DE3570555D1 - Process for fabricating multi-level-metal integrated circuits at high yields - Google Patents
Process for fabricating multi-level-metal integrated circuits at high yieldsInfo
- Publication number
- DE3570555D1 DE3570555D1 DE8585906125T DE3570555T DE3570555D1 DE 3570555 D1 DE3570555 D1 DE 3570555D1 DE 8585906125 T DE8585906125 T DE 8585906125T DE 3570555 T DE3570555 T DE 3570555T DE 3570555 D1 DE3570555 D1 DE 3570555D1
- Authority
- DE
- Germany
- Prior art keywords
- level
- integrated circuits
- high yields
- metal integrated
- fabricating multi
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76801—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76801—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing
- H01L21/76822—Modification of the material of dielectric layers, e.g. grading, after-treatment to improve the stability of the layers, to increase their density etc.
- H01L21/76826—Modification of the material of dielectric layers, e.g. grading, after-treatment to improve the stability of the layers, to increase their density etc. by contacting the layer with gases, liquids or plasmas
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/528—Geometry or layout of the interconnection structure
- H01L23/5283—Cross-sectional geometry
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Geometry (AREA)
- Plasma & Fusion (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US06/679,506 US4592132A (en) | 1984-12-07 | 1984-12-07 | Process for fabricating multi-level-metal integrated circuits at high yields |
PCT/US1985/002305 WO1986003622A1 (en) | 1984-12-07 | 1985-11-25 | Process for fabricating multi-level-metal integrated circuits at high yields |
Publications (1)
Publication Number | Publication Date |
---|---|
DE3570555D1 true DE3570555D1 (en) | 1989-06-29 |
Family
ID=24727173
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE8585906125T Expired DE3570555D1 (en) | 1984-12-07 | 1985-11-25 | Process for fabricating multi-level-metal integrated circuits at high yields |
Country Status (6)
Country | Link |
---|---|
US (1) | US4592132A (de) |
EP (1) | EP0204768B1 (de) |
JP (1) | JPS62501321A (de) |
KR (1) | KR900001986B1 (de) |
DE (1) | DE3570555D1 (de) |
WO (1) | WO1986003622A1 (de) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6087267A (en) * | 1986-03-04 | 2000-07-11 | Motorola, Inc. | Process for forming an integrated circuit |
US4786962A (en) * | 1986-06-06 | 1988-11-22 | Hewlett-Packard Company | Process for fabricating multilevel metal integrated circuits and structures produced thereby |
US4700462A (en) * | 1986-10-08 | 1987-10-20 | Hughes Aircraft Company | Process for making a T-gated transistor |
US4747211A (en) * | 1987-02-09 | 1988-05-31 | Sheldahl, Inc. | Method and apparatus for preparing conductive screened through holes employing metallic plated polymer thick films |
US5298365A (en) * | 1990-03-20 | 1994-03-29 | Hitachi, Ltd. | Process for fabricating semiconductor integrated circuit device, and exposing system and mask inspecting method to be used in the process |
US5897376A (en) * | 1993-09-20 | 1999-04-27 | Seiko Instruments Inc. | Method of manufacturing a semiconductor device having a reflection reducing film |
TW439118B (en) * | 2000-02-10 | 2001-06-07 | Winbond Electronics Corp | Multilayer thin photoresist process |
US6713395B2 (en) * | 2001-05-15 | 2004-03-30 | Infineon Technologies Ag | Single RIE process for MIMcap top and bottom plates |
US6979526B2 (en) * | 2002-06-03 | 2005-12-27 | Infineon Technologies Ag | Lithography alignment and overlay measurement marks formed by resist mask blocking for MRAMs |
US7223612B2 (en) * | 2004-07-26 | 2007-05-29 | Infineon Technologies Ag | Alignment of MTJ stack to conductive lines in the absence of topography |
US7442624B2 (en) * | 2004-08-02 | 2008-10-28 | Infineon Technologies Ag | Deep alignment marks on edge chips for subsequent alignment of opaque layers |
JP2006261434A (ja) * | 2005-03-17 | 2006-09-28 | L'air Liquide Sa Pour L'etude & L'exploitation Des Procede S Georges Claude | シリコン酸化膜の形成方法 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5218425B2 (de) * | 1972-05-01 | 1977-05-21 | ||
US3985597A (en) * | 1975-05-01 | 1976-10-12 | International Business Machines Corporation | Process for forming passivated metal interconnection system with a planar surface |
US4176029A (en) * | 1978-03-02 | 1979-11-27 | Sperry Rand Corporation | Subminiature bore and conductor formation |
GB1596907A (en) * | 1978-05-25 | 1981-09-03 | Fujitsu Ltd | Manufacture of semiconductor devices |
JPS5850417B2 (ja) * | 1979-07-31 | 1983-11-10 | 富士通株式会社 | 半導体装置の製造方法 |
US4409319A (en) * | 1981-07-15 | 1983-10-11 | International Business Machines Corporation | Electron beam exposed positive resist mask process |
US4398964A (en) * | 1981-12-10 | 1983-08-16 | Signetics Corporation | Method of forming ion implants self-aligned with a cut |
CA1169022A (en) * | 1982-04-19 | 1984-06-12 | Kevin Duncan | Integrated circuit planarizing process |
FR2537779B1 (fr) * | 1982-12-10 | 1986-03-14 | Commissariat Energie Atomique | Procede de positionnement d'un trou de contact electrique entre deux lignes d'interconnexion d'un circuit integre |
DE3344280A1 (de) * | 1982-12-21 | 1984-07-05 | Texas Instruments Inc., Dallas, Tex. | Verfahren zur herstellung einer halbleitervorrichtung und vorrichtung zur durchfuehrung des verfahrens |
US4415606A (en) * | 1983-01-10 | 1983-11-15 | Ncr Corporation | Method of reworking upper metal in multilayer metal integrated circuits |
US4517731A (en) * | 1983-09-29 | 1985-05-21 | Fairchild Camera & Instrument Corporation | Double polysilicon process for fabricating CMOS integrated circuits |
-
1984
- 1984-12-07 US US06/679,506 patent/US4592132A/en not_active Expired - Lifetime
-
1985
- 1985-11-25 WO PCT/US1985/002305 patent/WO1986003622A1/en active IP Right Grant
- 1985-11-25 KR KR1019860700533A patent/KR900001986B1/ko not_active IP Right Cessation
- 1985-11-25 DE DE8585906125T patent/DE3570555D1/de not_active Expired
- 1985-11-25 EP EP85906125A patent/EP0204768B1/de not_active Expired
- 1985-11-25 JP JP60505334A patent/JPS62501321A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPH0320064B2 (de) | 1991-03-18 |
JPS62501321A (ja) | 1987-05-21 |
WO1986003622A1 (en) | 1986-06-19 |
EP0204768A1 (de) | 1986-12-17 |
EP0204768B1 (de) | 1989-05-24 |
US4592132A (en) | 1986-06-03 |
KR900001986B1 (ko) | 1990-03-30 |
KR870700171A (ko) | 1987-03-14 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8339 | Ceased/non-payment of the annual fee |