DE3672306D1 - Geklebte photostrukturierbare polyimidfolie. - Google Patents
Geklebte photostrukturierbare polyimidfolie.Info
- Publication number
- DE3672306D1 DE3672306D1 DE8686810389T DE3672306T DE3672306D1 DE 3672306 D1 DE3672306 D1 DE 3672306D1 DE 8686810389 T DE8686810389 T DE 8686810389T DE 3672306 T DE3672306 T DE 3672306T DE 3672306 D1 DE3672306 D1 DE 3672306D1
- Authority
- DE
- Germany
- Prior art keywords
- adhesive
- polyimide film
- photostructurable
- photostructurable polyimide
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000853 adhesive Substances 0.000 title 1
- 230000001070 adhesive effect Effects 0.000 title 1
- 229920001721 polyimide Polymers 0.000 title 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
- G03F7/0387—Polyamides or polyimides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0346—Organic insulating material consisting of one material containing N
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3452—Solder masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
- H05K3/4676—Single layer compositions
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
- Y10S430/148—Light sensitive titanium compound containing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24273—Structurally defined web or sheet [e.g., overall dimension, etc.] including aperture
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
- Y10T428/31515—As intermediate layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31721—Of polyimide
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31855—Of addition polymer from unsaturated monomers
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CH380985 | 1985-09-04 | ||
CH460785 | 1985-10-25 |
Publications (1)
Publication Number | Publication Date |
---|---|
DE3672306D1 true DE3672306D1 (de) | 1990-08-02 |
Family
ID=25693895
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE8686810389T Expired - Lifetime DE3672306D1 (de) | 1985-09-04 | 1986-08-29 | Geklebte photostrukturierbare polyimidfolie. |
Country Status (4)
Country | Link |
---|---|
US (2) | US4786569A (de) |
EP (1) | EP0214103B1 (de) |
KR (1) | KR940007791B1 (de) |
DE (1) | DE3672306D1 (de) |
Families Citing this family (39)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3767392D1 (de) * | 1986-07-08 | 1991-02-21 | Ciba Geigy Ag | Beschichtetes material enthaltend eine strahlungsempfindliche polyimidschicht mit speziellen diaminodiphenylmethaneinheiten. |
US5102959A (en) * | 1987-12-15 | 1992-04-07 | Ciba-Geigy Corporation | Auto-photocrosslinkable copolyimides and polyimide compositions |
US4925912A (en) * | 1987-12-15 | 1990-05-15 | Ciba-Geigy Corporation | Auto-photocrosslinkable copolyimides and polyimide compositions |
DE3851134D1 (de) * | 1987-12-15 | 1994-09-22 | Ciba Geigy Ag | Autophotovernetzbare Copolyimide und Polyimidzusammensetzungen. |
GB8822145D0 (en) * | 1988-09-21 | 1988-10-26 | Ciba Geigy Ag | Method |
US5081005A (en) * | 1989-03-24 | 1992-01-14 | The Boeing Company | Method for reducing chemical interaction between copper features and photosensitive dielectric compositions |
US5006488A (en) * | 1989-10-06 | 1991-04-09 | International Business Machines Corporation | High temperature lift-off process |
EP0438382A1 (de) * | 1990-01-19 | 1991-07-24 | Ciba-Geigy Ag | Disubstituierte aromatische Dianhydride und daraus hergestelle Polyimide |
US5219669A (en) * | 1990-04-26 | 1993-06-15 | International Business Machines Corporation | Layer thin film wiring process featuring self-alignment of vias |
US5130229A (en) * | 1990-04-26 | 1992-07-14 | International Business Machines Corporation | Multi layer thin film wiring process featuring self-alignment of vias |
US5091289A (en) * | 1990-04-30 | 1992-02-25 | International Business Machines Corporation | Process for forming multi-level coplanar conductor/insulator films employing photosensitive polyimide polymer compositions |
US5229257A (en) * | 1990-04-30 | 1993-07-20 | International Business Machines Corporation | Process for forming multi-level coplanar conductor/insulator films employing photosensitive polymide polymer compositions |
CA2040994A1 (en) * | 1990-05-08 | 1991-11-09 | David D. Ngo | Photoimageable polyimide coating |
US5114757A (en) * | 1990-10-26 | 1992-05-19 | Linde Harold G | Enhancement of polyimide adhesion on reactive metals |
US5766824A (en) * | 1993-07-16 | 1998-06-16 | Semiconductor Systems, Inc. | Method and apparatus for curing photoresist |
EP0634699A1 (de) * | 1993-07-16 | 1995-01-18 | Semiconductor Systems, Inc. | Gruppiertes fotolithografisches System |
US5877229A (en) * | 1995-07-26 | 1999-03-02 | Lockheed Martin Energy Systems, Inc. | High energy electron beam curing of epoxy resin systems incorporating cationic photoinitiators |
US6462107B1 (en) | 1997-12-23 | 2002-10-08 | The Texas A&M University System | Photoimageable compositions and films for printed wiring board manufacture |
SE512906C2 (sv) | 1998-10-02 | 2000-06-05 | Ericsson Telefon Ab L M | Förfarande vid lödning av ett halvledarchip samt RF-power transistor för genomförande därav |
US6824879B2 (en) | 1999-06-10 | 2004-11-30 | Honeywell International Inc. | Spin-on-glass anti-reflective coatings for photolithography |
KR100804873B1 (ko) * | 1999-06-10 | 2008-02-20 | 얼라이드시그날 인코퍼레이티드 | 포토리소그래피용 sog 반사방지 코팅 |
US6368400B1 (en) * | 2000-07-17 | 2002-04-09 | Honeywell International | Absorbing compounds for spin-on-glass anti-reflective coatings for photolithography |
KR100589067B1 (ko) | 2001-10-30 | 2006-06-14 | 가부시키가이샤 가네카 | 감광성 수지 조성물, 이것을 이용한 감광성 필름 및 적층체 |
WO2003044600A1 (en) | 2001-11-15 | 2003-05-30 | Honeywell International Inc. | Spin-on anti-reflective coatings for photolithography |
KR100559153B1 (ko) * | 2002-02-28 | 2006-03-10 | 히다치 가세고교 가부시끼가이샤 | 전극의 접속방법, 그것에 사용되는 표면처리 배선판 및접착필름 및 전극의 접속구조 |
DE10227807A1 (de) * | 2002-06-21 | 2004-01-22 | Honeywell Specialty Chemicals Seelze Gmbh | Silylalkylester von Anthracen- und Phenanthrencarbonsäuren |
JP4300847B2 (ja) * | 2003-04-01 | 2009-07-22 | Jsr株式会社 | 感光性樹脂膜およびこれからなる硬化膜 |
US8053159B2 (en) | 2003-11-18 | 2011-11-08 | Honeywell International Inc. | Antireflective coatings for via fill and photolithography applications and methods of preparation thereof |
US7608367B1 (en) * | 2005-04-22 | 2009-10-27 | Sandia Corporation | Vitreous carbon mask substrate for X-ray lithography |
TW200710570A (en) * | 2005-05-31 | 2007-03-16 | Taiyo Ink Mfg Co Ltd | Composition for forming adhesive pattern, multilayer structure obtained by using same, and method for producing such multilayer structure |
US20080292993A1 (en) * | 2006-12-22 | 2008-11-27 | Canon Kabushiki Kaisha | Photo-cationic polymerizable epoxy resin composition, liquid discharge head, and manufacturing method thereof |
US8642246B2 (en) | 2007-02-26 | 2014-02-04 | Honeywell International Inc. | Compositions, coatings and films for tri-layer patterning applications and methods of preparation thereof |
US7955782B2 (en) * | 2008-09-22 | 2011-06-07 | Honeywell International Inc. | Bottom antireflective coatings exhibiting enhanced wet strip rates, bottom antireflective coating compositions for forming bottom antireflective coatings, and methods for fabricating the same |
US8557877B2 (en) | 2009-06-10 | 2013-10-15 | Honeywell International Inc. | Anti-reflective coatings for optically transparent substrates |
JP5461372B2 (ja) * | 2010-11-26 | 2014-04-02 | 株式会社ジャパンディスプレイ | 配向膜形成用溶媒、それを用いた配向膜材料および液晶表示装置の製造方法 |
US8864898B2 (en) | 2011-05-31 | 2014-10-21 | Honeywell International Inc. | Coating formulations for optical elements |
US20150151514A1 (en) * | 2013-11-29 | 2015-06-04 | Samsung Electronics Co., Ltd. | Laminated Structure, Method of Preparing Same, and Method of Fabricating Electronic Device Using Laminated Structure |
WO2016167892A1 (en) | 2015-04-13 | 2016-10-20 | Honeywell International Inc. | Polysiloxane formulations and coatings for optoelectronic applications |
US10036952B2 (en) | 2015-04-21 | 2018-07-31 | Fujifilm Electronic Materials U.S.A., Inc. | Photosensitive polyimide compositions |
Family Cites Families (54)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3450613A (en) * | 1964-03-09 | 1969-06-17 | Bausch & Lomb | Epoxy adhesive containing acrylic acid-epoxy reaction products and photosensitizers |
US3526504A (en) * | 1966-07-07 | 1970-09-01 | Du Pont | Photocrosslinkable elements and processes |
US3469982A (en) * | 1968-09-11 | 1969-09-30 | Jack Richard Celeste | Process for making photoresists |
US3752750A (en) * | 1969-05-30 | 1973-08-14 | Akira Matsushita | Method for electrodeposition |
US3925320A (en) * | 1972-05-05 | 1975-12-09 | Grace W R & Co | Solid curable polyene compositions containing liquid polythiols and solid styrene-allyl alcohol copolymer based polyenes |
US3861921A (en) * | 1973-01-12 | 1975-01-21 | Horst Hoffmann | Subbing layers comprising polyamide and phenolic resin for metal bases of photopolymerizable elements |
US4045516A (en) * | 1973-02-08 | 1977-08-30 | W. R. Grace & Co. | Solid curable polyene compositions containing a polythiol |
US3824104A (en) * | 1973-04-05 | 1974-07-16 | Grace W & Co Washington Res Ce | Solder resistant photopolymer composition |
GB1516352A (en) * | 1974-05-02 | 1978-07-05 | Gen Electric | Halonium salts |
US4127436A (en) * | 1975-04-17 | 1978-11-28 | E. I. Du Pont De Nemours And Company | Vacuum laminating process |
US4090936A (en) * | 1976-10-28 | 1978-05-23 | Minnesota Mining And Manufacturing Company | Photohardenable compositions |
DE2658422C2 (de) * | 1976-12-23 | 1986-05-22 | Hoechst Ag, 6230 Frankfurt | Verfahren zur Herstellung eines Negativ-Trockenresistfilms |
US4092442A (en) * | 1976-12-30 | 1978-05-30 | International Business Machines Corporation | Method of depositing thin films utilizing a polyimide mask |
GB1552046A (en) * | 1977-02-02 | 1979-09-05 | Ciba Geigy Ag | Film adhesives |
US4180404A (en) * | 1977-11-17 | 1979-12-25 | Asahi Kasei Kogyo Kabushiki Kaisha | Heat resistant photoresist composition and process for preparing the same |
DE2901685A1 (de) * | 1978-01-20 | 1979-07-26 | Ciba Geigy Ag | Epoxidhaltige massen und deren polymerisation |
US4195997A (en) * | 1978-01-23 | 1980-04-01 | E. I. Du Pont De Nemours And Company | Photopolymerizable compositions containing selected cellulose acetate butyrate as a binder |
US4278752A (en) * | 1978-09-07 | 1981-07-14 | E. I. Du Pont De Nemours And Company | Flame retardant radiation sensitive element |
US4349620A (en) * | 1979-06-15 | 1982-09-14 | E. I. Du Pont De Nemours And Company | Solvent developable photoresist film |
US4299938A (en) * | 1979-06-19 | 1981-11-10 | Ciba-Geigy Corporation | Photopolymerizable and thermally polymerizable compositions |
JPS5623150A (en) * | 1979-07-31 | 1981-03-04 | Kawasaki Seisakusho:Kk | Double paper sheet detector |
FR2477170B1 (fr) * | 1980-02-28 | 1986-09-19 | Toyo Boseki | Article moule a base de polyester ou de polyamide sature ayant des proprietes ameliorees et son procede de production |
US4339567A (en) * | 1980-03-07 | 1982-07-13 | Ciba-Geigy Corporation | Photopolymerization by means of sulphoxonium salts |
US4506004A (en) * | 1982-04-01 | 1985-03-19 | Sullivan Donald F | Printed wiring board |
JPS57100135A (en) * | 1980-12-13 | 1982-06-22 | Matsushita Electric Works Ltd | Preparation of epoxy resin prepreg |
US4383025A (en) * | 1980-07-10 | 1983-05-10 | Ciba-Geigy Corporation | Photopolymerization by means of sulfoxonium salts |
DE3173441D1 (en) * | 1980-08-26 | 1986-02-20 | Japan Synthetic Rubber Co Ltd | Ladder-like lower alkylpolysilsesquioxanes and process for their preparation |
US4398014A (en) * | 1980-11-04 | 1983-08-09 | Ciba-Geigy Corporation | Sulfoxonium salts and their use as polymerization catalysts |
GB2092164B (en) * | 1980-12-17 | 1984-12-05 | Hitachi Ltd | Loght or radiation-sensitive polymer composition |
US4442198A (en) * | 1981-01-16 | 1984-04-10 | W. R. Grace & Co. | Polymer composition having terminal alkene and terminal carboxyl groups |
JPS6025076B2 (ja) * | 1981-03-02 | 1985-06-15 | 川崎重工業株式会社 | 脱灰石炭・石油混合燃料の製造方法 |
JPS57143329A (en) * | 1981-03-03 | 1982-09-04 | Nippon Telegr & Teleph Corp <Ntt> | Photosensitive resin and its production |
JPS5823150A (ja) * | 1981-08-03 | 1983-02-10 | Hitachi Ltd | ブラウン管 |
DE3278567D1 (en) * | 1981-10-03 | 1988-07-07 | Japan Synthetic Rubber Co Ltd | Solvent-soluble organopolysilsesquioxanes, processes for producing the same, and compositions and semiconductor devices using the same |
JPS5868740A (ja) * | 1981-10-21 | 1983-04-23 | Japan Synthetic Rubber Co Ltd | 耐熱性フイルムホトレジスト積層物 |
JPS6025061B2 (ja) * | 1981-12-02 | 1985-06-15 | 日立化成工業株式会社 | 感光性シリコ−ン樹脂組成物 |
DE3372983D1 (en) * | 1982-04-21 | 1987-09-17 | Ciba Geigy Ag | Radiation-sensible coating composition and its use |
US4451971A (en) * | 1982-08-02 | 1984-06-05 | Fairchild Camera And Instrument Corporation | Lift-off wafer processing |
US4518676A (en) * | 1982-09-18 | 1985-05-21 | Ciba Geigy Corporation | Photopolymerizable compositions containing diaryliodosyl salts |
JPS59108031A (ja) * | 1982-12-13 | 1984-06-22 | Ube Ind Ltd | 感光性ポリイミド |
US4621043A (en) * | 1983-01-31 | 1986-11-04 | E. I. Du Pont De Nemours And Company | Storage stable photopolymerizable composition |
US4548891A (en) * | 1983-02-11 | 1985-10-22 | Ciba Geigy Corporation | Photopolymerizable compositions containing prepolymers with olefin double bonds and titanium metallocene photoinitiators |
GB8307220D0 (en) * | 1983-03-16 | 1983-04-20 | Ciba Geigy Ag | Production of images |
US4629777A (en) * | 1983-05-18 | 1986-12-16 | Ciba-Geigy Corporation | Polyimides, a process for their preparation and their use |
US4657832A (en) * | 1983-05-18 | 1987-04-14 | Ciba-Geigy Corporation | Photosensitive polymers as coating materials |
US5073476A (en) * | 1983-05-18 | 1991-12-17 | Ciba-Geigy Corporation | Curable composition and the use thereof |
US4656116A (en) * | 1983-10-12 | 1987-04-07 | Ciba-Geigy Corporation | Radiation-sensitive coating composition |
ZA837966B (en) * | 1983-10-26 | 1984-06-27 | Ciba Geigy Ag | Curable compositions containing metallocene complexes,the activated precursors obtainable therefrom and the use thereof |
JPS6098432A (ja) * | 1983-11-04 | 1985-06-01 | Fuotopori Ouka Kk | フオトレジスト形成用積層板の製造方法 |
JPS60184518A (ja) * | 1984-02-10 | 1985-09-20 | チバ‐ガイギー アーゲー | 硬化可能な組成物及びその使用法 |
ATE37242T1 (de) * | 1984-02-10 | 1988-09-15 | Ciba Geigy Ag | Verfahren zur herstellung einer schutzschicht oder einer reliefabbildung. |
EP0162017B1 (de) * | 1984-05-17 | 1991-08-21 | Ciba-Geigy Ag | Homo- und Copolymere, Verfahren zu deren Vernetzung und derenVerwendung |
US4629685A (en) * | 1984-11-16 | 1986-12-16 | Ciba-Geigy Corporation | Process for irradiating polyimides |
CN1004490B (zh) * | 1985-04-27 | 1989-06-14 | 旭化成工业株式会社 | 可固化组合物 |
-
1986
- 1986-08-27 US US06/901,095 patent/US4786569A/en not_active Expired - Fee Related
- 1986-08-29 DE DE8686810389T patent/DE3672306D1/de not_active Expired - Lifetime
- 1986-08-29 EP EP19860810389 patent/EP0214103B1/de not_active Expired - Lifetime
- 1986-09-04 KR KR1019860007452A patent/KR940007791B1/ko active IP Right Grant
-
1988
- 1988-08-12 US US07/231,323 patent/US4935320A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP0214103A2 (de) | 1987-03-11 |
KR870003407A (ko) | 1987-04-17 |
EP0214103B1 (de) | 1990-06-27 |
US4786569A (en) | 1988-11-22 |
KR940007791B1 (ko) | 1994-08-25 |
US4935320A (en) | 1990-06-19 |
EP0214103A3 (en) | 1987-12-09 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE3672306D1 (de) | Geklebte photostrukturierbare polyimidfolie. | |
DE3667675D1 (de) | Kettengestricktes haftverschlusstragband. | |
FI862754A0 (fi) | Orienterad film med syrespaerr. | |
NO860260L (no) | Klebestrimmel. | |
MX4714A (es) | Ariltriazolinonas herbicidas. | |
FI863146A0 (fi) | Roekbar syntetisk film foer livsmedelsfoerpackning. | |
DE3577753D1 (de) | Polarisationsfolie. | |
DE3685205D1 (de) | Destilliervorrichtung. | |
NL192630B (nl) | Weergeefapparaat. | |
DE3677242D1 (de) | Fluessigkristallprojektor. | |
FI863753A0 (fi) | Optisk film. | |
DE3650512D1 (de) | Orientierte Kunststoffolie | |
DE3778169D1 (de) | Polyimidfolie mit verbessertem haftvermoegen. | |
DE3879978T2 (de) | Klebstoffauftragevorrichtung. | |
DE3678059D1 (de) | Anzeigevorrichtung. | |
DE3689826T2 (de) | Polarisierender film. | |
FI853367A0 (fi) | Texturerad termoplastfilm. | |
DE3850147D1 (de) | Polyimid-Filme. | |
DE3580479D1 (de) | Auftragsvorrichtung. | |
DE3681056D1 (de) | Weichmagnetischer duenner film. | |
DE3677843D1 (de) | Klebstoffe. | |
DE3688402D1 (de) | Polycyanoarylaether-filme. | |
DE3878079D1 (de) | Klebebaender. | |
DE3688227T2 (de) | Filmuntersuchungsvorrichtung. | |
NO864914D0 (no) | Harpikspreparat for poroes film fremstilt derav. |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |