DE3583544D1 - Schutz fuer halbleiterkontaktmetall. - Google Patents

Schutz fuer halbleiterkontaktmetall.

Info

Publication number
DE3583544D1
DE3583544D1 DE8585106582T DE3583544T DE3583544D1 DE 3583544 D1 DE3583544 D1 DE 3583544D1 DE 8585106582 T DE8585106582 T DE 8585106582T DE 3583544 T DE3583544 T DE 3583544T DE 3583544 D1 DE3583544 D1 DE 3583544D1
Authority
DE
Germany
Prior art keywords
protection
contact metal
semiconductor contact
semiconductor
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE8585106582T
Other languages
English (en)
Inventor
Edward C Fredericks
Madan M Nanda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Application granted granted Critical
Publication of DE3583544D1 publication Critical patent/DE3583544D1/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/532—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
    • H01L23/53204—Conductive materials
    • H01L23/53271—Conductive materials containing semiconductor material, e.g. polysilicon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0272—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers for lift-off processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/76877—Filling of holes, grooves or trenches, e.g. vias, with conductive material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/942—Masking
    • Y10S438/948—Radiation resist
    • Y10S438/951—Lift-off
DE8585106582T 1984-06-22 1985-05-29 Schutz fuer halbleiterkontaktmetall. Expired - Fee Related DE3583544D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/623,656 US4640738A (en) 1984-06-22 1984-06-22 Semiconductor contact protection

Publications (1)

Publication Number Publication Date
DE3583544D1 true DE3583544D1 (de) 1991-08-29

Family

ID=24498919

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8585106582T Expired - Fee Related DE3583544D1 (de) 1984-06-22 1985-05-29 Schutz fuer halbleiterkontaktmetall.

Country Status (4)

Country Link
US (1) US4640738A (de)
EP (1) EP0165513B1 (de)
JP (1) JPS618955A (de)
DE (1) DE3583544D1 (de)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4687541A (en) * 1986-09-22 1987-08-18 Rockwell International Corporation Dual deposition single level lift-off process
JPS63124446A (ja) * 1986-11-06 1988-05-27 インタ−ナショナル・ビジネス・マシ−ンズ・コ−ポレ−シヨン 接続孔形成方法
US5238435A (en) * 1987-06-10 1993-08-24 U.S. Philips Corporation Liquid crystal display device and method of manufacturing such a display device
US5055423A (en) * 1987-12-28 1991-10-08 Texas Instruments Incorporated Planarized selective tungsten metallization system
US4902379A (en) * 1988-02-08 1990-02-20 Eastman Kodak Company UHV compatible lift-off method for patterning nobel metal silicide
US4956304A (en) * 1988-04-07 1990-09-11 Santa Barbara Research Center Buried junction infrared photodetector process
FR2630588A1 (fr) * 1988-04-22 1989-10-27 Philips Nv Procede pour realiser une configuration d'interconnexion sur un dispositif semiconducteur notamment un circuit a densite d'integration elevee
US4898841A (en) * 1988-06-16 1990-02-06 Northern Telecom Limited Method of filling contact holes for semiconductor devices and contact structures made by that method
US4981816A (en) * 1988-10-27 1991-01-01 General Electric Company MO/TI Contact to silicon
US4978637A (en) * 1989-05-31 1990-12-18 Sgs-Thomson Microelectronics, Inc. Local interconnect process for integrated circuits
JPH03150874A (ja) * 1989-11-07 1991-06-27 Nec Corp 半導体装置
JPH03156930A (ja) * 1989-11-15 1991-07-04 Sanyo Electric Co Ltd 半導体装置
US5317192A (en) * 1992-05-06 1994-05-31 Sgs-Thomson Microelectronics, Inc. Semiconductor contact via structure having amorphous silicon side walls
JP3086747B2 (ja) * 1992-05-07 2000-09-11 三菱電機株式会社 半導体装置およびその製造方法
US6130482A (en) * 1995-09-26 2000-10-10 Fujitsu Limited Semiconductor device and method for fabricating the same
US6025256A (en) * 1997-01-06 2000-02-15 Electro Scientific Industries, Inc. Laser based method and system for integrated circuit repair or reconfiguration
KR100770541B1 (ko) * 2005-12-29 2007-10-25 동부일렉트로닉스 주식회사 반도체 소자 및 그 제조 방법
TWI339444B (en) 2007-05-30 2011-03-21 Au Optronics Corp Conductor structure, pixel structure, and methods of forming the same
DE102013104953B4 (de) * 2013-05-14 2023-03-02 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronisches Bauelement und Verfahren zu seiner Herstellung

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3985597A (en) * 1975-05-01 1976-10-12 International Business Machines Corporation Process for forming passivated metal interconnection system with a planar surface
US4076575A (en) * 1976-06-30 1978-02-28 International Business Machines Corporation Integrated fabrication method of forming connectors through insulative layers
JPS5915174B2 (ja) * 1976-07-26 1984-04-07 日本電信電話株式会社 フオトマスクの製造方法
JPS5475275A (en) * 1977-11-29 1979-06-15 Fujitsu Ltd Manufacture of semiconductor device
US4410622A (en) * 1978-12-29 1983-10-18 International Business Machines Corporation Forming interconnections for multilevel interconnection metallurgy systems
US4272561A (en) * 1979-05-29 1981-06-09 International Business Machines Corporation Hybrid process for SBD metallurgies
US4367119A (en) * 1980-08-18 1983-01-04 International Business Machines Corporation Planar multi-level metal process with built-in etch stop
US4361599A (en) * 1981-03-23 1982-11-30 National Semiconductor Corporation Method of forming plasma etched semiconductor contacts
US4377633A (en) * 1981-08-24 1983-03-22 International Business Machines Corporation Methods of simultaneous contact and metal lithography patterning
US4514751A (en) * 1982-12-23 1985-04-30 International Business Machines Corporation Compressively stresses titanium metallurgy for contacting passivated semiconductor devices

Also Published As

Publication number Publication date
EP0165513A2 (de) 1985-12-27
EP0165513A3 (en) 1987-05-13
JPS618955A (ja) 1986-01-16
JPH0312767B2 (de) 1991-02-21
EP0165513B1 (de) 1991-07-24
US4640738A (en) 1987-02-03

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee