DE1665944A1 - Process for making electrical circuits - Google Patents

Process for making electrical circuits

Info

Publication number
DE1665944A1
DE1665944A1 DE19671665944 DE1665944A DE1665944A1 DE 1665944 A1 DE1665944 A1 DE 1665944A1 DE 19671665944 DE19671665944 DE 19671665944 DE 1665944 A DE1665944 A DE 1665944A DE 1665944 A1 DE1665944 A1 DE 1665944A1
Authority
DE
Germany
Prior art keywords
conductor tracks
plate
insulating
raised
circuits
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE19671665944
Other languages
German (de)
Inventor
Erwin Weidemann
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Publication of DE1665944A1 publication Critical patent/DE1665944A1/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/045—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by making a conductive layer having a relief pattern, followed by abrading of the raised portions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0382—Continuously deformed conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09118—Moulded substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09881—Coating only between conductors, i.e. flush with the conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0108—Male die used for patterning, punching or transferring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/025—Abrading, e.g. grinding or sand blasting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/128—Molten metals, e.g. casting thereof, or melting by heating and excluding molten solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/041—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by using a die for cutting the conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/043—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by using a moving tool for milling or cutting the conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material

Description

Verfahren zum Herstellen elektrischer Schaltkreise Die Erfindung bezieht sich auf ein Verfahren zum Herstellen elektrischer Schaltkreise. Es sind bereits Verfahren bekannt, bei denen eine elektrisch leitende Folie auf einem Träger aus Isolierstoff aufgebracht wird und die einzelnen Schaltkreise aus der leitenden Folie auf fototechnischem Wege herausgearbeitet werden. Nach diesem Verfahren hergestellte Schaltkreise haben einen verhältnismäßig kleinen Leiterquerschnitt und sind daher lediglich für die Übertragung schwacher Ströme geeignet. Erfindungsgemäß werden zur Herstellung elektrischer Schaltkreise Leiterbahnen an einer Platte aus elektrisch leitfähigem Material erhaben herausgearbeitet, dann wird auf die erhabenen Leiterbahnen eine Isolierschicht aufgebracht und die elektrisch leitende Platte wird von ihrer Grundseite her so weit abgetragen, bis die einzelnen Leitbahnen elektrisch voneinander getrennt sind. Auf diese Weise können Schaltkreise für die Übertragung beliebig großer Leistungen auf einfache Weise hergestellt werden.Method of Making Electrical Circuits The invention relates to refers to a method of making electrical circuits. There are already Process known in which an electrically conductive film is made on a carrier Insulating material is applied and the individual circuits from the conductive film be worked out by photo-technical means. Made by this process Circuits have a relatively small conductor cross-section and are therefore only suitable for the transmission of weak currents. Be according to the invention for the production of electrical circuits conductor tracks on a plate from electrical raised conductive material is worked out, then it is applied to the raised conductor tracks an insulating layer is applied and the electrically conductive plate is of their The base side is removed until the individual interconnects are electrically separated from each other are separated. In this way, circuits can be used for transmission at will great performances can be produced in a simple manner.

Anhand der Zeichnung wird das erfindungsgemäße Verfahren zur Herstellung von Schaltkreisen an Beispielen erläutert.The method according to the invention for production is illustrated with the aid of the drawing of circuits explained using examples.

Fig. 1a zeigt einen Schnitt einer elektrisch leitenden Platte 9, bei der Leitbahnen beispielsweise durch spanabhebende Bearbeitung herausgearbeitet worden sind. Dabei läßt sich beispielsweise bei Verwendung von Kopierfräsen eine beliebig große Anzahl untereinander gleicher Platten mit Erhebungen 2 bj.s 5 herstellen. vera,rtige P:_@f t ten können auch durch a dere bekannte :earbei tungsvrf°aren oder durch i7-5 eßen 'hergestellt werden. Zum Anschluß elektrischer Leiter an die Leiterbahnen können beispielsweise Anschlußbolzen 12 in die Erhebungen 2 bis 5 eingesetzt werden. Die Zwischenräume zwischen den einzelnen Erhebungen werden zweckmäßigerweise mit einer aushärtenden Isoliermasse 7 ausgegossen. Dann wird auf die erhaben herausgearbeiteten Leiterbahnen eine Isolierstoff schicht z.B. in Form einer Isolierplatte 6 aufgebracht (Fig. 1b). Diese Isolierstoffplatte 6 hat Öffnungen 13 für den Zugang der Anschlußbolzen 12.Fig. 1a shows a section of an electrically conductive plate 9, at the interconnects have been worked out, for example, by machining are. For example, when using copy milling, any one can be used Produce a large number of identical plates with elevations 2 yrs 5. Vera, rtige P: _ @ f t th can also be done by other known: processing requirements or produced by i7-5 eating ' will. For connecting electrical conductors For example, connecting bolts 12 can be attached to the conductor tracks in the elevations 2 up to 5 can be used. The spaces between the individual surveys are expediently filled with a hardening insulating compound 7. Then on the raised conductor tracks have an insulating material layer, e.g. in the form of a shape an insulating plate 6 applied (Fig. 1b). This insulating plate 6 has openings 13 for access to the connecting bolts 12.

Die mit einer Isolierstoffplatte 6 versehene Schaltkreisplatte wird von ihrer Grundseite her - beispielsweise durch Schleifensoweit abgetragen, bis die einzelnen Leiterbahnen 2 bis 5 der Schaltkreise voneinander getrennt sind (Fig. 1c). Nach dem Anschließen der elektrischen Zuleitungen 15 an die Anschlußbolzen 12 können die Öffnungen 13 mit Isoljxmasse 14 vergossen werden. Dadurch ergibt sich eine hohe mechanische Festigkeit der Schaltkreisplatte.The circuit board provided with an insulating material plate 6 is from their base - for example, removed by grinding until the individual conductor tracks 2 to 5 of the circuits are separated from each other (Fig. 1c). After connecting the electrical leads 15 to the connecting bolts 12, the openings 13 can be potted with insulating compound 14. This results in high mechanical strength of the circuit board.

Fig. 2a zeigt als weiteres Beispiel einen Schnitt einer elektrisch leitenden Platte 1, an der Schaltverbindungen durch Prägen herausgearbeitet worden sind.As a further example, FIG. 2a shows a section of an electrical conductive plate 1, on which circuit connections have been worked out by embossing are.

In Fig. 2b ist diese Platte nach dem Aufbringen einer Isolierschicht i gezeigt. Die Isolierschicht ist durch Vergießen der Teile 8 bis 11 mit einem aushärtenden Gießharz hergestellt. Durch das Vergießen wird zugleich mit einem Isolierstoffträger eine Isolierung zwischen den einzelnen Leiterbahnen der Schaltkreise erzeugt. Daher lassen sich die einzelnen Leiterbahnen der Schaltkreise sehr nahe aneinanderrücken, so daß ein sehr gedrängter Aufbau auf einfache Weise erreichbar ist. Nach dem Aushärten des Gießharzes wird die Schaltkreisplatte von ihrer Grundseite her soweit abgetragen, bis die einzelnen Leiter 8 bis 11 der Schaltkreise voneinander elektrisch getrennt sind (Fig.y)= Die elektrischen Zuleitungen können an beliebigen Stellen an den einzelnen Leiterbahnen 8 bis 11 angebracht werden.In Fig. 2b this plate is after the application of an insulating layer i shown. The insulating layer is made by potting the parts 8 to 11 with a hardening Cast resin made. By potting, an insulating material carrier is also used creates an insulation between the individual conductor tracks of the circuits. Therefore the individual conductor tracks of the circuits can be moved very close to one another, so that a very compact structure can be achieved in a simple manner. After hardening of the cast resin, the circuit board is removed from its base to the extent that until the individual conductors 8 to 11 of the circuits are electrically isolated from one another are (Fig.y) = The electrical leads can at any Places on the individual conductor tracks 8 to 11 are attached.

Zur Erzielung einer guten mechanischen Festigkeit der Schaltkreisplatte ist es ferner vorteilhaft, der Isoliermasse 7, 14 vor dem Aufbringen Trägerwerkstoffe, insbesondere Glasfasern, zuzusetzen.To achieve a good mechanical strength of the circuit board it is also advantageous to add carrier materials to the insulating compound 7, 14 before application, in particular glass fibers to be added.

Bei Schaltkreisen, die sich infolge hoher Belastungen erwärmen, ist es zweckmäßig, der Isoliermasse Stoffe mit guter Wärmeleitfähigkeit zuzusetzen.For circuits that heat up as a result of high loads, is It is advisable to add substances with good thermal conductivity to the insulating compound.

Die Vorteile des erfindungsgemäßen Verfahrens werden besonders deutlich, wenn es bei der Herstellung eines Schleifringüber--'U-ragers angewendet wird, bei dem die einzelnen Leiterbahnen als konzentrische Ringe 16 ausgebildet sind, da diese Ringe mit sehr großer Genauigkeit konzentrisch gehalten werden können (Figo 7,a,b). An den Stellen, an denen die Leiterbahnen 16 mit den AnschluBbolzen 12 verbunden werden, ist die IsOliErstoffplatte 6 mit einer Öffnung 13 versehen, die nach dem Herstellen der elektrischen Verbindung mit Isoliermasse 14 ausgegossen wird.The advantages of the method according to the invention are particularly clear, if it is used in the manufacture of a slip ring over- 'U-rager which the individual conductor tracks are designed as concentric rings 16, as these Rings can be kept concentric with great accuracy (Figo 7, a, b). At the points where the conductor tracks 16 are connected to the connecting bolts 12 are, the IsOliErstoffplatte 6 is provided with an opening 13, which after the Establishing the electrical connection with insulating compound 14 is poured out.

Claims (1)

Patentansprüche 1. Verfahren zum Herstellen elektrischer Schaltkreise, dadurch gekennzeichnet, daß an einer Platte aus elektrisch leitfähigem Material Leiterbahnen- erhaben herausgearbeitet werden, daß auf die erhabenen Leiterbahnen eine Isolierschicht aufgebracht wird und daß die elektrisch leitende Platte von ihrer Grundseite her soweit abgetragen wird, bis die einzelnen Leiterbahnen der Schaltkreise elektrisch ver..einander getrennt sind. 2. `verfahren nach l'inspruch i, dadurch gekennzeichnet, daß die Leiterbahnen durch spanabhebende Bearbeitung der Platte herausgearbeitet werden. 3. Verfahren nach Anspruch 1, dadurch gekennzeichnet, daß die Leiterbahnen durch Gießen einer Platte in einer Form erhaben herausgearbeitet werden. 4. Verfahren nach Ansy ruch 1, dadurch gekennzeichnet, daß die Leiterbahnen durch Prägen einer Platte erhaben herausgearbeitet werden. 5. Verfahren nach Anspruch 1, dadurch gekennzeichnet, daß die Isolierschicht durch Aufbringen einer Isolierplatte (6) auf die herausgearbeiteten Leiterbahnen hergestellt wird. 6. Verfahren nach Anspruch 5, dadurch gekennzeichnet, daß vor dem Aufbringen der Isolierplatte (6) die Zwischenräume zwischen den einzelnen Leiterbahnen mit einer aushärtenden Isoliermasse (7) ausgegossen werden. 7. Verfahren nach Anspruch 5, dadurch gekennzeichnet, daß vor dem Aufbringen der Isolierplatte (6) an den Leiterbahnen Anschlußbolzen (12) für elektrische Zeitungen angebracht werden, daß die Isolierplatte (6) mit einer oder mehreren Öffnungen (13) versehen wird in die die Anschlußbolzen (12) nach dem Aufbringen der Isolierstoffplatte (6) hineinragen, und daß die Öffnungen (13) nach dem Anschließen von elektrischen Zuleitungen (15) mit Isoliermasse (14) ausgegossen werden. B. Verfahren nach Anspruch 1, dadurch gekennzeichnet, daß die Isolierschicht durch Gießen mit einer aushärtenden Isoliermasse (7) hergestellt wird. 9. Verfahren nach Anspruch 6, 7 oder 8, dadurch gekennzeichnet, daß der Isoliermasse (7 und/oder 14) vor dem Aufbringen Trägerwerkstoffe zugesetzt-werden. 10. Verfahren nach Anspruch 9, dadurch gekennzeichnet, daß als Trägerwerkstoffe Glasfasern zugegeben werden. 11. Verfahren nach einem der Ansprüche 6 bis 9, dadurch gekennzeichnet, daß der Isoliermasse (7 und/oder 14) Stoffe mit guter Wärmeleitfähigkeit zugesetzt werden. 12. Nach dem Verfahren nach einem der vorhergehenden Ansprüche hergestellter Schleifringübertrager, bei dem die einzelnen Leiterbahnen als konzentrische Ringe (16) ausgebildet sind. Claims 1. A method for producing electrical circuits, characterized in that on a plate of electrically conductive material strip conductors are worked out raised, that an insulating layer is applied to the raised strip conductors and that the electrically conductive plate is removed from its base until the individual conductor tracks of the circuits are electrically ver..separated from one another. 2. `method according to claim i, characterized in that the conductor tracks are machined out by machining the plate. 3. The method according to claim 1, characterized in that the conductor tracks are carved out raised by casting a plate in a shape. 4. The method according to Ansy ruch 1, characterized in that the conductor tracks are raised by embossing a plate. 5. The method according to claim 1, characterized in that the insulating layer is produced by applying an insulating plate (6) to the worked out conductor tracks. 6. The method according to claim 5, characterized in that before the application of the insulating plate (6), the spaces between the individual conductor tracks are filled with a hardening insulating compound (7). 7. The method according to claim 5, characterized in that before the application of the insulating plate (6) on the conductor tracks connecting bolts (12) for electrical newspapers are attached, that the insulating plate (6) is provided with one or more openings (13) in the the connecting bolts (12) protrude after the insulating plate (6) has been applied, and that the openings (13) are filled with insulating compound (14) after electrical leads (15) have been connected. B. The method according to claim 1, characterized in that the insulating layer is produced by casting with a hardening insulating compound (7). 9. The method according to claim 6, 7 or 8, characterized in that the insulating compound (7 and / or 14) before application of carrier materials are added. 10. The method according to claim 9, characterized in that glass fibers are added as carrier materials. 11. The method according to any one of claims 6 to 9, characterized in that the insulating compound (7 and / or 14) substances with good thermal conductivity are added. 12. Slip ring transmitter produced by the method according to one of the preceding claims, in which the individual conductor tracks are designed as concentric rings (16).
DE19671665944 1967-05-13 1967-05-13 Process for making electrical circuits Pending DE1665944A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DES0109878 1967-05-13

Publications (1)

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DE1665944A1 true DE1665944A1 (en) 1971-04-08

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Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0626124A1 (en) * 1992-02-14 1994-11-30 Rock Ltd Partnership High density conductive networks and method and apparatus for making same
US5584120A (en) * 1992-02-14 1996-12-17 Research Organization For Circuit Knowledge Method of manufacturing printed circuits
EP0802711A2 (en) * 1996-04-19 1997-10-22 Matsushita Electric Industrial Co., Ltd. Wiring board and its manufacturing method
EP0836795A1 (en) * 1995-06-07 1998-04-22 The Dexter Corporation Method for making a debossed conductive film composite
EP0857010A1 (en) * 1997-01-31 1998-08-05 Mecanismos Auxiliares Industriales S.A. M.A.I.S.A. Manufacturing process for printed circuits
EP0923278A1 (en) * 1997-12-05 1999-06-16 Mecanismos Auxiliares Industriales S.A. M.A.I.S.A. Manufacturing process for printed circuits
US6182359B1 (en) 1997-01-31 2001-02-06 Lear Automotive Dearborn, Inc. Manufacturing process for printed circuits

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0626124A1 (en) * 1992-02-14 1994-11-30 Rock Ltd Partnership High density conductive networks and method and apparatus for making same
EP0626124A4 (en) * 1992-02-14 1995-11-15 Rock Lp High density conductive networks and method and apparatus for making same.
US5584120A (en) * 1992-02-14 1996-12-17 Research Organization For Circuit Knowledge Method of manufacturing printed circuits
EP0836795A1 (en) * 1995-06-07 1998-04-22 The Dexter Corporation Method for making a debossed conductive film composite
EP0836795A4 (en) * 1995-06-07 2000-05-10 Dexter Corp Method for making a debossed conductive film composite
EP0802711A2 (en) * 1996-04-19 1997-10-22 Matsushita Electric Industrial Co., Ltd. Wiring board and its manufacturing method
EP0802711A3 (en) * 1996-04-19 1999-08-18 Matsushita Electric Industrial Co., Ltd. Wiring board and its manufacturing method
EP0857010A1 (en) * 1997-01-31 1998-08-05 Mecanismos Auxiliares Industriales S.A. M.A.I.S.A. Manufacturing process for printed circuits
WO1998034444A1 (en) * 1997-01-31 1998-08-06 Ut Automotive Dearborn, Inc. A manufacturing process for printed circuits
US6182359B1 (en) 1997-01-31 2001-02-06 Lear Automotive Dearborn, Inc. Manufacturing process for printed circuits
EP0923278A1 (en) * 1997-12-05 1999-06-16 Mecanismos Auxiliares Industriales S.A. M.A.I.S.A. Manufacturing process for printed circuits

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