DE3769484D1 - Verfahren zur herstellung von gedruckten leiterplatten. - Google Patents

Verfahren zur herstellung von gedruckten leiterplatten.

Info

Publication number
DE3769484D1
DE3769484D1 DE8787100547T DE3769484T DE3769484D1 DE 3769484 D1 DE3769484 D1 DE 3769484D1 DE 8787100547 T DE8787100547 T DE 8787100547T DE 3769484 T DE3769484 T DE 3769484T DE 3769484 D1 DE3769484 D1 DE 3769484D1
Authority
DE
Germany
Prior art keywords
printed circuits
producing printed
producing
circuits
printed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE8787100547T
Other languages
English (en)
Inventor
Surysdevara Vijayakumar Babu
William Frederick Herrmann
Joseph Gerard Hoffarth
Voya Markovich
Robert Taylor Wiley
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Application granted granted Critical
Publication of DE3769484D1 publication Critical patent/DE3769484D1/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/08—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed by electric discharge, e.g. by spark erosion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/184—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/26—Cleaning or polishing of the conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0753—Insulation
    • H05K2201/0761—Insulation resistance, e.g. of the surface of the PCB between the conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0783—Using solvent, e.g. for cleaning; Regulating solvent content of pastes or coatings for adjusting the viscosity
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/09—Treatments involving charged particles
    • H05K2203/095—Plasma, e.g. for treating a substrate to improve adhesion with a conductor or for cleaning holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1407—Applying catalyst before applying plating resist
DE8787100547T 1986-01-24 1987-01-16 Verfahren zur herstellung von gedruckten leiterplatten. Expired - Fee Related DE3769484D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/822,216 US4718972A (en) 1986-01-24 1986-01-24 Method of removing seed particles from circuit board substrate surface

Publications (1)

Publication Number Publication Date
DE3769484D1 true DE3769484D1 (de) 1991-05-29

Family

ID=25235478

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8787100547T Expired - Fee Related DE3769484D1 (de) 1986-01-24 1987-01-16 Verfahren zur herstellung von gedruckten leiterplatten.

Country Status (4)

Country Link
US (1) US4718972A (de)
EP (1) EP0231795B1 (de)
JP (1) JPS62179197A (de)
DE (1) DE3769484D1 (de)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB8728399D0 (en) * 1987-12-04 1988-01-13 Secretary Trade Ind Brit Deposition of materials to substrates
US5092957A (en) * 1989-11-24 1992-03-03 The United States Of America As Represented By The United States Department Of Energy Carrier-lifetime-controlled selective etching process for semiconductors using photochemical etching
US5077176A (en) * 1990-07-30 1991-12-31 At&T Bell Laboratories Pre-plate cleaning process
US5167992A (en) * 1991-03-11 1992-12-01 Microelectronics And Computer Technology Corporation Selective electroless plating process for metal conductors
US5919514A (en) * 1992-12-28 1999-07-06 Xerox Corporation Process for preparing electroded donor rolls
US5509557A (en) * 1994-01-24 1996-04-23 International Business Machines Corporation Depositing a conductive metal onto a substrate
US5487218A (en) * 1994-11-21 1996-01-30 International Business Machines Corporation Method for making printed circuit boards with selectivity filled plated through holes
US6544584B1 (en) * 1997-03-07 2003-04-08 International Business Machines Corporation Process for removal of undesirable conductive material on a circuitized substrate and resultant circuitized substrate
US7381356B2 (en) 2003-10-02 2008-06-03 Kikusui Seisakusho, Ltd. Rotary powder compression molding machine
US20100081595A1 (en) * 2007-01-22 2010-04-01 Freescale Semiconductor, Inc Liquid cleaning composition and method for cleaning semiconductor devices
EP2003939A1 (de) 2007-06-14 2008-12-17 Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO Verfahren zur Erstellung eines Musters für eine dreidimensionale elektrische Schaltung
EP2197253A1 (de) * 2008-12-12 2010-06-16 Nederlandse Organisatie voor toegepast-natuurwetenschappelijk Onderzoek TNO Verfahren zur Stromkreisabscheidung
EP2281921A1 (de) 2009-07-30 2011-02-09 Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO Vorrichtung und Verfahren zur Atomlagenabscheidung
JP5573429B2 (ja) * 2009-08-10 2014-08-20 住友ベークライト株式会社 無電解ニッケル−パラジウム−金めっき方法、めっき処理物、プリント配線板、インターポーザ、および半導体装置
EP2360293A1 (de) 2010-02-11 2011-08-24 Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO Verfahren und Vorrichtung zur Ablagerung atomarer Schichten auf einem Substrat
EP2362002A1 (de) 2010-02-18 2011-08-31 Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO Kontinuierliche gemusterte Schichtablagerung
EP2362411A1 (de) 2010-02-26 2011-08-31 Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO Vorrichtung und Verfahren zum reaktiven Ionenätzen
US20150181724A1 (en) * 2013-12-17 2015-06-25 Sanmina Corporation Methods of forming segmented vias for printed circuit boards
CN113382551A (zh) * 2015-05-06 2021-09-10 哈钦森技术股份有限公司 用于硬盘驱动器的挠曲部的等离子体处理

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US30505A (en) * 1860-10-23 Fukntture-caster
SE332214B (de) * 1968-07-12 1971-02-01 Gylling & Co
US3867216A (en) * 1972-05-12 1975-02-18 Adir Jacob Process and material for manufacturing semiconductor devices
US3971684A (en) * 1973-12-03 1976-07-27 Hewlett-Packard Company Etching thin film circuits and semiconductor chips
JPS5091760A (de) * 1973-12-18 1975-07-22
JPS5320896A (en) * 1976-08-11 1978-02-25 Seiko Epson Corp Manufacture of liquid crystal display element
US4253907A (en) * 1979-03-28 1981-03-03 Western Electric Company, Inc. Anisotropic plasma etching
JPS5727177A (en) * 1980-07-25 1982-02-13 Yamamoto Yogyo Kako Kk Method for finishing ornamental wall representing pattern of natural stone
DE3110415C2 (de) * 1981-03-18 1983-08-18 Ruwel-Werke Spezialfabrik für Leiterplatten GmbH, 4170 Geldern Verfahren zum Herstellen von Leiterplatten
US4478883A (en) * 1982-07-14 1984-10-23 International Business Machines Corporation Conditioning of a substrate for electroless direct bond plating in holes and on surfaces of a substrate
US4416725A (en) * 1982-12-30 1983-11-22 International Business Machines Corporation Copper texturing process
JPS6074599A (ja) * 1983-09-30 1985-04-26 株式会社日立製作所 プリント配線板及びその製造方法
US4554182A (en) * 1983-10-11 1985-11-19 International Business Machines Corporation Method for conditioning a surface of a dielectric substrate for electroless plating
US4448804A (en) * 1983-10-11 1984-05-15 International Business Machines Corporation Method for selective electroless plating of copper onto a non-conductive substrate surface
JPS60147395A (ja) * 1984-01-12 1985-08-03 Fuji Photo Film Co Ltd 平版印刷版用版面洗浄剤
DE3407114A1 (de) * 1984-02-28 1985-09-05 Bayer Ag, 5090 Leverkusen Verfahren zur herstellung von leiterplatten
US4555303A (en) * 1984-10-02 1985-11-26 Motorola, Inc. Oxidation of material in high pressure oxygen plasma
US4568562A (en) * 1984-11-28 1986-02-04 General Dynamics, Pomona Division Method of electroless plating employing plasma treatment

Also Published As

Publication number Publication date
JPS62179197A (ja) 1987-08-06
EP0231795B1 (de) 1991-04-24
EP0231795A2 (de) 1987-08-12
US4718972A (en) 1988-01-12
EP0231795A3 (en) 1988-04-20
JPH0317390B2 (de) 1991-03-07

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee