DE19948613A1 - Electromechanical component for sensors, controllers and similar items, comprises mechanically active section which is at least partly coated with metal layer and incorporates flexural spring elements - Google Patents

Abstract

Electromechanical component comprises a mechanically active section which is at least partly coated with a metal layer and incorporates flexural spring elements. The electromechanical component (10) for sensors, controllers and similar items comprises a polymer body (12) with a frame (18) and a mechanically active section (14a, 14b, 14c) which is at least partly coated with a metal layer (30), and includes a flexural spring elements (14a, 14b) connecting the frame with a movable mass (14c). The metal layer serves for mechanical strengthening of the spring and, with the exception of the connection points at the frame and at the mass, almost totally envelops it. An Independent claim is also included for: a method for producing such an electromechanical component. It includes formation of a metal layer which almost totally envelops the spring elements.

Description

The present invention relates to the microstructure turtechnik and especially on electromechanical components ment.

Electromechanical components are components that one electrically detect mechanical effect or be electrically Act. Examples of electromechanical components are Sensors for linear accelerations, rotation rate sensors, Force sensors, pressure sensors, but also micro valves or Micropumps.

Accelerometers, for example, i. H. Sensors for Acquisition of a linear acceleration, or gyro rate sensors for detecting an angular acceleration have übli a moveable mass that has at least one Spring beam is connected to a fixed frame. When a Acceleration sensor is subjected to an acceleration, the cantilever deforms elastically, and the mass becomes deflected. This deflection can then be used a variety of known methods, such as. B. capacitive, inductive, optical etc. can be detected.

In contrast, microvalves usually have a movable, elastic structure, which is created when a suitable elec tric signal reduced a flow path for a fluid nert or enlarged, d. H. which as a mechanical effect Flow limitation causes.

Conversely, micropumps usually have a membrane that is elastic or is elastically suspended by a volume to change. A micropump will also become Ven tile to a defined with the volume change  To achieve fluid transportation. The mechanical effect Micropumps therefore consist of the transport or the dose tion of a fluid.

Pressure sensors or force sensors can also be used have elastically deformable membrane, which are present a certain pressure elastic by a certain degree deformed, d. H. "deflected", being this deflection then again as with the acceleration sensor to different Ways can be detected to be electrical Receive signal that indicates the pressure present. All Liche called electromechanical components include egg active part due to the external mechanical effect is elastically deformed, or its elastic deformation leads to the mechanical effect.

Such electromechanical components can inte free device for converting the mechanical effect in an electrical effect or to convert an elek tric effect in a mechanical effect. The known electrodes are only exemplary here structure, e.g. B. in the form of fingers or a membrane, mentioned, which has a first group of electrodes, the is connected to a moving part, and the one second electrode group having a fixed part is connected, with respect to which the movable part emotional. The two groups of electrodes are interlocking arranged such that a relative deflection of the moving part to a fixed part a change in the distances between the electrodes results in a changed Ka capacity of the finger arrangement leads. This changed capaci action is z. B. a function of the moving part acting acceleration. In the case of a pressure sensor the mechanical effect, for example, by changing the distance between two flat electrodes in the sense of a plate capacitor can be effected. This change in capacity can can be measured using an AC voltage.  

Such electromechanical components are usually in miniaturized form made of silicon material using silicon that has been tried and tested in wafer processing technology manufactured. The silicon technology enables a mass production that has led to, for example wise capacitive acceleration sensors that use silicon technology, one have experienced widespread use, particularly in the area of Automotive technology, with acceleration sensors in particular ren for airbag systems may be mentioned.

With such silicon sensors, the inert mass is thin Suspended springs and provided with electrode structures that along with fixed similar electrode structures form a capacitor, the capacity of which at Be acceleration changes, making acceleration electronic can be detected. Silicon acceleration sensors who for example in polysilicon surface micromechanics manufactured by Bosch in Reutlingen. At this Technology is used to manufacture a wafer with sensor chips and then with one also using techniques from Silici pre-fabricated lid wafer under micromechanics other associated with the anodic bonding process, so that the sensitive micromechanically structured silicon Sensor structures are protected. Then the Ver Bund wafers with the sealed sensor chips isolated. The individual sensor chips are then together with a Using electronic chip in a suitable package of standard processes in microelectronic technology builds to get the finished sensor system. The sensorsy systems can then function like purely electronic components to be processed further.

The advantages of these silicon acceleration sensors are small size of the sensor and thus the chip, the Her adjustability in the batch process and the high long-term storage stability and accuracy due to the favorable properties of the silicon material used.  

A disadvantage of such systems is the fact that such Sensors due to their very small dimensions Sensor structures, for example on electrode structures ren is thought of as groups of fingers, and due to the so-called called sticking effect practically hermetically sealed against Particles and moisture must be protected. Farther is disadvantageous that the entire manufacturing process despite the Batch manufacturing and assembly technology of electronics techno logic is still very expensive because in addition to the electronics Chip also two silicon wafers with micromechanical process must be manufactured, connected and separated.

Although silicon technology is very popular has what is more affordable for the entire clean room systems and already at a high level of automation has led, it must nevertheless be noted that the wafer pro a complete clean room and corresponding ge trained personnel are required. Crucial cost The factor is therefore not the material itself, but the opening wall in the manufacture, which is essentially by the be required systems and the personnel costs to be spent is true.

The object of the present invention is to price cheaper electromechanical components and methods for Manufacture the same to create the mechanical one nonetheless and have electrical properties comparable to those of Sili zium components are comparable.

This task is accomplished by an electromechanical component according to claim 1 and by a method for Her position of an electromechanical component according to patent claim 21 solved.

The present invention is based on the finding that that for the manufacture of really inexpensive electromechani of the established silicon technology  must be moved away. According to the invention as a starting measure material uses a polymer material, for example using the also well established injection molding technology and / or stamping technology in almost any shape and Structures can be processed. Are polymer materials generally also very inexpensive. The decision However, the end advantage lies in the manufacturing technology. The machine systems for the implementation of polymer processing tion are much less expensive and therefore essential cheaper than the corresponding mechanical systems for silicon technology. Just have polymer materials if, depending on the composition, elastic properties that can be used to set cantilevers with defined To produce deflection properties.

However, the problem with polymer materials is that they are Plastics have flow properties that are too significant Problems with long-term stability lead when no precautions are taken. According to the invention solved this problem in that mechanically active parts of the polymer body that the electromechanical component has to be provided with a metal layer. Thereby creates a plastic-metal composite system that is similar can achieve good properties, like a component that is completely made of metal or silicon. This is on it attributed to the fact that the outer metal surfaces the mecha African parameters, such as the rigidity or influence the area moment of inertia more than that Plastic core. As a metal layer itself, for example Gold can be used. Can further reduce costs but also a metal layer made of nickel, copper, etc. be set. Mechanically active parts are in the be accelerometer wrote the cantilevers over which the seismic mass is suspended from the fixed frame. in the Case of electromechanical components, the membranes have, the mechanically active part also includes the mem bran, which is elastically deformable and without a metal layer due to the flow properties of the plastic material  long-term stability would be too low.

In a particularly preferred embodiment there is the electromechanical component from a two-component ten-polymer body, which is a first part from a first Has polymer material that can be metallized wet-chemically and the second part from a second polymer material has material that is not chemically metallizable. So it is possible through a two-shot injection molding process define the necessary metallizations, d. H. the me Tallization of the mechanically active parts for improvement the mechanical stability of the same, but also the me tallizations to implement the mechanical effect are necessary in an electrical signal, such as. B. fingers structures, capacitor plates, but also the necessary Conductor tracks of the electromechanical component into one internal electronic circuit, the hybrid in the poly is inserted body or befe on the polymer body Stigt, or to an outer connector.

The main advantage of the method according to the invention is the extraordinary cost reduction compared to silicon Technology manufactured electromechanical components.

The minimum structure sizes currently used by art material processing can be achieved, at least still significantly higher than that of silicon micromechanics. As a result, the dimensions of the springs and the Distances between capacitor electrodes affected. Around to minimize the electrical noise of the sensor system, a minimum capacity must be achieved, which is the case with the Sili cium technology with very small electrode spacings must be enough. In the method according to the invention however, this does not involve further miniaturization are bought with their corresponding problems, but by increasing the size, since it is significantly less expensive stronger materials than silicon are used, and there the preferred injection molding process no essential loading  Limits for the height of, for example, vibrating mas sen, but what with the use of polysilicon is very much the case.

On the other hand, the master or impression technique with polymer Materials are also known to have the potential to also To be able to produce structures in the micrometer range. To it is preferred to use an injection molding process to combine embossing processes, or also with the known Hot stamping process.

The larger design and size of the elek tromechanical component has the advantage that the sensitivity to particles and contaminants is not is so big. It can also increase robustness the entire metallized surface with a dense thin NEN gold layer are coated to the moisture and To improve environmental sensitivity of the sensor system, so that the encapsulation requirements are significantly lower than with silicon components.

Preferably, as a method of forming the metal layer the process of electroless chemical metallization tion used. This procedure can conveniently be done with the process of galvanic reinforcement of the metal layer ten can be combined, thereby controlling the metal thickness when galvanically amplifying both the electrode spacing for electrode structures as well as the natural frequency of the Sen sorelements precisely controlled and for the specific user range can be optimized. The invention The process also provides the potential to measure the mass of the moveable Chen inert structure using the example of the acceleration sensor or the mass and also the elastic modulus of a membrane in the case of microvalves or micropumps by control the amount of metal that is grown very precisely to be determined. There is also the possibility of seismi mass with inertial sensors by overmolding a to increase the inserted metal body.  

Finally, the full range of plastic injection casting technology, for example the use of alignment pin / holes, from snap connections to the inseparable ver bind or from molded seals and / or externally used seals opened compared to the Sili cium technology are extremely inexpensive and almost the same can achieve the same effect.

Finally, the manufacturing process includes compared to Silicon technology a small number of steps where by the committee during production and thus also the Costs can be kept low.

Preferred embodiments of the present invention are referred to below with reference to the attached drawing explained in detail. Show it:

Figure 1 is a schematic plan view of the electromechanical device according to the present invention.

Figure 2 is a schematic side view of the electromechanical component's housing bottom and housing cover according to a preferred embodiment of the present invention.

Figure 3 is a side view of the electromechanical Bauele ments in combination with an SMD component for electrical control and / or evaluation.

Fig. 4 is a side view of the electromechanical component with spring contacts for contacting an electronic circuit;

Figure 5 is a side view of the electromechanical component with a spring and contact bumps for contacting an electronic circuit. and

Fig. 6 is a side view of the electromechanical component with adhesive bumps for contacting an electronic circuit.

Fig. 1 shows an electromechanical component, which is generally identified by the reference numeral 10 . The elec tromechanical component 10 has a polymer body 12 which has a mechanically active part which has the two spring bars 14 a, 14 b and a seismic mass 14 c. The electromechanical component 10 , which is shown in FIG. 1, is a sensor for measuring a mechanical acceleration. As an example, the capacitive detection principle was used in the acceleration sensor shown in FIG. 1, which comprises an electrode structure with a first electrode group 16 a, which are attached to a fixed frame 18 , and a second electrode group 16 b, which has fingers on the seismic mass 14 c are attached. The electromechanical component 10 , which is shown in Fig. 1 as an acceleration sensor, further comprises some electronic circuit (chip) 20 and a connector 22 , which is also part of the polymer body 12 , ie the connector 22 and the fixed frame and the mechanically active Part are all made of polymer material. To control or read out the electrode structure 16 a, 16 b, the electromechanical component also includes conductor tracks 24 a to 24 c, which groups both the movable mass and the two first electrode groups 16 a of the finger structures via bond wires 26 with the chip or with connect corresponding pads of the chip ver. In addition, the electromechanical component 10 comprises further conductor tracks 28 a to 28 d, which on the one hand are also connected to the chip 20 via bonding wires, and which on the other hand merge into wider ends in order to connect the polymer body 12 with a connector which is shown in FIG. 1 embodiment shown has four contacts to form.

If the electromechanical component 10 is subjected to a linear acceleration, the seismic (inertial) mass 14 c is deflected with respect to the fixed frame 18 , which leads to an elastic deformation of the spring bars 14 a, 14 b. The displacement of the mass 14 c leads to a changed capacitance, which can be detected using the first and second fin groups 16 a, 16 b and can already be processed "in place" in the IC 20 , via the plug area 22 to be issued.

As has already been mentioned, the long-term stability of such an electromechanical component would not be particularly great, since polymer materials usually have a flow behavior over time. In other words, a permanent deformation of the two cantilevers 14 a, 14 b over time leads to the fact that, in addition to the elastic deformation, plastic deformation also occurs, as a result of which the sensor loses sensitivity over time and would ultimately become unusable. According to the invention, this problem is solved by providing a metal layer 30 which at least partially covers the mechanically active part for mechanical stabilization thereof. In the embodiment shown in Fig. 1, the mechanically active part comprises the springs 14 a, 14 b and the seismic mass 14 c. To stabilize the invention, to achieve good long-term stability and thus to enable the use of polymer materials for such electromechanical components, the cantilevers are provided with the metal layer. However, it is not absolutely necessary to also metallize the seismic mass 14 c for mechanical stabilization reasons. However, this is done in the present case due to the capacitive detection principle. If no capacitive detection principle, but any other detection principle is used that does not require contacting the movable mass 14 c, then only the spring bars 14 a, 14 b would have to be metallized in order to decisively improve their mechanical properties.

Another advantage of the present invention is  in that the metallic layers for stabilization, which are preferably designed so that they are the beams not only partially, but completely surrounded, too also serve to conduct electrical signals can. This also affects the resonance frequency of the system increased, for example in acceleration sensors important is.

In principle, the polymer body 12 could consist of only one polymer material, the structuring of the capacitive detection electrodes and also the spring bars, for example, using a one-shot injection molding method, would then be carried out using a shadow mask , the metallization shown in Fig. 1 structure, ie the metal layers on the mechanically active part for stabilization and the further metal layers to form the conductor tracks, for example by vapor deposition.

However, it is preferred to use a two-shot injection molding process use, in which in a first shot the areas that to be metallized later using a Manufactured wet-chemical metallizable polymer material to then in a second shot to the result of the first shot around the solid frame. This Two-component injection molding technology has the advantage that the structuring of the metallization to a certain extent itself results when the result of the second shot is wet is chemically metallized because only on the surfaces that consist of the first polymer material that can be metallized is, a metal layer is formed while on the whose surfaces, which be from the second polymer material stand that can not be metallized by wet chemistry, none Metal deposition takes place.

The metallized part of the polymer body adheres to the non-metallized part per se due to the injection molding process. However, in order to improve the connections, since under certain circumstances mechanical forces act at least in the area of the springs, form-locking anchorages 32 are preferably provided, which lead to the fact that the two polymer parts from the different polymer materials not only adhere to one another, but also form-fit mechanically with one another are connected. Anchoring structures of any design are available for this purpose, which are compatible with the manufacturing process in at least two stages.

As shown in Fig. 1, the IC 20 does not have to be present as a packaged chip, but the same can also be provided as a bare chip with corresponding pads which can be contacted via the bond wires 26 .

In the following, the preferred manufacturing process using the two different polymer materials for the two injection molding shots is discussed in more detail. The springs 14 a, 14 b, the seismic mass 14 c, the electrical 16 a, 16 b and the conductor track regions 24 a to 24 c on the one hand and the conductor track regions 28 a to 28 d on the other hand, which are located in the plug region 22 extend with the first shot from a suitable metallizable first polymer material, for example from Pd-doped LCP (LCP = Liquid Crystal Polymer, e.g. Vectra E 820 i from Hoechst) or polyamide (PA) 66. In contrast, who the rest of the fixed frame, the isolation areas and other features such. B. snap connector, which will be discussed with reference to Fig. 2, made with the second shot from the second polymer material, which does not accept any metal in the metallization process then to be used. Such a material is, for example, undoped LCP or PA 66 etc. For tool design, however, it may also be advantageous to reverse the order in the injection molding process, that is to first spray the structures not to be metallized and then the structures to be metallized.

The two-component moldings are then in a wet chemical process sequence treated in such a way that a metal on the surface of the first polymer material deposits autocatalytic layer. The main ar steps consist of cleaning the spray linge, the tempering of the moldings and the sensitization tion of the surface of the same by a surface crack tion, such as B. etching the surface or swelling and germinating the surface with Pd nuclei.

Then the moldings in the autocatalytic Bathroom coated with metal. Copper or come as layers Nickel as the starting layer, conductor layer and layer to me mechanical stabilization and gold as solder and wire bond bare surface protective layer in question. Typical metal layer thicknesses are of the order of 30 µm, however, layer stresses or layer adhesion the polymer material and, of course, the parting limit the thickness.

Therefore, it is preferred to apply the layer thickness before gilding by a galvanic layer, e.g. B. nickel to reinforce. While metal layers deposited without external current characterized by a very high conformity of the layers, tend to galvanic layers with fine structural details strongly inhomogeneous layer thicknesses, which negatively affect the Geometry of the components, but especially on the distances de between the electrodes or on the springs and their can affect elastic properties.

Due to the symmetry of the structure of the fixed metallized regions 16 a as an auxiliary electrode be used via the application of a suitable potential a more homogeneous deposition on the elastic blade and also on the seismic mass to he can at a before ferred manufacturing method of the present invention in the form of the electrodes pass. No metal is deposited on the auxiliary electrode. Electrical contacting of the areas is required for galvanic deposition. When the voltage is applied, there is an attractive force on the sensor structure, which, however, is compensated for overall due to the symmetry of the structure.

However, to prevent the first electrode group 16 a and the second electrode group 16 b from contacting one another when applying an electrical voltage, or for asymmetrical structures in which the forces of attraction do not cancel one another, an auxiliary connection 34 can be made from the first or the second polymer material can be used. The auxiliary connection is then, after completion of the metallization process, when no more potential difference is applied to the comb structure, z. B. by punching.

Another parameter that must be taken into account in the preferred embodiment of the present invention, in which the polymer body consists of two polymer materials, is the bond strength between the various polymer materials. If two LCP materials are connected in a two-component injection molding process without further measures, a u. U. Too little adhesive strength. In order to improve the adhesive strength between the areas of different polymer material, the anchors 32 already described are used, which are particularly advantageously placed where the highest mechanical loads occur, that is, inter alia, in the area of the connections of the springs to the fixed frame.

After the plastic has been produced and metallized, the electromechanical component is equipped with the electronic circuit 20 . Various measures can be used for electrical contacting, which will be dealt with in detail in the further figures.

Fig. 2 shows a side view of the electromechanical component 10 , wherein, as in Fig. 1, bond connections via bond wires 26 for contacting the chip 20 were used. To increase the robustness, a potting compound 36 is applied over the area in which the chip 20 and the bond wires 26 are located. Fig. 2 also shows the configuration of the external conductor tracks using the example of the conductor track 28 d in the connector area, which is formed so that it extends around the connector area 22 . In Fig. 2 it is also shown that the electromechanical component is encapsulated using a housing base 40 and a housing cover 42 in order to protect it from external influences. To connect the polymer body 12 to both the housing base 40 and the housing cover 42 , snap connections known in the field of plastics technology are provided with a corresponding first snap hook on one component and a corresponding mating snap hook on the other component, all of which are generally identified by reference numeral 44 Marked are. To align the two components, alignment pins 46 are also provided on both the housing base 40 and the housing sedeckel 42 , which holes 48 can be inserted into corresponding alignment. To seal the mechanically active part, circumferential seals are also provided both on the housing cover and on the housing base, which are identified by reference numeral 50 . These seals can either be realized using rubber rings, or they can also be molded onto the sealing edges of the housing cover and housing base. This is because both the housing base and the housing cover preferably also consist of the polymer material, and in the case of the two-component exemplary embodiment at least partially of the polymer material, which can be metallized in order to provide metallization both on the outside of the housing base and on the outside of the housing cover, which is identified by the reference numeral 52 , to ensure electromagnetic shielding, whereby both the noise and the sensitivity of the entire electromechanical component can be improved.

As an alternative to the connection of the polymer body with the housing cover 42 or with the housing base 40 using the snap connector 44 , a suitable adhesive or a welding process can also be used. Suitable welding processes are ultrasonic welding or laser welding, especially with diode lasers. As it has already been mentioned, the arrangement of guide pins 46 and guide holes 48 can be used to adjust the housing cover 42 and the housing base 40 to simplify the assembly process.

As an alternative to the construction of the electromechanical component using the polymer body, the housing base 40 and the housing cover 42 , ie for the construction of the electromechanical component from three components, in a preferred embodiment the sensor element is from only one side with a housing cover closed, while the other side is already closed during the manufacturing process of the polymer body. In other words, when the polymer body is formed, the housing base is also formed at the same time, which can easily be achieved by a suitable casting mold.

However, the housing cover must be designed so that it can be put on later to populate the electromechanical component with the chip 20 . However, if a chip already in the electromechanical component is dispensed with, ie if the surfaces of the conductor tracks 24 a to 24 c ( FIG. 1) are "pulled out" to the plug area 22 , it is in principle also possible to do the whole Form electromechanical component using a suitable mold in one go, since in the case of using the wet chemical metallization process in the catalytic bath, in contrast to the known silicon technologies, the surfaces to be metallized do not have to be accessible from above, since the auto catalytic bath in the Cavities occurs and leads to metal deposition wherever the material is present as a polymer material on which metal can be applied using the wet chemical process.

In order to create a higher geometric accuracy of the mechanically active parts of the polymer body, ie the spring bars 14 a, 14 b and the movable mass 14 c in the case of the acceleration sensor, an injection molding process or a hot stamping process can also be used instead of the injection molding process to then inject the embossed parts obtained in order to form the finished polymer body, in which, however, the mechanically active part and in the case of using a capacitive evaluation also the second electrode group, ie the fixed fingers attached to the frame 18 , one more have a more precisely defined geometric shape. Both the injection embossing process and the hot embossing process allow a very high structural fineness and, in particular, a low component distortion, which can occur due to alignment effects of the polymers if only an injection molding process is used.

To avoid problems due to sticking or adhesion between mechanically active part and frame during manufacture but also to avoid position during operation it prefers to have recesses on the mechanically active part or shape on the frame to define spacers that sticking of the mechanically active part and the Prevent the frame from moving and touching.

In the following FIGS. 3 to 6, further possibilities for contacting the chip 20 on the metallized polymer body 12 are described. As shown in Fig. 3, the chip 20 does not necessarily have to be a so-called bare chip, but it can also be in the form of an SMD component (SMD = Surface Mount Device), ie a packaged component with connections 60 , Are present, the terminals 60 on the pads of the conductor tracks 24 a to 24 c or 28 a to 28 d ( Fig. 1) and then either conductively glued or preferably soldered to the pads. The use of easy-to-use SMD components, which are also available in large quantities with standardized dimensions due to mass production, is possible due to the large height and width of the electromechanical polymer components that can be achieved compared to silicon sensors. The elec tromechanical component itself can be designed as an SMD component in addition to a plug connection for contacting.

Another cheap variant of the contacting of the elec trical circuit, which is now again available as a bare chip 20 , is shown in Fig. 4. In this variant, the chip 20 is not contacted by soldering, gluing, bonding and the like, but only by spring force using metallized spring contacts 62 . In such an exemplary embodiment of the present invention, in order to obtain a simpler construction of the spring contacts 62 , a recess 64 is provided in the polymer body 12 , which can be obtained by a corresponding injection mold without further res. Preferably, the recess is dimensioned such that, as shown in FIG. 4, the surface of the chip 20 is substantially flush with the surface of the polymer body 12 . Then the chip is placed in the recess and, if necessary, lightly pinned so that it does not slip ver when the lid 42 is placed on . When the lid is then put on and the lid and polymer body 12 are pressed together, the snap connectors 44 snap into place at some point. The spring contacts 62 are dimensioned such that they, when the snap connections 44 snap, a pressure both on connection surfaces 66 of the chip 20 and on corresponding connection surfaces of the conductor tracks to be contacted, e.g. B. 24 a, 28 d, exercise that the way that a simple and above all releasable Kontaktverbin has been achieved. As illustrated in Fig. 4 by the hatched areas of the spring contacts 62 , the lower portions of the same are metallized so that electrical contact between the chip and the conductor can occur at all. The metallized spring contacts 62 , like the metallized regions of the polymer body 12, can be injection molded from the polymer material, which can be metallized by a wet chemical process. If only a single polymer material is used, the spring contacts can also be made conductive using a shadow mask, etc.

Another alternative of the chip attachment is shown in FIG. 5. Here, the chip 20 is with respect to its orientation Orien in Fig. 4 upside down, so that the pads 66 of the bare chips 20 are with reference to Fig. 5 is directed to ge below. The same are placed on contact bump 68 , whereupon the housing cover 42 , which is provided with a pressure spring 70 , is placed and pressed in the direction of the polymer body 12 until the snap connector 44 snap.

In FIG. 6, on the other hand, a further possibility of contacting the chip 20 is shown, the chip 20 being connected here by means of adhesive bumps 72 . The adhesive that forms the adhesive bumps 72 must of course be a conductive adhesive. The adhesive bumps can be applied, for example, with the stamping technique, the dispensing technique or by means of a stencil printing technique on the polymer body.

In the electro-mechanical components according to the invention, the chip 20 preferably takes on the known electronic functions for use as an acceleration sensor, as a rotation rate sensor, as a microvalve, as a micro pump, as a pressure sensor as a force sensor. Functions can include capacity readout, temperature compensation and self-test functions.

From the foregoing it can be seen that the geo metric interpretation of the active part of the electromechani  rule component, d. H. in the case of acceleration sensors springs and mass, by selecting the work materials and by optimizing the metal thicknesses similar Parameters like known airbag sensors made of silicon can be achieved. This applies in particular to the Base capacity, sensitivity as a change in capacity with applied acceleration, the natural frequency and the Damping. Due to the similar properties of the inventor inventive electromechanical components compared to Silicon sensors can even use electronic circuits are used, which are actually intended for silicon are, or at least circuits that are already connected to the existing circuits are similar. So it must be on electronic design no longer a completely new design.

In summary, an electromechanical component according to the invention thus has movable elements, integrated conductor tracks and areas with metallized surfaces, the electromechanical components being made from polymeric materials, preferably with the aid of two- or more-component injection molding technology and electroless chemical metalization. The main advantages over electromechanical components made of silicon are:

• - Drastically reduced costs due to the simple manufacture availability;
• - Any shape of the polymer body for implementation of snap connections, pressure springs, alignment pin ten, guide holes, anchorages, seals,. . .;
• - Less sensitivity to contamination and Ambient conditions due to the arbitrarily large setting real component size; and
• - Any three-dimensional shape instead of that for silicon known two-dimensional surface treatment.

Claims (36)

1. Electromechanical component ( 10 ) with the following features:
a polymer body ( 12 ) which has a mechanically active part ( 14 a- 14 c) and a frame ( 18 ); and
a metal layer ( 30 ) which at least partially covers the mechanically active part ( 14 a- 14 c) for mechanical stabilization thereof. 2. Electromechanical component ( 10 ) according to claim 1,
in which the mechanically active part ( 14 a - 14 c) has a spring ( 14 a, 14 b), the frame ( 18 ) with ei ner over a bend of the spring ( 14 a, 14 b) movable mass ( 14 c ) connects; and
in which the metal layer ( 30 ) completely surrounds the spring, apart from its connection points with the frame ( 18 ) and the mass ( 14 c). 3. Electromechanical component according to claim 1 or 2, further comprising a further metal layer ( 24 a- 24 c; 28 a- 28 d; 52 ) for conducting electrical signals or for shielding against electromagnetic interference on a mechanical non-active Area ( 18 ) of the polymer body ( 12 ) is provided. 4. Electromechanical component according to one of the preceding claims, in which the areas of the polymer body ( 12 ) on which the metal layer ( 30 ) or the further metal layer ( 24 a- 24 c, 28 a- 28 d, 52 ) are provided is, consist of a first polymer material that can be metallized wet-chemically, and in which the other areas, on which no metal layer is provided, consist of a second polymer material that is not metallized wet-chemically. 5. Electromechanical component ( 10 ) according to claim 4, in which the polymer body ( 12 ) has anchoring devices ( 32 ) through which at least the mechanically active part ( 14 a, 14 b, 14 c), which consists of the first polymer material , With the part of the polymer body ( 12 ) is connected essentially form-fitting, which consists of the second polymer material. 6. Electromechanical component according to one of claims 3 to 5,
in which the polymer body ( 12 ) has an electrode structure which has a first electrode group ( 16 b) on the movable mass ( 14 c) and a second electrode group ( 16 a) on the fixed frame ( 18 ), the first group and the second group are arranged in one another to act as a capacitive sensor for movement of the mass ( 14 c),
wherein the further metal layer at least partially covers both the first electrode group and the second electrode group, and wherein the further metal layer is configured such that the first electrode group from the second electrode group passes through a region of the polymer body which has no metallization, is electrically insulated. 7. Electromechanical component according to one of claims 3 to 6, in which the further metal layer further comprises a connection area which comprises electrically insulated contact surfaces for an electronic circuit ( 12 ), for a connector and / or an SMD / solder connection . 8. Electromechanical component according to one of the preceding claims, in which the metal layer ( 30 ) has a sandwich structure of different metals and / or is galvanically reinforced. 9. Electromechanical component according to one of the preceding claims, further comprising the following features:
a polymer case back ( 40 ); and
a housing cover ( 42 ) made of polymer,
wherein the polymer body ( 12 ) between the housing cover ( 42 ) and the housing base ( 40 ) is arranged. 10. Electromechanical component according to claim 9, wherein the polymer body ( 12 ), the housing cover ( 42 ) and the housing base ( 40 ) have snap means ( 44 ) through which the polymer body ( 12 ), the housing cover ( 42 ) and Housing base ( 40 ) are mechanically and / or electrically connected to each other. 11. Electromechanical component according to claim 9 or 10, in which an alignment device ( 46 , 48 ) on the housing cover ( 42 ), on the housing base ( 40 ) and on the poly mercury body is provided to the polymer body ( 12 ) with the housing base ( 40 ) and align with the housing cover ( 42 ). 12. Electromechanical component according to one of claims 9 to 11, in which a sealing device ( 50 ) made of polymer, in particular a molded seal, integrally with the housing base ( 40 ), housing cover ( 42 ) and / or polymer body ( 12 ) or a separate seal tion ring is provided to encapsulate the electromechanical component ( 10 ). 13. Electromechanical component according to claim 9, wherein the polymer body ( 12 ) and the housing base ( 40 ) are made in one piece. 14. Electromechanical component according to one of claims 7 to 13, which further has the following feature:
an electronic circuit ( 20 ) for controlling and / or evaluating the mechanically active part ( 14 a- 14 c), the electronic circuit with the contact surfaces being actuated by bonding wires ( 26 ), by solder, by conductive adhesive ( 72 ) or by spring force Contacts ( 70 ) is electrically conductively connected. 15. The electromechanical component according to claim 9, further comprising:
an electronic circuit (20) for control and / or evaluation of the mechanically active part, which is electrically conductively connected to the contact surfaces by at least one spring contact (62), wherein the spring contact (62) integral with the housing cover (42) or the housing bottom and has a metallized area which extends from a connection area ( 66 ) of the electrical circuit ( 20 ) to a contact area on the polymer body ( 12 ). 16. The electromechanical component according to claim 15, wherein the polymer body ( 12 ) has a recess ( 64 ) in which the electronic circuit ( 20 ) is placed. 17. Electromechanical device which acts as an accelerator gung sensor, rotation rate sensor, micro valve, micropump, Pressure sensor or force sensor is executed. 18. Electromechanical component ( 10 ) according to one of the preceding claims, in which the at least one polymer material is selected from a group comprising Pd-doped LCP, undoped LCP, polyamide 6 and polyamide 66, and in which the metal layer or the further Metal layer made of copper, nickel, gold or a combination thereof. 19. Electromechanical component according to one of the previously going claims, in which the mechanically active part of the polymer body one in the polymer material placed metal body to increase the mass. 20. Electromechanical component according to one of the previously going claims, in which the mechanically active part of the polymer body has recesses to distance halter to define the clinging of the me mechanically active part on the frame when moving or Prevent contact 21. A method for producing an electromechanical component ( 10 ) with the following steps:
Forming a polymer body ( 12 ) having a mechanically active part ( 14 a- 14 c) and a frame ( 18 ); and
Form a metal layer ( 30 ) which at least partially covers the mechanically active part ( 14 a- 14 c) for mechanical stabilization thereof. 22. The method of claim 21, wherein the step of forming the metal layer ( 30 ) comprises sputtering using a shadow mask. 23. The method of claim 21, wherein the step of forming the polymer body comprises the following steps in any order:
Injection molding of a first portion of the polymer body to be metallized from a wet mixable metallizable first polymer material;
Injection molding of a second portion of the polymer body ( 12 ), which is not to be metallized, from a wet chemical non-metallizable second polymer material;
and in which the step of metallizing comprises the following step:
wet chemical metallization, such that only surfaces of the polymer body ( 12 ), which consist of the most polymer material, receive a metal layer ( 30 , 24 a- 24 c, 28 a- 28 d). 24. The method of claim 23, wherein the step of forming the metal layer further comprises the step of:
galvanic amplification of the wet-chemical metal layer. 25. The method according to claim 24, wherein the galvanic amplification comprises the following steps:
Fixing the mechanically active part ( 14 a- 14 c) of the polymer body ( 12 ) to the frame of the polymer body ( 12 ) using an auxiliary structure ( 34 );
Applying a potential to a fixed part ( 16 a) of the polymer body ( 12 );
Depositing a metal on the movable part ( 14 c) and the mechanically active part ( 14 a, 14 b); and
after the step of galvanic amplification, removal of the auxiliary structure ( 34 ). 26. The method according to any one of claims 21 to 25,
wherein the polymer body ( 12 ) is formed such that it has snap connections ( 44 );
in which a polymer cover ( 42 ) and a polymer housing base ( 40 ) are also injection molded, which also have snap connections ( 44 ); and
in which the polymer body, the polymer cover and the housing base ( 44 ) are pressed together until the snap connections are engaged. 27. The method according to claim 26, in which the polymer body ( 12 ) has no snap connections, and in which the polymer cover and the housing base are welded together by ultrasound or laser welding. 28. The method according to any one of claims 21 to 25, in which in the step of forming the polymer body ( 12 ) at the same time the housing base ( 40 ) is formed so that the polymer body ( 12 ) and the housing base ( 40 ) are in one piece. 29. The method of claim 21, wherein the forming step comprises the following steps:
Spray embossing or hot embossing of a polymer starting material in order to obtain an embossing element which has the mechanically active part ( 14 a- 14 c) and geometrically fine structures of the frame; and
Injection molding around the stamping element in order to obtain the polymer body ( 12 ). 30. The method of claim 21, wherein the forming step comprises the following steps:
Injection of a polymer starting body;
Injection stamping or hot stamping of the polymer starting body in order to obtain the polymer body in such a way that the mechanically active part ( 14 a- 14 c) and geometrically fine structures of the frame are defined by injection stamping or hot stamping; and
Injection molding around the stamping element in order to obtain the polymer body ( 12 ). 31. The method according to any one of claims 21 to 30, further comprising the step of:
Equipping the electromechanical component ( 10 ) with an electrical circuit ( 20 ) by gluing using conductive adhesive ( 72 ), by wire bonding ( 26 ), by soldering ( 60 ) or by continuously applying mechanical pressure ( 62 , 70 ) the electronic circuit ( 20 ) to ensure both a mechanical and electrical connection between the polymer body and the electronic circuit ( 20 ). 32. The method according to any one of claims 23 to 31, in which the following steps are carried out before the metallization:
Cleaning the polymer body ( 12 );
Annealing the polymer body ( 12 ); and
Sensitizing the surface of the polymer body ( 12 ). 33. The method of claim 32, wherein the step of  Sensitizing the surface by a surface Chen reaction is caused, which is an etching of the upper surface or swelling or plasma treatment and germinating the surface with suitable germs points to achieve a metallization. 34. The method according to any one of claims 21 to 33, wherein the step of forming the polymer body comprises the following steps:
Providing a metal body;
Overmolding the metal body to form the polymer body ( 12 ) such that the mechanically active part of the polymer body comprises the metal body. 35. The method according to any one of claims 21 to 34, in which Defi an electrode structure through the metal layer niert, whose capacity by strengthening the Me tallschichtdicke and the associated change in Electrode distance is increased. 36. The method according to any one of claims 21 to 35, wherein the step of forming the polymer body ( 12 ) comprises the following step:
To define shapes of recesses in the mechanically active portion or the frame for spacers (14 a-14 c) sticking together of the mechanically active part and the frame (18) for preventing movement and touch.