DE3701310A1 - Contact-making device for making contact with surface-mounted integrated circuits - Google Patents

Contact-making device for making contact with surface-mounted integrated circuits

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Publication number
DE3701310A1
DE3701310A1 DE19873701310 DE3701310A DE3701310A1 DE 3701310 A1 DE3701310 A1 DE 3701310A1 DE 19873701310 DE19873701310 DE 19873701310 DE 3701310 A DE3701310 A DE 3701310A DE 3701310 A1 DE3701310 A1 DE 3701310A1
Authority
DE
Germany
Prior art keywords
circuit
carrier
intermediate ring
contact
carrier material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE19873701310
Other languages
German (de)
Inventor
Bernd Dipl Ing Clemens
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bodenseewerk Geratetechnik GmbH
Original Assignee
Bodenseewerk Geratetechnik GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bodenseewerk Geratetechnik GmbH filed Critical Bodenseewerk Geratetechnik GmbH
Priority to DE19873701310 priority Critical patent/DE3701310A1/en
Publication of DE3701310A1 publication Critical patent/DE3701310A1/en
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/714—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1053—Plug-in assemblages of components, e.g. IC sockets having interior leads
    • H05K7/1061—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/12—Resilient or clamping means for holding component to structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • H01R13/2414—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means conductive elastomers

Abstract

The contact-making device contains an intermediate ring (20) consisting of zebra conductive rubber (rubber with alternating regions of different conductance) which is inserted between the connecting contacts (14, 16) of the circuit carrier (12) and the printed circuit board (18). A retaining bracket (26) which can be latched in the printed circuit board (18) holds the integrated circuit (10) and the circuit carrier (12) and, in the latched-in state, compresses the intermediate ring (20). The connection between the pairs of associated connecting contacts (14, 16) is then produced via the electrically conductive wafers of the zebra conductive rubber. <IMAGE>

Description

Die Erfindung betrifft eine Kontaktierungsvor­ richtung zur Kontaktierung von oberflächenmontier­ baren integrierten Schaltkreisen, die auf einem Schaltkreisträger sitzen und mit diesem mittels eines Montageelements auf einem Trägermaterial montiert sind.The invention relates to a contacting direction for contacting surface mount ed integrated circuits that are on a Circuit carrier sit and with this a mounting element on a carrier material are mounted.

Es gibt integrierte Schaltkreise oder "Chips". Das sind kleine Blöcke, in denen eine Vielzahl von Schaltungsfunktionen integriert sind. Diese inte­ grierten Schaltkreise sitzen auf einem flachen, im allgemeinen rechteckigen oder quadratischen Schalt­ kreisträger oder "Chip Carrier" aus Kunststoff oder Keramik. Dieser Schaltkreisträger weist längs seines Randes nebeneinander die verschiedenen An­ schlußkontakte für den integrierten Schaltkreis auf. Die Schaltkreisträger bezeichnet man auch als PLCCs (plastic leadless chip carriers) oder LCCCs (leadless ceramic chip carriers). Der Schaltkreisträger wird wiederum mittels jeweils eines Montageelements auf einem Trägermaterial montiert. "Trägermaterial" kann beispielsweise eine Leiterplatte oder ein Keramiksubstrat sein. Solche Montageelemente geben Kontakt mit den Anschlußkontakten des Schaltkreisträgers und verbinden diese mit Anschlußdrähten oder -kontaktzungen, die wiederum mit der Leiterplatte o.dgl. verlötet werden.There are integrated circuits or "chips". The are small blocks in which a variety of Circuit functions are integrated. This inte circuits sit on a flat, im general rectangular or square switching circular carrier or "chip carrier" made of plastic or Ceramics. This circuit carrier points lengthways the different types of its side by side final contacts for the integrated circuit on. The circuit carriers are also referred to as PLCCs (plastic leadless chip carriers) or LCCCs (leadless ceramic chip carriers). The Circuit carrier is in turn by means of a mounting element on a carrier material  assembled. "Backing material" can be, for example Printed circuit board or a ceramic substrate. Such Mounting elements give contact with the Connection contacts of the circuit carrier and connect these with connecting wires or - Contact tongues, which in turn connect to the circuit board or the like to be soldered.

Schaltkreisträger und Montageelemente dieser Art sind beispielsweise dargestellt in der Firmenzeit­ schrift der Cannon Electric GmbH ITT-CANNON SCC-1/985 "Montageelemente für Chip Carriers - Sockets for Chip Carriers".Circuit carriers and assembly elements of this type are shown in company time, for example written by Cannon Electric GmbH ITT-CANNON SCC-1/985 "assembly elements for chip carriers - Sockets for Chip Carriers ".

Die üblichen Kontaktierungsvorrichtungen haben den Nachteil, daß eine Auswechslung des integrierten Schaltkreises für Meß- und Reparaturzwecke sehr schwierig ist. Entweder müssen mit einem Heißluft­ gerät alle vier Seiten des Montageelements gleich­ mäßig erhitzt werden, um das Lot zum Schmelzen zu bringen, oder das Montageelement muß mit einem speziellen quadratischen Lötstempel ausgelötet werden. Beide Verfahren sind aufwendig und zeitraubend und führen häufig zu einer thermischen Überlastung der Bauteile. Weiterhin benötigt man bei den handelsüblichen Montageelementen ein besonderes Werkzeug, um den Schaltkreisträger aus dem Montageelement herauszunehmen.The usual contacting devices have the Disadvantage that a replacement of the integrated Circuit for measurement and repair purposes very much is difficult. Either have to use hot air all four sides of the mounting element are the same be moderately heated to melt the solder bring, or the mounting element with a special square soldering stamp will. Both procedures are complex and time consuming and often lead to thermal Overloading the components. Furthermore you need with the commercially available assembly elements special tool to make the circuit carrier out to remove the mounting element.

Der Erfindung liegt die Aufgabe zugrunde, eine Kontaktierungsvorrichtung der eingangs genannten Art so auszubilden, daß einerseits eine sichere Kontaktierung gewährleistet ist und andererseits der integrierte Schaltkreis bequem wieder ausgebaut werden kann. The invention has for its object a Contacting device of the aforementioned Kind in such a way that on the one hand a safe Contacting is guaranteed and on the other hand the integrated circuit is easily removed again can be.  

Der Erfindung liegt weiter die Aufgabe zugrunde, eine möglichst einfach aufgebaute Kontaktierungs­ vorrichtung zu schaffen.The invention is further based on the object a contact structure that is as simple as possible creating device.

Eine weitere Aufgabe der Erfindung besteht darin, eine Kontaktierungsvorrichtung zu schaffen, bei welcher die Verbindung zwischen den Anschlußkon­ takten des Schaltkreisträgers und den Anschluß­ kontakten des Trägermaterials ohne Lötverbindungen sicher hergestellt wird.Another object of the invention is to create a contacting device at which is the connection between the connecting con clocking the circuit carrier and the connection contacts of the carrier material without solder connections is manufactured safely.

Erfindungsgemäß werden diese Aufgaben gelöst durchAccording to the invention, these tasks are solved by

  • a) einen elastischen Zwischenring aus Zebraleit­ gummi, der zwischen die Anschlußkontakte des Schaltkreisträgers und die Anschlußkontakte des Trägermaterials eingesetzt ist unda) an elastic intermediate ring made of zebral wire rubber between the contacts of the Circuit carrier and the connecting contacts of the carrier material is used and
  • b) eine in das Trägermaterial einrastbare Halte­ klammer, welche den zu kontaktierenden inte­ grierten Schaltkreis und den Schaltkreisträger aufnimmt und im eingerasteten Zustand den Zwischenring über den Schaltkreisträger fe­ dernd zusammendrückt.b) a holder which can be latched into the carrier material brackets, which the inte circuit and the circuit carrier records and in the locked state Intermediate ring over the circuit carrier fe which squeezes.

"Zebraleitgummi" ist bekannt. Das ist ein Material, welches aus abwechselnd aufeinanderfolgenden sehr feinen Scheiben von elektrisch leitendem, elasti­ schem Material (Gummi) und isolierenden Gummischei­ ben besteht. Dieses Material wird zwischen den Anschlußkontakten des Schaltkreisträgers und den damit fluchtenden Anschlußkontakten der Leiter­ platte o.dgl. zusammengedrückt. Dabei wird über mehrere dieser Scheiben eine elektrisch leitende Verbindung zwischen den einander zugeordneten Anschlußkontakten hergestellt. Von dem benachbarten Paar von Anschlußkontakten sind diese Schichten jeweils durch die angrenzenden isolierenden Gummi­ scheiben elektrisch isoliert. Durch die federnd- elastische Anlage mit Vorspannung ist eine einwand­ freie Kontaktierung gewährleistet. Durch Ausrasten der Halteklammer kann diese von der Leiterplatte o.dgl. gelöst werden. Damit wird der Schaltkreis­ träger ohne weiteres frei."Zebraleitgummi" is known. This is a material which consists of alternating very consecutive fine discs of electrically conductive, elastic chemical material (rubber) and insulating rubber sheave ben exists. This material is between the Connection contacts of the circuit carrier and the thus aligned connection contacts of the conductors plate or the like pressed together. It is about several of these disks are electrically conductive Connection between the assigned  Connection contacts made. From the neighboring one These layers are a pair of connection contacts each through the adjacent insulating rubber discs electrically insulated. Due to the springy elastic system with preload is a flaw free contact guaranteed. By disengaging the retaining clip can remove this from the circuit board or the like be solved. This will make the circuit Carrier easily free.

Ausgestaltungen der Erfindung sind Gegenstand der Unteransprüche.Embodiments of the invention are the subject of Subclaims.

Ein Ausführungsbeispiel der Erfindung ist nach­ stehend unter Bezugnahme auf die zugehörigen Zeichnungen näher erläutert:An embodiment of the invention is according to standing with reference to the related Drawings explained in more detail:

Fig. 1 ist eine auseinandergezogene, schema­ tisch-perspektivische Darstellung einer Kontaktierungsvorrichtung für einen integrierten Schaltkreis. Fig. 1 is an exploded, schematic-perspective view of a contacting device for an integrated circuit.

Fig. 2 zeigt eine Einzelheit A von Fig. 1. FIG. 2 shows a detail A from FIG. 1.

Fig. 3 zeigt einen Schnitt durch die montierte Kontaktierungsvorrichtung etwa längs der Ebene B von Fig. 1. FIG. 3 shows a section through the assembled contacting device approximately along the plane B of FIG. 1.

Fig. 4 ist eine zugehörige Draufsicht. Figure 4 is a related top view.

Mit 10 ist ein integrierter Schaltkreis bezeichnet. Dieser sitzt auf einem Schaltkreisträger 12. Die (nicht dargestellten) Anschlüsse des integrierten Schaltkreises 10 sind mit Anschlußkontakten 14 am Rand des Schaltkreisträgers 12 verbunden. Die An­ schlußkontakte 14 erstrecken sich C-förmig um den Rand des Schaltkreisträgers 12, also sowohl über dessen Oberseite als auch über dessen (in Fig. 1 nicht sichtbare) Unterseite. Der integrierte Schaltkreis 10 mit dem Schaltkreisträger 12 ist mit Kontakten 16 zu kontaktieren, die auf einer Leiter­ platte 18 vorgesehen sind. Dabei entspricht das quadratische Muster der Kontakte 16 auf der Leiter­ platte 18 genau dem quadratischen Muster der Kon­ takte 14 an dem Schaltkreisträger 12. Die Leiter­ platte 18 bildet hier das "Trägermaterial". 10 is an integrated circuit. This sits on a circuit carrier 12 . The (not shown) connections of the integrated circuit 10 are connected to connection contacts 14 on the edge of the circuit carrier 12 . At the circuit contacts 14 extend C-shaped around the edge of the circuit carrier 12 , that is, both over its top and over its (not visible in Fig. 1) underside. The integrated circuit 10 with the circuit carrier 12 is to be contacted with contacts 16 which are provided on a circuit board 18 . The square pattern of the contacts 16 on the circuit board 18 corresponds exactly to the square pattern of the contacts 14 on the circuit board 12th The circuit board 18 here forms the "carrier material".

Die Kontaktierung erfolgt über einen elastischen Zwischenring 20 aus "Zebraleitgummi". Fig. 2 zeigt in vergrößertem Maßstab einen Abschnitt des elastischen Zwischenringes 20, wie in Fig. 1 ange­ deutet. Der Zebraleitgummi enthält abwechselnde dünne Scheiben 22 von elektrisch leitendem Gummi und dünne Scheiben 24 von isolierendem Gummi. Der Zwischenring 20 ist ebenfalls quadratisch ent­ sprechend der Anordnung der Kontakte 14 und 16. Der Zwischenring 20 hat auch quadratischen oder recht­ eckigen Querschnitt. Die Scheiben aus leitendem und isolierendem Gummi erstrecken sich jeweils senk­ recht zur Längsrichtung der einzelnen Seiten des quadratischen Zwischenringes, wie aus Fig. 2 er­ sichtlich ist.The contact is made via an elastic intermediate ring 20 made of "Zebraleitgummi". Fig. 2 shows on an enlarged scale a portion of the elastic intermediate ring 20 , as indicated in Fig. 1. The zebral conductive rubber contains alternating thin disks 22 of electrically conductive rubber and thin disks 24 of insulating rubber. The intermediate ring 20 is also square accordingly the arrangement of the contacts 14 and 16th The intermediate ring 20 also has a square or rectangular cross section. The discs made of conductive and insulating rubber each extend perpendicular to the longitudinal direction of the individual sides of the square intermediate ring, as can be seen from FIG. 2.

Zur Kontaktierung des integrierten Schaltkreises 10 wird der Zwischenring 20 auf die Kontakte 16 ge­ setzt. Der Schaltkreisträger 12 wird auf den Zwischenring 20 gelegt. Es wird dann auf den Schaltkreisträger 12 eine einrastbare Halteklammer 26 aufgesetzt. Die Halteklammer 26 nimmt, wie aus Fig. 3 ersichtlich ist, den zu kontaktierenden Schaltkreis 10 und den Schaltkreisträger 12 auf. Im eingerasteten Zustand (Fig. 3) drückt er über den Schaltkreisträger 12 den Zwischenring 20 federnd zusammen.To contact the integrated circuit 10 , the intermediate ring 20 is placed on the contacts 16 ge. The circuit carrier 12 is placed on the intermediate ring 20 . A snap-in retaining clip 26 is then placed on the circuit carrier 12 . As can be seen from FIG. 3, the holding clip 26 receives the circuit 10 to be contacted and the circuit carrier 12 . In the locked state ( Fig. 3) he presses the intermediate ring 20 together via the circuit carrier 12 .

Die Halteklammer 26 weist eine mit einem zentralen Durchbruch 28 versehene Andruckplatte 30 auf. Die Andruckplatte 30 ist an die Oberfläche 32 des Schaltkreisträgers 12 um den integrierten Schalt­ kreis 10 herum anlegbar. Der integrierte Schalt­ kreis 10 ragt dann durch den zentralen Durchbruch 28 hindurch. Weiterhin weist die Halteklammer 26 einen längs des Randes der Andruckplatte 30 ver­ laufenden Kragenteil 34 zur seitlichen Halterung von Schaltkreisträger 12 und Zwischenring 20 auf. Es sind vier vorstehende Füße 36 vorgesehen, welche in das Trägermaterial, d.h. die Leiterplatte 18 einrastbar sind. Zu diesem Zweck sind an den Füßen 36 Rastnasen 38 gebildet. Die Leiterplatte 18 besitzt vier Löcher 40, die mit den Füßen 36 im wesentlichen fluchten. Die Füße 36 sind in die Löcher 40 einsteckbar und rasten dann, wie in Fig. 3 dargestellt ist, mit den Rastnasen 38 federnd unter der Leiterplatte 18 ein. Einer der vier Füße 36 ist abweichend von den anderen gestaltet, so daß er nur in eines der Löcher 40 einrastbar ist. Auf diese Weise wird sichergestellt, daß die Andruckplatte 30 nur in einer einzigen definierten Lage eingerastet werden kann.The holding clip 26 has a pressure plate 30 provided with a central opening 28 . The pressure plate 30 can be applied to the surface 32 of the circuit carrier 12 around the integrated circuit 10 . The integrated circuit 10 then protrudes through the central opening 28 . Furthermore, the retaining clip 26 has a ver along the edge of the pressure plate 30 collar portion 34 for lateral mounting of the circuit carrier 12 and the intermediate ring 20 . Four protruding feet 36 are provided, which can be snapped into the carrier material, ie the printed circuit board 18 . For this purpose, detents 38 are formed on the feet 36 . The circuit board 18 has four holes 40 which are substantially aligned with the feet 36 . The feet 36 can be inserted into the holes 40 and then, as shown in FIG. 3, snap into place with the latches 38 under the circuit board 18 . One of the four feet 36 is designed differently from the others, so that it can only be snapped into one of the holes 40 . In this way it is ensured that the pressure plate 30 can only be locked in a single defined position.

Der Zwischenring 20 aus Zebraleitgummi wird in diesem Zustand zusammengedrückt und liegt mit gutem Kontakt an dem Schaltkreisträger 12 und der Leiterplatte 18 an. Dabei wird eine elektrische Verbindung zwischen den Paaren zusammengehöriger und miteinander fluchtender Anschlußkontakte 14 und 16 parallel über jeweils mehrere der Scheiben 22 aus leitendem Gummi hergestellt. Eine elektrische Verbindung längs des Zwischenringes 20 wird durch die isolierenden Scheiben 24 verhindert.The intermediate ring 20 made of zebral conductive rubber is compressed in this state and is in good contact with the circuit carrier 12 and the printed circuit board 18 . In this case, an electrical connection is made between the pairs of connecting contacts 14 and 16 which belong together and are aligned with one another in parallel via a plurality of the disks 22 made of conductive rubber. An electrical connection along the intermediate ring 20 is prevented by the insulating washers 24 .

Zum Lösen des integrierten Schaltkreises 10 und Schaltkreisträgers 12 werden die Füße 36 federnd auswärtsgedrückt. Sie können dann mit den Rastnasen 38 aus den Löchern herausgezogen werden. Dann können die Teile, wie in Fig. 1 dargestellt, ohne irgendein Werkzeug auseinandergezogen werden.In order to release the integrated circuit 10 and circuit carrier 12 , the feet 36 are pressed outwards in a springy manner. You can then be pulled out of the holes with the locking lugs 38 . Then, as shown in Fig. 1, the parts can be pulled apart without any tool.

Soll der integrierte Schaltkreis 10 später doch fest eingelötet werden, so kann dies bei unver­ ändertem Layout der Leiterplatte geschehen. Die beschriebene Anordnung ist daher sehr günstig für die Prototypenwicklung im Labor.If the integrated circuit 10 is later to be firmly soldered in, this can be done with the layout of the circuit board unchanged. The arrangement described is therefore very favorable for prototype development in the laboratory.

Claims (4)

1. Kontaktierungsvorrichtung zur Kontaktierung von oberflächenmontierbaren integrierten Schalt­ kreisen (10), die auf einem Schaltkreisträger (12) sitzen und mit diesem mittels eines Mon­ tageelements auf einem Trägermaterial (18) montiert sind, gekennzeichnet durch
  • a) einen elastischen Zwischenring (20) aus Zebraleitgummi, der zwischen die Anschluß­ kontakte (14) des Schaltkreisträgers (12) und die Anschlußkontakte (16) des Träger­ materials (18) eingesetzt ist und
  • b) eine in das Trägermaterial (18) einrast­ bare Halteklammer (26), welche den zu kontaktierenden integrierten Schaltkreis (10) und den Schaltkreisträger (12) auf­ nimmt und im eingerasteten Zustand den Zwischenring (20) über den Schaltkreis­ träger (12) federnd zusammendrückt.
1. Contacting device for contacting surface-mountable integrated circuits ( 10 ) which sit on a circuit carrier ( 12 ) and are mounted with this by means of a mounting element on a carrier material ( 18 ), characterized by
  • a) an elastic intermediate ring ( 20 ) made of zebraleitgummi, which is inserted between the connection contacts ( 14 ) of the circuit carrier ( 12 ) and the connection contacts ( 16 ) of the carrier material ( 18 ) and
  • b) in the support material (18) face the holding clip (26) which receives the integrated which contact circuit (10) and the circuit support (12) and in the engaged state the intermediate ring (20) support via the switching circuit (12) snap resiliently squeezing.
2. Kontaktierungsvorrichtung nach Anspruch 1, dadurch gekennzeichnet, daß die Halteklammer (26)
  • a) eine mit einem zentralen Durchbruch (28) versehene Andruckplatte (30) aufweist, die an die Oberfläche (32) des Schaltkreis­ trägers (12) anlegbar ist,
  • b) einen längs des Randes der Andruckplatte (30) verlaufenden Kragenteil (34) zur seitlichen Halterung von Schaltkreisträger (12) und Zwischenring (20) und
  • c) eine Mehrzahl von vorstehenden Füßen (36), welche in dem Trägermaterial (18) einrast­ bar sind.
2. Contacting device according to claim 1, characterized in that the holding clip ( 26 )
  • a) having a central opening ( 28 ) pressure plate ( 30 ) which can be applied to the surface ( 32 ) of the circuit carrier ( 12 ),
  • b) a along the edge of the pressure plate ( 30 ) extending collar part ( 34 ) for lateral mounting of the circuit carrier ( 12 ) and intermediate ring ( 20 ) and
  • c) a plurality of protruding feet ( 36 ) which are latched into the carrier material ( 18 ).
3. Kontaktierungsvorrichtung nach Anspruch 2, da­ durch gekennzeichnet, daß die Füße (36) mit Rastnasen (38) versehen sind, welche durch Löcher (40) des Trägermaterials (18) hindurchsteckbar sind und dann unter dem Trägermaterial (18) federnd einrasten.3. Contacting device according to claim 2, characterized in that the feet ( 36 ) are provided with locking lugs ( 38 ) which can be plugged through holes ( 40 ) of the carrier material ( 18 ) and then snap under the carrier material ( 18 ). 4. Kontaktierungsvorrichtung nach Anspruch 2, dadurch gekennzeichnet, daß einer der Füße (36) abweichend von den anderen ausgebildet und nur bei einer einzigen, definierten Lage der Andruckplatte (30) einrastbar ist.4. Contacting device according to claim 2, characterized in that one of the feet ( 36 ) is formed differently from the others and can only be snapped into a single, defined position of the pressure plate ( 30 ).
DE19873701310 1987-01-17 1987-01-17 Contact-making device for making contact with surface-mounted integrated circuits Withdrawn DE3701310A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE19873701310 DE3701310A1 (en) 1987-01-17 1987-01-17 Contact-making device for making contact with surface-mounted integrated circuits

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19873701310 DE3701310A1 (en) 1987-01-17 1987-01-17 Contact-making device for making contact with surface-mounted integrated circuits

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DE3701310A1 true DE3701310A1 (en) 1988-07-28

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US5105262A (en) * 1988-09-19 1992-04-14 Ford Motor Company Thick film circuit housing assembly design
FR2674295A1 (en) * 1991-03-22 1992-09-25 Alcatel Business Systems Device for positioning and fastening an element in an appliance, particularly for a telephone keypad
DE4242566A1 (en) * 1992-12-16 1994-06-23 Deutsche Aerospace Process for mounting semiconductor components in housings by mechanical clamping
DE4341103C1 (en) * 1993-12-02 1995-01-12 Harting Elektronik Gmbh Electrical plug connector
US5579212A (en) * 1993-07-29 1996-11-26 Sun Microsystems, Inc. Protective cover for a silicon chip device and method relating thereto
EP0813356A1 (en) * 1996-06-11 1997-12-17 Sun Microsystems, Inc. Hold-down collar for attachment of IC substrates and elastomeric material to PCBs
DE19856083A1 (en) * 1998-12-04 2000-06-21 Siemens Ag Electrical connection arrangement for data communications equipment e.g. between contact pads especially of electro=optical module and terminals of circuit board
EP1137329A2 (en) * 2000-03-24 2001-09-26 Matsushita Electric Industrial Co., Ltd. Fixture, circuit board with fixture, and electronic-component mounted body and method of manufacturing the same
DE10137667A1 (en) * 2001-08-01 2003-02-27 Infineon Technologies Ag Protection device for assemblies with spacers
DE10162676A1 (en) * 2001-12-19 2003-07-10 Infineon Technologies Ag Electronic component and system carrier and method for producing the same
DE102008018886A1 (en) * 2008-04-14 2009-10-15 Marquardt Gmbh Assembly part manufacturing method for use during manufacturing of e.g. micro switch, involves positioning component at another component in carrier such that former component is fastened at latter component and is separated from carrier
CN103969995A (en) * 2013-01-31 2014-08-06 日本冲信息株式会社 Replaceable unit, image forming apparatus that incorporates the replaceable unit
CN107017471A (en) * 2017-05-24 2017-08-04 桂林恒昌电子科技有限公司 A kind of method that ultra-fine spacing connects integrated circuit
DE102020102599A1 (en) 2020-02-03 2021-08-05 Webasto SE Arrangement and method for electrically connecting a first contact surface of a first electrical component to a second contact surface of a second electrical component and a high-voltage heater device for a vehicle

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US5833471A (en) * 1996-06-11 1998-11-10 Sun Microsystems, Inc. Hold-down collar for attachment of IC substrates and elastomeric material to PCBS
DE19856083A1 (en) * 1998-12-04 2000-06-21 Siemens Ag Electrical connection arrangement for data communications equipment e.g. between contact pads especially of electro=optical module and terminals of circuit board
EP1137329A2 (en) * 2000-03-24 2001-09-26 Matsushita Electric Industrial Co., Ltd. Fixture, circuit board with fixture, and electronic-component mounted body and method of manufacturing the same
EP1137329A3 (en) * 2000-03-24 2004-05-06 Matsushita Electric Industrial Co., Ltd. Fixture, circuit board with fixture, and electronic-component mounted body and method of manufacturing the same
DE10137667A1 (en) * 2001-08-01 2003-02-27 Infineon Technologies Ag Protection device for assemblies with spacers
US6927487B2 (en) 2001-08-01 2005-08-09 Infineon Technologies Ag Protective device with spacer for subassemblies
DE10137667B4 (en) * 2001-08-01 2010-05-20 Qimonda Ag Protective device for assemblies with spacers
DE10162676A1 (en) * 2001-12-19 2003-07-10 Infineon Technologies Ag Electronic component and system carrier and method for producing the same
DE10162676B4 (en) * 2001-12-19 2005-06-02 Infineon Technologies Ag Electronic component with a semiconductor chip and a rewiring plate and system carrier for a plurality of electronic components and method for producing the same
US6933595B2 (en) 2001-12-19 2005-08-23 Infineon Technologies Ag Electronic device and leadframe and methods for producing the electronic device and the leadframe
DE102008018886A1 (en) * 2008-04-14 2009-10-15 Marquardt Gmbh Assembly part manufacturing method for use during manufacturing of e.g. micro switch, involves positioning component at another component in carrier such that former component is fastened at latter component and is separated from carrier
CN103969995A (en) * 2013-01-31 2014-08-06 日本冲信息株式会社 Replaceable unit, image forming apparatus that incorporates the replaceable unit
CN103969995B (en) * 2013-01-31 2019-12-27 日本冲信息株式会社 Replaceable unit and image forming apparatus incorporating the same
CN107017471A (en) * 2017-05-24 2017-08-04 桂林恒昌电子科技有限公司 A kind of method that ultra-fine spacing connects integrated circuit
DE102020102599A1 (en) 2020-02-03 2021-08-05 Webasto SE Arrangement and method for electrically connecting a first contact surface of a first electrical component to a second contact surface of a second electrical component and a high-voltage heater device for a vehicle

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