DE3465033D1 - Improvements in or relating to vapour phase soldering - Google Patents

Improvements in or relating to vapour phase soldering

Info

Publication number
DE3465033D1
DE3465033D1 DE8484303050T DE3465033T DE3465033D1 DE 3465033 D1 DE3465033 D1 DE 3465033D1 DE 8484303050 T DE8484303050 T DE 8484303050T DE 3465033 T DE3465033 T DE 3465033T DE 3465033 D1 DE3465033 D1 DE 3465033D1
Authority
DE
Germany
Prior art keywords
sub
relating
vapour phase
phase soldering
vapour bath
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8484303050T
Other languages
English (en)
Inventor
Colin Robert Sargent
Keith Brierley
David Edward Mudge Wotton
Paul Leslie Coe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ISC Chemicals Ltd
Original Assignee
ISC Chemicals Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ISC Chemicals Ltd filed Critical ISC Chemicals Ltd
Application granted granted Critical
Publication of DE3465033D1 publication Critical patent/DE3465033D1/de
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/012—Soldering with the use of hot gas
    • B23K1/015—Vapour-condensation soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/38—Selection of media, e.g. special atmospheres for surrounding the working area
    • B23K35/386—Selection of media, e.g. special atmospheres for surrounding the working area for condensation soldering
DE8484303050T 1983-05-06 1984-05-04 Improvements in or relating to vapour phase soldering Expired DE3465033D1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB838312503A GB8312503D0 (en) 1983-05-06 1983-05-06 Vapour phase soldering

Publications (1)

Publication Number Publication Date
DE3465033D1 true DE3465033D1 (en) 1987-09-03

Family

ID=10542287

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8484303050T Expired DE3465033D1 (en) 1983-05-06 1984-05-04 Improvements in or relating to vapour phase soldering

Country Status (10)

Country Link
US (1) US4549686A (de)
EP (1) EP0125129B1 (de)
JP (1) JPS59212165A (de)
KR (1) KR910007786B1 (de)
AT (1) ATE28588T1 (de)
DE (1) DE3465033D1 (de)
GB (3) GB8312503D0 (de)
HK (1) HK22787A (de)
MY (1) MY8700250A (de)
ZA (1) ZA843176B (de)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IT1184362B (it) * 1985-03-06 1987-10-28 Montefluos Spa Procedimento per effittuare la saldatura di componenti elettronici su un supporto
US4728023A (en) * 1986-01-22 1988-03-01 Mcdonnell Douglas Corporation Rosin-free solder composition
US4692114A (en) * 1986-03-26 1987-09-08 Dynapert-Htc Corp. Vapor level control for vapor processing system
US4747533A (en) * 1986-04-28 1988-05-31 International Business Machines Corporation Bonding method and apparatus
GB8612972D0 (en) * 1986-05-28 1986-07-02 Isc Chemicals Ltd Vapour-phase soldering
GB8615400D0 (en) * 1986-06-24 1986-07-30 Isc Chemicals Ltd Flourinated polycyclic compounds
US4721578A (en) * 1986-10-06 1988-01-26 E. I. Du Pont De Nemours And Company Perfluorinated polypropylene oxide compounds for vapor phase heat transfer processes
US4801761A (en) * 1987-02-20 1989-01-31 Air Products And Chemicals, Inc. Perfluoro-1,1-di(orthoxylyl)alkyl compounds
US4777304A (en) * 1987-08-25 1988-10-11 Air Products & Chemicals, Inc. Perfluorinated butyl derivative compounds
US4925992A (en) * 1987-08-25 1990-05-15 Air Products And Chemicals, Inc. Perfluorinated 2-ISO propyl derivative compounds
US4881682A (en) * 1987-08-25 1989-11-21 Air Products And Chemicals, Inc. Vapor phase soldering with perfluorinated butyl derivative compounds
US4873315A (en) * 1987-08-25 1989-10-10 Air Products And Chemicals, Inc. Perfluorinated propyl derivative compounds
US4956390A (en) * 1987-08-25 1990-09-11 Air Products And Chemicals, Inc. Gas transport employing perfluorobutyldecalin
US4849553A (en) * 1988-08-03 1989-07-18 Air Products And Chemicals, Inc. Perfluorinated dibutyl derivatives compounds
US4827053A (en) * 1988-08-03 1989-05-02 Air Products And Chemicals, Inc. Perfluorinated Di-isopropylmethyl decalin
AU4406289A (en) * 1988-09-28 1990-04-18 Exfluor Research Corporation Perfluoroheptaglyme - an improved vapor-phase soldering fluid
US4929283A (en) * 1989-03-07 1990-05-29 Air Products And Chemicals, Inc. Vapor phase artificial aging of metal alloys using fluorochemicals
US4940072A (en) * 1989-05-31 1990-07-10 Air Products And Chemicals, Inc. Removing pattern material from investment casting molds
CA2026165A1 (en) * 1989-10-19 1991-04-20 John C. Hansen Perfluoro-n,n,n',n'-tetrapropyldiaminopropane and use thereof in vapor phase heating
US5976629A (en) * 1996-08-30 1999-11-02 Wood; Edward Russell Coating compositions
US6247639B1 (en) * 1998-04-29 2001-06-19 Medallion Technology, Llc Fixed-gap solder reflow method

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US30399A (en) * 1860-10-16 Gas-kegttlatob
US3947240A (en) * 1974-11-01 1976-03-30 Western Electric Company, Inc. Method and apparatus for generating a vapor for soldering fusing or brazing articles
JPS5812509B2 (ja) * 1975-09-20 1983-03-08 株式会社日立製作所 カイホウガタフツトウレイキヤクソウチ
US4022371A (en) * 1976-06-14 1977-05-10 International Business Machines Corporation Vapor bonding method
USRE30399E (en) 1977-08-19 1980-09-09 Western Electric Co., Inc. Method for soldering, fusing or brazing
US4187974A (en) * 1978-03-13 1980-02-12 Western Electric Company, Inc. Condensation soldering facility
GB2110204A (en) * 1981-11-26 1983-06-15 Isc Chemicals Ltd Perfluoro(alkylcyclohexane) mixtures for use in vapour soldering

Also Published As

Publication number Publication date
EP0125129A3 (en) 1985-08-21
GB2139132B (en) 1986-08-20
EP0125129B1 (de) 1987-07-29
JPS6333939B2 (de) 1988-07-07
MY8700250A (en) 1987-12-31
ZA843176B (en) 1985-12-24
KR910007786B1 (ko) 1991-10-02
HK22787A (en) 1987-03-20
EP0125129A2 (de) 1984-11-14
GB8409634D0 (en) 1984-05-23
JPS59212165A (ja) 1984-12-01
GB8411470D0 (en) 1984-06-13
GB8312503D0 (en) 1983-06-08
ATE28588T1 (de) 1987-08-15
KR840009237A (ko) 1984-12-26
US4549686A (en) 1985-10-29
GB2139132A (en) 1984-11-07

Similar Documents

Publication Publication Date Title
DE3465033D1 (en) Improvements in or relating to vapour phase soldering
EP0649699A3 (de) Verfahren, Vorrichtung zum Löten von elektronischen Baugruppen auf Leiterplatten, Zusammensetzen von diesen Baugruppen und durch Löten enthaltene Leiterplatten.
GB2094203B (en) Method of soldering electronic components to metallized substrates
PT78971B (en) Method of making high metal content circuit patterns on plastic boards
EP0257792A3 (de) Chemische Zusammensetzung eines Mittels und Verfahren zum Abziehen von Filmen von gedruckten Schaltungen
CA2368384A1 (en) A control method for copper density in a solder dipping bath
JPS5555598A (en) Method of soldering to printed circuit board
Keegan et al. Advantages of Nitrogen-Inerted Wave Soldering
Bunning Electroless Nickel--Immersion Gold-Surfaces for High Value Printed Circuit Boards
JPS56115599A (en) Method of soldering electronic circuit component on printed circuit board
JPS56116693A (en) Method of rigidly soldering parts on bothhside circuit board
DE69120937D1 (de) Verfahren zur herstellung von einer gedruckten leiterplatte
JPS57107094A (en) Method of soldering through hole printed circuit board
JPS5567188A (en) Method of soldering printed circuit board
WO1991019414A3 (de) Verfahren zum tauchbeloten von leiterplatten
JPS57208193A (en) Method of soldering printed circuit board
JPS5712597A (en) Method of soldering circuit board
JPS56144597A (en) Method of soldering printed circuit board
JPS54110467A (en) Method of soldering printed circuit board
JPS53147264A (en) Method of producing printed circuit wiring board treated for preventing solder of soldered portion of electronic parts or like from flowing out
LeBlanc Simplifying SMT adhesive selection for component placement machines.
JPS57174000A (en) Method of soldering printed circuit board
JPS57173999A (en) Method of soldering printed circuit board
JPS56112796A (en) Method of soldering printed circuit board
JPS56167394A (en) Method of soldering circuit board

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee