DE3781370T2 - Integrierte schaltungspackung hoher leistung. - Google Patents

Integrierte schaltungspackung hoher leistung.

Info

Publication number: DE3781370T2
Authority: DE; Germany
Prior art keywords: integrated circuit; circuit pack; performance integrated; performance; pack
Prior art date: 1986-11-12
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired - Fee Related

Application number

DE8787106477T

Other languages

English (en)

Other versions

DE3781370D1 (de

Inventor

Scott Laurence Jacobs

Perwaiz Nihal

Burhan Ozmat

Henri Daniel Schnurmann

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

International Business Machines Corp

Original Assignee

International Business Machines Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1986-11-12

Filing date

1987-05-05

Publication date

1993-04-01

1987-05-05 Application filed by International Business Machines Corp filed Critical International Business Machines Corp

1992-10-01 Publication of DE3781370D1 publication Critical patent/DE3781370D1/de

1993-04-01 Application granted granted Critical

1993-04-01 Publication of DE3781370T2 publication Critical patent/DE3781370T2/de

2007-05-06 Anticipated expiration legal-status Critical

Status Expired - Fee Related legal-status Critical Current

Links

Classifications

- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
- H01L23/5383—Multilayer substrates
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance

DE8787106477T 1986-11-12 1987-05-05 Integrierte schaltungspackung hoher leistung. Expired - Fee Related DE3781370T2 (de)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
US06/929,946 US4811082A (en)	1986-11-12	1986-11-12	High performance integrated circuit packaging structure

Publications (2)

Publication Number	Publication Date
DE3781370D1 DE3781370D1 (de)	1992-10-01
DE3781370T2 true DE3781370T2 (de)	1993-04-01

Family

ID=25458729

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
DE8787106477T Expired - Fee Related DE3781370T2 (de)	1986-11-12	1987-05-05	Integrierte schaltungspackung hoher leistung.

Country Status (4)

Country	Link
US (1)	US4811082A (de)
EP (1)	EP0267360B1 (de)
JP (1)	JP2575734B2 (de)
DE (1)	DE3781370T2 (de)

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1986
- 1986-11-12 US US06/929,946 patent/US4811082A/en not_active Expired - Lifetime
1987
- 1987-05-05 EP EP87106477A patent/EP0267360B1/de not_active Expired
- 1987-05-05 DE DE8787106477T patent/DE3781370T2/de not_active Expired - Fee Related
- 1987-09-18 JP JP62232738A patent/JP2575734B2/ja not_active Expired - Lifetime

Also Published As

Publication number	Publication date
EP0267360B1 (de)	1992-08-26
DE3781370D1 (de)	1992-10-01
JPS63129655A (ja)	1988-06-02
US4811082A (en)	1989-03-07
EP0267360A2 (de)	1988-05-18
EP0267360A3 (en)	1988-11-09
JP2575734B2 (ja)	1997-01-29

Legal Events

Date	Code	Title	Description
1993-09-23	8364	No opposition during term of opposition
2001-07-12	8339	Ceased/non-payment of the annual fee

Publication	Publication Date	Title
DE3781370T2 (de)	1993-04-01	Integrierte schaltungspackung hoher leistung.
DE3786844T2 (de)	1993-11-11	Packung für integrierte Schaltung.
DE3688088D1 (de)	1993-04-29	Integrierte halbleiterschaltung.
DE68916784D1 (de)	1994-08-18	Integrierte Schaltungspackung.
DE3853814T2 (de)	1995-11-30	Integrierte Halbleiterschaltung.
DK590187A (da)	1988-05-14	Trykt-kredsloebsantenne
DE3751376D1 (de)	1995-08-03	Schaltungselement.
DE3766422D1 (de)	1991-01-10	Integrierte hybridschaltung.
DE3770461D1 (de)	1991-07-04	Elektronisches neigungsmessgeraet.
DK638687D0 (da)	1987-12-04	Baereboelgereproducerende kredsloeb
DE3672709D1 (de)	1990-08-23	Integrierte schaltungspackung.
DE3685071D1 (de)	1992-06-04	Integrierte halbleiterschaltung.
DE3782775D1 (de)	1993-01-07	Integrierte halbleiterschaltung.
DE3685759D1 (de)	1992-07-30	Integrierte halbleiterschaltung.
DE3887849T2 (de)	1994-08-11	Integrierte Schaltungspackung.
DE3884492T2 (de)	1994-02-17	Integrierte Halbleiterschaltungsanordnung.
DE3889570D1 (de)	1994-06-23	Halbleiterschaltung.
DE3684364D1 (de)	1992-04-23	Integrierte halbleiterschaltung.
DE3677165D1 (de)	1991-02-28	Integrierte halbleiterschaltungsanordnung.
DE8620276U1 (de)	1987-11-26	Messzirkel.
DE3784192D1 (de)	1993-03-25	Schaltungssubstrat.
DE3675666D1 (de)	1991-01-03	Integrierte halbleiterschaltungsanordnung.
DE3675827D1 (de)	1991-01-10	Dreidimensionaler integrierter schaltkreis.
DE3884460T2 (de)	1994-01-20	Intergrierte Halbleiterschaltung.
DE3787037T2 (de)	1993-12-09	Halteschaltung.