造方法
FR2743555B1 (fr) * 1996-01-17 1998-02-27 Rhone Poulenc Chimie Borate de terre rare et son precurseur, leurs procedes de preparation et l'utilisation du borate comme luminophore
US6153123A (en) * 1997-02-24 2000-11-28 Superior Micropowders, Llc Sulfur-containing phosphor powders, methods for making phosphor powders and devices incorporating same
JP3906352B2 (ja) * 2000-03-27 2007-04-18 独立行政法人物質・材料研究機構 Ｙａｇ透明焼結体の製造方法
JP3425582B2 (ja) * 2000-04-14 2003-07-14 Ｎｅｃエレクトロニクス株式会社 半導体装置及びその製造方法
JP2002029742A (ja) * 2000-07-21 2002-01-29 Daiichi Kigensokagaku Kogyo Co Ltd 希土類金属酸化物粉末及びその製造方法
JP2002194346A (ja) * 2000-12-22 2002-07-10 Sumitomo Chem Co Ltd アルミン酸塩蛍光体の製造方法
DE20308495U1 (de) * 2003-05-28 2004-09-30 Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH Konversions-LED

Also Published As

Publication number Publication date
JP2005527692A (ja) 2005-09-15
US7481951B2 (en) 2009-01-27
WO2003102113A1 (de) 2003-12-11
DE10223988A1 (de) 2003-12-18
DE10392603B4 (de) 2018-01-18
US20060022580A1 (en) 2006-02-02

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