DE29500428U1 - Connecting component - Google Patents
Connecting componentInfo
- Publication number
- DE29500428U1 DE29500428U1 DE29500428U DE29500428U DE29500428U1 DE 29500428 U1 DE29500428 U1 DE 29500428U1 DE 29500428 U DE29500428 U DE 29500428U DE 29500428 U DE29500428 U DE 29500428U DE 29500428 U1 DE29500428 U1 DE 29500428U1
- Authority
- DE
- Germany
- Prior art keywords
- connecting component
- component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49833—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers the chip support structure consisting of a plurality of insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73253—Bump and layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE29500428U DE29500428U1 (en) | 1995-01-12 | 1995-01-12 | Connecting component |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE29500428U DE29500428U1 (en) | 1995-01-12 | 1995-01-12 | Connecting component |
Publications (1)
Publication Number | Publication Date |
---|---|
DE29500428U1 true DE29500428U1 (en) | 1995-03-30 |
Family
ID=8002417
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE29500428U Expired - Lifetime DE29500428U1 (en) | 1995-01-12 | 1995-01-12 | Connecting component |
Country Status (1)
Country | Link |
---|---|
DE (1) | DE29500428U1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10352705A1 (en) * | 2003-11-12 | 2005-06-23 | Diehl Bgt Defence Gmbh & Co. Kg | Circuit arrangement, especially for use in space, has element, especially vacuum-tight housing on base element and at least one heat-generating component connected to housing to dissipate heat losses |
Citations (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CH447300A (en) * | 1966-01-20 | 1967-11-30 | Ibm | Process for the production of spherical solder balls on carrier plates |
DE2056193A1 (en) * | 1970-02-13 | 1971-08-19 | Elektromat Veb | Process for contacting electrical see clamping components |
DE2330732A1 (en) * | 1972-06-30 | 1974-01-10 | Ibm | CIRCUIT CARD FOR INTEGRATED CIRCUITS |
DE1966877A1 (en) * | 1969-04-17 | 1974-10-31 | Siemens Ag | RELEASABLE ELECTRICAL CONNECTIONS BETWEEN MICRO-ASSEMBLIES AND / OR WIRING BOARDS |
FR2447101A1 (en) * | 1979-01-22 | 1980-08-14 | Defontaine Suzanne | Electrical contact between terminal groups in matrix - has magnetic contact discs. moving over conductive surfaces of nickel alloy, esp. for movement simulating that of chess board |
DE3315583A1 (en) * | 1983-04-29 | 1984-10-31 | Siemens AG, 1000 Berlin und 8000 München | AN ELECTRICAL COMPONENT-CARRYING, EASILY COOLABLE CIRCUIT MODULE |
FR2639154A1 (en) * | 1988-11-15 | 1990-05-18 | Thomson Csf | Connector for converting a specific integrated-circuit package with connection pads into a standard package with connection pins |
US4945399A (en) * | 1986-09-30 | 1990-07-31 | International Business Machines Corporation | Electronic package with integrated distributed decoupling capacitors |
US5093986A (en) * | 1990-02-05 | 1992-03-10 | Murata Manufacturing Co., Ltd. | Method of forming bump electrodes |
DE9213987U1 (en) * | 1992-02-13 | 1992-12-17 | Jaton Technology Co., Ltd., Hsi Chih, Taipeh, Tw | |
US5286926A (en) * | 1991-04-16 | 1994-02-15 | Ngk Spark Plug Co., Ltd. | Integrated circuit package and process for producing same |
US5303119A (en) * | 1991-07-25 | 1994-04-12 | Ncr Corporation | Interconnection system for integrated circuits |
US5341564A (en) * | 1992-03-24 | 1994-08-30 | Unisys Corporation | Method of fabricating integrated circuit module |
-
1995
- 1995-01-12 DE DE29500428U patent/DE29500428U1/en not_active Expired - Lifetime
Patent Citations (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CH447300A (en) * | 1966-01-20 | 1967-11-30 | Ibm | Process for the production of spherical solder balls on carrier plates |
DE1966877A1 (en) * | 1969-04-17 | 1974-10-31 | Siemens Ag | RELEASABLE ELECTRICAL CONNECTIONS BETWEEN MICRO-ASSEMBLIES AND / OR WIRING BOARDS |
DE2056193A1 (en) * | 1970-02-13 | 1971-08-19 | Elektromat Veb | Process for contacting electrical see clamping components |
DE2330732A1 (en) * | 1972-06-30 | 1974-01-10 | Ibm | CIRCUIT CARD FOR INTEGRATED CIRCUITS |
FR2447101A1 (en) * | 1979-01-22 | 1980-08-14 | Defontaine Suzanne | Electrical contact between terminal groups in matrix - has magnetic contact discs. moving over conductive surfaces of nickel alloy, esp. for movement simulating that of chess board |
DE3315583A1 (en) * | 1983-04-29 | 1984-10-31 | Siemens AG, 1000 Berlin und 8000 München | AN ELECTRICAL COMPONENT-CARRYING, EASILY COOLABLE CIRCUIT MODULE |
US4945399A (en) * | 1986-09-30 | 1990-07-31 | International Business Machines Corporation | Electronic package with integrated distributed decoupling capacitors |
FR2639154A1 (en) * | 1988-11-15 | 1990-05-18 | Thomson Csf | Connector for converting a specific integrated-circuit package with connection pads into a standard package with connection pins |
US5093986A (en) * | 1990-02-05 | 1992-03-10 | Murata Manufacturing Co., Ltd. | Method of forming bump electrodes |
US5286926A (en) * | 1991-04-16 | 1994-02-15 | Ngk Spark Plug Co., Ltd. | Integrated circuit package and process for producing same |
US5303119A (en) * | 1991-07-25 | 1994-04-12 | Ncr Corporation | Interconnection system for integrated circuits |
DE9213987U1 (en) * | 1992-02-13 | 1992-12-17 | Jaton Technology Co., Ltd., Hsi Chih, Taipeh, Tw | |
US5341564A (en) * | 1992-03-24 | 1994-08-30 | Unisys Corporation | Method of fabricating integrated circuit module |
Non-Patent Citations (3)
Title |
---|
JP 3-196475 A., In: Patents Abstracts of Japan, E-1136, Nov. 21, 1991, Vol.15, No. 459 * |
Packaging Concept Providing Parallel Substrate Build for C4 Modules. In: IBM Technical Disclosure Bulletin, Vol.37, No. 05, May 1994, S.83 * |
SCHRICKER, Ulrich: Modernes Multilayer-Design. In: Elektronik 15, 20.07,1990, S.78-81 * |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10352705A1 (en) * | 2003-11-12 | 2005-06-23 | Diehl Bgt Defence Gmbh & Co. Kg | Circuit arrangement, especially for use in space, has element, especially vacuum-tight housing on base element and at least one heat-generating component connected to housing to dissipate heat losses |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
R207 | Utility model specification |
Effective date: 19950511 |
|
R163 | Identified publications notified |
Effective date: 19950721 |
|
R150 | Term of protection extended to 6 years |
Effective date: 19980219 |
|
R079 | Amendment of ipc main class |
Free format text: PREVIOUS MAIN CLASS: H01R0009090000 Ipc: H01R0012320000 |
|
R151 | Term of protection extended to 8 years |
Effective date: 20010201 |
|
R152 | Term of protection extended to 10 years |
Effective date: 20030224 |
|
R071 | Expiry of right |