DE19882885T1 - Testsystem mit mechanischer Ausrichtung für halbleiterchipgroße Verpackungen und Chips - Google Patents

Testsystem mit mechanischer Ausrichtung für halbleiterchipgroße Verpackungen und Chips

Info

Publication number
DE19882885T1
DE19882885T1 DE19882885T DE19882885T DE19882885T1 DE 19882885 T1 DE19882885 T1 DE 19882885T1 DE 19882885 T DE19882885 T DE 19882885T DE 19882885 T DE19882885 T DE 19882885T DE 19882885 T1 DE19882885 T1 DE 19882885T1
Authority
DE
Germany
Prior art keywords
chips
packaging
size
semiconductor chip
test system
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
DE19882885T
Other languages
English (en)
Inventor
Salman Akram
Warren M Farnworth
David A Hembree
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Micron Technology Inc
Original Assignee
Micron Technology Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Micron Technology Inc filed Critical Micron Technology Inc
Publication of DE19882885T1 publication Critical patent/DE19882885T1/de
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
DE19882885T 1997-12-11 1998-12-04 Testsystem mit mechanischer Ausrichtung für halbleiterchipgroße Verpackungen und Chips Ceased DE19882885T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/988,433 US6018249A (en) 1997-12-11 1997-12-11 Test system with mechanical alignment for semiconductor chip scale packages and dice
PCT/US1998/025804 WO1999030174A1 (en) 1997-12-11 1998-12-04 Test system with mechanical alignment for semiconductor chip scale packages and dice

Publications (1)

Publication Number Publication Date
DE19882885T1 true DE19882885T1 (de) 2000-11-30

Family

ID=25534115

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19882885T Ceased DE19882885T1 (de) 1997-12-11 1998-12-04 Testsystem mit mechanischer Ausrichtung für halbleiterchipgroße Verpackungen und Chips

Country Status (6)

Country Link
US (3) US6018249A (de)
JP (1) JP2001526395A (de)
KR (2) KR100396723B1 (de)
AU (1) AU1711299A (de)
DE (1) DE19882885T1 (de)
WO (1) WO1999030174A1 (de)

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Also Published As

Publication number Publication date
KR100396723B1 (ko) 2003-09-02
AU1711299A (en) 1999-06-28
KR20030014232A (ko) 2003-02-15
KR20010032974A (ko) 2001-04-25
US6353328B2 (en) 2002-03-05
JP2001526395A (ja) 2001-12-18
US20010000646A1 (en) 2001-05-03
US6229324B1 (en) 2001-05-08
US6018249A (en) 2000-01-25
WO1999030174A1 (en) 1999-06-17
KR100423250B1 (ko) 2004-03-18

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