DE20316645U1 - Modular elastic contact pin group device for integrated circuit testing, has elastic contact pins whose position is defined by holes in upper and lower lids - Google Patents

Abstract

The device includes an upper lid (1) with one or more first positioning holes in the axial direction, and a lower lid (2) with a second hollow positioning hole opposite the first hole(s). One or more elastic contact pins (31) with an elastic compression part between an upper contact pin and a lower contact pin, are arranged between the upper and lower lids. The position of the upper and lower contact pins is defined by the first and second positioning holes respectively.

Description

Technical area

The The present invention relates to a modular elastic Contact pin group device, in particular an elastic contact pin group device, which are interchangeable according to the specification of the integrated circuit is, taking the compatibility the elastic contact pin group device of the test mechanism is achievable.

State of the art

• 1. Der BGA-Typ-integrierte Schaltkreis kann mehr Anschlußpunkte,nämlich mehr Funktionen als bei der traditionellen Packung aufweisen.
• 2. Unter der Bedingung gleicher Anzahl von Anschlußpunkten sind der besetzte Raumplatz der Anschlußpunkte, und das Gewicht von den BGA-Typ-integrierten Schaltkreisen reduziert. Dies führt zur Reduzierung des Gewichtes und des Maßes von mobilem Telephonapparat.

Since the National Telecommunication Engineering Laboratory was founded in the Industrial Technical Research Station late last year (2001), our country is entering a new era of integrated circuit. This means that the life of one generation of the integrated circuit is changing dramatically and the integrated circuit is currently evolving to reduce weight, thickness, length, occupied space, spacing between terminals, and increasing function. At present, most integrated circuits in the world are implemented in BGA (Ball Grid Array) technology. Such packing technology has the following advantages:

• 1. The BGA type integrated circuit can have more connection points, more functions than the traditional package.
• 2. Under the condition of equal number of connection points, the occupied space space of the connection points and the weight of the BGA type integrated circuits are reduced. This leads to the reduction of the weight and the size of mobile telephone apparatus.

In In the middle of 1997, the Intel company has corresponding reliability test successfully performed by the BGA type integrated circuits. And With this packing technology, "Flash Memory" is produced to a great extent. In addition, will Since 1997, more and more DRAM (Dynamic Random Access Memory) or "Direct Rambus DRAM" in the BGA packaging technology produced.

But only after the test can be determined, if the packed integrated Circuit corresponds to the intended specification. To such a test perform, you have to special test device for carrying out the test of the integrated Recycle circuit packed in such packing technology is.

As in 1 As shown, the traditional test apparatus is unchanged in accordance with the specific design of the integrated circuit. Therefore, the components of the test device are not interchangeable. For example, the chips such as central control unit (CPU) and memory are soldered and fixed directly on a circuit board. Also with respect to the integrated circuit under test, the contact points between the test device and the integrated circuit are formed directly in the test device and the test device is designed to be unsolvable. Therefore, if the test is performed by the integrated circuits packaged in the same packaging technology but with a different configuration and number of solder balls, and with a different spacing between two solder balls, then a new test mechanism must be designed. In other words, compatibility with such a test mechanism is not achievable. It is also impossible to replace the components of the test mechanism. Therefore, such test mechanism is not user-friendly and its cost is considerably high.

Content of the invention

Of the present invention is based on the object, a modular To provide elastic contact pin group device, wherein the test by the contact of the projecting from both sides of this device upper and lower contact pin respectively with the solder ball of the integrated circuit and is performed with the circuit board. In this elastic contact pin group device, since the configuration, the distance or the number of elastic contact pins after To wish is adjustable, one needs in the implementation of the test of the integrated Circuits with different numbers, with different configuration of solder ball , or with other distance between two solder ball only the elastic contact pin group device replace the test mechanism, so that the compatibility of the test mechanism is reachable.

Of the The present invention is further based on an object, a to specify elastic contact pin group device, wherein an upper and a lower contact pin, and an elastic compression element the elastic contact pin group device in one piece or are formed as individual separate elements.

The modular resilient contact pin group device according to the invention comprises an upper cover, a lower cover and a plurality of resilient contact pins, the upper cover having a number of hollow first positioning holes in the axial direction, the lower cover being disposed below the upper cover and connected to the upper cover , and in the axial direction relative to the first positioning holes hollow second positioning holes, wherein an elastic compression element between the upper contact pin and the lower contact pin of the elastic Kon tact pin is arranged, and the elastic contact pins between the upper and the lower ceiling are arranged, and the position of the upper and the lower contact pin is limited respectively by the first and the second positioning hole and the upper and the lower contact pin respectively from the first and the projecting outward from the second positioning hole, a spring being fixedly disposed respectively in the first and second positioning holes, the test being performed by contacting the upper and lower contact pins respectively with the solder ball of the integrated circuit and the terminals of the circuit board, and the elastic contact pin group device is configurable according to the different number or the different disposition position of the solder ball of the integrated circuits, so that one only needs to replace the contact pin group device according to the specification of the circuit under test when the test is performed by an integrated circuit with different number or different arrangement position of the solder ball. As a result, the compatibility of the test device can be achieved.

Description of the drawings

following For example, the present invention is based on preferred embodiments in conjunction with drawings closer explained.

1 Perspective view of prior art;

2 perspective view of the present invention;

3 an elastic contact pin group device according to the invention shown in section;

4 an embodiment of the present invention is shown;

5 the modular elastic contact pin group device according to the invention in use state shown;

6 perspective view of a configuration according to the invention of the second embodiment;

7 perspective view of a configuration according to the invention of the third embodiment;

8th perspective view of a configuration according to the invention of the fourth embodiment, and

9 a schematic representation of a second embodiment of the present invention in section.

1

upper blanket

11

first positioning hole

111

Pin positioning hole

112

Spring receiving space

2

lower blanket

21

second positioning hole

211

Spring receiving space

212

Contact positioning hole

3

elastic pin

31

upper pin

311

stop piece

32

lower pin

321

stop piece

33

feather

4

integrated circuit

41

solder ball

5

circuit board

6

casing

7

test mechanism

Preferred embodiment

As in 2 and 3 As shown, the present invention includes a top cover 1 , a lower ceiling 2 and a number of elastic contact pins 3 , the upper ceiling 1 in the axial direction, a number of hollow first positioning holes 11 having in the upper region a contact pin positioning hole 111 and at the bottom, one with the contact positioning hole 111 connected spring receiving space 112 has, and the light width of the spring receiving space 112 greater than the light width of the contact pin positioning hole 111 is.

The lower ceiling 2 points opposite the first positioning holes 11 axially second positioning holes in the axial direction 21 on, the second positioning holes 21 have a Federaufnahmeruam in the upper area 211 and at the bottom with the spring receiving space 211 connected contact pin positioning hole 212 on, and the range of the spring receiving space 211 greater than the light width of the contact pin positioning hole 212 is.

A number of elastic contact pins 3 is provided, wherein the elastic contact pin 3 an upper contact pin 31 , a lower contact pin 32 and an elastic compression element, the elastic compression element as a spring 33 is designed, the spring 33 between the upper and lower contact pins 31 and 32 is arranged or with the upper and lower contact pin 31 and 32 is integrally formed, and the head end of the upper contact pin 31 as a concave depression is designed.

When assembling, the upper contact pin 31 through the spring receiving space 112 on the upper ceiling 1 in the direction of the contact pin positioning hole 111 of the first positioning hole 11 so guided that the position of the upper contact pin 31 through the contact pin positioning hole 111 of the first positioning hole 11 is limited while the lower contact pin 32 through the spring receiving space 211 on the lower ceiling 2 in the direction of the contact pin positioning hole 212 of the second positioning hole 21 is guided so that the position of the lower contact pin 32 through the contact pin positioning hole 212 of the second positioning hole 21 is limited, and the spring 33 through one through the spring receiving space 112 of the first positioning hole 11 and the spring receiving space 211 of the second positioning hole 21 limited space is defined. After the top ceiling 1 and the lower ceiling 2 By means of the locating pin, an elastic contact pin group device is constituted by the fixed connection of the upper and lower covers 1 and 2 formed, wherein the elastic contact pin group device both sides of each of the projecting upper and lower contact pin 31 and 32 having.

As in 4 and 5 Shown are the upper and lower contact pins 31 and 32 contracted under the action of pressure, while the upper and lower contact pins 31 and 32 because of the relaxation respectively from the contact pin positioning hole 111 of the first positioning hole 11 and from the contact pin positioning hole 212 of the second positioning hole 21 project so that the contact of the upper contact pin 31 with the solder ball 41 of the integrated circuit 4 and the contact of the lower contact pin 32 with the connection point on the circuit board 5 the test mechanism 7 are achievable. These elastic contact pins, the electrical signal between the solder ball 41 and the circuit board 5 transfer. In addition, since the head end of the upper contact pin is designed as a concave depression, the solder ball is 41 of the integrated circuit 4 umschließbar, so that the risk is reduced, the solder ball to injure or pinch.

As in 6 . 7 and 8th shown are the configuration, the distance and the number of elastic contact pins 3 adjustable according to the configuration, the distance and the number of the solder ball of the integrated circuit to meet the specification of the integrated circuit under test. If the test is performed by an integrated circuit of a different specification, one need only replace the resilient pin array device of the test mechanism so that the test mechanism is capable of performing the test of integrated circuits with different specifications.

As in 9 shown, the upper contact pin 31 , the lower contact pin 32 and the spring 33 be designed as a single separate elements, wherein at both ends of the upper and the lower contact pin 31 and 32 one stop piece each 311 . 321 . 112 . 211 is formed, which is arranged in each case against both ends of the spring, and the upper contact pin 31 , the lower contact pin 32 and the spring 33 in a housing 6 are arranged so that the upper and lower contact pin 31 and 32 each from both ends of the housing 6 protrude. When assembling, the upper and lower Kontaktstft 31 and 32 each in the contact pin positioning hole 111 of the first positioning hole 11 and in the contact pin positioning hole 212 of the second positioning hole 21 are guided and their position respectively through the pin positioning hole 111 and 212 is limited. And the case is in the spring receiving space 112 . 211 arranged. If the upper and the lower ceiling 1 and 2 are secured by means of the positioning pin, the upper and the lower ceiling 1 and 2 connected together, so that the position of the upper and lower contact pin 31 and 32 respectively through the contact pin positioning hole 111 of the first positioning hole 11 and through the contact pin positioning hole 212 of the second positioning hole 21 is limited and the upper and the lower contact pin 31 and 32 to project outwards.

• 1. Da ein elastisches Kompressionselement zwischen der oberen und der unteren Kontaktstift der erfindungsgemäßen elastischen Kontaktstiftgruppevorrichtung vorgesehen ist, ist der Kontaktwiderstand reduziert. Und außerdem, da das Ende der oberen Kontaktstift als eine konkave Vertiefung gestaltet ist, ist die Lötkugel des Anschlußpunktes von dem integrierten Schaltkreis beim Kontakt umschießbar, ohne die Lötkugel zu klemmen oder zu verletzen.
• 2. Da die Konfiguration, der Abstand oder die Anzahl der elastischen Kontaktstiften bei der erfindungsgemäßen elastischen Kontaktstiftgruppevorrichtung einstellbar ist, braucht man nur die elastische Kontaktstiftgruppevorrichtung nach der Spezifikation des zu testenden integrierten Schaltkreises auszuwechseln, wenn das Test von einem integrierten Schaltkreis mit anderer Konfiguration, anderem Abstand oder mit anderer Anzahl der Lötkugel durchgeführt wird. Dadurch ist die erfindungsgemäße elastische Kontaktstiftgruppevorrichtung geeignet, den Test von integrierten Schaltkreisen mit unterschiedlicher Spezifikation durchzuführen.
• 3. Da die elastische Kontaktstift der erfindungsgemäßen elastischen Kontaktstiftgruppevorrichtung aus leitfähigem Material hergestellt ist, kann das elektrische Signal zwischen der Lötkugel des integrierten Schaltkreises und der Leiterplatte übertragen werden.

Due to the above-mentioned configuration, the present invention has the following advantages:

• 1. Since an elastic compression member is provided between the upper and lower contact pins of the elastic contact pin group device according to the invention, the contact resistance is reduced. And moreover, since the end of the upper contact pin is designed as a concave depression, the solder ball of the connection point of the integrated circuit on contact can be embraced without jamming or damaging the solder ball.
• 2. Since the configuration, spacing or number of elastic contact pins in the elastic contact pin group device according to the invention is adjustable, one need only replace the elastic contact pin group device according to the specification of the integrated circuit under test, if the test is from an integrated circuit having a different configuration, different Distance or with a different number of solder ball is performed. Thereby, the elastic contact pin group device according to the invention is suitable to the test of integrated circuits with different Spe cification.
• 3. Since the elastic contact pin of the elastic contact pin group device according to the invention is made of conductive material, the electrical signal between the solder ball of the integrated circuit and the circuit board can be transmitted.

Claims (8)

A modular resilient contact pin group device, characterized in that the device comprises at least: a top cover having one or more than one first positioning holes in the axial direction; a lower ceiling disposed below the upper ceiling and connected to the upper ceiling and having hollow second positioning hole in the axial direction opposite to the first positioning hole; one or more than one elastic contact pins, wherein an elastic compression member between an upper contact pin and a lower contact pin of the elastic contact pin is arranged, and the elastic contact pin between the upper and the lower ceiling is arranged, and the position of the upper and the lower contact pin respectively is bounded by the first and second positioning holes, and the upper and lower contact pins project outwardly from the first and second positioning holes, respectively. Modular elastic contact pin group device according to claim 1, characterized in that the upper and the lower Ceiling connected together by means of a positioning pin are. Modular elastic contact pin group device according to claim 1, characterized in that the first positioning hole on the upper ceiling in the upper part of a contact pin positioning hole and at the bottom one with the contact pin positioning hole having connected spring receiving space, and the light width of the spring receiving space greater than is the light width of the contact pin positioning hole. Modular elastic contact pin group device according to claim 1, characterized in that the second positioning hole at the lower ceiling in the upper area a spring receiving space and in the lower area a Kontstiftpositionierungsloch connected to the spring receiving space Kont has, and the light width of the spring receiving space greater than is the light width of the contact pin positioning hole. Modular elastic contact pin group device according to claim 1, characterized in that the head end of the upper contact pin the elastic contact pin designed as a concave depression is. Modular elastic contact pin group device according to claim 1, characterized in that the upper and the lower Contact pin and the elastic compression element integrally formed are. Modular elastic contact pin group device according to claim 1, characterized in that the upper and the lower Contact pin and the elastic compression element as a single separate elements are designed, and arranged in a housing so are that the upper and under contact pin respectively from the two ends of the Project housing, and the position of the upper and lower contact pins respectively through the first positioning hole and the second positioning hole are limited and each of the first and the second positioning hole projecting when the upper and lower contact pins respectively be arranged on the upper and on the lower ceiling. Modular elastic contact pin group device according to claim 1, characterized in that the elastic compression element is designed as an element that has the elasticity.