DE3278227D1 - Sputtering system - Google Patents

Sputtering system

Info

Publication number: DE3278227D1
Authority: DE; Germany
Prior art keywords: sputtering system; sputtering
Prior art date: 1981-07-27
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired

Application number

DE8282104113T

Other languages

English (en)

Inventor

Joseph Skinner Logan

Steve Istvan Petvai

Cornel Rosu

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

International Business Machines Corp

Original Assignee

International Business Machines Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1981-07-27

Filing date

1982-05-12

Publication date

1988-04-14

Family has litigation

First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=23102977&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE3278227(D1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.

1982-05-12 Application filed by International Business Machines Corp filed Critical International Business Machines Corp

1988-04-14 Application granted granted Critical

1988-04-14 Publication of DE3278227D1 publication Critical patent/DE3278227D1/de

Status Expired legal-status Critical Current

Links

Classifications

- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3438—Electrodes other than cathode
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/02—Details
- H01J2237/0203—Protection arrangements
- H01J2237/0206—Extinguishing, preventing or controlling unwanted discharges
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/02—Details
- H01J2237/022—Avoiding or removing foreign or contaminating particles, debris or deposits on sample or tube

DE8282104113T 1981-07-27 1982-05-12 Sputtering system Expired DE3278227D1 (en)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
US06/287,452 US4362611A (en)	1981-07-27	1981-07-27	Quadrupole R.F. sputtering system having an anode/cathode shield and a floating target shield

Publications (1)

Publication Number	Publication Date
DE3278227D1 true DE3278227D1 (en)	1988-04-14

Family

ID=23102977

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
DE8282104113T Expired DE3278227D1 (en)	1981-07-27	1982-05-12	Sputtering system

Country Status (7)

Country	Link
US (1)	US4362611A (de)
EP (1)	EP0070982B1 (de)
JP (1)	JPS5819473A (de)
BR (1)	BR8203977A (de)
CA (1)	CA1163602A (de)
DE (1)	DE3278227D1 (de)
ES (1)	ES513335A0 (de)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US4461239A (en) *	1982-07-30	1984-07-24	Energy Conversion Devices, Inc.	Reduced capacitance electrode assembly
US4496448A (en) *	1983-10-13	1985-01-29	At&T Bell Laboratories	Method for fabricating devices with DC bias-controlled reactive ion etching
US4657654A (en) *	1984-05-17	1987-04-14	Varian Associates, Inc.	Targets for magnetron sputter device having separate confining magnetic fields to separate targets subject to separate discharges
US4569746A (en) *	1984-05-17	1986-02-11	Varian Associates, Inc.	Magnetron sputter device using the same pole piece for coupling separate confining magnetic fields to separate targets subject to separate discharges
US4595482A (en) *	1984-05-17	1986-06-17	Varian Associates, Inc.	Apparatus for and the method of controlling magnetron sputter device having separate confining magnetic fields to separate targets subject to separate discharges
US4606806A (en) *	1984-05-17	1986-08-19	Varian Associates, Inc.	Magnetron sputter device having planar and curved targets
JPH0668147B2 (ja) *	1985-02-28	1994-08-31	トリメデイアコ−ポレ−シヨン	薄膜記憶ディスクおよび方法
CN86104429A (zh) *	1985-07-05	1987-01-07	西屋电气公司	溅射镀膜设备的靶中阴极和接地屏蔽极的配置
US4610775A (en) *	1985-07-26	1986-09-09	Westinghouse Electric Corp.	Method and apparatus for clearing short-circuited, high-voltage cathodes in a sputtering chamber
US4818359A (en) *	1986-08-27	1989-04-04	International Business Machines Corporation	Low contamination RF sputter deposition apparatus
US4738761A (en) *	1986-10-06	1988-04-19	Microelectronics Center Of North Carolina	Shared current loop, multiple field apparatus and process for plasma processing
US4802968A (en) *	1988-01-29	1989-02-07	International Business Machines Corporation	RF plasma processing apparatus
US5045166A (en) *	1990-05-21	1991-09-03	Mcnc	Magnetron method and apparatus for producing high density ionic gas discharge
WO1992002659A1 (en) *	1990-08-10	1992-02-20	Viratec Thin Films, Inc.	Shielding for arc suppression in rotating magnetron sputtering systems
DE4117518C2 (de) *	1991-05-29	2000-06-21	Leybold Ag	Vorrichtung zum Sputtern mit bewegtem, insbesondere rotierendem Target
CH687111A5 (de) *	1992-05-26	1996-09-13	Balzers Hochvakuum	Verfahren zum Erzeugen einer Niederspannungsentladung, Vakuumbehandlungsanlage hierfuer sowie Anwendung des Verfahrens.
US5620577A (en) *	1993-12-30	1997-04-15	Viratec Thin Films, Inc.	Spring-loaded mount for a rotatable sputtering cathode
US5567289A (en) *	1993-12-30	1996-10-22	Viratec Thin Films, Inc.	Rotating floating magnetron dark-space shield and cone end
US5527439A (en) *	1995-01-23	1996-06-18	The Boc Group, Inc.	Cylindrical magnetron shield structure
US5736021A (en) *	1996-07-10	1998-04-07	Applied Materials, Inc.	Electrically floating shield in a plasma reactor
KR100273326B1 (ko) *	1998-12-04	2000-12-15	김영환	고주파 스퍼터링 장치 및 이를 이용한 박막형성방법
US6409896B2 (en) *	1999-12-01	2002-06-25	Applied Materials, Inc.	Method and apparatus for semiconductor wafer process monitoring
CN101542013B (zh) *	2007-06-04	2011-05-04	佳能安内华股份有限公司	形成薄膜的溅射设备
US8373427B2 (en) *	2010-02-10	2013-02-12	Skyworks Solutions, Inc.	Electron radiation monitoring system to prevent gold spitting and resist cross-linking during evaporation
US20130284589A1 (en) *	2012-04-30	2013-10-31	Youming Li	Radio frequency tuned substrate biased physical vapor deposition apparatus and method of operation
AU2016232864A1 (en) *	2015-03-18	2017-08-17	Vision Ease, Lp	Anode shield
US10896798B2 (en)	2016-08-01	2021-01-19	Koninklijke Philips N.V.	X-ray unit

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US3544445A (en) *	1966-09-01	1970-12-01	Bendix Corp	Floating shield in a triode sputtering apparatus protecting the base from the discharge
US3507774A (en) *	1967-06-02	1970-04-21	Nat Res Corp	Low energy sputtering apparatus for operation below one micron pressure
FR2082505A5 (de) *	1970-03-18	1971-12-10	Radiotechnique Compelec
DE2149606C3 (de) *	1971-10-05	1979-12-06	Thorn, Gernot, Dipl.-Ing., 6450 Hanau	Vorrichtung zur Beschichtung von Substraten durch Hochfrequenz-Kathodenzerstäubung
US3913520A (en) *	1972-08-14	1975-10-21	Precision Thin Film Corp	High vacuum deposition apparatus
DE2307649B2 (de) *	1973-02-16	1980-07-31	Robert Bosch Gmbh, 7000 Stuttgart	Anordnung zum Aufstäuben verschiedener Materialien auf einem Substrat
GB1443827A (en) *	1973-04-27	1976-07-28	Triplex Safety Glass Co	Reactive sputtering apparatus and cathode units therefor
US3864239A (en) *	1974-04-22	1975-02-04	Nasa	Multitarget sequential sputtering apparatus
US4014779A (en) *	1974-11-01	1977-03-29	Coulter Information Systems, Inc.	Sputtering apparatus
US4060470A (en) *	1974-12-06	1977-11-29	Clarke Peter J	Sputtering apparatus and method
US4116793A (en) *	1974-12-23	1978-09-26	Telic Corporation	Glow discharge method and apparatus
FR2324755A1 (fr) *	1975-09-19	1977-04-15	Anvar	Dispositif de pulverisation cathodique de grande vitesse de depot
US4038171A (en) *	1976-03-31	1977-07-26	Battelle Memorial Institute	Supported plasma sputtering apparatus for high deposition rate over large area
US4131533A (en) *	1977-12-30	1978-12-26	International Business Machines Corporation	RF sputtering apparatus having floating anode shield
US4169031A (en) *	1978-01-13	1979-09-25	Polyohm, Inc.	Magnetron sputter cathode assembly
CH636647A5 (de) *	1979-02-01	1983-06-15	Balzers Hochvakuum	Vakuumbedampfungsanlage.

1981
- 1981-07-27 US US06/287,452 patent/US4362611A/en not_active Expired - Fee Related
1982
- 1982-05-12 EP EP82104113A patent/EP0070982B1/de not_active Expired
- 1982-05-12 DE DE8282104113T patent/DE3278227D1/de not_active Expired
- 1982-05-17 JP JP57081725A patent/JPS5819473A/ja active Granted
- 1982-05-28 CA CA000404044A patent/CA1163602A/en not_active Expired
- 1982-06-22 ES ES513335A patent/ES513335A0/es active Granted
- 1982-07-08 BR BR8203977A patent/BR8203977A/pt unknown

Also Published As

Publication number	Publication date
US4362611A (en)	1982-12-07
EP0070982A3 (en)	1983-11-30
CA1163602A (en)	1984-03-13
EP0070982B1 (de)	1988-03-09
ES8307536A1 (es)	1983-08-01
JPS5819473A (ja)	1983-02-04
BR8203977A (pt)	1983-07-05
ES513335A0 (es)	1983-08-01
JPS6134510B2 (de)	1986-08-08
EP0070982A2 (de)	1983-02-09

Legal Events

Date	Code	Title	Description
1988-11-10	8363	Opposition against the patent
1994-03-24	8331	Complete revocation

Publication	Publication Date	Title
DE3278227D1 (en)	1988-04-14	Sputtering system
GB8420735D0 (en)	1984-09-19	Semiconductor-memory system
AU561101B2 (en)	1987-04-30	Communicating system
DE3278427D1 (en)	1988-06-09	Sputtering apparatus
MY8600740A (en)	1986-12-31	Trasportation system
GB2091540B (en)	1984-08-30	Shelving system
GB2108722B (en)	1986-02-26	Pen-lift system
CS913482A2 (en)	1984-06-18	System zaveseni pro sprazene napravy podvozku
GB2097286B (en)	1984-08-30	Hemiodialysis system
JPS57187675A (en)	1982-11-18	Radar system
GB2093990B (en)	1985-05-22	Spectroanalytical system
GB2101286B (en)	1984-08-15	Refrigeration system
GB2110893B (en)	1985-10-16	Controlled-phase system
GB2110719B (en)	1985-10-30	Sputtering apparatus
GB2093306B (en)	1985-07-24	Multiple radar combination system
IL65021A0 (en)	1982-04-30	Multiple control system
IL64800A0 (en)	1982-03-31	Switching system
GB2134659B (en)	1985-06-19	Gear-indicating system
GB8425489D0 (en)	1984-11-14	Microlithographical system
GB2106692B (en)	1985-09-18	Display system
JPS57189194A (en)	1982-11-20	Music system
JPS57146287A (en)	1982-09-09	Display system
DE3261653D1 (en)	1985-02-07	Sputtering apparatus
JPS57130198A (en)	1982-08-12	Tracking system
JPS57161786A (en)	1982-10-05	Display system