DE19820234A1 - Arrangement for transferring signals between a component of a portable data medium and a lead permanently associated with the component can be produced with a further simplified process - Google Patents
Arrangement for transferring signals between a component of a portable data medium and a lead permanently associated with the component can be produced with a further simplified processInfo
- Publication number
- DE19820234A1 DE19820234A1 DE1998120234 DE19820234A DE19820234A1 DE 19820234 A1 DE19820234 A1 DE 19820234A1 DE 1998120234 DE1998120234 DE 1998120234 DE 19820234 A DE19820234 A DE 19820234A DE 19820234 A1 DE19820234 A1 DE 19820234A1
- Authority
- DE
- Germany
- Prior art keywords
- coil
- component
- arrangement according
- coupling coil
- arrangement
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
- G06K19/07756—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna the connection being non-galvanic, e.g. capacitive
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07773—Antenna details
- G06K19/07777—Antenna details the antenna being of the inductive type
- G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07773—Antenna details
- G06K19/07777—Antenna details the antenna being of the inductive type
- G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
- G06K19/07783—Antenna details the antenna being of the inductive type the inductive antenna being a coil the coil being planar
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07773—Antenna details
- G06K19/07777—Antenna details the antenna being of the inductive type
- G06K19/07784—Antenna details the antenna being of the inductive type the inductive antenna consisting of a plurality of coils stacked on top of one another
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K7/00—Methods or arrangements for sensing record carriers, e.g. for reading patterns
- G06K7/10—Methods or arrangements for sensing record carriers, e.g. for reading patterns by electromagnetic radiation, e.g. optical sensing; by corpuscular radiation
- G06K7/10009—Methods or arrangements for sensing record carriers, e.g. for reading patterns by electromagnetic radiation, e.g. optical sensing; by corpuscular radiation sensing by radiation using wavelengths larger than 0.1 mm, e.g. radio-waves or microwaves
- G06K7/10158—Methods or arrangements for sensing record carriers, e.g. for reading patterns by electromagnetic radiation, e.g. optical sensing; by corpuscular radiation sensing by radiation using wavelengths larger than 0.1 mm, e.g. radio-waves or microwaves methods and means used by the interrogation device for reliably powering the wireless record carriers using an electromagnetic interrogation field
- G06K7/10178—Methods or arrangements for sensing record carriers, e.g. for reading patterns by electromagnetic radiation, e.g. optical sensing; by corpuscular radiation sensing by radiation using wavelengths larger than 0.1 mm, e.g. radio-waves or microwaves methods and means used by the interrogation device for reliably powering the wireless record carriers using an electromagnetic interrogation field including auxiliary means for focusing, repeating or boosting the electromagnetic interrogation field
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/0239—Signal transmission by AC coupling
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
Abstract
Description
Die Erfindung geht aus von einer Anordnung nach der Gattung des Hauptanspruchs. Eine Anordnung dieser Art ist aus der DE 44 16 697 A1 bekannt. Darin ist ein Datenträger beschrieben, der aus einem Kartenkörper, auf dessen Oberfläche sich eine Spule befindet, sowie einem einen integrier ten Schaltkreis beinhaltenden Modul, das elektrisch an die Spule angeschlos sen ist, besteht. Kartenkörper mit Spule und Modul werden in einem übli chen Laminierprozeß zu einem mehrschichtig aufgebauten Datenträger zu sammengefügt. Spulenanschlüsse und Kontaktelemente des Moduls liegen sich dabei gegenüber. Mittels eines elektrisch leitenden Klebers werden sie elektrisch verbunden. Der vorgeschlagene Aufbau eines Datenträgers gestat tet eine getrennte Fertigung von Modul und Kartenkörper mit Spule, wo durch besonders die Fertigung der Spule erleichtert wird. Trotz dieser Er leichterung wird die Fertigungstechnologie zur Herstellung von Datenträ gern mit dem vorgeschlagenen Aufbau maßgeblich durch die Verbindung zwischen Spule und Modul bestimmt. So durchlaufen die Module den ge samten Laminierprozeß, dessen Schritte so zu gestalten sind, daß es nicht zu einer Beschädigung des integrierten Schaltkreises kommen kann. Weiter sind die Laminierprozeßschritte so zu gestalten, daß die leitende Verbindung zwischen Spulenanschlüssen und Kontaktelementen des Modules nicht be einträchtigt wird.The invention is based on an arrangement according to the genus Main claim. An arrangement of this type is known from DE 44 16 697 A1 known. It describes a data carrier that consists of a card body, on the surface of which there is a coil and an integrator th circuit containing module that is electrically connected to the coil sen exists. Card body with coil and module are in one übli Chen laminating process to a multi-layer data carrier put together. Coil connections and contact elements of the module are located towards each other. They are made using an electrically conductive adhesive electrically connected. The proposed structure of a data carrier allows tet a separate production of module and card body with coil, where is made particularly easy by the manufacture of the coil. Despite this he The manufacturing technology for the production of data media will be easier happy with the proposed structure significantly through the connection determined between coil and module. So the modules go through the ge entire laminating process, the steps of which must be designed so that it is not too damage to the integrated circuit. Are further to design the lamination process steps so that the conductive connection between coil connections and contact elements of the module is impaired.
Der Erfindung liegt vor diesem Hintergrund die Aufgabe zugrunde, eine insbesondere für einen Datenträger mit Spule und integriertem Schaltkreis geeignete Signalübertragungsanordnung anzugeben, die eine weiter verein fachte Fertigung zuläßt. Against this background, the invention is based on the object of a especially for a data carrier with a coil and an integrated circuit specify suitable signal transmission arrangement that further unite fold manufacturing permits.
Diese Aufgabe wird gelöst durch eine Anordnung mit dem Merkmalen des Hauptanspruchs. Wesentlicher Vorteil der Erfindung ist die Bereitstellung einer berührungslosen Verbindung zwischen einer mit den Spulenenden verbundenen Zuleitung und einem Bauelement. Die Notwendigkeit zur Verwendung eines elektrisch leitenden Klebers und damit der zugehörige Fertigungsschritt sowie das Risiko einer fehlerhaften elektrischen Verbin dung entfallen vollständig. In vorteilhafter Weise kann der integrierte Schaltkreis in einem späten Arbeitsschritt in einen im wesentlichen fertigen Kartenkörper implantiert und muß nicht dem kompletten Laminierprozeß unterworfen werden. Das Bauelement kann unabhängig von der Spulenher stellung gefertigt werden. Vorteilhaft kann dabei die dem Bauelement zuge ordnete Gegenspule monolithisch in das Bauelement integriert sein. Die Möglichkeit, die Spule separat herzustellen, erlaubt die Nutzung aller be kannten Techniken. So kann die Spule in einer Schicht eines mehrschichtig aufgebauten Datenträgers ausgeführt sein. Sie kann drahtgewickelt, als elek trisch leitende Schicht durch Siebdruck, aus einer Metallfolie gestanzt oder aus einer leitend beschichteten Folie geätzt und anschließend aufgeklebt sein. Genauso möglich ist, die Spule als elektrisch leitende Schicht in einem Heißprägeverfahren einzuprägen. Bei Nutzung der erfindungsgemäßen Übertragungsanordnung in Chipkarten können zu deren Herstellung vor handene Anlagen eingesetzt werden, die lediglich in einem vorgesehenen Rahmen modifiziert werden müssen. Alle üblichen Kartenarchitekturen las sen sich grundsätzlich unverändert beibehalten.This object is achieved by an arrangement with the features of Main claim. The essential advantage of the invention is the provision a non-contact connection between one with the coil ends connected supply line and a component. The need for Use of an electrically conductive adhesive and thus the associated one Manufacturing step and the risk of a faulty electrical connection are completely eliminated. The integrated can advantageously Circuit into a substantially finished in a late step Card body implanted and does not have to go through the entire laminating process be subjected. The component can be independent of the coil position. It can be advantageous to the component ordered counter coil can be monolithically integrated into the component. The Possibility to manufacture the coil separately allows the use of all be knew techniques. So the coil can be multi-layered in one layer constructed data carrier to be executed. It can be wire-wound as an elec tric conductive layer by screen printing, punched out of a metal foil or etched from a conductive coated film and then glued on be. It is equally possible to use the coil as an electrically conductive layer in one To emboss hot stamping process. When using the invention Transmission arrangement in chip cards can be used to manufacture them existing systems are used, which are only provided in a Frames need to be modified. Read all the usual map architectures fundamentally remain unchanged.
Vorteilhafte Weiterbildungen und zweckmäßige Ausgestaltungen der erfin dungsgemäßen Anordnung ergeben sich mit den Merkmalen der Unteran sprüche. So eignet sich die erfindungsgemäße Anordnung besonders für Da tenträger, die einen berührungslosen Datenaustausch mit einer Bezugsstati on führen und dazu eine Antenne in Form einer Spule aufweisen. Eine sol che Antennenspule läßt sich vorteilhaft auf einem gemeinsamen Substrat um die Koppelspule herum ausbilden. Beide Spulen können dann fertigungs günstig in einem Arbeitsschritt vorzugsweise gedruckt werden. Besonders geeignet ist die erfindungsgemäße Anordnung für kontaktlose IC-Karten.Advantageous further developments and practical refinements of the inventions arrangement according to the invention arise with the features of the Unteran claims. The arrangement according to the invention is particularly suitable for Da tträger that a contactless data exchange with a reference status lead on and have an antenna in the form of a coil. A sol che antenna coil can be advantageously on a common substrate train the coupling coil around. Both coils can then be manufactured be printed favorably in one work step. Especially the arrangement according to the invention is suitable for contactless IC cards.
Ein Ausführungsbeispiel der Erfindung wird nachfolgend unter Bezugnah me auf die Zeichnung näher erläutert. Es zeigen:An embodiment of the invention is below with reference me explained in more detail on the drawing. Show it:
Fig. 1 einen Datenträger mit Koppel- und Außenspule, Fig. 1 shows a data carrier with coupling and outer coil,
Fig. 2 einen Schnitt durch den in Fig. 1 gezeigten Datenträger. Fig. 2 shows a section through the data carrier shown in Fig. 1.
Fig. 1 zeigt einen Datenträger mit einem flächigen Substrat 10 und einem auf dessen, hier willkürlich als Oberseite 11 bezeichnete, Oberfläche aufzubrin genden Bauelement 12. Bei dem Substrat 10 kann es sich insbesondere um den Kartenkörper einer Chipkarte handeln, das Bauelement 12 ist dann ent sprechend ein integrierter Schaltkreis. Die vorgeschlagene Übertragungsan ordnung ist allerdings nicht auf Chipkarten beschränkt, sondern eignet sich für beliebige Schaltungsanordnungen, in denen Signale zwischen einer Zu leitung und einem Bauelement über eine kurze Entfernung zu übertragen sind. Fig. 1 shows a data carrier with a flat substrate 10 and a component to be applied to its surface 12 , which is here arbitrarily referred to as the top 11 . The substrate 10 can in particular be the card body of a chip card, the component 12 is then an integrated circuit accordingly. However, the proposed transmission arrangement is not limited to chip cards, but is suitable for any circuit arrangement in which signals are to be transmitted between a line and a component over a short distance.
Auf der Oberseite 11 des Substrates 10 befindet sich eine Zuleitung 15 in Form einer Leiterbahn. Sie ist, angepaßt an die hier zugrundegelegte Chip kartenanwendung als Flachbahn ausgebildet und vorzugsweise aufgedruckt. Die Zuleitung 15 verläuft zum einen in mehrfachen parallelen Windungen entlang den Kanten des Substrats 10 und bildet damit eine als Antenne wir kende Außenspule 18. In dem von der Außenspule 18 umschlossenen Innen raum auf der Oberseite 11 des Substrates 10 bildet die Zuleitung 15 weiter hin eine gegenüber der Außenspule 18 flächenkleinere Koppelspule 16 mit mehreren Windungen.On the top 11 of the substrate 10 there is a feed line 15 in the form of a conductor track. It is adapted to the underlying chip card application designed as a flat web and preferably printed. The supply line 15 runs on the one hand in multiple parallel turns along the edges of the substrate 10 and thus forms an outer coil 18 which acts as an antenna. In the inner space enclosed by the outer coil 18 on the upper side 11 of the substrate 10 , the feed line 15 further forms a coupling coil 16 with a smaller area than the outer coil 18 with a plurality of turns.
Zur Realisierung der in Fig. 1 gezeigten Struktur mit den beiden ineinander ausgebildeten Spulen 16, 18 ist es erforderlich, daß die Zuleitung 15 sich selbst kreuzt. Im Beispiel der Fig. 1 finden sich solche Zuleitungskreuzungen bei der Verbindung des innenliegenden Spulenendes der Koppelspule 16 mit dem außenliegenden Ende der Außenspule 16. Die Realisierung der Zulei tungskreuzungen kann, wie aus Fig. 2 ersichtlich, mit Hilfe von Durchkon taktierungen 19 erfolgen. Sie sind jeweils unter den Spulenenden in das Substrat 10 eingebracht und verbinden die oberseitige Zuleitung 15 elek trisch mit einem auf der Unterseite des Substrates 10 angebrachten Querung selement 14. Selbstverständlich können die Zuleitungskreuzungen auch an ders realisiert sein, beispielsweise unter Weglassung der Durchkontaktie rungen 19 mittels galvanischer Kopplung oder durch direktes Übereinan deraufbringen der sich kreuzenden Zuleitungselemente unter Zwischenlage geeigneter Isolierungen.To implement the structure shown in FIG. 1 with the two coils 16 , 18 formed one inside the other, it is necessary for the feed line 15 to cross itself. In the example in FIG. 1, such feed crossings are found when the inner coil end of the coupling coil 16 is connected to the outer end of the outer coil 16 . The realization of the supply intersections can, as can be seen from FIG. 2, be carried out with the help of through contacts 19 . They are each inserted under the coil ends in the substrate 10 and connect the upper supply line 15 elec trically with an attached to the underside of the substrate 10 crossing element 14th Of course, the supply crossings can also be realized on other things, for example by omitting the plated-through holes 19 by means of galvanic coupling or by directly overlapping the crossing supply elements with the interposition of suitable insulation.
Zur Übernahme bzw. Entgegennahme von über die Zuleitung 15 übertragen nen Signalen ist weiter dem Bauelement 12 eine Gegenspule 20 zugeordnet. Zweckmäßig befindet sie sich unmittelbar am Bauelement 12. Ist das Bau element 12 ein als Chip ausgeführter integrierter Schaltkreis, ist die Gegen spule 20 vorteilhaft, wie in Fig. 2 angedeutet, monolithisch in den Chip inte griert. Die Gegenspule 20 ist auf die Koppelspule 16 abgestimmt und ent spricht jener zumindest näherungsweise in Größe und Windungszahl.A counter coil 20 is also assigned to the component 12 in order to accept or receive signals transmitted via the lead 15 . It is expediently located directly on the component 12 . If the construction element 12 is an integrated circuit designed as a chip, the counter coil 20 is advantageous, as indicated in FIG. 2, monolithically integrated in the chip. The counter coil 20 is matched to the coupling coil 16 and speaks accordingly at least approximately in size and number of turns.
Fig. 2 zeigt eine zur Durchführung einer Signalübertragung zwischen Zulei tung 15 und Bauelement 12 geeignete Zuordnung von Bauelement 12 und Zuleitung 15. Die dem Bauelement 12 zugeordnete Gegenspule 20 befindet sich dabei genau über der aus der Zuleitung 15 herausgebildeten Koppelspu le 16. Die beiden Spulen 16, 20 können unmittelbar aufeinanderliegen. Übli cherweise sind beide aber, wie in Fig. 2 angedeutet, durch eine Zwischen schicht 13 getrennt. Die Zwischenschicht 13 fungiert dabei als Schutz- und Strukturschicht, welche die auf das Substrat 10 aufgebrachte Zuleitung überdeckt und eine glatte Oberfläche erzeugt. Sie kann desweiteren als Ein bauhilfe und zur Fixierung des Bauelementes 12 ausgebildet sein, indem sie das Bauelement 12, wie durch die strichlierte Linie angedeutet, seitlich um gibt und an dessen Einbauort eine seiner Größe entsprechende Ausnehmung aufweist. Zum Schutz der dem Bauelement 12 zugeordneten Gegenspule 20 kann diese an der dem Substrat 10 zugewandten Seite ebenfalls durch eine Schutzschicht 22 überdeckt sein. Fig. 2 shows a suitable for performing a signal transmission between Zulei device 15 and component 12 assignment of component 12 and lead 15th The counter coil 20 assigned to the component 12 is located exactly above the coupling coil 16 formed from the supply line 15 . The two coils 16 , 20 can lie directly on top of one another. Übli chich are both, as indicated in Fig. 2, separated by an intermediate layer 13 . The intermediate layer 13 functions as a protective and structural layer, which covers the feed line applied to the substrate 10 and produces a smooth surface. It can also be designed as a construction aid and for fixing the component 12 by the component 12 , as indicated by the dashed line, around the side and at its installation location has a recess corresponding to its size. To protect the counter coil 20 associated with the component 12 , it can also be covered by a protective layer 22 on the side facing the substrate 10 .
Die in den Fig. 1 und 2 beispielhaft zugrundegelegte Ausführungsanord nung entspricht einer kontaktlosen IC-Karte. In diesem Fall bildet die Au ßenspule 18 eine Antenne zum beruhigungslosen Austausch von Signalen mit einer Bezugseinheit, etwa einem Terminal. Der größte mögliche Abstand, über den ein Signalaustausch möglich ist, hängt dabei unter anderem von der Zahl der Spulenwindungen und dem Spulendurchmesser ab. Typi scherweise liegt er im Bereich mehrerer Zentimeter. In der Außenspule 18 vorhandene Signale liegen gleichzeitig auch in der damit verbundenen Kop pelspule 16 an. Durch transformatorische Wechselwirkung zwischen Kop pelspule 16 und der dem Bauelement 12 zugeordneten Gegenspule 20 wer den in der Koppelspule 16 anliegende Signale in die Gegenspule 20 übertra gen. Analog übertragen sich in der Gegenspule 20 anliegende Signale in um gekehrter Richtung in die Koppelspule 16 und damit in die Außenspule 18. Entsprechend ihrer kleineren Bauform liegt die Übertragungsreichweite zwi schen Koppelspule 16 und Gegenspule 20 im Millimeterbereich. An diese Signalübertragungsreichweite ist die Gesamtdicke von Zwischenschicht 13 und/oder Schutzschicht 22 anzupassen.The example in Fig. 1 and 2 exemplary embodiment corresponds to a contactless IC card. In this case, the outer coil 18 forms an antenna for the smooth exchange of signals with a reference unit, such as a terminal. The largest possible distance over which signal exchange is possible depends, among other things, on the number of coil turns and the coil diameter. Typically, it is in the range of several centimeters. In the outer coil 18 existing signals are also present in the associated pel coil 16 . By transformer interaction between Kop pelspule 16 and the component 12 associated counter coil 20 who the fitting in the coupling coil 16 signals transmitted in the opposite coil 20 übertra gen. Analogously, in the opposite coil 20 signals present in order to reverse direction in the coupling coil 16 and thus in the outer coil 18 . According to their smaller design, the transmission range between coupling coil 16 and counter coil 20 is in the millimeter range. The total thickness of intermediate layer 13 and / or protective layer 22 must be adapted to this signal transmission range.
Die vorgeschlagene Übertragungsanordnung ist nicht auf kontaktlose Chip karten beschränkt. Sie eignet sich ebenso für kontaktbehaftete Chipkarten. Anstelle der Außenspule 18 tritt dann eine Kontaktflächengruppe. Darüber hinaus eignet sich die vorgeschlagene Übertragungsanordnung aber ganz allgemein zur Realisierung von Signalübertragungen in allen elektronischen Schaltungen, bei denen ein Wechselfeldsignal von einer Zuleitung, die auch ein Bauelement sein kann, an ein eng benachbart angeordnetes Bauelement, das auch eine Zuleitung sein kann, übertragen werden soll.The proposed transmission arrangement is not limited to contactless chip cards. It is also suitable for contact-based chip cards. A contact surface group then takes the place of the outer coil 18 . In addition, the proposed transmission arrangement is generally suitable for implementing signal transmissions in all electronic circuits in which an alternating field signal is transmitted from a feed line, which can also be a component, to a component which is arranged in close proximity and which can also be a feed line should.
Claims (11)
- - die Zuleitung (15) mit einer Koppelspule (16) verbunden ist,
- - dem Bauelement (12) eine Gegenspule (20) zugeordnet ist, die in Flä che und Windungszahl näherungsweise der Koppelspule (16) ent spricht, und
- - die Koppelspule (16) und die Gegenspule (20) einander in so gerin gem Abstand gegenüberliegend angeordnet sind, daß sie induktiv zu sammenwirken.
- - The feed line ( 15 ) is connected to a coupling coil ( 16 ),
- - The component ( 12 ) is assigned a counter coil ( 20 ) which speaks approximately in area and number of turns of the coupling coil ( 16 ), and
- - The coupling coil ( 16 ) and the opposing coil ( 20 ) are arranged opposite one another at such a small distance that they interact inductively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE1998120234 DE19820234A1 (en) | 1998-05-06 | 1998-05-06 | Arrangement for transferring signals between a component of a portable data medium and a lead permanently associated with the component can be produced with a further simplified process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE1998120234 DE19820234A1 (en) | 1998-05-06 | 1998-05-06 | Arrangement for transferring signals between a component of a portable data medium and a lead permanently associated with the component can be produced with a further simplified process |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE19820234A1 true DE19820234A1 (en) | 1999-11-11 |
Family
ID=7866856
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE1998120234 Withdrawn DE19820234A1 (en) | 1998-05-06 | 1998-05-06 | Arrangement for transferring signals between a component of a portable data medium and a lead permanently associated with the component can be produced with a further simplified process |
Country Status (1)
| Country | Link |
|---|---|
| DE (1) | DE19820234A1 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10150194A1 (en) * | 2001-10-12 | 2003-04-17 | Morpho Cards Gmbh | Chip card with body integrating conductive track, includes positional coding over sections of its length, within the body of the card |
| FR2908207A1 (en) * | 2006-11-03 | 2008-05-09 | Oberthur Card Syst Sa | MICROCIRCUIT CARD, PARTICULARLY OF REDUCED DIMENSION, PROVIDED WITH AN ANTENNA |
| WO2009030325A1 (en) * | 2007-09-04 | 2009-03-12 | Bielomatik Leuze Gmbh + Co. Kg | Method and device for producing an rfid label |
| US7926728B2 (en) | 2007-10-31 | 2011-04-19 | Infineon Technologies Ag | Integrated circuit device including a contactless integrated circuit inlay |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3721822C1 (en) * | 1987-07-02 | 1988-11-10 | Philips Patentverwaltung | Chip card |
| US5532667A (en) * | 1992-07-31 | 1996-07-02 | Hughes Aircraft Company | Low-temperature-cofired-ceramic (LTCC) tape structures including cofired ferromagnetic elements, drop-in components and multi-layer transformer |
| WO1996035190A1 (en) * | 1995-05-03 | 1996-11-07 | Siemens Aktiengesellschaft | Contactless smart card |
| DE19604774A1 (en) * | 1996-02-09 | 1997-08-14 | Siemens Ag | Plastics carrier with an induction coil |
| DE19645067A1 (en) * | 1996-10-09 | 1998-05-07 | Pav Card Gmbh | Method and connection arrangement for producing a chip card |
-
1998
- 1998-05-06 DE DE1998120234 patent/DE19820234A1/en not_active Withdrawn
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3721822C1 (en) * | 1987-07-02 | 1988-11-10 | Philips Patentverwaltung | Chip card |
| US5532667A (en) * | 1992-07-31 | 1996-07-02 | Hughes Aircraft Company | Low-temperature-cofired-ceramic (LTCC) tape structures including cofired ferromagnetic elements, drop-in components and multi-layer transformer |
| WO1996035190A1 (en) * | 1995-05-03 | 1996-11-07 | Siemens Aktiengesellschaft | Contactless smart card |
| DE19604774A1 (en) * | 1996-02-09 | 1997-08-14 | Siemens Ag | Plastics carrier with an induction coil |
| DE19645067A1 (en) * | 1996-10-09 | 1998-05-07 | Pav Card Gmbh | Method and connection arrangement for producing a chip card |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10150194A1 (en) * | 2001-10-12 | 2003-04-17 | Morpho Cards Gmbh | Chip card with body integrating conductive track, includes positional coding over sections of its length, within the body of the card |
| DE10150194B4 (en) * | 2001-10-12 | 2013-08-22 | Morpho Cards Gmbh | smart card |
| FR2908207A1 (en) * | 2006-11-03 | 2008-05-09 | Oberthur Card Syst Sa | MICROCIRCUIT CARD, PARTICULARLY OF REDUCED DIMENSION, PROVIDED WITH AN ANTENNA |
| WO2008059138A2 (en) * | 2006-11-03 | 2008-05-22 | Oberthur Technologies | Microcircuit card with antenna, particularly having small dimensions |
| WO2008059138A3 (en) * | 2006-11-03 | 2008-10-02 | Oberthur Technologies | Microcircuit card with antenna, particularly having small dimensions |
| WO2009030325A1 (en) * | 2007-09-04 | 2009-03-12 | Bielomatik Leuze Gmbh + Co. Kg | Method and device for producing an rfid label |
| US8368538B2 (en) | 2007-09-04 | 2013-02-05 | Bielomatik Leuze Gmbh + Co.Kg | Method of making an RFID label |
| US7926728B2 (en) | 2007-10-31 | 2011-04-19 | Infineon Technologies Ag | Integrated circuit device including a contactless integrated circuit inlay |
| DE102008051948B4 (en) * | 2007-10-31 | 2020-08-20 | Infineon Technologies Ag | Integrated circuit component comprising a contactless integrated circuit insert |
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