DE3688840D1 - Verfahren und vorrichtung zur elektroplattierung eines kupferblattes. - Google Patents

Verfahren und vorrichtung zur elektroplattierung eines kupferblattes.

Info

Publication number
DE3688840D1
DE3688840D1 DE8787900763T DE3688840T DE3688840D1 DE 3688840 D1 DE3688840 D1 DE 3688840D1 DE 8787900763 T DE8787900763 T DE 8787900763T DE 3688840 T DE3688840 T DE 3688840T DE 3688840 D1 DE3688840 D1 DE 3688840D1
Authority
DE
Germany
Prior art keywords
current density
electrolyte
pulsed
zone
applying
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE8787900763T
Other languages
English (en)
Other versions
DE3688840T2 (de
Inventor
Betty M Luce
Betty L Berdan
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Gould Electronics Inc
Original Assignee
Gould Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gould Inc filed Critical Gould Inc
Publication of DE3688840D1 publication Critical patent/DE3688840D1/de
Application granted granted Critical
Publication of DE3688840T2 publication Critical patent/DE3688840T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0307—Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
DE87900763T 1985-12-24 1986-12-23 Verfahren und vorrichtung zur elektroplattierung eines kupferblattes. Expired - Fee Related DE3688840T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US81309785A 1985-12-24 1985-12-24

Publications (2)

Publication Number Publication Date
DE3688840D1 true DE3688840D1 (de) 1993-09-09
DE3688840T2 DE3688840T2 (de) 1993-11-25

Family

ID=25211440

Family Applications (1)

Application Number Title Priority Date Filing Date
DE87900763T Expired - Fee Related DE3688840T2 (de) 1985-12-24 1986-12-23 Verfahren und vorrichtung zur elektroplattierung eines kupferblattes.

Country Status (13)

Country Link
US (1) US4898647A (de)
EP (1) EP0252139B1 (de)
JP (1) JPS63241193A (de)
AT (1) ATE92544T1 (de)
AU (1) AU602673B2 (de)
BR (1) BR8607061A (de)
DE (1) DE3688840T2 (de)
DK (1) DK439887D0 (de)
FI (1) FI873643A0 (de)
HU (1) HU208556B (de)
IN (1) IN166842B (de)
NO (1) NO873533L (de)
WO (1) WO1987003915A1 (de)

Families Citing this family (50)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4661213A (en) * 1986-02-13 1987-04-28 Dorsett Terry E Electroplate to moving metal
US5215645A (en) * 1989-09-13 1993-06-01 Gould Inc. Electrodeposited foil with controlled properties for printed circuit board applications and procedures and electrolyte bath solutions for preparing the same
US5403465A (en) * 1990-05-30 1995-04-04 Gould Inc. Electrodeposited copper foil and process for making same using electrolyte solutions having controlled additions of chloride ions and organic additives
US5393396A (en) * 1990-10-30 1995-02-28 Gould Inc. Apparatus for electrodepositing metal
US5228965A (en) * 1990-10-30 1993-07-20 Gould Inc. Method and apparatus for applying surface treatment to metal foil
JP3207909B2 (ja) * 1992-02-07 2001-09-10 ティーディーケイ株式会社 電気めっき方法および電気めっき用分割型不溶性電極
US5215646A (en) * 1992-05-06 1993-06-01 Circuit Foil Usa, Inc. Low profile copper foil and process and apparatus for making bondable metal foils
US5685970A (en) * 1992-07-01 1997-11-11 Gould Electronics Inc. Method and apparatus for sequentially metalized polymeric films and products made thereby
US5646814A (en) 1994-07-15 1997-07-08 Applied Materials, Inc. Multi-electrode electrostatic chuck
US5592358A (en) 1994-07-18 1997-01-07 Applied Materials, Inc. Electrostatic chuck for magnetic flux processing
JP3281783B2 (ja) * 1995-12-06 2002-05-13 三井金属鉱業株式会社 プリント配線板用銅箔、その製造法及び電解装置
US6730387B2 (en) 1996-04-24 2004-05-04 The Procter & Gamble Company Absorbent materials having improved structural stability in dry and wet states and making methods therefor
JPH10195689A (ja) * 1996-12-27 1998-07-28 Fukuda Metal Foil & Powder Co Ltd 微細孔明き金属箔の製造方法
US5863410A (en) * 1997-06-23 1999-01-26 Circuit Foil Usa, Inc. Process for the manufacture of high quality very low profile copper foil and copper foil produced thereby
US7244677B2 (en) * 1998-02-04 2007-07-17 Semitool. Inc. Method for filling recessed micro-structures with metallization in the production of a microelectronic device
EP1055020A2 (de) * 1998-02-12 2000-11-29 ACM Research, Inc. Elektroplattierungsvorrichtung und verfahren
TWI223678B (en) * 1998-03-20 2004-11-11 Semitool Inc Process for applying a metal structure to a workpiece, the treated workpiece and a solution for electroplating copper
US6565729B2 (en) * 1998-03-20 2003-05-20 Semitool, Inc. Method for electrochemically depositing metal on a semiconductor workpiece
US6497801B1 (en) * 1998-07-10 2002-12-24 Semitool Inc Electroplating apparatus with segmented anode array
WO2000015875A1 (en) * 1998-09-14 2000-03-23 Mitsui Mining & Smelting Co., Ltd. Porous copper foil, use thereof and method for preparation thereof
WO2000026444A1 (en) * 1998-11-03 2000-05-11 The John Hopkins University Copper metallization structure and method of construction
US6309969B1 (en) 1998-11-03 2001-10-30 The John Hopkins University Copper metallization structure and method of construction
US7160421B2 (en) * 1999-04-13 2007-01-09 Semitool, Inc. Turning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
US7020537B2 (en) * 1999-04-13 2006-03-28 Semitool, Inc. Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
US7264698B2 (en) * 1999-04-13 2007-09-04 Semitool, Inc. Apparatus and methods for electrochemical processing of microelectronic workpieces
US6916412B2 (en) 1999-04-13 2005-07-12 Semitool, Inc. Adaptable electrochemical processing chamber
CN1217034C (zh) * 1999-04-13 2005-08-31 塞米用具公司 具有改进的处理流体流的处理腔的工件处理装置
US6368475B1 (en) * 2000-03-21 2002-04-09 Semitool, Inc. Apparatus for electrochemically processing a microelectronic workpiece
US7351314B2 (en) 2003-12-05 2008-04-01 Semitool, Inc. Chambers, systems, and methods for electrochemically processing microfeature workpieces
US7351315B2 (en) 2003-12-05 2008-04-01 Semitool, Inc. Chambers, systems, and methods for electrochemically processing microfeature workpieces
US20030038035A1 (en) * 2001-05-30 2003-02-27 Wilson Gregory J. Methods and systems for controlling current in electrochemical processing of microelectronic workpieces
US7189318B2 (en) * 1999-04-13 2007-03-13 Semitool, Inc. Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
US7438788B2 (en) * 1999-04-13 2008-10-21 Semitool, Inc. Apparatus and methods for electrochemical processing of microelectronic workpieces
US7585398B2 (en) * 1999-04-13 2009-09-08 Semitool, Inc. Chambers, systems, and methods for electrochemically processing microfeature workpieces
KR19990064747A (ko) * 1999-05-06 1999-08-05 이종구 Ｎｉ-Ｆｅ 합금 박판 제조방법 및 그 장치
US6183607B1 (en) * 1999-06-22 2001-02-06 Ga-Tek Inc. Anode structure for manufacture of metallic foil
US20050183959A1 (en) * 2000-04-13 2005-08-25 Wilson Gregory J. Tuning electrodes used in a reactor for electrochemically processing a microelectric workpiece
US6913680B1 (en) 2000-05-02 2005-07-05 Applied Materials, Inc. Method of application of electrical biasing to enhance metal deposition
EP1337693A2 (de) * 2000-05-23 2003-08-27 Applied Materials, Inc. Verfahren und vorrichtung zur aufhebung von anomalien in keimschichten aus kupfer und zur abstimmung der grösse und des aspektverhältnises
AU2001259504A1 (en) * 2000-05-24 2001-12-03 Semitool, Inc. Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
JP2004536217A (ja) * 2000-10-03 2004-12-02 アプライド　マテリアルズ　インコーポレイテッド 金属蒸着のためのエントリーにあたって半導体基板を傾けるための方法と関連する装置
EP1481114A4 (de) 2001-08-31 2005-06-22 Semitool Inc Vorrichtung und verfahren zur elektrochemischen verarbeitung von mikroelektronischen werkstücken
US6911136B2 (en) * 2002-04-29 2005-06-28 Applied Materials, Inc. Method for regulating the electrical power applied to a substrate during an immersion process
US20040108212A1 (en) * 2002-12-06 2004-06-10 Lyndon Graham Apparatus and methods for transferring heat during chemical processing of microelectronic workpieces
US20040206628A1 (en) * 2003-04-18 2004-10-21 Applied Materials, Inc. Electrical bias during wafer exit from electrolyte bath
DE602005022650D1 (de) * 2004-04-26 2010-09-16 Rohm & Haas Elect Mat Verbessertes Plattierungsverfahren
US20060175201A1 (en) * 2005-02-07 2006-08-10 Hooman Hafezi Immersion process for electroplating applications
CN102321895B (zh) * 2011-09-01 2013-10-23 西安航天动力机械厂 一种整体式阳极槽
CN104099652A (zh) * 2014-07-09 2014-10-15 山东金宝电子股份有限公司 一种电子铜箔的表面处理粗化工艺
KR102029139B1 (ko) * 2015-11-09 2019-10-07 케이씨에프테크놀로지스 주식회사 전해동박, 그것을 포함하는 전극, 그것을 포함하는 이차전지, 및 그것의 제조방법

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4318794A (en) * 1980-11-17 1982-03-09 Edward Adler Anode for production of electrodeposited foil
US4490218A (en) * 1983-11-07 1984-12-25 Olin Corporation Process and apparatus for producing surface treated metal foil
US4549941A (en) * 1984-11-13 1985-10-29 Olin Corporation Electrochemical surface preparation for improving the adhesive properties of metallic surfaces
IT1182818B (it) * 1985-08-12 1987-10-05 Centro Speriment Metallurg Dispositivo a cella radiale per elettrodeposizione

Also Published As

Publication number Publication date
US4898647A (en) 1990-02-06
JPH031391B2 (de) 1991-01-10
AU6898187A (en) 1987-07-15
ATE92544T1 (de) 1993-08-15
NO873533D0 (no) 1987-08-21
BR8607061A (pt) 1988-02-23
DK439887A (da) 1987-08-24
HUT46083A (en) 1988-09-28
AU602673B2 (en) 1990-10-25
IN166842B (de) 1990-07-28
DE3688840T2 (de) 1993-11-25
JPS63241193A (ja) 1988-10-06
EP0252139A4 (de) 1988-03-22
NO873533L (no) 1987-08-21
WO1987003915A1 (en) 1987-07-02
DK439887D0 (da) 1987-08-24
HU208556B (en) 1993-11-29
FI873643A (fi) 1987-08-24
EP0252139A1 (de) 1988-01-13
EP0252139B1 (de) 1993-08-04
FI873643A0 (fi) 1987-08-24

Similar Documents

Publication Publication Date Title
DE3688840D1 (de) Verfahren und vorrichtung zur elektroplattierung eines kupferblattes.
MY111485A (en) Electrodeposited copper foil and process for making same.
US3644181A (en) Localized electroplating method
KR890002623B1 (en) Method for electroplating non-metallic surfaces
ATE42351T1 (de) Verfahren zur selektiven metallisierung eines werkstuecks.
DE59504068D1 (de) Verfahren und vorrichtung zum elektrolytischen metallisieren oder ätzen von behandlungsgut
ATE32532T1 (de) Verfahren und vorrichtung zum galvanoplastischen herstellen von sieben, sowie damit hergestellte siebe.
BE893883Q (fr) Procede de decapage de surfaces en cuivre ou en alliages de cuivre
AT364214B (de) Verfahren und vorrichtung zur kontinuierlichen elektroplattierung, insbesondere zum verzinken oder verzinnen
US3374159A (en) Marking of steel strip electrolytically using electrolyte adhering to the strip
DE602004003698D1 (de) Verfahren zum auffüllen von mikroblindlöchern
ATE221924T1 (de) Verfahren und vorrichtung zur behandlung einer schmelze
ATE50802T1 (de) Vorrichtung zum galvanischen abscheiden einer dispersionsschicht.
ATE214745T1 (de) Verfahren und vorrichtung zur konzentrationsregulierung von stoffen in elektrolyten
ATE135417T1 (de) Verfahren und vorrichtung zum elektrolytischen austragen von metallen aus einer metallionen enthaltenden lösung sowie elektrode zur durchführung des verfahrens
SG46609A1 (en) Method of electrolytically treating in particular flat material and apparatus particularly for carrying out the method
DE59801310D1 (de) Verfahren und vorrichtung zum herstellen einer elektrodenschicht
DE69906733T2 (de) Verfahren und vorrichtung zur elektroplattierung
SU367746A1 (ru) Контактно-химический способ осаждени металлов
Leroy Method and Apparatus for Electroless Plating
ES2012606A6 (es) Metodo de eliminar una configuracion denditrica durante la galvanoplastia de cinta metalica:
EP0141507A3 (de) Verfahren und Vorrichtung zur stromlosen Plattierung
KR890005304A (ko) 구리박막을 전기도금하는 방법 및 장치
Florian Process for Electroplating a Zinc--Nickel Alloy on a Steel Strip
ATE539181T1 (de) Verfahren und vorrichtung zum verschieben von auf kontaktbalken hängenden metall-anodenplatten oder metall-anodenstäben in elektrolyttanks

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: GOULD ELECTRONICS INC., EASTLAKE, OHIO, US

8328 Change in the person/name/address of the agent

Free format text: DERZEIT KEIN VERTRETER BESTELLT

8327 Change in the person/name/address of the patent owner

Owner name: NIKKO MATERIALS USA INC., CHANDLER, ARIZ., US

8339 Ceased/non-payment of the annual fee