DE3566767D1 - Multilayer hybrid integrated circuit - Google Patents
Multilayer hybrid integrated circuitInfo
- Publication number
- DE3566767D1 DE3566767D1 DE8585901751T DE3566767T DE3566767D1 DE 3566767 D1 DE3566767 D1 DE 3566767D1 DE 8585901751 T DE8585901751 T DE 8585901751T DE 3566767 T DE3566767 T DE 3566767T DE 3566767 D1 DE3566767 D1 DE 3566767D1
- Authority
- DE
- Germany
- Prior art keywords
- integrated circuit
- hybrid integrated
- multilayer hybrid
- multilayer
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
- H01L23/5383—Multilayer substrates
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
- H05K3/4676—Single layer compositions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0133—Elastomeric or compliant polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09509—Blind vias, i.e. vias having one side closed
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0023—Etching of the substrate by chemical or physical means by exposure and development of a photosensitive insulating layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/901—Printed circuit
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
- Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
- Y10S430/1055—Radiation sensitive composition or product or process of making
- Y10S430/114—Initiator containing
- Y10S430/12—Nitrogen compound containing
- Y10S430/121—Nitrogen in heterocyclic ring
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US06/597,626 US4554229A (en) | 1984-04-06 | 1984-04-06 | Multilayer hybrid integrated circuit |
PCT/US1985/000422 WO1985004780A1 (en) | 1984-04-06 | 1985-03-12 | Multilayer hybrid integrated circuit |
Publications (1)
Publication Number | Publication Date |
---|---|
DE3566767D1 true DE3566767D1 (en) | 1989-01-12 |
Family
ID=24392283
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE8585901751T Expired DE3566767D1 (en) | 1984-04-06 | 1985-03-12 | Multilayer hybrid integrated circuit |
Country Status (6)
Country | Link |
---|---|
US (1) | US4554229A (de) |
EP (1) | EP0176555B1 (de) |
JP (1) | JPS61501806A (de) |
CA (1) | CA1254789A (de) |
DE (1) | DE3566767D1 (de) |
WO (1) | WO1985004780A1 (de) |
Families Citing this family (60)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4601972A (en) * | 1984-04-06 | 1986-07-22 | At&T Technologies, Inc. | Photodefinable triazine based composition |
US4600736A (en) * | 1985-03-11 | 1986-07-15 | Phillips Petroleum Company | Pigment concentrates for resins |
US5302494A (en) * | 1985-06-10 | 1994-04-12 | The Foxboro Company | Multilayer circuit board having microporous layers and process for making same |
US5246817A (en) * | 1985-08-02 | 1993-09-21 | Shipley Company, Inc. | Method for manufacture of multilayer circuit board |
EP0211180A3 (de) * | 1985-08-02 | 1989-08-09 | Shipley Company Inc. | Herstellungsverfahren für mehrschichtige Leiterplatten |
US5334488A (en) * | 1985-08-02 | 1994-08-02 | Shipley Company Inc. | Method for manufacture of multilayer circuit board |
US4937172A (en) * | 1986-12-02 | 1990-06-26 | E. I. Du Pont De Nemours And Company | Photopolymerizable composition having superior adhesion, articles and processes |
US5073462A (en) * | 1986-12-02 | 1991-12-17 | E. I. Du Pont De Nemours And Company | Photopolymerizable composition having superior adhesion, articles and processes |
DE3785550T2 (de) * | 1986-12-02 | 1993-11-04 | Du Pont | Photosensible zusammensetzung mit verbesserter haftung, gegenstaende und verfahren. |
WO1988005252A1 (en) * | 1987-01-12 | 1988-07-14 | Allied Corporation | Method for the manufacture of multilayer printed circuit boards |
DE3881911D1 (de) * | 1987-03-09 | 1993-07-29 | Siemens Nixdorf Inf Syst | Aufbautechnik fuer mehrlagige verdrahtungen. |
US4775573A (en) * | 1987-04-03 | 1988-10-04 | West-Tronics, Inc. | Multilayer PC board using polymer thick films |
US4854040A (en) * | 1987-04-03 | 1989-08-08 | Poly Circuits, Inc. | Method of making multilayer pc board using polymer thick films |
USRE35064E (en) * | 1988-08-01 | 1995-10-17 | Circuit Components, Incorporated | Multilayer printed wiring board |
US5079069A (en) * | 1989-08-23 | 1992-01-07 | Zycon Corporation | Capacitor laminate for use in capacitive printed circuit boards and methods of manufacture |
US5155655A (en) * | 1989-08-23 | 1992-10-13 | Zycon Corporation | Capacitor laminate for use in capacitive printed circuit boards and methods of manufacture |
JPH0383398A (ja) * | 1989-08-26 | 1991-04-09 | Shinko Electric Ind Co Ltd | 配線基板及びその製造方法 |
US5041943A (en) * | 1989-11-06 | 1991-08-20 | Allied-Signal Inc. | Hermetically sealed printed circuit board |
US5055164A (en) * | 1990-03-26 | 1991-10-08 | Shipley Company Inc. | Electrodepositable photoresists for manufacture of hybrid circuit boards |
US5098860A (en) * | 1990-05-07 | 1992-03-24 | The Boeing Company | Method of fabricating high-density interconnect structures having tantalum/tantalum oxide layers |
US5126289A (en) * | 1990-07-20 | 1992-06-30 | At&T Bell Laboratories | Semiconductor lithography methods using an arc of organic material |
US5800575A (en) * | 1992-04-06 | 1998-09-01 | Zycon Corporation | In situ method of forming a bypass capacitor element internally within a capacitive PCB |
US5261153A (en) * | 1992-04-06 | 1993-11-16 | Zycon Corporation | In situ method for forming a capacitive PCB |
US6274391B1 (en) | 1992-10-26 | 2001-08-14 | Texas Instruments Incorporated | HDI land grid array packaged device having electrical and optical interconnects |
US5326671A (en) * | 1992-12-28 | 1994-07-05 | At&T Bell Laboratories | Method of making circuit devices comprising a dielectric layer of siloxane-caprolactone |
US5552503A (en) * | 1993-12-22 | 1996-09-03 | At&T Corp. | Photodefinable dielectric layers comprising poly(aromatic diacetylenes) |
US5466972A (en) * | 1994-05-09 | 1995-11-14 | At&T Corp. | Metallization for polymer-dielectric multichip modules including a Ti/Pd alloy layer |
JP3121213B2 (ja) * | 1994-07-27 | 2000-12-25 | 株式会社日立製作所 | 感光性樹脂組成物 |
US5545510A (en) * | 1995-03-28 | 1996-08-13 | Mac Dermid, Inc. | Photodefinable dielectric composition useful in the manufacture of printed circuits |
US5889462A (en) * | 1996-04-08 | 1999-03-30 | Bourns, Inc. | Multilayer thick film surge resistor network |
JPH1041633A (ja) * | 1996-07-25 | 1998-02-13 | Hitachi Ltd | 多層配線板とそれに用いる感光性樹脂組成物 |
US6462107B1 (en) | 1997-12-23 | 2002-10-08 | The Texas A&M University System | Photoimageable compositions and films for printed wiring board manufacture |
US6349456B1 (en) * | 1998-12-31 | 2002-02-26 | Motorola, Inc. | Method of manufacturing photodefined integral capacitor with self-aligned dielectric and electrodes |
US6181004B1 (en) | 1999-01-22 | 2001-01-30 | Jerry D. Koontz | Digital signal processing assembly and test method |
US6492600B1 (en) | 1999-06-28 | 2002-12-10 | International Business Machines Corporation | Laminate having plated microvia interconnects and method for forming the same |
EP1067406A1 (de) * | 1999-07-01 | 2001-01-10 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Hitzehärtbares Kunststoffsubstrat für optische Systeme |
US6734369B1 (en) * | 2000-08-31 | 2004-05-11 | International Business Machines Corporation | Surface laminar circuit board having pad disposed within a through hole |
DE10105914C1 (de) * | 2001-02-09 | 2002-10-10 | Siemens Ag | Organischer Feldeffekt-Transistor mit fotostrukturiertem Gate-Dielektrikum und ein Verfahren zu dessen Erzeugung |
AT412681B (de) * | 2002-04-22 | 2005-05-25 | Hueck Folien Gmbh | Substrate mit unsichtbaren elektrisch leitfähigen schichten |
US7057264B2 (en) * | 2002-10-18 | 2006-06-06 | National Starch And Chemical Investment Holding Corporation | Curable compounds containing reactive groups: triazine/isocyanurates, cyanate esters and blocked isocyanates |
DE50313445D1 (de) * | 2003-01-09 | 2011-03-10 | Polyic Gmbh & Co Kg | Ikgerät, sowie verwendung dazu |
DE10338277A1 (de) * | 2003-08-20 | 2005-03-17 | Siemens Ag | Organischer Kondensator mit spannungsgesteuerter Kapazität |
DE10339036A1 (de) | 2003-08-25 | 2005-03-31 | Siemens Ag | Organisches elektronisches Bauteil mit hochaufgelöster Strukturierung und Herstellungsverfahren dazu |
DE10340644B4 (de) * | 2003-09-03 | 2010-10-07 | Polyic Gmbh & Co. Kg | Mechanische Steuerelemente für organische Polymerelektronik |
DE10340643B4 (de) * | 2003-09-03 | 2009-04-16 | Polyic Gmbh & Co. Kg | Druckverfahren zur Herstellung einer Doppelschicht für Polymerelektronik-Schaltungen, sowie dadurch hergestelltes elektronisches Bauelement mit Doppelschicht |
DE102004002024A1 (de) * | 2004-01-14 | 2005-08-11 | Siemens Ag | Organischer Transistor mit selbstjustierender Gate-Elektrode und Verfahren zu dessen Herstellung |
JP4701632B2 (ja) * | 2004-05-17 | 2011-06-15 | 凸版印刷株式会社 | 抵抗素子用感光性樹脂組成物及びそれを用いた積層体もしくは素子内蔵基板 |
DE102004040831A1 (de) * | 2004-08-23 | 2006-03-09 | Polyic Gmbh & Co. Kg | Funketikettfähige Umverpackung |
DE102004059465A1 (de) * | 2004-12-10 | 2006-06-14 | Polyic Gmbh & Co. Kg | Erkennungssystem |
DE102004059464A1 (de) * | 2004-12-10 | 2006-06-29 | Polyic Gmbh & Co. Kg | Elektronikbauteil mit Modulator |
DE102004059467A1 (de) * | 2004-12-10 | 2006-07-20 | Polyic Gmbh & Co. Kg | Gatter aus organischen Feldeffekttransistoren |
DE102004063435A1 (de) | 2004-12-23 | 2006-07-27 | Polyic Gmbh & Co. Kg | Organischer Gleichrichter |
DE102005009820A1 (de) * | 2005-03-01 | 2006-09-07 | Polyic Gmbh & Co. Kg | Elektronikbaugruppe mit organischen Logik-Schaltelementen |
DE102005009819A1 (de) | 2005-03-01 | 2006-09-07 | Polyic Gmbh & Co. Kg | Elektronikbaugruppe |
DE102005017655B4 (de) | 2005-04-15 | 2008-12-11 | Polyic Gmbh & Co. Kg | Mehrschichtiger Verbundkörper mit elektronischer Funktion |
DE102005031448A1 (de) | 2005-07-04 | 2007-01-11 | Polyic Gmbh & Co. Kg | Aktivierbare optische Schicht |
DE102005035589A1 (de) | 2005-07-29 | 2007-02-01 | Polyic Gmbh & Co. Kg | Verfahren zur Herstellung eines elektronischen Bauelements |
DE102005044306A1 (de) | 2005-09-16 | 2007-03-22 | Polyic Gmbh & Co. Kg | Elektronische Schaltung und Verfahren zur Herstellung einer solchen |
US7886414B2 (en) * | 2007-07-23 | 2011-02-15 | Samsung Electro-Mechanics Co., Ltd. | Method of manufacturing capacitor-embedded PCB |
WO2019065129A1 (ja) * | 2017-09-27 | 2019-04-04 | 富士フイルム株式会社 | 感光性樹脂組成物、フレキソ印刷版原版およびフレキソ印刷版 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3397204A (en) * | 1962-05-07 | 1968-08-13 | Monsanto Co | Production of halohydrocarbyloxysym-triazines |
US3632861A (en) * | 1969-03-19 | 1972-01-04 | American Cyanamid Co | Vinyl ester resins from epoxides and isomerized hydroxy alkyl acrylates-aleic anhydride reaction product |
US3900594A (en) * | 1971-12-17 | 1975-08-19 | Grace W R & Co | Photocurable triazine containing polyene-polythiol lacquer composition |
US4060656A (en) * | 1973-04-02 | 1977-11-29 | Teijin Limited | Support for photosensitive resin |
US4054483A (en) * | 1976-12-22 | 1977-10-18 | E. I. Du Pont De Nemours And Company | Additives process for producing plated holes in printed circuit elements |
JPS5651735A (en) * | 1979-10-03 | 1981-05-09 | Asahi Chem Ind Co Ltd | Photoreactive composition |
US4329384A (en) * | 1980-02-14 | 1982-05-11 | Minnesota Mining And Manufacturing Company | Pressure-sensitive adhesive tape produced from photoactive mixture of acrylic monomers and polynuclear-chromophore-substituted halomethyl-2-triazine |
US4357219A (en) * | 1980-06-27 | 1982-11-02 | Westinghouse Electric Corp. | Solventless UV cured thermosetting cement coat |
JPS5797970U (de) * | 1980-12-08 | 1982-06-16 | ||
US4456712A (en) * | 1982-06-14 | 1984-06-26 | International Business Machines Corporation | Bismaleimide triazine composition |
-
1984
- 1984-04-06 US US06/597,626 patent/US4554229A/en not_active Expired - Lifetime
-
1985
- 1985-03-12 DE DE8585901751T patent/DE3566767D1/de not_active Expired
- 1985-03-12 WO PCT/US1985/000422 patent/WO1985004780A1/en active IP Right Grant
- 1985-03-12 EP EP85901751A patent/EP0176555B1/de not_active Expired
- 1985-03-12 JP JP60501373A patent/JPS61501806A/ja active Granted
- 1985-03-25 CA CA000477379A patent/CA1254789A/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
US4554229A (en) | 1985-11-19 |
JPH0447475B2 (de) | 1992-08-04 |
CA1254789A (en) | 1989-05-30 |
JPS61501806A (ja) | 1986-08-21 |
EP0176555B1 (de) | 1988-12-07 |
EP0176555A1 (de) | 1986-04-09 |
WO1985004780A1 (en) | 1985-10-24 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8328 | Change in the person/name/address of the agent |
Free format text: BLUMBACH, KRAMER & PARTNER, 65193 WIESBADEN |
|
8339 | Ceased/non-payment of the annual fee |