DE3379238D1 - Specimen mounting adhesive composition - Google Patents

Specimen mounting adhesive composition

Info

Publication number
DE3379238D1
DE3379238D1 DE8383305305T DE3379238T DE3379238D1 DE 3379238 D1 DE3379238 D1 DE 3379238D1 DE 8383305305 T DE8383305305 T DE 8383305305T DE 3379238 T DE3379238 T DE 3379238T DE 3379238 D1 DE3379238 D1 DE 3379238D1
Authority
DE
Germany
Prior art keywords
adhesive composition
specimen mounting
mounting adhesive
specimen
composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8383305305T
Other languages
English (en)
Inventor
Leonard Ornstein
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Icahn School of Medicine at Mount Sinai
Original Assignee
Mount Sinai School of Medicine
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mount Sinai School of Medicine filed Critical Mount Sinai School of Medicine
Application granted granted Critical
Publication of DE3379238D1 publication Critical patent/DE3379238D1/de
Expired legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N1/00—Sampling; Preparing specimens for investigation
    • G01N1/28—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
    • G01N1/36—Embedding or analogous mounting of samples
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C09J163/10—Epoxy resins modified by unsaturated compounds
DE8383305305T 1982-09-13 1983-09-12 Specimen mounting adhesive composition Expired DE3379238D1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US41725482A 1982-09-13 1982-09-13

Publications (1)

Publication Number Publication Date
DE3379238D1 true DE3379238D1 (en) 1989-03-30

Family

ID=23653200

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8383305305T Expired DE3379238D1 (en) 1982-09-13 1983-09-12 Specimen mounting adhesive composition

Country Status (6)

Country Link
US (1) US5444105A (de)
EP (1) EP0104825B1 (de)
JP (1) JPS59117571A (de)
AU (1) AU577261B2 (de)
CA (1) CA1338542C (de)
DE (1) DE3379238D1 (de)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3426043A1 (de) * 1984-07-14 1986-01-16 Kulzer & Co GmbH, 6393 Wehrheim Photopolymerisierbares material fuer das einbetten von schliffproben
JPH02142813A (ja) * 1988-09-30 1990-05-31 Westinghouse Electric Corp <We> 紫外線硬化型樹脂組成物
WO1996040506A1 (en) * 1995-06-07 1996-12-19 Jacques Michael Casparian Method of optimizing tissue for histopathologic examination
US6087134A (en) * 1997-01-14 2000-07-11 Applied Imaging Corporation Method for analyzing DNA from a rare cell in a cell population
US6110761A (en) * 1997-08-05 2000-08-29 Micron Technology, Inc. Methods for simultaneously electrically and mechanically attaching lead frames to semiconductor dice and the resulting elements
US6097092A (en) * 1998-04-22 2000-08-01 International Business Machines Corporation Freestanding multilayer IC wiring structure
US6670719B2 (en) 1999-08-25 2003-12-30 Micron Technology, Inc. Microelectronic device package filled with liquid or pressurized gas and associated method of manufacture
US7335965B2 (en) 1999-08-25 2008-02-26 Micron Technology, Inc. Packaging of electronic chips with air-bridge structures
US6709968B1 (en) * 2000-08-16 2004-03-23 Micron Technology, Inc. Microelectronic device with package with conductive elements and associated method of manufacture
US6433413B1 (en) 2001-08-17 2002-08-13 Micron Technology, Inc. Three-dimensional multichip module
US6747347B2 (en) * 2001-08-30 2004-06-08 Micron Technology, Inc. Multi-chip electronic package and cooling system
US6686654B2 (en) * 2001-08-31 2004-02-03 Micron Technology, Inc. Multiple chip stack structure and cooling system
US6620638B1 (en) 2002-06-05 2003-09-16 Micron Technology, Inc. Testing of multi-chip electronic modules
DE10359705A1 (de) * 2003-12-18 2005-07-14 Wacker-Chemie Gmbh Additionsvernetzende Siliconharzzusammensetzungen
US7300821B2 (en) * 2004-08-31 2007-11-27 Micron Technology, Inc. Integrated circuit cooling and insulating device and method
US10473557B2 (en) 2015-06-30 2019-11-12 Clarapath, Inc. Method, system, and device for automating transfer of tape to microtome sections
US10571368B2 (en) 2015-06-30 2020-02-25 Clarapath, Inc. Automated system and method for advancing tape to transport cut tissue sections
US10796781B2 (en) 2015-12-07 2020-10-06 Clarapath, Inc. Spatial genomics with co-registered histology
US10724929B2 (en) 2016-05-13 2020-07-28 Clarapath, Inc. Automated tissue sectioning and storage system
DE102016009908A1 (de) * 2016-08-18 2018-02-22 Orsatec Gmbh UV-härtbares Eindeckmittel
WO2019110078A1 (en) 2017-12-06 2019-06-13 Orsatec Gmbh Uv curable mounting medium
CN109705786A (zh) * 2018-12-26 2019-05-03 上海熙邦新材料有限公司 光通信器件用粘结剂
CN111662654A (zh) * 2020-07-23 2020-09-15 北京高盟新材料股份有限公司 一种长操作时间双组份丙烯酸酯结构胶及其制备方法
CN113484109A (zh) * 2021-06-30 2021-10-08 艾佧科技(北京)有限公司 一种制备植入活泼金属骨组织磨片的新方法

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3450613A (en) * 1964-03-09 1969-06-17 Bausch & Lomb Epoxy adhesive containing acrylic acid-epoxy reaction products and photosensitizers
US3466209A (en) * 1964-07-15 1969-09-09 Newton G Leveskis Method of preparing microscope slides using terpolymers of vinyl benzene;methyl methacrylate,and acrylate ester
US3709866A (en) * 1970-06-01 1973-01-09 Dentsply Int Inc Photopolymerizable dental products
JPS4826844B1 (de) * 1970-11-17 1973-08-16
US4165265A (en) * 1973-07-17 1979-08-21 Nippon Paint Co., Ltd. Multi-stage irradiation method of curing a photocurable coating composition
JPS5069143A (de) * 1973-10-09 1975-06-09
US3891327A (en) * 1973-11-01 1975-06-24 Grace W R & Co Mounted slides and method of securing a cover glass to a glass slide having a specimen thereon
US3939019A (en) * 1974-08-02 1976-02-17 Pickett John E P Covering apparatus and method for film mounted serial tissue sections
JPS51125138A (en) * 1974-08-05 1976-11-01 Chem Kagaku Kogyosho:Kk Thermosetting adhesive composition showing tackiness at normal tempera tvre and conpition
US4052282A (en) * 1975-10-08 1977-10-04 Mitsubishi Petrochemical Co., Ltd. Photocurable flexible orthopedic bandage
US4257346A (en) * 1976-12-10 1981-03-24 Technicon Instruments Corp. Apparatus for mounting tissue sections with an U.V. light curable mounting medium
US4120991A (en) * 1976-12-10 1978-10-17 Technicon Instruments Corporation Process for mounting tissue sections with an U.V. light curable mounting medium
JPS605627B2 (ja) * 1977-03-25 1985-02-13 積水化学工業株式会社 熱硬化しうる感圧性接着剤
DE2862131D1 (en) * 1978-12-21 1983-01-20 Freudenberg Carl Fa Process for bonding non-woven fabrics
FR2456134A1 (fr) * 1979-05-10 1980-12-05 Commissariat Energie Atomique Composition de colle utilisable notamment pour assembler des elements en materiaux identiques ou differents
US4287255A (en) * 1979-09-06 1981-09-01 Avery International Corporation Reinforced adhesive tapes
JPS56108935A (en) * 1980-01-31 1981-08-28 Canon Inc Method for making sample for microscopic observation
US4317858A (en) * 1980-06-27 1982-03-02 Westinghouse Electric Corp. Ultraviolet curable solvent-free wire enamel blends
MX173523B (es) * 1981-11-02 1994-03-11 Gencorp Inc Mejoras en composicion de revestimiento termoendurecible y metodo
JPS58167695A (ja) * 1982-03-29 1983-10-03 Arai Pump Mfg Co Ltd 摺動部用部材

Also Published As

Publication number Publication date
JPH0555557B2 (de) 1993-08-17
US5444105A (en) 1995-08-22
EP0104825A1 (de) 1984-04-04
CA1338542C (en) 1996-08-20
AU1869683A (en) 1984-03-22
JPS59117571A (ja) 1984-07-06
AU577261B2 (en) 1988-09-22
EP0104825B1 (de) 1989-02-22

Similar Documents

Publication Publication Date Title
GB8309937D0 (en) Adhesive composition
DE3379238D1 (en) Specimen mounting adhesive composition
DE3366703D1 (en) Adhesive compositions
DE3460838D1 (en) Adhesive composition
DE3463779D1 (en) Adhesive compositions
DE3464062D1 (en) Adhesive compositions
GB8304216D0 (en) Adhesive blends
IE801812L (en) Adhesive composition
DE3371914D1 (en) Hot-melt adhesive composition
JPS57192476A (en) Adhesive composition
JPS5747369A (en) Adhesive composition
DE3375153D1 (en) Two-part self-indicating adhesive composition
JPS5751770A (en) Adhesive composition
DE3269173D1 (en) Adhesive composition
JPS5780469A (en) Adhesive composition
ZA847799B (en) Composition usable as adhesive
GB8315882D0 (en) Adhesive composition
GB8310453D0 (en) Adhesive compositions
AU1991583A (en) Adhesive composition
GB2093856B (en) Adhesive compositions
GB8302707D0 (en) Adhesive composition
ZA815601B (en) Adhesive composition
GB2134913B (en) Adhesive compositions
GB2141726B (en) Adhesive compositions
ZA833048B (en) Adhesive composition

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee