DE3587013D1 - Plasmareaktor mit einer automatisierten schleuse zur ladung von einzelwaferkassetten. - Google Patents

Plasmareaktor mit einer automatisierten schleuse zur ladung von einzelwaferkassetten.

Info

Publication number
DE3587013D1
DE3587013D1 DE8585307442T DE3587013T DE3587013D1 DE 3587013 D1 DE3587013 D1 DE 3587013D1 DE 8585307442 T DE8585307442 T DE 8585307442T DE 3587013 T DE3587013 T DE 3587013T DE 3587013 D1 DE3587013 D1 DE 3587013D1
Authority
DE
Germany
Prior art keywords
loading
plasma reactor
single wafer
automated lock
cartridges
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE8585307442T
Other languages
English (en)
Other versions
DE3587013T2 (de
Inventor
Rhett B Jucha
Frederick W Brown
Stanford P Kohan
Cecil J Davis
John E Spencer
Randall E Johnson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Texas Instruments Inc
Original Assignee
Texas Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Texas Instruments Inc filed Critical Texas Instruments Inc
Application granted granted Critical
Publication of DE3587013D1 publication Critical patent/DE3587013D1/de
Publication of DE3587013T2 publication Critical patent/DE3587013T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/18—Vacuum locks ; Means for obtaining or maintaining the desired pressure within the vessel
    • H01J37/185—Means for transferring objects between different enclosures of different pressure or atmosphere
DE8585307442T 1984-10-24 1985-10-16 Plasmareaktor mit einer automatisierten schleuse zur ladung von einzelwaferkassetten. Expired - Fee Related DE3587013T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/664,448 US4659413A (en) 1984-10-24 1984-10-24 Automated single slice cassette load lock plasma reactor

Publications (2)

Publication Number Publication Date
DE3587013D1 true DE3587013D1 (de) 1993-03-04
DE3587013T2 DE3587013T2 (de) 1993-08-05

Family

ID=24666011

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8585307442T Expired - Fee Related DE3587013T2 (de) 1984-10-24 1985-10-16 Plasmareaktor mit einer automatisierten schleuse zur ladung von einzelwaferkassetten.

Country Status (3)

Country Link
US (1) US4659413A (de)
EP (1) EP0179610B1 (de)
DE (1) DE3587013T2 (de)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2635021B2 (ja) * 1985-09-26 1997-07-30 宣夫 御子柴 堆積膜形成法及びこれに用いる装置
US4842680A (en) * 1985-10-24 1989-06-27 Texas Instruments Incorporated Advanced vacuum processor
US4816116A (en) * 1985-10-24 1989-03-28 Texas Instruments Incorporated Semiconductor wafer transfer method and arm mechanism
US5096364A (en) * 1986-04-28 1992-03-17 Varian Associates, Inc. Wafer arm handler mechanism
DE3814924A1 (de) * 1988-05-03 1989-11-16 Leybold Ag Vorrichtung zum ein- und ausschleusen von substraten aus einem vakuumkessel
JPH0478377A (ja) * 1990-07-20 1992-03-12 Tokyo Electron Ltd トグル式ゲート
US5494522A (en) * 1993-03-17 1996-02-27 Tokyo Electron Limited Plasma process system and method
US5813893A (en) * 1995-12-29 1998-09-29 Sgs-Thomson Microelectronics, Inc. Field emission display fabrication method
US5746565A (en) * 1996-01-22 1998-05-05 Integrated Solutions, Inc. Robotic wafer handler
US7102737B2 (en) * 1997-11-04 2006-09-05 Micron Technology, Inc. Method and apparatus for automated, in situ material detection using filtered fluoresced, reflected, or absorbed light
US6704107B1 (en) * 1997-11-04 2004-03-09 Micron Technology, Inc. Method and apparatus for automated, in situ material detection using filtered fluoresced, reflected, or absorbed light
US6528364B1 (en) * 1998-08-24 2003-03-04 Micron Technology, Inc. Methods to form electronic devices and methods to form a material over a semiconductive substrate
US6204142B1 (en) 1998-08-24 2001-03-20 Micron Technology, Inc. Methods to form electronic devices
DE10052724B4 (de) * 2000-10-24 2012-08-02 Pac Tech-Packaging Technologies Gmbh Behandlungseinrichtung für Wafer
US8983631B2 (en) * 2009-06-30 2015-03-17 Lam Research Corporation Arrangement for identifying uncontrolled events at the process module level and methods thereof
US8473089B2 (en) * 2009-06-30 2013-06-25 Lam Research Corporation Methods and apparatus for predictive preventive maintenance of processing chambers
US8618807B2 (en) * 2009-06-30 2013-12-31 Lam Research Corporation Arrangement for identifying uncontrolled events at the process module level and methods thereof
US8538572B2 (en) * 2009-06-30 2013-09-17 Lam Research Corporation Methods for constructing an optimal endpoint algorithm
US20110180097A1 (en) * 2010-01-27 2011-07-28 Axcelis Technologies, Inc. Thermal isolation assemblies for wafer transport apparatus and methods of use thereof
JP5730521B2 (ja) * 2010-09-08 2015-06-10 株式会社日立ハイテクノロジーズ 熱処理装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3757733A (en) * 1971-10-27 1973-09-11 Texas Instruments Inc Radial flow reactor
JPS5681533U (de) * 1979-11-27 1981-07-01
US4313783A (en) * 1980-05-19 1982-02-02 Branson International Plasma Corporation Computer controlled system for processing semiconductor wafers
US4341582A (en) * 1980-12-22 1982-07-27 The Perkin-Elmer Corporation Load-lock vacuum chamber
US4433951A (en) * 1981-02-13 1984-02-28 Lam Research Corporation Modular loadlock
US4340462A (en) * 1981-02-13 1982-07-20 Lam Research Corporation Adjustable electrode plasma processing chamber
US4422896A (en) * 1982-01-26 1983-12-27 Materials Research Corporation Magnetically enhanced plasma process and apparatus
US4392915A (en) * 1982-02-16 1983-07-12 Eaton Corporation Wafer support system
US4526670A (en) * 1983-05-20 1985-07-02 Lfe Corporation Automatically loadable multifaceted electrode with load lock mechanism

Also Published As

Publication number Publication date
EP0179610A3 (en) 1988-05-11
EP0179610A2 (de) 1986-04-30
DE3587013T2 (de) 1993-08-05
EP0179610B1 (de) 1993-01-20
US4659413A (en) 1987-04-21

Similar Documents

Publication Publication Date Title
DE3587013D1 (de) Plasmareaktor mit einer automatisierten schleuse zur ladung von einzelwaferkassetten.
DE3587442T2 (de) Verfahren zur Herstellung von Polysilsesquioxanen.
DE3577885D1 (de) Gegenstand mit einer extrem harten beschichtung.
DE3486115T2 (de) Kohlenstoffartikel mit oxydationsverhindernder beschichtung.
DE3667877D1 (de) Kernbrennstabbuendellademaschine und verfahren zur reaktorbeladung unter einsatz derselben.
DE3578750D1 (de) Mit verschlusselementen versehener flaschentraeger.
DE58901634D1 (de) Verfahren zur kernchlorierung von aromatischen kohlenwasserstoffen.
DE3571838D1 (en) Chemical beam deposition method
DE58900973D1 (de) Verfahren zur kernchlorierung von aromatischen kohlenwasserstoffen.
NO164559C (no) Fremgangsmaate for bestemmelse av produktiviteten av en broennbeliggenhet.
DE3860379D1 (de) Verfahren zur kernchlorierung von aromatischen kohlenwasserstoffen.
DE3884180D1 (de) Verfahren zur Einlagerung von radioaktiven Abfallstoffen.
NO164917C (no) Fremgangsmaate ved fermentering av myse.
DE3576707D1 (de) Verfahren zur verhinderung der bildung von ablagerungen in raffinerievorrichtungen.
DE3889687D1 (de) Verfahren zur Darstellung von leitenden oder supraleitenden dünnen Schichten.
NO164902C (no) Fremgangsmaate til fremstilling av en kjemisk forbindelse.
DE3884157D1 (de) Verfahren zur Alkylierung von Phenolen.
IT8521441A0 (it) Procedimento per rivestire un substrato con un composto metallico.
DE3688818T2 (de) Verfahren zur Herstellung von gesinterten Kernbrennstoffkörpern.
AT384670B (de) Panzersperre
DE3784791T2 (de) Abschirmungsanordnung zur einschraenkung der uebertragung von elektromagnetischen strahlen.
IT8419560A0 (it) Procedimento per rivestire substrati filiformi.
NO864224D0 (no) Laasesikring for et vaapenroer til automatiske vaapen.
NO167311C (no) Fremgangsmaate for fjerning av brukte eller overskytende kokekjemikalier.
NO162802C (no) Fremgangsmaate ved fremstilling av en sponplate.

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee