DE3525702A1 - Method for protecting surfaces which in the beam direction lie close behind a point to be worked by means of the laser - Google Patents

Method for protecting surfaces which in the beam direction lie close behind a point to be worked by means of the laser

Info

Publication number
DE3525702A1
DE3525702A1 DE19853525702 DE3525702A DE3525702A1 DE 3525702 A1 DE3525702 A1 DE 3525702A1 DE 19853525702 DE19853525702 DE 19853525702 DE 3525702 A DE3525702 A DE 3525702A DE 3525702 A1 DE3525702 A1 DE 3525702A1
Authority
DE
Germany
Prior art keywords
laser
worked
beam direction
point
radiation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE19853525702
Other languages
German (de)
Inventor
Friedrich Dipl Phys D Bachmann
Christoph Dipl Phys Hamann
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Messer Griesheim GmbH
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Priority to DE19853525702 priority Critical patent/DE3525702A1/en
Publication of DE3525702A1 publication Critical patent/DE3525702A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/18—Working by laser beam, e.g. welding, cutting or boring using absorbing layers on the workpiece, e.g. for marking or protecting purposes

Abstract

When surfaces are worked with a laser, problems arise if there is material at a small distance behind the point to be worked, as seen in the beam direction, which must not be damaged by the radiation. According to the invention, a strongly absorbing, weakly reflecting and deformable medium is introduced in the interspace between the surface to be worked and the face lying at a small distance behind.

Description

Es ist bekannt, Material mit dem Laser abtragend zu bearbeiten (Schneiden, Bohren). Probleme treten jedoch dann auf, wenn von zwei eng benachbarten, beliebig geformten Teilen nur das bearbeitet werden soll, das dem Laser zugewandt ist, während das zweite unbeschädigt bleiben soll. Die durchtretende Strahlung beschädigt nämlich das zweite Teil, wenn es sich in so geringem Abstand in Strahlrichtung hinter der Bearbeitungsstelle befindet, daß die durch die Fuge tretende Strahlung intensiv genug ist, um auf dieses Material einzuwirken. Außerdem können sich Bearbeitungsrückstände auf dem zweiten Teil niederschlagen und so auch zu einer Beschädigung der Oberfläche führen. It is known to remove material with the laser (cutting, drilling). Problems arise, however, when of two closely adjacent, arbitrarily shaped parts, only the part facing the laser is to be machined, while the second part is to remain undamaged. The penetrating radiation damages the second part when it is so close behind the processing point in the beam direction that the radiation passing through the joint is intense enough to act on this material. Machining residues can also deposit on the second part and thus damage the surface.

Mit den Linienzügen a und b ist der Verlauf von irgendwelchen Oberflächen angedeutet, an denen die mit Pfeilen gekennzeichneten Schnittstellen angebracht werden sollen. Bei der Oberfläche a kann die Bearbeitung problemlos erfolgen, während b bisher eine Verarbeitung mit dem Laser nicht zuließ, wenn die beiden in der Figur parallelen Oberflächen so nahe beieinander liegen, daß die durch die Bearbeitungsfuge tretende Strahlung noch die darunterliegende Oberfläche bearbeiten könnte. The lines a and b indicate the course of any surfaces on which the interfaces marked with arrows are to be attached. With surface a , processing can be carried out without any problems, while b has so far not allowed processing with the laser if the two surfaces parallel in the figure are so close together that the radiation passing through the processing joint could still process the surface below.

Eine Abhilfe wäre ein solider, gegen die Laserstrahlung resistenter Strahlabsorber, der sowohl die Strahlung als auch die Bearbeitungsrückstände auffangen würde. Dieser hat jedoch die Nachteile, daß er nur dann einsetzbar wäre, wenn der Raum zwischen den beiden Teilen dies ermöglicht. Dies ist aber bei komplexer Formgebung und engen Abständen nicht der Fall. Ein weiterer Nachteil besteht darin, daß ein Absorber verschmutzt und gereinigt werden muß. Darüber hinaus kann durch die Reflexion der Laserstrahlung am Absorber die vom Laser abgewandte Seite des zu bearbeitenden Teils beschädigt werden.A remedy would be a solid one, against laser radiation resistant beam absorber, which both the radiation and would also catch up on the machining residues. This has the disadvantages, however, that it could only be used if the space between the two parts allows it. However, this is the case with complex shapes and narrow distances not the case. Another disadvantage is that an absorber must be dirty and cleaned. In addition, the reflection of the laser radiation on the absorber, the side of the machining part can be damaged.

Der Erfindung liegt die Aufgabe zugrunde, ein Verfahren zu konzipieren, mit dem eine durchdringende Strahlbearbeitung auch von eng beieinander liegenden und komplex geformten Oberflächen möglich ist. Diese Aufgabe wird gemäß den kennzeichnenden Merkmalen der Patentansprüche gelöst.The invention is based on the object of a method conceive with a penetrating beam processing also of closely spaced and complex shapes Surfaces is possible. This task is carried out according to the characterizing features of the claims solved.

Durch Einbringen eines stark absorbierenden, schwach reflektierenden und deformierbaren Mediums (insbesondere Gas oder Flüssigkeit) zwischen die beiden Teile wird die Strahlungsintensität so stark abgeschwächt, daß keine Beschädigung des zweiten Teils auftritt. Außerdem sorgt ein ständiger Austausch des Mediums für die Entfernung von Rückständen.By introducing a highly absorbent, weakly reflective and deformable medium (in particular Gas or liquid) between the two parts Radiation intensity weakened so much that no damage of the second part occurs. Also ensures constant exchange of the medium for the removal of Residues.

Die in der Einleitung genannten Probleme werden daher beim Verfahren nach der Erfindung umgangen, wenn statt der Verwendung eines festen Absorbers ein Gas mit einem hohen Absorptionskoeffizienten für die Laserwellenlänge zwischen die beiden Flächen einer zum Beispiel U-förmigen Rinne geblasen wird.The problems mentioned in the introduction are therefore bypassed in the method according to the invention if instead the use of a solid absorber a gas with a high absorption coefficients for the laser wavelength between the two surfaces, for example a U-shaped one Gutter is blown.

Für die 10,6 μm-Strahlung des CO2-Lasers hat Schwefelhexafluorid einen der höchsten Absorptionskoeffizienten. Schwefelhexafluorid ist nicht brennbar und ungiftig. For the 10.6 μm radiation of the CO 2 laser, sulfur hexafluoride has one of the highest absorption coefficients. Sulfur hexafluoride is non-flammable and non-toxic.

Das Verfahren nach der Erfindung ist überall dort einzusetzen, wo von zwei dicht beieinander liegenden Teilen nur eines zum Beispiel geschnitten oder gebohrt werden soll, das andere aber unbeschädigt bleiben muß.The method according to the invention can be used anywhere where from two parts lying close together for example, only one should be cut or drilled, the other must remain undamaged.

Claims (3)

1. Verfahren zum Schutz von Oberflächen, die beim durchdringenden Bearbeiten mit dem Laser in Strahlrichtung hinter der Bearbeitungsstelle liegen, dadurch gekennzeichnet, daß in den Zwischenraum zwischen der zu bearbeitenden Oberfläche und der in geringem Abstand darunter oder darüber liegenden Fläche ein stark absorbierendes, schwach reflektierendes und deformierbares Medium eingebracht wird.1. A method for protecting surfaces which are in penetrating processing with the laser in the beam direction behind the processing point, characterized in that in the space between the surface to be processed and the surface a short distance below or above a highly absorbent, weakly reflective and deformable medium is introduced. 2. Verfahren nach Anspruch 1, dadurch gekennzeichnet, daß als Medium ein Gas bzw. eine Flüssigkeit mit einem hohen Absorptionskoeffizienten für die Strahlung bei einer vorgegebenen Laserwellenlänge eingebracht wird.2. The method according to claim 1, characterized in that that as a medium a gas or a liquid with a high absorption coefficient for the radiation at a given laser wavelength is introduced. 3. Verfahren nach Anspruch 2, dadurch gekennzeichnet, daß für die 10,6 µm-Strahlung eines CO2-Lasers Schwefelhexafluorid in den Zwischenraum eingeblasen wird.3. The method according to claim 2, characterized in that sulfur hexafluoride is blown into the intermediate space for the 10.6 µm radiation of a CO 2 laser.
DE19853525702 1985-07-18 1985-07-18 Method for protecting surfaces which in the beam direction lie close behind a point to be worked by means of the laser Withdrawn DE3525702A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE19853525702 DE3525702A1 (en) 1985-07-18 1985-07-18 Method for protecting surfaces which in the beam direction lie close behind a point to be worked by means of the laser

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19853525702 DE3525702A1 (en) 1985-07-18 1985-07-18 Method for protecting surfaces which in the beam direction lie close behind a point to be worked by means of the laser

Publications (1)

Publication Number Publication Date
DE3525702A1 true DE3525702A1 (en) 1987-01-22

Family

ID=6276115

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19853525702 Withdrawn DE3525702A1 (en) 1985-07-18 1985-07-18 Method for protecting surfaces which in the beam direction lie close behind a point to be worked by means of the laser

Country Status (1)

Country Link
DE (1) DE3525702A1 (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0347053A2 (en) * 1988-06-13 1989-12-20 ROLLS-ROYCE plc Laser drilling of components
FR2639238A1 (en) * 1988-11-21 1990-05-25 Technomed Int Sa APPARATUS FOR SURGICAL TREATMENT OF FABRICS BY HYPERTHERMIA, PREFERABLY PROSTATE, COMPRISING THERMAL PROTECTION MEANS COMPRISING PREFERABLY MEANS FORMING RADIOREFLECTIVE SCREEN
DE3937460A1 (en) * 1989-11-10 1990-11-08 Daimler Benz Ag Producing burr-free openings in liq. conduit - using laser beam with bubble-free liq. running through conduit to remove residue during cutting
US5330518A (en) * 1992-03-06 1994-07-19 Urologix, Inc. Method for treating interstitial tissue associated with microwave thermal therapy
US5413588A (en) * 1992-03-06 1995-05-09 Urologix, Inc. Device and method for asymmetrical thermal therapy with helical dipole microwave antenna
US5509929A (en) * 1988-11-21 1996-04-23 Technomed Medical Systems Urethral probe and apparatus for the therapeutic treatment of the prostate by thermotherapy

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3813511A (en) * 1973-02-21 1974-05-28 Avco Everett Res Lab Inc Method of and apparatus for absorbing high power laser energy
CH628273A5 (en) * 1978-03-24 1982-02-26 United Technologies Corp METHOD FOR DRILLING A PASSAGE IN A ROOM.

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3813511A (en) * 1973-02-21 1974-05-28 Avco Everett Res Lab Inc Method of and apparatus for absorbing high power laser energy
CH628273A5 (en) * 1978-03-24 1982-02-26 United Technologies Corp METHOD FOR DRILLING A PASSAGE IN A ROOM.

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
JP-Z: Patents Abstracts of Japan, M-134, June 5, 1982 Vol. 6/No.97, Kokai-No.57-32890 *

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0347053A3 (en) * 1988-06-13 1990-08-16 Rolls-Royce Plc Laser drilling of components
EP0347053A2 (en) * 1988-06-13 1989-12-20 ROLLS-ROYCE plc Laser drilling of components
US5509929A (en) * 1988-11-21 1996-04-23 Technomed Medical Systems Urethral probe and apparatus for the therapeutic treatment of the prostate by thermotherapy
EP0370890A1 (en) * 1988-11-21 1990-05-30 Technomed Medical Systems Apparatus for the surgical treatment of tissues by hyperthermia, preferably the prostate, equipped with heat protection means preferably comprising means forming radioreflecting screen
US5480417A (en) * 1988-11-21 1996-01-02 Technomed Medical Systems Method and apparatus for the surgical treatment of tissues by thermal effect, and in particular the prostate, using a urethral microwave-emitting probe means
FR2639238A1 (en) * 1988-11-21 1990-05-25 Technomed Int Sa APPARATUS FOR SURGICAL TREATMENT OF FABRICS BY HYPERTHERMIA, PREFERABLY PROSTATE, COMPRISING THERMAL PROTECTION MEANS COMPRISING PREFERABLY MEANS FORMING RADIOREFLECTIVE SCREEN
DE3937460A1 (en) * 1989-11-10 1990-11-08 Daimler Benz Ag Producing burr-free openings in liq. conduit - using laser beam with bubble-free liq. running through conduit to remove residue during cutting
US5330518A (en) * 1992-03-06 1994-07-19 Urologix, Inc. Method for treating interstitial tissue associated with microwave thermal therapy
US5413588A (en) * 1992-03-06 1995-05-09 Urologix, Inc. Device and method for asymmetrical thermal therapy with helical dipole microwave antenna
US5464445A (en) * 1992-03-06 1995-11-07 Urologix, Inc. Device and method for asymmetrical thermal therapy with helical dipole microwave antenna
US5545137A (en) * 1992-03-06 1996-08-13 Urologix, Inc. Device for asymmetrical thermal therapy with helical dipole microwave antenna
US5620480A (en) * 1992-03-06 1997-04-15 Urologix, Inc. Method for treating benign prostatic hyperplasia with thermal therapy
US5755754A (en) * 1992-03-06 1998-05-26 Urologix, Inc. Device and method for asymmetrical thermal therapy with helical dipole microwave antenna
US5916240A (en) * 1992-03-06 1999-06-29 Urologix, Inc. Device and method for asymmetrical thermal therapy with helical dipole microwave antenna
US5916241A (en) * 1992-03-06 1999-06-29 Urologix, Inc. Device and method for asymmetrical thermal therapy with helical dipole microwave antenna

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Legal Events

Date Code Title Description
OM8 Search report available as to paragraph 43 lit. 1 sentence 1 patent law
8127 New person/name/address of the applicant

Owner name: BACHMANN, FRIEDRICH, DIPL.-PHYS. DR., 8150 HOLZKIR

8127 New person/name/address of the applicant

Owner name: MESSER GRIESHEIM GMBH, 6000 FRANKFURT, DE

8141 Disposal/no request for examination