DE3709222A1 - Printed circuit board - Google Patents

Printed circuit board

Info

Publication number
DE3709222A1
DE3709222A1 DE19873709222 DE3709222A DE3709222A1 DE 3709222 A1 DE3709222 A1 DE 3709222A1 DE 19873709222 DE19873709222 DE 19873709222 DE 3709222 A DE3709222 A DE 3709222A DE 3709222 A1 DE3709222 A1 DE 3709222A1
Authority
DE
Germany
Prior art keywords
circuit board
hybrid
printed circuit
plugs
structural unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
DE19873709222
Other languages
German (de)
Inventor
Heinz-Werner Wiezorek
Volker Sellner
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mannesmann VDO AG
Original Assignee
Mannesmann VDO AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mannesmann VDO AG filed Critical Mannesmann VDO AG
Priority to DE19873709222 priority Critical patent/DE3709222A1/en
Publication of DE3709222A1 publication Critical patent/DE3709222A1/en
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/12—Resilient or clamping means for holding component to structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10386—Clip leads; Terminals gripping the edge of a substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/1075—Shape details
    • H05K2201/10757—Bent leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components

Abstract

In the case of a structural unit which is formed from a printed circuit board (1) and a hybrid (2), the plugs (3, 4) which connect these two parts to one another each have a sprung region (8, 9) which is formed by a section of the plugs which is bent in a V-shape. In consequence, the hybrid (2) can spring relative to the printed circuit board (1), as a result of which the structural unit is less sensitive to shock. <IMAGE>

Description

Die Erfindung bezieht sich auf eine Baueinheit mit einer Leiterplatte und einem in Abstand darüber angeordneten Hybrid, welches mittels in die Leiterplatte greifenden Steckern mit der Leiterplatte verbunden ist. Solche Bau­ einheiten sind in den unterschiedlichsten Geräten vor­ gesehen und allgemein bekannt.The invention relates to a structural unit with a PCB and a spaced above it Hybrid, which reaches into the circuit board Plugs is connected to the circuit board. Such construction units are available in a wide variety of devices seen and well known.

Bei elektronischen Geräten ist es oftmals wünschenswert, daß diese stoßgesichert sind. Insbesondere sollten sie auch einen Fall auf einen Steinfußboden ohne Schaden überstehen. Das ist mit den herkömmlichen, ein Hybrid tragenden Leiterplatten jedoch nicht möglich, weil die dabei auftretende Stoßenergie zu einem Zerbrechen der Hybride führt.With electronic devices, it is often desirable that these are shockproof. In particular, they should also a fall on a stone floor without damage survive. That is with the conventional, a hybrid load-bearing circuit boards not possible because of the the resulting impact energy to break the Hybrid leads.

Der Erfindung liegt die Aufgabe zugrunde, eine Bauein­ heit der eingangs genannten Art derart zu gestalten, daß das Hybrid auch relativ harte Stöße, insbesondere einen Fall auf den Fußboden, ohne Schaden übersteht. The invention has for its object a Bauein unit of the type mentioned in such a way that the hybrid also has relatively hard knocks, especially one Fall on the floor without any damage.  

Diese Aufgabe wird erfindungsgemäß dadurch gelöst, daß die Stecker einen quer zur Ebene der Leiterplatte federn­ den Bereich aufweisen.This object is achieved in that the plugs spring one across the plane of the circuit board have the range.

Bei der erfindungsgemäßen Baueinheit können die Hybride relativ zur Leiterplatte federn. Dadurch brechen die Hybride weniger leicht, als wenn sie wie bei den bekann­ ten Baueinheiten mittels geraden Steckern mit der Leiter­ platte verbunden sind. Die die elektrischen Verbindungen herstellenden Stecker haben eine Doppelfunktion. Sie sind einerseits elektrische Leiter, andererseits Feder- und Dämpfungselemente.In the structural unit according to the invention, the hybrids spring relative to the circuit board. This will break them Hybrids are less light than if they had become like those ten units with straight plugs to the ladder plate are connected. The electrical connections Manufacturing plugs have a double function. they are on the one hand electrical conductors, on the other hand spring and damping elements.

Besonders einfach ist die Baueinheit gestaltet, wenn der federnde Bereich jeweils durch einen V-förmigen Ab­ schnitt des Steckers gebildet ist.The unit is particularly simple if the resilient area each by a V-shaped Ab cut of the plug is formed.

Die Baueinheit ist besonders kompakt, wenn der V-förmige Abschnitt zwischen den Hybrid und die Leiterplatte gerichtet ist.The unit is particularly compact if the V-shaped Section between the hybrid and the circuit board is directed.

Die Erfindung läßt zahlreiche Ausführungsformen zu. Zu ihrer weiteren Verdeutlichung ist eine davon in der Zeichnung dargestellt und wird nachfolgend beschrieben. Die Zeichnung zeigt inThe invention allows numerous embodiments. To its further clarification is one of them in the Drawing shown and is described below. The drawing shows in

Fig. 1 eine Vorderansicht einer erfindungsgemäßen Baueinheit, Fig. 1 is a front view of an assembly according to the invention,

Fig. 2 eine Seitenansicht der Baueinheit nach der Fig. 1. FIG. 2 shows a side view of the assembly according to FIG. 1.

Die Fig. 1 zeigt eine Leiterplatte 1, auf der in Ab­ stand zu ihr ein Hybrid 2 mittels Steckern 3, 4 be­ festigt ist. Auf dem Hybrid 2 befinden sich unterschied­ liche, elektronische Bauteile wie zum Beispiel Bauteile 5, 6. Auch auf der Leiterplatte 1 ist ein elektronisches Bauteil 7 vorgesehen. Fig. 1 shows a circuit board 1 , on the stand in from it a hybrid 2 by means of connectors 3 , 4 be fastened. The hybrid 2 contains different electronic components, such as components 5 , 6 . An electronic component 7 is also provided on the printed circuit board 1 .

Wichtig für die Erfindung ist die Gestaltung der Stecker 3, 4. Diese verlaufen nicht, wie üblich, geradlinig vom Hybrid 2 bis durch die Leiterplatte 1, sondern weisen jeweils einen federnden Bereich 8, 9 auf, der durch einen zwischen dem Hybrid 2 und der Leiterplatte 1 ge­ führten, V-förmigen Abschnitt der jeweiligen Stecker 3, 4 gebildet ist. Mit ihrem oberen Ende greifen die Stecker 3, 4 jeweils mittels einer Klammer 10, 11 über das Hybrid 2 und sind dort verlötet. Die unteren Enden der Stecker 3, 4 sind auf übliche Weise durch Löcher der Leiterplatte 1 geführt und auf der dem Hybrid 2 abge­ wandten Seite verlötet.The design of the connectors 3 , 4 is important for the invention. These do not run, as usual, straight from the hybrid 2 to through the circuit board 1 , but each have a resilient area 8 , 9 , which led through a ge between the hybrid 2 and the circuit board 1 , V-shaped section of the respective connector 3 , 4 is formed. With their upper end, the plugs 3 , 4 each grip the hybrid 2 by means of a clip 10 , 11 and are soldered there. The lower ends of the plugs 3 , 4 are guided in the usual way through holes in the circuit board 1 and soldered on the side facing the hybrid 2 .

Die Fig. 2 verdeutlicht, daß das Hybrid 2 durch eine Vielzahl von nebeneinander angeordneten Steckern 3, 4 mit der Leiterplatte verbunden ist. Fig. 2 illustrates that the hybrid 2 is connected by a plurality of juxtaposed plugs 3, 4 to the circuit board.

Claims (3)

1. Elektronische Baueinheit mit einer Leiterplatte und einem in Abstand darüber angeordneten Hybrid, welches mittels in die Leiterplatte greifenden Steckern mit der Leiterplatte verbunden ist, dadurch gekennzeichnet, daß die Stecker (3, 4) einen quer zur Ebene der Leiterplatte (1) federnden Bereich (8, 9) aufweisen.1. Electronic assembly with a circuit board and a hybrid arranged at a distance above it, which is connected by means of plugs engaging in the circuit board with the circuit board, characterized in that the connector ( 3 , 4 ) a transverse to the plane of the circuit board ( 1 ) resilient area ( 8 , 9 ). 2. Baueinheit nach Anspruch 1, dadurch gekennzeichnet, daß der federnde Bereich (8, 9) jeweils durch einen V-förmigen Abschnitt des Steckers (3, 4) gebildet ist.2. Unit according to claim 1, characterized in that the resilient region ( 8 , 9 ) is each formed by a V-shaped section of the plug ( 3 , 4 ). 3. Baueinheit nach Anspruch 2, dadurch gekennzeichnet, daß der V-förmige Abschnitt zwischen den Hybrid (2) und die Leiterplatte (1) gerichtet ist.3. Unit according to claim 2, characterized in that the V-shaped section between the hybrid ( 2 ) and the circuit board ( 1 ) is directed.
DE19873709222 1987-03-20 1987-03-20 Printed circuit board Ceased DE3709222A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE19873709222 DE3709222A1 (en) 1987-03-20 1987-03-20 Printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19873709222 DE3709222A1 (en) 1987-03-20 1987-03-20 Printed circuit board

Publications (1)

Publication Number Publication Date
DE3709222A1 true DE3709222A1 (en) 1988-09-29

Family

ID=6323611

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19873709222 Ceased DE3709222A1 (en) 1987-03-20 1987-03-20 Printed circuit board

Country Status (1)

Country Link
DE (1) DE3709222A1 (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1996013966A1 (en) * 1994-10-27 1996-05-09 Siemens Aktiengesellschaft Current supply module for mounting on a component-carrying printed circuit board
DE19614298A1 (en) * 1996-04-11 1997-10-16 Abb Patent Gmbh Contact between circuit board and bus=bar
US6336269B1 (en) * 1993-11-16 2002-01-08 Benjamin N. Eldridge Method of fabricating an interconnection element
US6727579B1 (en) 1994-11-16 2004-04-27 Formfactor, Inc. Electrical contact structures formed by configuring a flexible wire to have a springable shape and overcoating the wire with at least one layer of a resilient conductive material, methods of mounting the contact structures to electronic components, and applications for employing the contact structures
US6778406B2 (en) 1993-11-16 2004-08-17 Formfactor, Inc. Resilient contact structures for interconnecting electronic devices
WO2008009500A1 (en) * 2006-07-20 2008-01-24 Continental Automotive Gmbh Electrical contacting element for superposed electrical carrier components
US8033838B2 (en) 1996-02-21 2011-10-11 Formfactor, Inc. Microelectronic contact structure
US8485418B2 (en) 1995-05-26 2013-07-16 Formfactor, Inc. Method of wirebonding that utilizes a gas flow within a capillary from which a wire is played out

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE7104381U (en) * 1971-04-29 Schindling A Gmbh An electrical assembly made up of a printed circuit board and a thick film substrate
DE7404505U (en) * 1974-05-16 Licentia Gmbh Connection fitting for modules

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE7104381U (en) * 1971-04-29 Schindling A Gmbh An electrical assembly made up of a printed circuit board and a thick film substrate
DE7404505U (en) * 1974-05-16 Licentia Gmbh Connection fitting for modules

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6336269B1 (en) * 1993-11-16 2002-01-08 Benjamin N. Eldridge Method of fabricating an interconnection element
US6778406B2 (en) 1993-11-16 2004-08-17 Formfactor, Inc. Resilient contact structures for interconnecting electronic devices
US6835898B2 (en) 1993-11-16 2004-12-28 Formfactor, Inc. Electrical contact structures formed by configuring a flexible wire to have a springable shape and overcoating the wire with at least one layer of a resilient conductive material, methods of mounting the contact structures to electronic components, and applications for employing the contact structures
US7225538B2 (en) 1993-11-16 2007-06-05 Formfactor, Inc. Resilient contact structures formed and then attached to a substrate
WO1996013966A1 (en) * 1994-10-27 1996-05-09 Siemens Aktiengesellschaft Current supply module for mounting on a component-carrying printed circuit board
US5835358A (en) * 1994-10-27 1998-11-10 Siemens Aktiengesellschaft Power supply module for equipping an assembly PC board
US6727579B1 (en) 1994-11-16 2004-04-27 Formfactor, Inc. Electrical contact structures formed by configuring a flexible wire to have a springable shape and overcoating the wire with at least one layer of a resilient conductive material, methods of mounting the contact structures to electronic components, and applications for employing the contact structures
US8485418B2 (en) 1995-05-26 2013-07-16 Formfactor, Inc. Method of wirebonding that utilizes a gas flow within a capillary from which a wire is played out
US8033838B2 (en) 1996-02-21 2011-10-11 Formfactor, Inc. Microelectronic contact structure
DE19614298A1 (en) * 1996-04-11 1997-10-16 Abb Patent Gmbh Contact between circuit board and bus=bar
DE19614298C2 (en) * 1996-04-11 2002-09-19 Abb Patent Gmbh Contacting device for an electrical installation device
WO2008009500A1 (en) * 2006-07-20 2008-01-24 Continental Automotive Gmbh Electrical contacting element for superposed electrical carrier components

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Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law
8131 Rejection