DE3576900D1 - Verfahren zum herstellen von gedruckten schaltungen. - Google Patents
Verfahren zum herstellen von gedruckten schaltungen.Info
- Publication number
- DE3576900D1 DE3576900D1 DE8585116653T DE3576900T DE3576900D1 DE 3576900 D1 DE3576900 D1 DE 3576900D1 DE 8585116653 T DE8585116653 T DE 8585116653T DE 3576900 T DE3576900 T DE 3576900T DE 3576900 D1 DE3576900 D1 DE 3576900D1
- Authority
- DE
- Germany
- Prior art keywords
- printed circuits
- producing printed
- producing
- circuits
- printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4076—Through-connections; Vertical interconnect access [VIA] connections by thin-film techniques
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
- H05K3/426—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates without metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1152—Replicating the surface structure of a sacrificial layer, e.g. for roughening
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP85116653A EP0227857B1 (de) | 1985-12-30 | 1985-12-30 | Verfahren zum Herstellen von gedruckten Schaltungen |
Publications (1)
Publication Number | Publication Date |
---|---|
DE3576900D1 true DE3576900D1 (de) | 1990-05-03 |
Family
ID=8193982
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE8585116653T Expired - Lifetime DE3576900D1 (de) | 1985-12-30 | 1985-12-30 | Verfahren zum herstellen von gedruckten schaltungen. |
Country Status (4)
Country | Link |
---|---|
US (1) | US4705592A (de) |
EP (1) | EP0227857B1 (de) |
JP (1) | JPS62158393A (de) |
DE (1) | DE3576900D1 (de) |
Families Citing this family (37)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61229389A (ja) * | 1985-04-03 | 1986-10-13 | イビデン株式会社 | セラミツク配線板およびその製造方法 |
US5006212A (en) * | 1988-03-10 | 1991-04-09 | Copytele, Inc. | Methods enabling stress crack free patterning of chrome on layers of organic polymers |
US4913789A (en) * | 1988-04-18 | 1990-04-03 | Aung David K | Sputter etching and coating process |
US4916260A (en) * | 1988-10-11 | 1990-04-10 | International Business Machines Corporation | Circuit member for use in multilayered printed circuit board assembly and method of making same |
JPH02303086A (ja) * | 1989-05-17 | 1990-12-17 | Hitachi Ltd | プリント配線板の製造方法及びそれに用いるスパッタデポジション装置及び銅張積層板 |
JPH0724328B2 (ja) * | 1989-07-03 | 1995-03-15 | ポリプラスチックス株式会社 | 精密細線回路用成形品の製造方法 |
US5245751A (en) * | 1990-04-27 | 1993-09-21 | Circuit Components, Incorporated | Array connector |
US5071359A (en) * | 1990-04-27 | 1991-12-10 | Rogers Corporation | Array connector |
FI85793C (fi) * | 1990-05-18 | 1992-05-25 | Plasmapiiri Oy | Foerfarande och anordning foer framstaellning av kretskort. |
JPH0476985A (ja) * | 1990-07-18 | 1992-03-11 | Cmk Corp | プリント配線板の製造法 |
US5017271A (en) * | 1990-08-24 | 1991-05-21 | Gould Inc. | Method for printed circuit board pattern making using selectively etchable metal layers |
US5137618A (en) * | 1991-06-07 | 1992-08-11 | Foster Miller, Inc. | Methods for manufacture of multilayer circuit boards |
US5190637A (en) * | 1992-04-24 | 1993-03-02 | Wisconsin Alumni Research Foundation | Formation of microstructures by multiple level deep X-ray lithography with sacrificial metal layers |
US5498311A (en) * | 1994-06-15 | 1996-03-12 | Quatro Corporation | Process for manufacture of printed circuit boards |
US5721007A (en) * | 1994-09-08 | 1998-02-24 | The Whitaker Corporation | Process for low density additive flexible circuits and harnesses |
GB9420182D0 (en) * | 1994-10-06 | 1994-11-23 | Int Computers Ltd | Printed circuit manufacture |
US6195883B1 (en) * | 1998-03-25 | 2001-03-06 | International Business Machines Corporation | Full additive process with filled plated through holes |
IL115713A0 (en) * | 1995-10-22 | 1996-01-31 | Ipmms Dev & Production Ltd | Sputter deposit method and apparatus |
US5707893A (en) * | 1995-12-01 | 1998-01-13 | International Business Machines Corporation | Method of making a circuitized substrate using two different metallization processes |
US6117300A (en) * | 1996-05-01 | 2000-09-12 | Honeywell International Inc. | Method for forming conductive traces and printed circuits made thereby |
US6141870A (en) * | 1997-08-04 | 2000-11-07 | Peter K. Trzyna | Method for making electrical device |
US6117784A (en) * | 1997-11-12 | 2000-09-12 | International Business Machines Corporation | Process for integrated circuit wiring |
US6242078B1 (en) | 1998-07-28 | 2001-06-05 | Isola Laminate Systems Corp. | High density printed circuit substrate and method of fabrication |
US6540524B1 (en) * | 2000-02-14 | 2003-04-01 | Advantest Corp. | Contact structure and production method thereof |
US6297164B1 (en) * | 1998-11-30 | 2001-10-02 | Advantest Corp. | Method for producing contact structures |
US6686539B2 (en) * | 2001-01-03 | 2004-02-03 | International Business Machines Corporation | Tamper-responding encapsulated enclosure having flexible protective mesh structure |
EP1542518A4 (de) * | 2002-06-04 | 2009-08-26 | Sumitomo Electric Industries | Leiterplatte für gedruckte verdrahtung, gedruckte leiterplatte und verfahren zu ihrer herstellung |
US20040084320A1 (en) * | 2002-10-30 | 2004-05-06 | Xerox Corporation | Copper interconnect by immersion/electroless plating in dual damascene process |
US20040149689A1 (en) * | 2002-12-03 | 2004-08-05 | Xiao-Shan Ning | Method for producing metal/ceramic bonding substrate |
US7802360B2 (en) * | 2003-01-29 | 2010-09-28 | General Dynamics Advanced Information Systems, Inc. | Methods for filling holes in printed wiring boards |
TWI262041B (en) * | 2003-11-14 | 2006-09-11 | Hitachi Chemical Co Ltd | Formation method of metal layer on resin layer, printed wiring board, and production method thereof |
US7276453B2 (en) * | 2004-08-10 | 2007-10-02 | E.I. Du Pont De Nemours And Company | Methods for forming an undercut region and electronic devices incorporating the same |
US7166860B2 (en) * | 2004-12-30 | 2007-01-23 | E. I. Du Pont De Nemours And Company | Electronic device and process for forming same |
JP5125389B2 (ja) * | 2007-10-12 | 2013-01-23 | 富士通株式会社 | 基板の製造方法 |
JP2009099621A (ja) * | 2007-10-12 | 2009-05-07 | Fujitsu Ltd | 基板の製造方法 |
WO2014113508A2 (en) * | 2013-01-15 | 2014-07-24 | Microfabrica Inc. | Methods of forming parts using laser machining |
CN116075053A (zh) * | 2022-09-07 | 2023-05-05 | 深圳市奔强电路有限公司 | 一种蚀刻补钻pth孔的处理方法 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2982625A (en) * | 1957-03-22 | 1961-05-02 | Sylvania Electric Prod | Etchant and method |
DE1490374B1 (de) * | 1963-02-06 | 1969-11-20 | Siemens Ag | Verfahren zur Herstellung eines Isolierstoffkoerpers mit Metallauflagen |
DE1924775B2 (de) * | 1969-05-14 | 1971-06-09 | Verfahren zur herstellung einer leiterplatte | |
BE768887A (fr) * | 1971-06-23 | 1971-11-03 | Macdermid Inc | Procede pour la fabrication de panneaux de circuits imprimes etpanneauxobtenus par ledit procede |
DE2515706A1 (de) * | 1975-04-10 | 1976-10-21 | Siemens Ag | Verfahren zur herstellung von durchkontaktierten gedruckten schaltungen |
JPS5210564A (en) * | 1975-07-16 | 1977-01-26 | Citizen Watch Co Ltd | Method of manufacturing opposite printed surfaced substrate having throughhholes therein |
DE2634560A1 (de) * | 1976-07-31 | 1978-02-02 | Hoechst Ag | Verfahren und vorrichtung zur trennung von verbunden |
JPS5716759A (en) * | 1981-05-23 | 1982-01-28 | Kohei Shirato | Solar heat collector |
DE3304004A1 (de) * | 1983-02-03 | 1984-08-09 | Lieber, Hans-Wilhelm, Prof. Dr.-Ing., 1000 Berlin | Verfahren zur herstellung von durchkontaktierten schaltungen |
EP0127689B1 (de) * | 1983-05-19 | 1987-08-26 | Ibm Deutschland Gmbh | Verfahren zum Herstellen von gedruckten Schaltungen mit in das Isolierstoffsubstrat eingebetteten metallischen Leiterzugstrukturen |
DE3371592D1 (en) * | 1983-06-01 | 1987-06-19 | Ibm Deutschland | Production method of printed circuits with one conductive layer |
US4581301A (en) * | 1984-04-10 | 1986-04-08 | Michaelson Henry W | Additive adhesive based process for the manufacture of printed circuit boards |
JPS6163086A (ja) * | 1984-09-03 | 1986-04-01 | 松下電器産業株式会社 | スル−ホ−ル配線板の製造方法 |
-
1985
- 1985-12-30 EP EP85116653A patent/EP0227857B1/de not_active Expired - Lifetime
- 1985-12-30 DE DE8585116653T patent/DE3576900D1/de not_active Expired - Lifetime
-
1986
- 1986-11-20 JP JP61275510A patent/JPS62158393A/ja active Granted
- 1986-12-18 US US06/943,227 patent/US4705592A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JPH0472396B2 (de) | 1992-11-18 |
JPS62158393A (ja) | 1987-07-14 |
US4705592A (en) | 1987-11-10 |
EP0227857A1 (de) | 1987-07-08 |
EP0227857B1 (de) | 1990-03-28 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |