DE1653263A1 - Method and device for the production of panels, profiles and hollow profiles, preferably made of lignocellulosic material or especially wood chips - Google Patents

Description

Günther Paperan e!>?;'

4-931 Pivitsheide V.L., Detmold district, tjchulstrasse

n and device for the production of rlatbeii, profiles and Hoxilprofilen, yorzug woise from li ^ noze llttlose Haltip; a material or similar, in particular wood chips, "

The invention "relates to a process for the production of" chipboard, profiles or hollow profiles, which does not use the usual production methods, but is considerably, simplified and at the same time -ualiü .- "t and \ -i 'naltijlcoit of the product -re- .j : ϊΐϋϋοα 5 ..stGigort becomes.

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The apparatus for performing this method should essentially consist of one or more tendon mixers, preferably one behind the other exist in connection with screw presses for continuous production of panels, profiles and hollow profiles.

In general, the ones known so far differ FlachpreÜverfahren for the production of Chipboard is only slightly apart and is composed of a sequence of

1. Chipping the wood

2. Crushing mills

3. Bunkering of the swarf 4-. Drying of the chips

5. Troclron dislocation

6. üichtUL -.-; in oorcimenten

7. lieleiiiiung, -jvtl. g-3 he poor in dorbimc-ncön

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8c Bunkering of the glued chips 9. Distribution with and without ^ separation in assortments

10. Pre-pressing

11. Finishing the chipboard

12. Measurement control, possibly sanding of the surface,

liin another process for the production of chipboard it should be mentioned, which is the milling of the chips according to the Stranfj'preß method - known as G-lobiboard- and Krei ^ -baumverfahren - carries out. The preparatory Work processes - for the last! Pressing are the same as the first-mentioned process and deal with the above-described processes after the wood has been chipped Work processes up to the gluing of the dried chips.

Weather proposals for making particle board 109840 / 03OS

have become known in which the pressing and calibration of the chipboard with roller presses is carried out, but the laborious pretreatment of the chips does not deviate from that described above Procedure and will not be reduced.

The processes mentioned are already very cumbersome in the preparatory treatment of the chips and require an extensive and expensive l'ux machine park in order to produce panels of a more or less constant quality.

After wet chipping of the wood and bunkering of the wet chips, the chips must be dried to a moisture content of approx. 2-4 / o in a very expensive and extensive drying system with a high expenditure of energy. The subsequent bunkering of the chips does not guarantee that

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the moisture content of the dried chips is maintained, since the moisture content adapts to the climatic conditions immediately, if storage is not carried out in climate-proof silos, it can "until the next processing stage the moisture content will already rise again, and therefore the quality of the panels will vary have to be. Too moist chips very easily result in bubble plates that are unsuitable for use especially if a high level of humidity is not taken into account during gluing and production will.

These known methods also require the opane material to be sealed, since the binder storage area seals off from one another considerably in the case of coarse-in and fine chips. Large opanes take about 5 - 4 W »f,» in «? öx ^ üiie dag'.i _t : on ca «. 20 - 50; ■> glue on.

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On the one hand, to keep the glue uptake within economic limits and, on the other hand, to keep it even Shaving of the chips in different coarse and fine layers, as well as a flawless one Achieving plasticization of the glue-rich fine chips on the board surface requires a expensive and time-consuming sifting and, if possible, a separate gluing.

For gluing the chips, the chip material must be separated from the bunker into the gluing machines or given up at different times in order to be able to carry out an economical gluing of the chips. Already with this known Beleimungstechnik is the big disadvantage is that for example in the Sprühbeleimung with dex · glue liquor about 40 - is returned 6ü / o "Yasser chips, DAT previously in an elaborate drying

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procedure with high energy expenditure was removed from the wet chips "

In certain "procedures, the chips have to be separated be bunkered, as the top layers of the chipboard with the finer chip assortments are separate must be glued and applied separately. Because a separate gluing of the fine Chips of the top layers, as well as the coarse chips for the Iiittellagei ^ -st for the quality and simultaneous hardening of the chipboard significantly. In addition, the binder layers are the Upper and lower covers exposed to the temperature of the press plates earlier and should therefore have a longer curing time than that Binder of the putty shavings.

After this very cumbersome gluing and

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Bunkering, the glued chips are fed to a pouring device, which is only filled with lioliem technical effort the öpahgut in an approximately uniform density on the Prcßplatten in certain Layers of the individual chip assortments. The machines with separate spreading dsr Chip assortments achieve the best bulk density per unit area of the plate, however, an exact, uniform and repeatable pouring is not possible feasible »The density and therefore the quality of the finished chipboard is only approximate Comparable in quality and strength. Lan tried through special absorption measurements and optical instruments to achieve a more precise pouring to achieve a uniform density, but these have not led to any practical result. The mass of the plate is subject to hence always fluctuations and therefore it is

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required,; each finished panel through ./äsen and allow for his viciite and defection consider to keep the product reasonably equivalent. The high technical complexity of the bed the chipboard with expensive Ließ- and control device scoi.it in no relation to the practical Result.

The subsequent pressing of the poured plate generally takes place in! flat presses or, for rational reasons, in -! day presses. In many cases must first the poured plate can be pre-pressed. This pre-pressing is necessary to the location of the to maintain the embankment and to reduce the high embankment to a lower level in order to achieve this Plates in the press away from the limited Opening height can be entered, The other part of the disadvantage results from the

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ungleichmäßig3 thermal treatment after the introduction of the front ₀ ^- epreßten plastics by the lower side is heated by * EITS by the pressing plate, while the upper Same is not touched prior to closing the press of the upper press plate.

When closing the flat or multi-tier press comes it then inevitably leads to a displacement of air, v / whether the chips still loosely on the surface of the Planets can whirl up, causing imperfections and clumps to form in the surface. It can only be troublesome with a high level of technical effort Effect can be eliminated e.g. by simultaneous pressing.

In addition to these defects described above, there is a uniform pressing with an even pressing pressure per unit area on the chipboard not

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performs) ar, since the pouring - albeit already Carefully carried out - can never be so precise as to when pressing together on every ^ part of the chip layer then to exert the same pressure .. The even Pressing pressure is already prevented by the fact that the press ram is only up to an applied discancy bar can press. If the pouring were accurate these distance bars are unnecessary.

As a result, the glue fuses also remain different big, hzw. it remains between the prisoners Air chambers that increase the strength of the particle board

affect and create an intense connection "

is not given. Thick glue joints result in a lower strength anyway and therefore the aim is to to keep the glue joint structure as thin as possible in order to achieve high strength. Both conventional flat and floor press is through

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the difference in density does not make a tight glue joint structure us self-evident the proportion of glue must be higher in order to achieve a good connection at all. An uneven one Plasticization in the top layers is the result, since the pressure differences and thus the penetration the heat affects the hardening of the binder. An irregular surface quality is then the consequence.

Further disadvantages arise when the press is opened after the pressing time has elapsed. The surface of the pressed chipboard is released first and is already cooling, while the underside of the board is still warmed up. Uneven thermal stresses in connection with the uneven density structure and . The inclusion of moisture in the central area of the panel results in

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turns and the plates easily assume a convex shape. That requires another one again Treatment to compensate for these errors.

/ 5in is very "real factor for the strength and the possible use of the clamping plate, the clamping orientation _t Λ itself. The fabricated by pressing flat plates have a clamping position in which the chips are predominantly parallel to the plane of the plate surface. As a result, although the plate has good flexural strength, it splits very easily on the front sides. The problem is this strength, which is not uniform in all dimensions, eg in furniture construction γ (transverse tensile strength and flexural strength) when screws have to be screwed into the end faces. There is no mutual anchoring of the chips.

1098A6 / 0308 BAD original

The extrusion process mentioned at the beginning "at because the chipboard is stuffed at the front in cycles, it achieves a better density than after the flat pressing process, however, this plate breaks very easily because the chips are predominant are aligned perpendicular to the plane of the plate. The strength of the plate is therefore less favorable in flexural strength than by the flat pressing method, although this pressing method for the continuous Manufacture of tubular plates and hollow profiles is suitable. Sin disadvantage is with to this process in the daily pressing see, because the desired continuous pressure does not exist during the setting time and the setting ' binding is constantly disturbed by the alternating loosening and pressing of the chips.

This invention is directed to these

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known process for the production of panels, profiles and hollow profiles from wet chip to to simplify and improve finished product in such a way that the known processing stations of the chips and the machine-technical effort is considerably reduced in. The method according to the invention is designed to produce a more uniform product, with consistent density and strength and a previously unknown chip orientation that extends in all directions and directions. By this new chip layer and the continuous pressing pressure can matt the chips with each other and anchor, which achieves high strength in all dimensions of the chipboard. Of the Moisture content of the chips, the hardening times with the required temperatures controllable during manufacture. The continuous Compression pressure should be arbitrary - ^ e as required -

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be adjustable, whereby, it is possible to have a completely new memory material of any density and festi ^ - . ability to produce. The binder content can be kept lower in order to create a structure of tight to get thin binder joints, which guarantees a higher strength. The pressure should be even be distributed on the chip material and in calibrated device harden to achieve high constant dimensional accuracy.

. According to the invention, the wet opöie come from one Storage container continuously fed to a high-speed mixer with any dosing device. It has been shown that especially the high speed of rotation of the mixing tool with large Shear forces and the resulting frictional heat are particularly suitable for wood chips in a short time Time to remove the moisture.

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This will be the water that is becoming frayed, and who? wet chips due to the higher density the centrifugal force is fed directly to the "heated container wall" under proportionally high pressure, where the moisture evaporates quickly. The freezing water vapors are caused by a The hot air stream blown into the container is quickly removed and the water vapor condenses vv'is avoided in the mixing container «

This Irish should preferably be used as a preheater serve and predominantly the free water from the

remove opaniiiatorial, as well as the temperature of the I.

-γ.ι oo vo: - _; , o'trocknite ^ iatiri-xl flows over a - J ₁ -; j Iu - ^ j-- in üu'j -lau Γ in ο inen Zvvoit-jn Schnell-ischer luichoc Arb. in aissam bischer should preferably

10MMA0306 ^

that which is bound in the wood, is released "down to the desired moisture content.

Both mixers can be adjusted to the most varied of material conditions, so that the temperatures, the moisture content and the flow rate can be controlled in each case. This can be done through the multitude of control options, through the adjustment of the speed of circulation of the mixing tool and the associated heat generated by the centrifugal force and circulation speed, the 'temperature setting of the container, the hot air throughput and the adjustable hot air temperature, so / ie the regulation of the residence time of the Jparu.iacerials in the

This drying process can still be preceded

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can be influenced by using the mixing tool Cavities or channels can be equipped to, for example, hot air, preferably at the rear To guide the edges of the mixing tool blades into the flute.

Once the desired degree of dryness has been reached, the pre-dried chips flow over one further adjustable overflow into a downstream high-speed glue mixer. In the feed stream of the chip material is continuously fed with any desired metering device Additives - preferably in powder form - are added to the mixer.

The temperature of this glue mixer can be adjusted so that the residual moisture that escapes is deposited on the chip surface,

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For example, this is achieved by blowing in a cooled air flow in the Bell container reached. Temperature and humidity are depending on the The required degree can be adjusted for the type of binder used, a good binder Oil distribution will be on the moistened in a short time Chip surface due to the fast rotating mixing tool and the high circulation speed scored

The big advantage in this procedural section; According to the invention, it lies in bogrünaet, there .; the wet tension runs through a short rapid drying process and the free fiestfeuchtigkoit f "r the gluing of the chip is used in a energiespax'enden operation. In Ge ^ APPROACH this, the chips with a high expenditure of energy are at burning process onto a Feuchtirk.itsgrad 2 -

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4- ϊο yät- dried and then through the glue liquor with a ".Vas 3 he content of approx. 40 - 60 yo re-moistened, as" has already been mentioned.

The 'drying and gluing mixers can if necessary work under vacuum, whereby the drying process in special cases, e.g. when processing of 2oh3boffen with high bound water content, much improved .vsrden.

The prepared for pressing glued chips reach recently lay in a supply hopper one or more screw presses and ä'epreiiit the finished product without delay. The screw press can be set up so; be that, after a short preliminary press, in a section of the screw cylinder, obscuration was removed oaei; can be admitted

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in each case according to the requirements of the molding material. Inside the screw press are the temperatures controllable to adjust the setting and hardening times of the binding agent in the naCij.f ο Inenden pressing process as required to have in hand and to control. The fitting arranged in front of the screw press z. B. for the production of solid panels, tubular panels, Profiles or hollow profiles - can be provided with openings - preferably with angled after outside, facing opposite to the pressing direction Drilling - to remove any excess moisture derive, possibly with the support of a vacuum. In this way, especially in 3 cases Moisture or coating agents of any kind, such as plastics, of the surface of the Pressed strand are fed.

The preformed press section passes through a potash

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Tared mold heated on all sides with adjustable 'temperature. Temperature and processing time ^ - ^es stranjes are set so that the binder sets and hardens in this form. The extruded strand is connected to the heating zone by a

thermally separated cooling channel pressed - with ge ^ / icher calibration of the heating mold - to cool the extruded strand to the necessary, shape-constant temperature. Due to the uniform pressing, a narrow glue joint structure is created with a lower proportion of binding agent, in which the excess binding agent is pressed against the surface of the pressing strand and a uniformly plasticized, flawless surface is formed here, which is ^{equivalent to a coating I 1} T special case ciÄ is.

i'for 3escnichtun _c Tszvvecke, z. 3, with plastics according to well-known Sescxiiciiuuii-'sver'i'L.ai'är., The

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Exploited temperature of the extruded strand after passage through the heated, calibrated mold be to energy-saving the coating material to raise.

The chip dosage, the addition of glue, the degree of humidity and the temperatures in the individual machine elements, as well as the pressing speed, heating and cooling times are after Adjustment of the individual processing stations to be controlled appropriately synchronously. The whole Plant can run as a machine unit.

* It is thus possible, according to the method according to the invention, of the wet chipping of the wood in a single operation, the drying and spraying process, as well as the pressing of the

for raw or coated

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Plate or to the finished profile of any density and strength, consistent quality and dimensional accuracy. Here is the thermal energy fully utilized, as there is no undesired cooling of the raw material through intermediate storage.

The method and the device according to the invention for the implementation of the production should now be explained in more detail using the enclosed drawing, for example explained. The individual phases of the processing stations from the machining of the wood up to the finished product are shown schematically.

In FIG. 1, an arrangement of devices is shown, for example, in which the inventive concept Procedure can be carried out.

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From a known Zerspammgseinrichtung 1 the moist chips are conveyed into a silo 2. In the lower part of the silo 2 is any Chip metering device 3 is provided in a known manner, for example in the form of a stepless adjustable worm or rotary valve, with which a continuous chip addition in the next High speed mixer can be done. The chips fall centrally into the drum 4 of the rotating High-speed mixer 5 chip materials and will direct fed to the rapidly rotating mixing tool 6 in the lower part of the mixing container. Through the emerging Frictional heat and the heated container, the chips are heated quickly, increases gradually on the container wall upwards and reaches the trough-shaped circulation of the container contents. The free water in the wood is quickly connected by the high shear and centrifugal forces

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with the developed heat free and evaporate. The heated air is blown through a pipe 8 into the container 5 via a hot air unit 7. The dry hot air absorbs the water vapor and is sucked out of the mixing container by an exhaustor 9 via the discharge pipes. The hot air throughput and temperature can be adjusted as required until the desired temperature and humidity level is reached. The humidity and temperature are expediently determined in the overflow channel 10 by means of known measuring instruments. The dwell time of the chip material in the mixer 5 can be determined by the chip addition of the metering device 5 and a flow regulator 11 in the overflow channel 10. After the required dwell time, the chip material flows through the overflow channel 10 into the second mixer 12. In this mixer 12, the raw material should preferably be treated at higher temperatures,

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so that the bound water in the wood is also released. After this further drying process - in the same way as in the first mixer 5 - gelai ^ the chip material after one more control of humidity and temperature over the next Overflow channel 13 into the glue mixer 14. A binder feed line is central in the PIuS of the chip material 15 arranged, the continuously a measured amount of binder and possibly additives to the flowing into the container Chip current admixed. The binding agent is added via any known metering device 16 from a storage container 17 arranged above.

The container of the glue mixer 14 can be both heated and cooled to once the chip temperature the properties of the binder

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to adapt and, on the other hand, to initiate condensation of the moisture on the chip surface. This process can also be supported by a fan 18.

The binding agent is first passed with the incoming raw material into the lower part of the container and is picked up directly by the rapidly rotating mixing tool 19, whereby a good ¥ «r is achieved on the condensate-covered chip surface _o

The glued and tempered chips flow continuously into the storage hopper 20 of a screw press 21. The storage hopper 20 is expediently equipped with an agitator 22 in order to feed the chips (lev screw. The screw cylinder 23 can for certain purposes with a compression zone 24 and a venting zone 2 ^! j be equipped.

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The ventilation shaft 26 can be used to drain away excess Serve moisture. On the other hand, it is also possible, if necessary, through this ventilation shaft 26 To return moisture to the raw material in the screw barrel.

In the screw cylinder 23, the raw material is inevitably circulated under "certain pressure, whereby the binder distribution is still improved. The pressing of the glued chips begins in Mouthpiece 27 and is here first in the intended Form headed.

™ Bores can be provided in the molded mouthpiece 27

are used to dissipate any excess moisture. The bores 28 are expediently arranged in such a way that that the openings point opposite to the pressing direction. It is entirely possible for that

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special treatment of the surface of the extruded strand through the bores 28 moisture, coating materials or to add any additives to the molding compound.

The chip material is removed from the mold mouthpiece 27 by the adjustable pressure of the worm into the calibrated form 29 pressed, also wä.che with Vent holes 30 may be equipped. The temperature of the mold heating 29 is set, taking into account the pressing speed, that here the setting of the binding agent and hardening of the pressed strand occurs.

The extruded strand slides through a thermally insulated transition piece 31 into the cooling channel 32, the - like form 29 - has a calibrated guide. The cooling channel 32 can be supplied by a cooling unit 33

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be cooled and is expediently divided into several cells for better control of the temperatures, After the pressed product has cooled to the required, shape-constant temperature is, the pressed strand 34 emerges from the cooling channel 32 from and then cut to desired lengths with a cutting device 35 known per se be e.g. B. for flat material to any plate size. 36. Between the cooling channel 32 with the Heating mold 28 can be any known per se - not shown ^ - arranged charging system are used to manufacture coated products. It is also possible, preferably before the heating mold 29 in the mold mouthpiece 28, via a corresponding one Device, coating material ins Bring interior of the extruded strand - z. B. for the inner coating of Holilprofilen.

It is also possible to use means for reinforcement

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introduce the extruded strand, z. B ₀ steel wires in Holilprofiles for the production of beams for high loads.

In FIG. 2 there are, for example, some hollow profiles shown, which can be prepared by the process of the invention, for. B. walls and Roof coverings 37 »ceiling beams 38, as well as insulated pipes 39 for" any purposes. Since after this Pressing process the density and thus also the specific weight "can be determined at will it is possible to produce relatively thin-walled profiles with sl \ er high strength, with the higher specific weight balanced by large clear cross-sections in the hollow profiles or hollow plates can be. The strength in all dimensions is not allowed for the new chip orientation, in particular attributed by the pressing method according to the invention with screw presses.

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Claims (1)

Claims Process for the production of plates, hollow plates, profiles or hollow profiles from lignozfl-lulosem or similar material, such as wood chips, fibers, etc., characterized in that the wet, machined raw material, in several, in the production sequence connected, drying mixers through the adjustable Frictional heat of the tools, the heating of the containers, the high circulation speed and the supply of hot air are continuously dried and the heated, pre-dried raw material is wetted in the subsequent glue mixer by setting the temperatures and the condensation caused by the air supply, possibly from the residual moisture of the raw material, under continuous Encore . £ 109846/0305 - ² - MO ORIGINAL a binder, preferably in powder form for applying glue to the surface of the raw material. 2. Process for the production of panels, hollow panels, profiles or hollow profiles according to spoke 1, characterized in that the pre-dried, wetted with binder, optionally warm, raw material with continuous, adjustable pressure in a screw press while regulating the temperatures, prepressing and humidity of the raw material is continuously pressed to the finished product. 3. Apparatus for performing the method according to claim 1, characterized in that any number of drying and gluing mixers (5, 12, 14) one after the other are arranged. - 5 -109846/0305 Device according to claim 1 and 3? through this characterized in that the drying and gluing mixer are equipped with a container heater. 5. Apparatus according to claim 1, 3 and 4-, characterized characterized that the drying and gluing mixers are in different levels, arranged one above the other and connected to overflow lines (10, 13). 6. Apparatus according to claim 1, 3-5 »characterized in that those connecting the mixer, Overflow lines (10, 13) with flow control devices (11) are provided. 7. Apparatus according to claim 1, 3-6, characterized in that the initiation of the - M- 1Q9846 / 0305 BATH ORIGINAL Raw material centrally into the drum (4) of the circulating Ron material takes place in the mixing container. ο device according to claim 1,3-7 »thereby characterized in that the raw material drains out of the containers tangentially. 9 · Device according to claim 1, 3-8, characterized in that the rotational speeds the mixing tools are adjustable » 10. Apparatus according to claim 1,3-9 »characterized in that the (drying mixer container connected to a hot air unit (7) are. 11. The device according to claim 1, 3-9 »thereby - 5 109846/030 5 BAD OBtQINAt αϊ characterized in that the glue mixer or mixers (14 ·) equipped with a hot or cold air blower (18) connected to the container are" 12. The device according to claim 1, 3-11, characterized characterized in that the mixing tools (6, 19) with hollow channels for the passage of hot air are fitted into the chip material. 13. Apparatus according to claim 1, 3 - 12, characterized in that the central raw material inflow ' in the container a feed line (15) for the addition of binder and any Raw additives is arranged. 14 ·. Device according to claim 1, 3 - 13, characterized in that the drying and loading - 6 109846/0305 - fr- glue containers (5, 12, 14-) are connected to a suction system (9). Device according to claim 1, 3-13 »thereby characterized in that the drying and gluing containers work under vacuum. 16. The device according to claim 2, characterized in that the pressure of the screws infinitely adjustable eats. 17. Apparatus according to claim 2 and 16, characterized in that the screw press with is equipped with a pre-compression zone. 18. Apparatus according to claim 2, 16 and 17, characterized in that the snow cylinder with a shaft (26) for removing or removing - 7 109846/0305 SAD ORiOfHAL Moistening of the raw material or for the addition of additives is provided _o 19 · Device according to claim 2, 16-18, characterized in that the screw press with is equipped with an adjustable heating and cooling device » 20.. Device according to claim 2, 16-19 »characterized in that on the screw press a]? standard mouthpiece (27) is connected 21. The device according to claim 20, characterized in that that the standard mouthpiece (27) can be heated. 22β device according to Angruch 20 and 21, thereby characterized in that the shaped mouthpiece (27) - 8 109846/0305 BATH 1653283 "*" TJ ■ " HJl for dehumidifying or moistening the press material or for the supply of additives with holes (28) is provided ^ ösaä. Claim 20, 21 and 22, characterized in that the bores (28) are connected to a vacuum. 23ο Device according to claim 2, 16-22, characterized characterized in that a compression mold (29) of any length is arranged after the shaped mouthpiece (27) is. 24 "Device according to claim 23, characterized in that that the mold (29) can be heated, 25 «device according to. Claim 23 and 24, characterized characterized in that the mold (29) is provided with stanchions (30). " ⁹ ~ ^BAD ORlGiNAL 109846/0305 ^AL 26o device according to. Claim 23 »24 · una 25, thereby marked that the bores (30) are connected to vacuum. 27 · Device according to claim 2, 16-26, characterized in that between the press mold (29) and the subsequent cooling channel (32) a thermally insulated intermediate piece (31) is located. 28. Device according to claim 2, 16-27 »thereby characterized in that a cooling channel (32) for "any cooling of the press strand of the press mold (29) is subordinate to » 29. The device according to claim 28, characterized in that that the cooling channel (32) consists of several cells for various cooling-medium operations consists. 109 846 ^ 0305 30. The device according to claim 2, 16-29, characterized in that after the molded mouthpiece (27) or mold (29) "any devices for surface treatment, coating or the like are attached. 31. The device according to claim 2, 16-30, characterized in that in the molded mouthpiece (27) or die (29) any device for interior coating or interior treatment the surface of hollow profiles is arranged. 32. Apparatus according to claim 2, 16 - 31, characterized in that in the molded mouthpiece (27) or the press mold (29) has a device for introducing a reinforcement into the pressed strand is. 109846/0305 ψ * Blank page