DE3784760T2 - Substrat für gedruckte Schaltungsplatte. - Google Patents
Substrat für gedruckte Schaltungsplatte.Info
- Publication number
- DE3784760T2 DE3784760T2 DE87105901T DE3784760T DE3784760T2 DE 3784760 T2 DE3784760 T2 DE 3784760T2 DE 87105901 T DE87105901 T DE 87105901T DE 3784760 T DE3784760 T DE 3784760T DE 3784760 T2 DE3784760 T2 DE 3784760T2
- Authority
- DE
- Germany
- Prior art keywords
- circuit board
- printed circuit
- board substrate
- substrate
- printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
- H05K3/445—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits having insulated holes or insulated via connections through the metal core
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/901—Printed circuit
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24273—Structurally defined web or sheet [e.g., overall dimension, etc.] including aperture
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24893—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including particulate material
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61096114A JPS62251136A (ja) | 1986-04-25 | 1986-04-25 | 金属複合積層板 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE3784760D1 DE3784760D1 (de) | 1993-04-22 |
DE3784760T2 true DE3784760T2 (de) | 1993-10-21 |
Family
ID=14156360
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE87105901T Expired - Fee Related DE3784760T2 (de) | 1986-04-25 | 1987-04-22 | Substrat für gedruckte Schaltungsplatte. |
Country Status (4)
Country | Link |
---|---|
US (1) | US4769270A (de) |
EP (1) | EP0244699B1 (de) |
JP (1) | JPS62251136A (de) |
DE (1) | DE3784760T2 (de) |
Families Citing this family (61)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5201974A (en) * | 1990-02-06 | 1993-04-13 | West Frederick A | Method and apparatus for making patterned electrically conductive structures |
JPS63274195A (ja) * | 1987-05-06 | 1988-11-11 | Mitsubishi Electric Corp | 金属芯印刷配線板 |
US4924590A (en) * | 1988-01-08 | 1990-05-15 | Siemens Aktiengesellschaft | Method for making metal core printed circuit board |
DE3826522A1 (de) * | 1988-08-04 | 1990-02-08 | Teldix Gmbh | Leiterplatte |
US4900878A (en) * | 1988-10-03 | 1990-02-13 | Hughes Aircraft Company | Circuit terminations having improved electrical and structural integrity |
EP0373363A3 (de) * | 1988-12-15 | 1991-09-11 | International Business Machines Corporation | Füllen von Löchern in einer metallischen Folie |
EP0389966B1 (de) * | 1989-03-25 | 1994-08-10 | Sumitomo Electric Industries, Ltd. | Mit Fluorkunststoffen beschichtetes Produkt |
JPH03229482A (ja) * | 1990-02-05 | 1991-10-11 | Fujitsu Ltd | 金属板内蔵プリント配線板 |
JPH03232297A (ja) * | 1990-02-08 | 1991-10-16 | Fujitsu Ltd | 金属板内蔵プリント配線板の製造方法 |
JPH04355990A (ja) * | 1990-09-18 | 1992-12-09 | Fujitsu Ltd | 回路基板およびその製造方法 |
US5288769A (en) * | 1991-03-27 | 1994-02-22 | Motorola, Inc. | Thermally conducting adhesive containing aluminum nitride |
FR2675654B1 (fr) * | 1991-04-16 | 1997-11-14 | Alsthom Cge Alcatel | Materiau absorbant les ondes electromagnetiques utilisable a haute temperature. |
US5316831A (en) * | 1991-05-08 | 1994-05-31 | Fuji Electric Co., Ltd. | Metallic printed board |
US5374469A (en) * | 1991-09-19 | 1994-12-20 | Nitto Denko Corporation | Flexible printed substrate |
EP0642412B1 (de) * | 1992-05-29 | 2003-08-13 | M-Rad Electromagnetic Technology Ltd. | Bedruckte schaltträger |
FR2694139B1 (fr) * | 1992-07-21 | 1994-10-14 | Aerospatiale | Substrat d'interconnexion pour composants électroniques et son procédé de fabrication. |
JPH07302868A (ja) * | 1992-12-10 | 1995-11-14 | Hewlett Packard Co <Hp> | 電子部品の接着法 |
AU6232994A (en) * | 1993-02-02 | 1994-08-29 | Ast Research, Inc. | A circuit board arrangement including shielding grids, and constructing thereof |
US5334800A (en) * | 1993-07-21 | 1994-08-02 | Parlex Corporation | Flexible shielded circuit board |
US5677045A (en) * | 1993-09-14 | 1997-10-14 | Hitachi, Ltd. | Laminate and multilayer printed circuit board |
US6124220A (en) * | 1995-03-28 | 2000-09-26 | Sumitomo Bakelite Company Limited | Laminated board and process for production thereof |
US5733639A (en) * | 1995-06-30 | 1998-03-31 | Poly Circuits/M-Wave | Circuit board assembly with foam substrate and method of making same |
US5675299A (en) * | 1996-03-25 | 1997-10-07 | Ast Research, Inc. | Bidirectional non-solid impedance controlled reference plane requiring no conductor to grid alignment |
US5981880A (en) * | 1996-08-20 | 1999-11-09 | International Business Machines Corporation | Electronic device packages having glass free non conductive layers |
US5847327A (en) | 1996-11-08 | 1998-12-08 | W.L. Gore & Associates, Inc. | Dimensionally stable core for use in high density chip packages |
US6143396A (en) * | 1997-05-01 | 2000-11-07 | Texas Instruments Incorporated | System and method for reinforcing a bond pad |
US6180261B1 (en) | 1997-10-21 | 2001-01-30 | Nitto Denko Corporation | Low thermal expansion circuit board and multilayer wiring circuit board |
US7071424B1 (en) * | 1998-02-26 | 2006-07-04 | Ibiden Co., Ltd. | Multilayer printed wiring board having filled-via structure |
JPH11354684A (ja) * | 1998-06-09 | 1999-12-24 | Nitto Denko Corp | 低熱膨張配線基板および多層配線基板 |
DE60031680T2 (de) * | 1999-06-02 | 2007-09-06 | Ibiden Co., Ltd., Ogaki | Mehrschichtige, gedruckte leiterplatte und herstellungsmethode für eine mehrschichtige, gedruckte leiterplatte |
JP4201436B2 (ja) * | 1999-07-14 | 2008-12-24 | 日東電工株式会社 | 多層配線基板の製造方法 |
JP2003136623A (ja) * | 2001-08-22 | 2003-05-14 | Tdk Corp | モジュール部品、コア基板要素集合体、多層基板、コア基板要素集合体の製造方法、多層基板の製造方法、及びモジュール部品の製造方法 |
US6867491B2 (en) * | 2001-12-19 | 2005-03-15 | Intel Corporation | Metal core integrated circuit package with electrically isolated regions and associated methods |
TW200806144A (en) * | 2004-02-04 | 2008-01-16 | Ibiden Co Ltd | Multilayer printed wiring board |
KR20070015210A (ko) * | 2004-05-15 | 2007-02-01 | 씨-코어 테크놀로지즈, 인코포레이티드 | 수지로 충전된 채널을 포함하는 전도성 억제 코어를 가지는인쇄 배선 기판 |
WO2006026566A1 (en) * | 2004-08-27 | 2006-03-09 | Vasoya Kalu K | Printed wiring boards possessing regions with different coefficients of thermal expansion |
DE102004058335A1 (de) * | 2004-11-29 | 2006-06-14 | Schulz-Harder, Jürgen, Dr.-Ing. | Substrat |
US20060231198A1 (en) * | 2005-03-15 | 2006-10-19 | Vasoya Kalu K | Manufacturing process: how to construct constraining core material into printed wiring board |
USRE45637E1 (en) | 2005-08-29 | 2015-07-28 | Stablcor Technology, Inc. | Processes for manufacturing printed wiring boards |
US7730613B2 (en) * | 2005-08-29 | 2010-06-08 | Stablcor, Inc. | Processes for manufacturing printed wiring boards |
US7436270B2 (en) * | 2005-12-20 | 2008-10-14 | Delphi Technologies, Inc. | Structure and method for improving the reliability of surface mounted ceramic duplexers |
CN101507058B (zh) | 2006-07-14 | 2013-05-01 | 斯塔布科尔技术公司 | 具有构成电路一部分的核心层的增层印刷线路板衬底 |
US7655292B2 (en) * | 2007-04-11 | 2010-02-02 | Kaylu Industrial Corporation | Electrically conductive substrate with high heat conductivity |
KR20080111316A (ko) * | 2007-06-18 | 2008-12-23 | 삼성전기주식회사 | 메탈코어를 갖는 방열 기판 및 그 제조방법 |
JP5264110B2 (ja) * | 2007-07-06 | 2013-08-14 | 矢崎総業株式会社 | メタルコア基板 |
CN101426331A (zh) * | 2007-10-31 | 2009-05-06 | 富葵精密组件(深圳)有限公司 | 多层电路板 |
DE102009017985A1 (de) * | 2009-04-21 | 2010-11-04 | Sefar Ag | Leiterplattengrundmaterial, Leiterplatte sowie Gehäuse |
KR101077359B1 (ko) * | 2009-09-23 | 2011-10-26 | 삼성전기주식회사 | 방열회로기판 및 그 제조방법 |
US20120090883A1 (en) * | 2010-10-13 | 2012-04-19 | Qualcomm Incorporated | Method and Apparatus for Improving Substrate Warpage |
KR20130055220A (ko) * | 2011-11-18 | 2013-05-28 | 삼성전자주식회사 | 동박적층판 및 이를 사용한 금속코어기판의 제조방법 |
KR102070207B1 (ko) * | 2013-03-05 | 2020-01-28 | 엘지전자 주식회사 | 전도성 필름 및 이의 제조 방법, 그리고 이를 포함하는 전자 장치 |
CN105593016B (zh) * | 2013-04-18 | 2018-04-10 | 一都公司 | 阻燃阻火层压膜 |
US20150122532A1 (en) * | 2013-11-04 | 2015-05-07 | Teledyne Technologies Incorporated | High temperature multilayer flexible printed wiring board |
US9332632B2 (en) | 2014-08-20 | 2016-05-03 | Stablcor Technology, Inc. | Graphene-based thermal management cores and systems and methods for constructing printed wiring boards |
TWI526129B (zh) * | 2014-11-05 | 2016-03-11 | Elite Material Co Ltd | Multilayer printed circuit boards with dimensional stability |
JP6621781B2 (ja) * | 2017-08-10 | 2019-12-18 | 太陽誘電株式会社 | 集合プリント基板、プリント配線板の製造方法 |
US11492708B2 (en) | 2018-01-29 | 2022-11-08 | The Boeing Company | Cold spray metallic coating and methods |
US10645808B2 (en) * | 2018-02-22 | 2020-05-05 | Apple Inc. | Devices with radio-frequency printed circuits |
JP2019153668A (ja) * | 2018-03-02 | 2019-09-12 | 太陽誘電株式会社 | 回路基板及びその製造方法 |
US11634820B2 (en) | 2019-06-18 | 2023-04-25 | The Boeing Company | Molding composite part with metal layer |
US20230279554A1 (en) * | 2022-03-03 | 2023-09-07 | The Boeing Company | Cold sprayed electrical circuits and methods thereof |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL293033A (de) * | 1962-05-21 | |||
JPS49348B1 (de) * | 1970-12-25 | 1974-01-07 | ||
JPS5051172A (de) * | 1973-09-07 | 1975-05-07 | ||
DE2739494B2 (de) * | 1977-08-30 | 1980-10-16 | Fuba, Hans Kolbe & Co, 3202 Bad Salzuflen | Verfahren zum Herstellen elektrischer Leiterplatten |
US4315845A (en) * | 1979-03-22 | 1982-02-16 | Hitachi Chemical Company, Ltd. | Process for preparing chemically platable thermosetting powder coating |
US4522667A (en) * | 1980-06-25 | 1985-06-11 | General Electric Company | Method for making multi-layer metal core circuit board laminate with a controlled thermal coefficient of expansion |
US4496793A (en) * | 1980-06-25 | 1985-01-29 | General Electric Company | Multi-layer metal core circuit board laminate with a controlled thermal coefficient of expansion |
US4318954A (en) * | 1981-02-09 | 1982-03-09 | Boeing Aerospace Company | Printed wiring board substrates for ceramic chip carriers |
US4360360A (en) * | 1981-04-02 | 1982-11-23 | Baxter Travenol Laboratories, Inc. | Centrifugal analyzer |
US4492730A (en) * | 1982-03-26 | 1985-01-08 | Showa Denko Kabushiki Kaisha | Substrate of printed circuit |
US4491622A (en) * | 1982-04-19 | 1985-01-01 | Olin Corporation | Composites of glass-ceramic to metal seals and method of making the same |
US4559264A (en) * | 1983-01-27 | 1985-12-17 | Corning Glass Works | Synthetic mica products |
JPS6112874A (ja) * | 1984-06-26 | 1986-01-21 | Mitsubishi Electric Corp | 薬液保護層形成法 |
US4601916A (en) * | 1984-07-18 | 1986-07-22 | Kollmorgen Technologies Corporation | Process for bonding metals to electrophoretically deposited resin coatings |
US4679122A (en) * | 1984-10-09 | 1987-07-07 | General Electric Company | Metal core printed circuit board |
US4594311A (en) * | 1984-10-29 | 1986-06-10 | Kollmorgen Technologies Corporation | Process for the photoselective metallization on non-conductive plastic base materials |
-
1986
- 1986-04-25 JP JP61096114A patent/JPS62251136A/ja active Granted
-
1987
- 1987-04-22 EP EP87105901A patent/EP0244699B1/de not_active Expired - Lifetime
- 1987-04-22 DE DE87105901T patent/DE3784760T2/de not_active Expired - Fee Related
- 1987-04-23 US US07/041,490 patent/US4769270A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH0574457B2 (de) | 1993-10-18 |
EP0244699A2 (de) | 1987-11-11 |
US4769270A (en) | 1988-09-06 |
JPS62251136A (ja) | 1987-10-31 |
EP0244699B1 (de) | 1993-03-17 |
EP0244699A3 (en) | 1988-04-20 |
DE3784760D1 (de) | 1993-04-22 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |