DE19525708C1 - Temporary tarnish protection for copper and copper alloys - Google Patents
Temporary tarnish protection for copper and copper alloysInfo
- Publication number
- DE19525708C1 DE19525708C1 DE1995125708 DE19525708A DE19525708C1 DE 19525708 C1 DE19525708 C1 DE 19525708C1 DE 1995125708 DE1995125708 DE 1995125708 DE 19525708 A DE19525708 A DE 19525708A DE 19525708 C1 DE19525708 C1 DE 19525708C1
- Authority
- DE
- Germany
- Prior art keywords
- copper
- temporary
- tarnish protection
- tarnish
- protection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
- H01L23/49586—Insulating layers on lead frames
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D133/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Coating compositions based on derivatives of such polymers
- C09D133/04—Homopolymers or copolymers of esters
- C09D133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/008—Temporary coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Description
Die Erfindung betrifft einen temporären Anlaufschutz für Ober flächen von Bauteilen, Gegenständen aus Kupfer und Kupferle gierungen, die vorwiegend in der Elektrotechnik verwendet werden.The invention relates to temporary tarnish protection for waiters surfaces of components, objects made of copper and copper Alloys that are mainly used in electrical engineering.
Die Oberflächen von Bauteilen und Gegenständen aus Kupfer und Kupferlegierungen laufen unter Einwirkung der Atmosphäre durch oxidative Prozesse sehr schnell an. Vor ihrer Weiterverarbeitung müssen die Oberflächen wieder gereinigt werden. Es werden daher üblicherweise Schutzfolien aufgeklebt oder Überzüge auf Basis von Lacken und Wachsen als Anlaufschutz verwendet. Solche bekannten Überzüge weisen jedoch eine geringere mechanische Stabilität auf und zu ihrer Entfernung sind organische Lösungsmittel und ggf. mechanische Reinigungsschritte erforderlich.The surfaces of components and objects made of copper and Copper alloys pass through under the influence of the atmosphere oxidative processes very quickly. Before further processing the surfaces must be cleaned again. It will therefore Usually, protective films are stuck on or coatings based on Paint and wax used as tarnish protection. Such well-known However, coatings have a lower mechanical stability and to remove them are organic solvents and possibly mechanical cleaning steps required.
Bekannt ist auch die Verwendung wiederentfernbarer Schutzüber züge auf Basis synthetischer Polymere für Eisenmetalle in Form von Automobilkarosserien, Maschinen bzw. Maschinenteilen und Werkzeugen. Die DE 31 51 372 A1 beschreibt für diese Zwecke wäßrige Emulsionen auf Basis von saure Gruppen enthaltenden Acrylpolymerisaten. Nachteilig wirkt sich bei der Anwendung solcher Emulsionen der hohe Anteil an nicht wäßrigen Bestand teilen und die Verwendung korrosiver Polymerisationshilfstoffe bei ihrer Herstellung aus.The use of removable protective covers is also known trains based on synthetic polymers for ferrous metals of automobile bodies, machines or machine parts and Tools. DE 31 51 372 A1 describes for these purposes aqueous emulsions based on acidic groups Acrylic polymers. The application has a disadvantageous effect such emulsions the high proportion of non-aqueous stock share and the use of corrosive polymerization aids in their manufacture.
Aus der EP 0311906 B1 sind wäßrige Polyacrylatdispersionen oder Polyacrylatemulsionen mit einem pH-Wert von 4-6 bekannt, deren Herstellung bedingt aufwendig ist. Die Dispersionen weisen eine Aktivsubstanz von 20% auf. Weiterhin sind aus der EP 0115694 A2 wäßrige Dispersionen von Acrylatcopolymeren bekannt die für eine temporären Schutz von beschichteten Metalloberflächen, von Glas u. a. Oberflächen vor mechanischen Beschädigungen während des Her stellungs- und Verarbeitungsprozesses geeignet sind. Diese Disper sionen erfordern bei Anwendung und auch bei ihrer Entfernung einen Zusatz von Alkoholen. Die Übertragung dieser bekannten technischen Lehren auf den erfindungsgemäßen Zweck ist nicht möglich.From EP 0311906 B1 are aqueous polyacrylate dispersions or Polyacrylate emulsions with a pH of 4-6 are known, the Manufacturing is time-consuming. The dispersions have a Active substance of 20%. Furthermore, EP 0115694 A2 aqueous dispersions of acrylate copolymers known for a temporary protection of coated metal surfaces, of glass u. a. Surfaces from mechanical damage during manufacture position and processing are suitable. This disper sions require use and removal an addition of alcohols. The transfer of this known technical lessons on the purpose of the invention is not possible.
Der vorliegenden Erfindung liegt die Aufgabe zugrunde, für Gegen stände aus Kupfer und dessen Legierungen einen temporären Anlauf schutz zu entwickeln, der nur dünne Schichten erfordert und nicht korrosiv wirkt.The present invention is based, for counter copper and its alloys a temporary tarnish to develop protection that only requires thin layers and not has a corrosive effect.
Die Aufgabe wird erfindungsgemäß dadurch gelöst, daß der tempo räre Anlaufschutz für Kupfer und dessen Legierungen aus 2 bis 20 µm dicke Schichten besteht, die mit Hilfe wäßriger Dispersionen von Acrylatcopolymeren der Molmasse von 50.000 bis 200.000 hergestellt werden. Der Aktivsubstanzgehalt der wäßrigen Disper sionen beträgt 2-10%. Sie enthalten keine Hydrophobiermittel.The object is achieved in that the tempo tarnish protection for copper and its alloys from 2 to 20 µm thick layers exist with the help of aqueous dispersions of acrylic copolymers with a molecular weight of 50,000 to 200,000 getting produced. The active substance content of the aqueous disper ion is 2-10%. They do not contain any water repellents.
Die Herstellung der Acrylatcopolymeren erfolgt durch Emulsions polymerisation in an sich bekannten Verfahren ohne Verwendung organischer Lösungsmittel. Es werden dabei Polymerisationshilfs stoffe verwendet, die nicht korrosiv wirken. In vorteilhafter Ausgestaltung der Erfindung können den wäßrigen Dispersionen korrosiosinhibierende Additive zugesetzt werden. Der Zusatz organischer Lösungsmittel, wie Alkohole, bei der Anwendung ist nicht erforderlich.The acrylate copolymers are produced by emulsions polymerization in processes known per se without use organic solvent. It will help polymerization substances that are not corrosive are used. In advantageous Embodiment of the invention can the aqueous dispersions Corrosive inhibiting additives are added. The addition organic solvents such as alcohols is in use not mandatory.
Der erfindungsgemäße temporäre Anlaufschutz wird vorzugsweise zum Schutz von Gegenständen bzw. Bauteilen der Elektrotechnik und Elektronik wie z. B. für Dehnungsbänder, Kontakte oder Leiterplat ten eingesetzt. Der temporäre Anlaufschutz kann in einfacher Wei se durch Behandeln mit lösungsmittelfreien wäßrigalkalischen Lösungen rückstandfrei wieder entfernt werden.The temporary tarnish protection according to the invention is preferably used for Protection of objects or components in electrical engineering and Electronics such as B. for expansion bands, contacts or printed circuit boards ten used. The temporary tarnish protection can be done in simple white se by treatment with solvent-free aqueous alkaline Solutions can be removed without leaving any residue.
Bei der Weiterverarbeitung von mit Anlaufschutz beschichteten Bauteilen durch Löten ist überraschenderweise keine vorhergehende Entfernung der Schutzschicht erforderlich.When processing coated with tarnish protection Components by soldering are surprisingly not a previous one Removal of the protective layer required.
Die Anwendung des erfindungsgemäßen Anlaufschutzes ist auch für Gebäudeverkleidungen, Schilder u.ä. aus Kupfer oder Kupferlegie rungen geeignet. The use of the tarnish protection according to the invention is also for Building cladding, signs, etc. made of copper or copper alloy suitable.
Durch die Erfindung werden folgende Vorteile erreicht: Bereits in dünnen Schichten wird ein witterungsbeständiger, aus reichend fester, temporärer Schutz ohne vorherige Beschichtung oder Lackierung der Oberflächen erzielt. Damit verbunden ist der geringe Verbrauch durch den niedrigen Aktivsubstanzgehalt der Dispersionen. Ein weiterer Vorteil ist die einfache rückstands freie, lösungsmittelfreie Entfernung des Anlaufschutzes. Nach Entfernung wurde kein erhöhter elektrischer Widerstand festge stellt. Vorteilhaft wirkt sich auch aus, daß bei Weiterbearbei tung durch Löten keine Entfernung des Anlaufschutzes erforderlich ist.The following advantages are achieved by the invention: Even in thin layers, it becomes weatherproof sufficiently firm, temporary protection without prior coating or painting the surfaces. Associated with that low consumption due to the low active substance content Dispersions. Another advantage is the simple residue free, solvent-free removal of the tarnish protection. After No increased electrical resistance was determined at distance poses. It also has an advantageous effect when further processing no need to remove the tarnish protection is.
Im folgenden wird die Erfindung anhand von Ausführungsbeispielen näher erläutert.In the following, the invention is illustrated by means of exemplary embodiments explained in more detail.
Eine erfindungsgemäße wäßrige Dispersion von Acrylatcopolymeren einer Molmasse von 100.000 mit einem Aktivsubstanzgehalt von 5% wurde auf Kupferblech der Abmessung 12×6 cm aufgetragen. Die Flächenbenetzung war gut. Die Kupferblechstreifen wurden mit ei nem Heißluftfön getrocknet. Die Schichtdicke des Trockenfilms betrug ca. 5 µm. Im Ergebnis wurde ein fester, wasserbeständiger Anlaufschutz erzielt. Die damit beschichteten Kupferbleche zeig ten auch nach Ablauf von 2 Monaten keine Anlauferscheinungen. Der Schutzfilm eines beschichteten Kupferbleches wurde durch eine 1% Sodalösung, der 0,5% Tenside und bis 1% übliche Korrosionsinhi bitoren zugesetzt wurden, rückstandsfrei in kurzer Zeit entfernt.An aqueous dispersion of acrylate copolymers according to the invention a molecular weight of 100,000 with an active substance content of 5% was applied to copper sheet measuring 12 × 6 cm. The Surface wetting was good. The copper sheet strips were covered with egg dried with a hot air dryer. The layer thickness of the dry film was approximately 5 µm. As a result, it became stronger, water-resistant Tarnish protection achieved. The copper sheets coated with it show no start-up symptoms even after 2 months. Of the Protective film of a coated copper sheet was covered by a 1% Soda solution, the 0.5% surfactants and up to 1% usual corrosion inhibitor bitters were added, removed without residue in a short time.
Auf die Kontakte von zwei Leiterplatten wurde eine erfindungsge mäße wäßrige Dispersion mit 5% Aktivsubstanzgehalt aufgetragen. Die Schichtdicke nach dem Trocknen betrug 5 bis 10 µm. On the contacts of two circuit boards was a fiction moderate aqueous dispersion with 5% active substance content applied. The layer thickness after drying was 5 to 10 µm.
Von einer Leiterplatte wurde nach 20 Tagen der Anlaufschutz gem. Beispiel 1 entfernt und Anschlüsse gelötet.The tarnish protection was removed from a printed circuit board after 20 days. Example 1 removed and connections soldered.
An der zweiten Leiterplatte wurden ebenfalls Anschlüsse, ohne Entfernung des Anlaufschutzes, gelötet.Connections were also made to the second circuit board without Removal of the tarnish protection, soldered.
In beiden Fällen wurde an den Kontakten kein erhöhter elektri scher Widerstand gemessen.In both cases there was no increased electri at the contacts measured resistance.
Claims (3)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE1995125708 DE19525708C1 (en) | 1995-07-14 | 1995-07-14 | Temporary tarnish protection for copper and copper alloys |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE1995125708 DE19525708C1 (en) | 1995-07-14 | 1995-07-14 | Temporary tarnish protection for copper and copper alloys |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE19525708C1 true DE19525708C1 (en) | 1997-01-30 |
Family
ID=7766840
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE1995125708 Expired - Fee Related DE19525708C1 (en) | 1995-07-14 | 1995-07-14 | Temporary tarnish protection for copper and copper alloys |
Country Status (1)
| Country | Link |
|---|---|
| DE (1) | DE19525708C1 (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19652728A1 (en) * | 1995-12-23 | 1997-06-26 | Volkswagen Ag | Application of peelable protective film to lacquered vehicle bodywork |
| WO2004021436A1 (en) * | 2002-08-29 | 2004-03-11 | Freescale Semiconductor, Inc. | A packaged semiconductor with coated leads and method therefore |
| EP1615484A1 (en) * | 2004-06-23 | 2006-01-11 | Ormecon GmbH | Article with a coating of an electrically conductive polymer and process for making it |
| US7547479B2 (en) | 2004-06-25 | 2009-06-16 | Ormecon Gmbh | Tin-coated printed circuit boards with low tendency to whisker formation |
| US7989533B2 (en) | 2005-08-19 | 2011-08-02 | Ormecon Gmbh | Chemical compound comprising an indium-containing intrinsically conductive polymer |
| US8153271B2 (en) | 2006-09-13 | 2012-04-10 | Ormecon Gmbh | Article with a coating of electrically conductive polymer and precious/semiprecious metal and process for production thereof |
| US8344062B2 (en) | 2004-01-23 | 2013-01-01 | Ormecon Gmbh | Dispersions of intrinsically conductive polymers |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0115694A2 (en) * | 1983-01-12 | 1984-08-15 | Imperial Chemical Industries Plc | Compositions for producing on a substrate a temporary protective coating subsequently removable with aqueous alkali |
-
1995
- 1995-07-14 DE DE1995125708 patent/DE19525708C1/en not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0115694A2 (en) * | 1983-01-12 | 1984-08-15 | Imperial Chemical Industries Plc | Compositions for producing on a substrate a temporary protective coating subsequently removable with aqueous alkali |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19652728A1 (en) * | 1995-12-23 | 1997-06-26 | Volkswagen Ag | Application of peelable protective film to lacquered vehicle bodywork |
| WO2004021436A1 (en) * | 2002-08-29 | 2004-03-11 | Freescale Semiconductor, Inc. | A packaged semiconductor with coated leads and method therefore |
| US7105383B2 (en) | 2002-08-29 | 2006-09-12 | Freescale Semiconductor, Inc. | Packaged semiconductor with coated leads and method therefore |
| US8344062B2 (en) | 2004-01-23 | 2013-01-01 | Ormecon Gmbh | Dispersions of intrinsically conductive polymers |
| EP1615484A1 (en) * | 2004-06-23 | 2006-01-11 | Ormecon GmbH | Article with a coating of an electrically conductive polymer and process for making it |
| US7547479B2 (en) | 2004-06-25 | 2009-06-16 | Ormecon Gmbh | Tin-coated printed circuit boards with low tendency to whisker formation |
| US7989533B2 (en) | 2005-08-19 | 2011-08-02 | Ormecon Gmbh | Chemical compound comprising an indium-containing intrinsically conductive polymer |
| US8153271B2 (en) | 2006-09-13 | 2012-04-10 | Ormecon Gmbh | Article with a coating of electrically conductive polymer and precious/semiprecious metal and process for production thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 8100 | Publication of the examined application without publication of unexamined application | ||
| D1 | Grant (no unexamined application published) patent law 81 | ||
| 8364 | No opposition during term of opposition | ||
| 8320 | Willingness to grant licenses declared (paragraph 23) | ||
| 8339 | Ceased/non-payment of the annual fee |