DE3781197T2 - Verfahren und vorrichtung mit einem zweistrahleninterferenzmikroskop zur untersuchung von integrierten schaltungen und dergleichen. - Google Patents

Verfahren und vorrichtung mit einem zweistrahleninterferenzmikroskop zur untersuchung von integrierten schaltungen und dergleichen.

Info

Publication number
DE3781197T2
DE3781197T2 DE8787106331T DE3781197T DE3781197T2 DE 3781197 T2 DE3781197 T2 DE 3781197T2 DE 8787106331 T DE8787106331 T DE 8787106331T DE 3781197 T DE3781197 T DE 3781197T DE 3781197 T2 DE3781197 T2 DE 3781197T2
Authority
DE
Germany
Prior art keywords
microscope
fringes
develop
integrated circuits
interference microscope
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE8787106331T
Other languages
English (en)
Other versions
DE3781197D1 (de
Inventor
Mark Davidson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KLA Corp
Original Assignee
KLA Instruments Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by KLA Instruments Corp filed Critical KLA Instruments Corp
Publication of DE3781197D1 publication Critical patent/DE3781197D1/de
Application granted granted Critical
Publication of DE3781197T2 publication Critical patent/DE3781197T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00Measuring arrangements characterised by the use of optical techniques
    • G01B11/02Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/024Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness by means of diode-array scanning
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B9/00Measuring instruments characterised by the use of optical techniques
    • G01B9/02Interferometers
    • G01B9/02015Interferometers characterised by the beam path configuration
    • G01B9/02029Combination with non-interferometric systems, i.e. for measuring the object
    • G01B9/0203With imaging systems
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B9/00Measuring instruments characterised by the use of optical techniques
    • G01B9/02Interferometers
    • G01B9/02055Reduction or prevention of errors; Testing; Calibration
    • G01B9/0207Error reduction by correction of the measurement signal based on independently determined error sources, e.g. using a reference interferometer
    • G01B9/02072Error reduction by correction of the measurement signal based on independently determined error sources, e.g. using a reference interferometer by calibration or testing of interferometer
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B9/00Measuring instruments characterised by the use of optical techniques
    • G01B9/02Interferometers
    • G01B9/02083Interferometers characterised by particular signal processing and presentation
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B9/00Measuring instruments characterised by the use of optical techniques
    • G01B9/02Interferometers
    • G01B9/0209Low-coherence interferometers
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/95Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956Inspecting patterns on the surface of objects
    • G01N21/95607Inspecting patterns on the surface of objects using a comparative method
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605Workpiece metrology
    • G03F7/70616Monitoring the printed patterns
    • G03F7/70625Dimensions, e.g. line width, critical dimension [CD], profile, sidewall angle or edge roughness

Landscapes

  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Signal Processing (AREA)
  • Microscoopes, Condenser (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
DE8787106331T 1986-05-06 1987-05-01 Verfahren und vorrichtung mit einem zweistrahleninterferenzmikroskop zur untersuchung von integrierten schaltungen und dergleichen. Expired - Lifetime DE3781197T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/860,308 US4818110A (en) 1986-05-06 1986-05-06 Method and apparatus of using a two beam interference microscope for inspection of integrated circuits and the like

Publications (2)

Publication Number Publication Date
DE3781197D1 DE3781197D1 (de) 1992-09-24
DE3781197T2 true DE3781197T2 (de) 1993-03-25

Family

ID=25332924

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8787106331T Expired - Lifetime DE3781197T2 (de) 1986-05-06 1987-05-01 Verfahren und vorrichtung mit einem zweistrahleninterferenzmikroskop zur untersuchung von integrierten schaltungen und dergleichen.

Country Status (5)

Country Link
US (1) US4818110A (de)
EP (1) EP0244781B1 (de)
JP (1) JPH0629692B2 (de)
AT (1) ATE79669T1 (de)
DE (1) DE3781197T2 (de)

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Also Published As

Publication number Publication date
ATE79669T1 (de) 1992-09-15
EP0244781A2 (de) 1987-11-11
EP0244781A3 (en) 1989-02-08
DE3781197D1 (de) 1992-09-24
JPH0629692B2 (ja) 1994-04-20
US4818110A (en) 1989-04-04
EP0244781B1 (de) 1992-08-19
JPS63100302A (ja) 1988-05-02

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