DE3277264D1 - Method of laser annealing a subsurface region in a semiconductor - Google Patents
Method of laser annealing a subsurface region in a semiconductorInfo
- Publication number
- DE3277264D1 DE3277264D1 DE8282105775T DE3277264T DE3277264D1 DE 3277264 D1 DE3277264 D1 DE 3277264D1 DE 8282105775 T DE8282105775 T DE 8282105775T DE 3277264 T DE3277264 T DE 3277264T DE 3277264 D1 DE3277264 D1 DE 3277264D1
- Authority
- DE
- Germany
- Prior art keywords
- semiconductor
- laser annealing
- subsurface region
- subsurface
- region
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/74—Making of localized buried regions, e.g. buried collector layers, internal connections substrate contacts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
- H01L21/268—Bombardment with radiation with high-energy radiation using electromagnetic radiation, e.g. laser radiation
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/092—Laser beam processing-diodes or transistor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/093—Laser beam treatment in general
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US06/281,267 US4379727A (en) | 1981-07-08 | 1981-07-08 | Method of laser annealing of subsurface ion implanted regions |
Publications (1)
Publication Number | Publication Date |
---|---|
DE3277264D1 true DE3277264D1 (en) | 1987-10-15 |
Family
ID=23076599
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE8282105775T Expired DE3277264D1 (en) | 1981-07-08 | 1982-06-29 | Method of laser annealing a subsurface region in a semiconductor |
Country Status (5)
Country | Link |
---|---|
US (1) | US4379727A (de) |
EP (1) | EP0069327B1 (de) |
JP (1) | JPS5810822A (de) |
CA (1) | CA1189768A (de) |
DE (1) | DE3277264D1 (de) |
Families Citing this family (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5823479A (ja) * | 1981-08-05 | 1983-02-12 | Fujitsu Ltd | 半導体装置の製造方法 |
JPS5856409A (ja) * | 1981-09-30 | 1983-04-04 | Toshiba Corp | 半導体装置の製造方法 |
US4698486A (en) * | 1984-02-28 | 1987-10-06 | Tamarack Scientific Co., Inc. | Method of heating semiconductor wafers in order to achieve annealing, silicide formation, reflow of glass passivation layers, etc. |
US4571348A (en) * | 1984-08-08 | 1986-02-18 | General Motors Corporation | Reducing hydrogen content of vacuum deposited films |
US4621411A (en) * | 1984-09-28 | 1986-11-11 | Texas Instruments Incorporated | Laser-enhanced drive in of source and drain diffusions |
US4666557A (en) * | 1984-12-10 | 1987-05-19 | Ncr Corporation | Method for forming channel stops in vertical semiconductor surfaces |
US5578520A (en) | 1991-05-28 | 1996-11-26 | Semiconductor Energy Laboratory Co., Ltd. | Method for annealing a semiconductor |
US5766344A (en) * | 1991-09-21 | 1998-06-16 | Semiconductor Energy Laboratory Co., Ltd. | Method for forming a semiconductor |
JPH06124913A (ja) * | 1992-06-26 | 1994-05-06 | Semiconductor Energy Lab Co Ltd | レーザー処理方法 |
JP3211394B2 (ja) * | 1992-08-13 | 2001-09-25 | ソニー株式会社 | 半導体装置の製造方法 |
JPH06232069A (ja) * | 1993-02-04 | 1994-08-19 | Semiconductor Energy Lab Co Ltd | 半導体装置の作製方法 |
GB9406900D0 (en) * | 1994-04-07 | 1994-06-01 | Philips Electronics Uk Ltd | Manufacture of electronic devices comprising thin -film transistors |
DE19511251A1 (de) * | 1995-03-27 | 1996-10-02 | Siemens Ag | Bipolarer Siliziumtransistor |
WO1999028960A1 (fr) * | 1997-11-28 | 1999-06-10 | Matsushita Electric Industrial Co., Ltd. | Procede et dispositif d'activation d'impuretes dans des semi-conducteurs |
US6417515B1 (en) | 2000-03-17 | 2002-07-09 | International Business Machines Corporation | In-situ ion implant activation and measurement apparatus |
US6594446B2 (en) * | 2000-12-04 | 2003-07-15 | Vortek Industries Ltd. | Heat-treating methods and systems |
CN100416243C (zh) * | 2001-12-26 | 2008-09-03 | 加拿大马特森技术有限公司 | 测量温度和热处理的方法及系统 |
DE10393962B4 (de) | 2002-12-20 | 2019-03-14 | Mattson Technology Inc. | Verfahren und Vorrichtung zum Stützen eines Werkstücks und zur Wärmebehandlung des Werkstücks |
WO2005059991A1 (en) * | 2003-12-19 | 2005-06-30 | Mattson Technology Canada Inc. | Apparatuses and methods for suppressing thermally induced motion of a workpiece |
TWI237857B (en) * | 2004-10-21 | 2005-08-11 | Nanya Technology Corp | Method of fabricating MOS transistor by millisecond anneal |
US7989888B2 (en) * | 2006-08-31 | 2011-08-02 | Infineon Technologies Autria AG | Semiconductor device with a field stop zone and process of producing the same |
US8454356B2 (en) * | 2006-11-15 | 2013-06-04 | Mattson Technology, Inc. | Systems and methods for supporting a workpiece during heat-treating |
FR2921752B1 (fr) * | 2007-10-01 | 2009-11-13 | Aplinov | Procede de chauffage d'une plaque par un flux lumineux. |
WO2009137940A1 (en) | 2008-05-16 | 2009-11-19 | Mattson Technology Canada, Inc. | Workpiece breakage prevention method and apparatus |
FR2938116B1 (fr) * | 2008-11-04 | 2011-03-11 | Aplinov | Procede et dispositif de chauffage d'une couche d'une plaque par amorcage et flux lumineux. |
WO2011096326A1 (ja) * | 2010-02-04 | 2011-08-11 | 富士電機システムズ株式会社 | 半導体素子の製造方法および半導体素子の製造装置 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4151008A (en) * | 1974-11-15 | 1979-04-24 | Spire Corporation | Method involving pulsed light processing of semiconductor devices |
US4111720A (en) * | 1977-03-31 | 1978-09-05 | International Business Machines Corporation | Method for forming a non-epitaxial bipolar integrated circuit |
US4230505A (en) * | 1979-10-09 | 1980-10-28 | Rca Corporation | Method of making an impatt diode utilizing a combination of epitaxial deposition, ion implantation and substrate removal |
US4269631A (en) * | 1980-01-14 | 1981-05-26 | International Business Machines Corporation | Selective epitaxy method using laser annealing for making filamentary transistors |
US4318752A (en) * | 1980-05-16 | 1982-03-09 | Bell Telephone Laboratories, Incorporated | Heterojunction semiconductor laser fabrication utilizing laser radiation |
-
1981
- 1981-07-08 US US06/281,267 patent/US4379727A/en not_active Expired - Lifetime
-
1982
- 1982-05-20 JP JP57084092A patent/JPS5810822A/ja active Granted
- 1982-05-28 CA CA000404043A patent/CA1189768A/en not_active Expired
- 1982-06-29 DE DE8282105775T patent/DE3277264D1/de not_active Expired
- 1982-06-29 EP EP82105775A patent/EP0069327B1/de not_active Expired
Also Published As
Publication number | Publication date |
---|---|
CA1189768A (en) | 1985-07-02 |
US4379727A (en) | 1983-04-12 |
EP0069327A3 (en) | 1984-09-12 |
EP0069327B1 (de) | 1987-09-09 |
JPS5810822A (ja) | 1983-01-21 |
JPS6244849B2 (de) | 1987-09-22 |
EP0069327A2 (de) | 1983-01-12 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |