DE3366507D1 - Method of forming electroconductive domains in integrated monolithic semiconductor devices, and high package density semiconductor device manufactured by said method - Google Patents
Method of forming electroconductive domains in integrated monolithic semiconductor devices, and high package density semiconductor device manufactured by said methodInfo
- Publication number
- DE3366507D1 DE3366507D1 DE8383810057T DE3366507T DE3366507D1 DE 3366507 D1 DE3366507 D1 DE 3366507D1 DE 8383810057 T DE8383810057 T DE 8383810057T DE 3366507 T DE3366507 T DE 3366507T DE 3366507 D1 DE3366507 D1 DE 3366507D1
- Authority
- DE
- Germany
- Prior art keywords
- conductive film
- device manufactured
- semiconductor device
- openings
- semiconductor devices
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
- H01L21/76886—Modifying permanently or temporarily the pattern or the conductivity of conductive members, e.g. formation of alloys, reduction of contact resistances
- H01L21/76892—Modifying permanently or temporarily the pattern or the conductivity of conductive members, e.g. formation of alloys, reduction of contact resistances modifying the pattern
- H01L21/76894—Modifying permanently or temporarily the pattern or the conductivity of conductive members, e.g. formation of alloys, reduction of contact resistances modifying the pattern using a laser, e.g. laser cutting, laser direct writing, laser repair
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
- H01L21/76886—Modifying permanently or temporarily the pattern or the conductivity of conductive members, e.g. formation of alloys, reduction of contact resistances
- H01L21/76888—By rendering at least a portion of the conductor non conductive, e.g. oxidation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/525—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/046—Electron beam treatment of devices
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/093—Laser beam treatment in general
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/94—Laser ablative material removal
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CH103682 | 1982-02-19 |
Publications (1)
Publication Number | Publication Date |
---|---|
DE3366507D1 true DE3366507D1 (en) | 1986-11-06 |
Family
ID=4200953
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE8383810057T Expired DE3366507D1 (en) | 1982-02-19 | 1983-02-09 | Method of forming electroconductive domains in integrated monolithic semiconductor devices, and high package density semiconductor device manufactured by said method |
Country Status (5)
Country | Link |
---|---|
US (2) | US4691434A (de) |
EP (1) | EP0088045B1 (de) |
JP (1) | JPS58202549A (de) |
AT (1) | ATE22632T1 (de) |
DE (1) | DE3366507D1 (de) |
Families Citing this family (31)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4691434A (en) * | 1982-02-19 | 1987-09-08 | Lasarray Holding Ag | Method of making electrically conductive regions in monolithic semiconductor devices as applied to a semiconductor device |
US4979012A (en) * | 1984-10-05 | 1990-12-18 | Honeywell Inc. | Semiconductor device with bonding pad contacts |
US4924287A (en) * | 1985-01-20 | 1990-05-08 | Avner Pdahtzur | Personalizable CMOS gate array device and technique |
US4778771A (en) * | 1985-02-14 | 1988-10-18 | Nec Corporation | Process of forming input/output wiring areas for semiconductor integrated circuit |
CH670211A5 (de) * | 1986-06-25 | 1989-05-31 | Lasarray Holding Ag | |
JPS63102342A (ja) * | 1986-10-20 | 1988-05-07 | Mitsubishi Electric Corp | 半導体集積回路装置の配線構造 |
IL82113A (en) * | 1987-04-05 | 1992-08-18 | Zvi Orbach | Fabrication of customized integrated circuits |
US4872140A (en) * | 1987-05-19 | 1989-10-03 | Gazelle Microcircuits, Inc. | Laser programmable memory array |
JP2690929B2 (ja) * | 1988-02-26 | 1997-12-17 | 株式会社日立製作所 | Mosトランジスタ間の配線方法 |
US5139963A (en) * | 1988-07-02 | 1992-08-18 | Hitachi, Ltd. | Method and a system for assisting mending of a semiconductor integrated circuit, and a wiring structure and a wiring method suited for mending a semiconductor integrated circuit |
US4989063A (en) * | 1988-12-09 | 1991-01-29 | The United States Of America As Represented By The Secretary Of The Air Force | Hybrid wafer scale microcircuit integration |
US5008213A (en) * | 1988-12-09 | 1991-04-16 | The United States Of America As Represented By The Secretary Of The Air Force | Hybrid wafer scale microcircuit integration |
US4974048A (en) * | 1989-03-10 | 1990-11-27 | The Boeing Company | Integrated circuit having reroutable conductive paths |
US5021856A (en) * | 1989-03-15 | 1991-06-04 | Plessey Overseas Limited | Universal cell for bipolar NPN and PNP transistors and resistive elements |
US5217916A (en) * | 1989-10-03 | 1993-06-08 | Trw Inc. | Method of making an adaptive configurable gate array |
US5459340A (en) * | 1989-10-03 | 1995-10-17 | Trw Inc. | Adaptive configurable gate array |
US5037771A (en) * | 1989-11-28 | 1991-08-06 | Cross-Check Technology, Inc. | Method for implementing grid-based crosscheck test structures and the structures resulting therefrom |
EP0433720A3 (en) * | 1989-12-22 | 1992-08-26 | Siemens Aktiengesellschaft | Method of applying a solder stop coating on printed circuit boards |
JPH06314692A (ja) * | 1993-04-27 | 1994-11-08 | Intel Corp | 集積回路におけるビア/接点被覆範囲を改善する方法 |
US5440154A (en) * | 1993-07-01 | 1995-08-08 | Lsi Logic Corporation | Non-rectangular MOS device configurations for gate array type integrated circuits |
US5874754A (en) * | 1993-07-01 | 1999-02-23 | Lsi Logic Corporation | Microelectronic cells with bent gates and compressed minimum spacings, and method of patterning interconnections for the gates |
US5585016A (en) * | 1993-07-20 | 1996-12-17 | Integrated Device Technology, Inc. | Laser patterned C-V dot |
US5557534A (en) * | 1995-01-03 | 1996-09-17 | Xerox Corporation | Forming array with metal scan lines to control semiconductor gate lines |
US5911850A (en) * | 1997-06-20 | 1999-06-15 | International Business Machines Corporation | Separation of diced wafers |
US5840627A (en) * | 1997-03-24 | 1998-11-24 | Clear Logic, Inc. | Method of customizing integrated circuits using standard masks and targeting energy beams for single resist development |
US6060330A (en) * | 1997-03-24 | 2000-05-09 | Clear Logic, Inc. | Method of customizing integrated circuits by selective secondary deposition of interconnect material |
US5985518A (en) * | 1997-03-24 | 1999-11-16 | Clear Logic, Inc. | Method of customizing integrated circuits using standard masks and targeting energy beams |
US5885749A (en) * | 1997-06-20 | 1999-03-23 | Clear Logic, Inc. | Method of customizing integrated circuits by selective secondary deposition of layer interconnect material |
US5953577A (en) * | 1998-09-29 | 1999-09-14 | Clear Logic, Inc. | Customization of integrated circuits |
US7708993B2 (en) | 1999-02-03 | 2010-05-04 | Amgen Inc. | Polypeptides involved in immune response |
EP1631137A4 (de) * | 2004-03-30 | 2009-05-27 | Panasonic Corp | Modulkomponente und verfahren zur ihrer herstellung |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3304594A (en) * | 1963-08-15 | 1967-02-21 | Motorola Inc | Method of making integrated circuit by controlled process |
US4000502A (en) * | 1973-11-05 | 1976-12-28 | General Dynamics Corporation | Solid state radiation detector and process |
JPS5632777B2 (de) * | 1974-05-10 | 1981-07-30 | ||
DE2521543A1 (de) * | 1974-05-16 | 1975-11-27 | Crosfield Electronics Ltd | Verfahren und vorrichtung zur wiedergabe von bildern |
NL7413977A (nl) * | 1974-10-25 | 1976-04-27 | Philips Nv | Aanbrengen van een geleiderlaagpatroon met op een geringe onderlinge afstand gelegen delen, in het bijzonder bij de vervaardiging van half- geleiderinrichtingen. |
US4161662A (en) * | 1976-01-22 | 1979-07-17 | Motorola, Inc. | Standardized digital logic chip |
US4207585A (en) * | 1976-07-01 | 1980-06-10 | Texas Instruments Incorporated | Silicon gate MOS ROM |
US4181563A (en) * | 1977-03-31 | 1980-01-01 | Citizen Watch Company Limited | Process for forming electrode pattern on electro-optical display device |
US4240094A (en) * | 1978-03-20 | 1980-12-16 | Harris Corporation | Laser-configured logic array |
US4193687A (en) * | 1978-06-05 | 1980-03-18 | Rockwell International Corporation | High resolution alignment technique and apparatus |
DE2927824A1 (de) * | 1978-07-12 | 1980-01-31 | Vlsi Technology Res Ass | Halbleitervorrichtungen und ihre herstellung |
US4231149A (en) * | 1978-10-10 | 1980-11-04 | Texas Instruments Incorporated | Narrow band-gap semiconductor CCD imaging device and method of fabrication |
US4243866A (en) * | 1979-01-11 | 1981-01-06 | International Business Machines Corporation | Method and apparatus for forming a variable size electron beam |
EP0020116B1 (de) * | 1979-05-24 | 1984-03-14 | Fujitsu Limited | Halbleitervorrichtung vom "MASTERSLICE"-Typ und Herstellungsverfahren |
US4310743A (en) * | 1979-09-24 | 1982-01-12 | Hughes Aircraft Company | Ion beam lithography process and apparatus using step-and-repeat exposure |
GB2064226B (en) * | 1979-11-23 | 1983-05-11 | Ferranti Ltd | Trimming of a circuit element layer |
JPS6024591B2 (ja) * | 1979-12-06 | 1985-06-13 | セイコーインスツルメンツ株式会社 | 静電誘導トランジスタ読み出し専用記憶装置 |
JPS5772234A (en) * | 1980-10-20 | 1982-05-06 | Matsushita Electric Ind Co Ltd | Production of electrode structure |
US4691434A (en) * | 1982-02-19 | 1987-09-08 | Lasarray Holding Ag | Method of making electrically conductive regions in monolithic semiconductor devices as applied to a semiconductor device |
FR2524206B1 (fr) * | 1982-03-26 | 1985-12-13 | Thomson Csf Mat Tel | Circuit integre prediffuse, et procede d'interconnexion des cellules de ce circuit |
US4649413A (en) * | 1983-08-29 | 1987-03-10 | Texas Instruments Incorporated | MOS integrated circuit having a metal programmable matrix |
-
1983
- 1983-02-04 US US06/463,817 patent/US4691434A/en not_active Expired - Fee Related
- 1983-02-09 EP EP83810057A patent/EP0088045B1/de not_active Expired
- 1983-02-09 DE DE8383810057T patent/DE3366507D1/de not_active Expired
- 1983-02-09 AT AT83810057T patent/ATE22632T1/de not_active IP Right Cessation
- 1983-02-18 JP JP58024925A patent/JPS58202549A/ja active Granted
-
1985
- 1985-07-11 US US06/754,007 patent/US4689657A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP0088045A1 (de) | 1983-09-07 |
EP0088045B1 (de) | 1986-10-01 |
ATE22632T1 (de) | 1986-10-15 |
JPH0572745B2 (de) | 1993-10-12 |
US4689657A (en) | 1987-08-25 |
JPS58202549A (ja) | 1983-11-25 |
US4691434A (en) | 1987-09-08 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |