DE3566071D1 - Printed circuit board load-unload system and method - Google Patents

Printed circuit board load-unload system and method

Info

Publication number
DE3566071D1
DE3566071D1 DE8585300293T DE3566071T DE3566071D1 DE 3566071 D1 DE3566071 D1 DE 3566071D1 DE 8585300293 T DE8585300293 T DE 8585300293T DE 3566071 T DE3566071 T DE 3566071T DE 3566071 D1 DE3566071 D1 DE 3566071D1
Authority
DE
Germany
Prior art keywords
circuit board
printed circuit
board load
unload system
unload
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8585300293T
Other languages
English (en)
Inventor
Hideo Sakamoto
Yoshikuni Kawakami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP59007923A external-priority patent/JPS60153307A/ja
Priority claimed from JP59007924A external-priority patent/JPS60153308A/ja
Priority claimed from JP59007922A external-priority patent/JPS60153306A/ja
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Application granted granted Critical
Publication of DE3566071D1 publication Critical patent/DE3566071D1/de
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
DE8585300293T 1984-01-21 1985-01-16 Printed circuit board load-unload system and method Expired DE3566071D1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP59007923A JPS60153307A (ja) 1984-01-21 1984-01-21 プリント板給排装置
JP59007924A JPS60153308A (ja) 1984-01-21 1984-01-21 プリント板給排装置
JP59007922A JPS60153306A (ja) 1984-01-21 1984-01-21 プリント板給排装置

Publications (1)

Publication Number Publication Date
DE3566071D1 true DE3566071D1 (en) 1988-12-08

Family

ID=27277799

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8585300293T Expired DE3566071D1 (en) 1984-01-21 1985-01-16 Printed circuit board load-unload system and method

Country Status (5)

Country Link
US (1) US4725182A (de)
EP (1) EP0152183B1 (de)
KR (1) KR890004551B1 (de)
CA (1) CA1234924A (de)
DE (1) DE3566071D1 (de)

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JP4904722B2 (ja) * 2005-06-02 2012-03-28 株式会社Ｉｈｉ 基板搬送装置
US7553119B2 (en) * 2006-02-24 2009-06-30 Northrop Grumman Systems Corporation Mail tray unloader with shuttle transfer through system comprising tilting
FR2898880B1 (fr) * 2006-03-22 2008-05-30 Datacard Corp Machine lineaire de traitement d'objets portables et procede de traitement d'objets portables
US8132317B2 (en) * 2007-06-11 2012-03-13 Research In Motion Limited Apparatus for manufacture of electronic assemblies
JP2009056656A (ja) * 2007-08-30 2009-03-19 Mimaki Engineering Co Ltd 印刷装置
JP5196918B2 (ja) * 2007-08-30 2013-05-15 株式会社ミマキエンジニアリング 印刷装置の製造方法
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JP5440483B2 (ja) * 2010-12-09 2014-03-12 パナソニック株式会社 電子部品実装システムおよび電子部品実装方法
JP5323137B2 (ja) * 2011-06-14 2013-10-23 ヤマハ発動機株式会社 段取り方法、部品実装方法および部品実装システム
KR101923531B1 (ko) * 2011-12-23 2018-11-30 삼성전자주식회사 반도체 칩 본딩 장치
US9285416B2 (en) * 2012-04-02 2016-03-15 Samsung Electronics Co., Ltd. Apparatus and method for manufacturing substrates
US10271437B2 (en) 2014-08-14 2019-04-23 The United States Of America As Represented By The Secretary Of The Army Motion-based reconfigurable microelectronics system
CN106335730A (zh) * 2015-07-17 2017-01-18 辽宁聚龙海目星智能物流科技有限公司 一种内流转式立体仓库
CN105346747A (zh) * 2015-11-30 2016-02-24 苏州康贝尔电子设备有限公司 一种双收板机
WO2019040629A1 (en) 2017-08-22 2019-02-28 Universal Instruments Corporation IMPROVED CIRCUIT BOARD TRANSPORT
DE102019211603B4 (de) * 2019-08-01 2021-05-20 Asys Automatisierungssysteme Gmbh Substratmagazin, Substratmagazinsystem und Substratbestückungsanlage
DE102019217033B4 (de) * 2019-11-05 2022-06-30 Asys Automatisierungssysteme Gmbh Be- und Entladeeinrichtung für ein Substratmagazin, Substratmagazinsystem
WO2021087795A1 (zh) * 2019-11-06 2021-05-14 苏州得奥自动化科技有限公司 一种注塑薄板件的自动装箱机
DE102022129638B3 (de) 2022-11-09 2024-05-02 Asys Automatisierungssysteme Gmbh Entladeeinrichtung für ein Substratmagazin, Substratmagazinsystem

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Also Published As

Publication number Publication date
KR890004551B1 (ko) 1989-11-13
KR850006303A (ko) 1985-10-02
CA1234924A (en) 1988-04-05
EP0152183A1 (de) 1985-08-21
US4725182A (en) 1988-02-16
EP0152183B1 (de) 1988-11-02

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee