DE3788479T2 - Laminierung eines photopolymerisierbaren Films auf einem Träger mittels einer nicht photoempfindlichen flüssigen Zwischenschicht. - Google Patents

Laminierung eines photopolymerisierbaren Films auf einem Träger mittels einer nicht photoempfindlichen flüssigen Zwischenschicht.

Info

Publication number
DE3788479T2
DE3788479T2 DE3788479T DE3788479T DE3788479T2 DE 3788479 T2 DE3788479 T2 DE 3788479T2 DE 3788479 T DE3788479 T DE 3788479T DE 3788479 T DE3788479 T DE 3788479T DE 3788479 T2 DE3788479 T2 DE 3788479T2
Authority
DE
Germany
Prior art keywords
lamination
support
intermediate layer
photosensitive liquid
liquid intermediate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE3788479T
Other languages
English (en)
Other versions
DE3788479D1 (de
Inventor
Tit-Kueng Lau
Abraham Bernard Cohen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EIDP Inc
Original Assignee
EI Du Pont de Nemours and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EI Du Pont de Nemours and Co filed Critical EI Du Pont de Nemours and Co
Publication of DE3788479D1 publication Critical patent/DE3788479D1/de
Application granted granted Critical
Publication of DE3788479T2 publication Critical patent/DE3788479T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16Coating processes; Apparatus therefor
    • G03F7/161Coating processes; Apparatus therefor using a previously coated surface, e.g. by stamping or by transfer lamination
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/0038Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving application of liquid to the layers prior to lamination, e.g. wet laminating
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/09Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/11Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/28Applying non-metallic protective coatings
    • H05K3/281Applying non-metallic protective coatings by means of a preformed insulating foil
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05Patterning and lithography; Masks; Details of resist
    • H05K2203/0562Details of resist
    • H05K2203/0577Double layer of resist having the same pattern
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/28Applying non-metallic protective coatings
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/155Nonresinous additive to promote interlayer adhesion in element
DE3788479T 1986-09-12 1987-09-09 Laminierung eines photopolymerisierbaren Films auf einem Träger mittels einer nicht photoempfindlichen flüssigen Zwischenschicht. Expired - Lifetime DE3788479T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/906,442 US4698294A (en) 1986-09-12 1986-09-12 Lamination of photopolymerizable film onto a substrate employing an intermediate nonphotosensitive liquid layer

Publications (2)

Publication Number Publication Date
DE3788479D1 DE3788479D1 (de) 1994-01-27
DE3788479T2 true DE3788479T2 (de) 1994-06-23

Family

ID=25422456

Family Applications (1)

Application Number Title Priority Date Filing Date
DE3788479T Expired - Lifetime DE3788479T2 (de) 1986-09-12 1987-09-09 Laminierung eines photopolymerisierbaren Films auf einem Träger mittels einer nicht photoempfindlichen flüssigen Zwischenschicht.

Country Status (7)

Country Link
US (1) US4698294A (de)
EP (1) EP0260590B1 (de)
JP (1) JPS6374051A (de)
KR (1) KR880003744A (de)
CN (1) CN1029426C (de)
BR (1) BR8704705A (de)
DE (1) DE3788479T2 (de)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5736424A (en) * 1987-02-27 1998-04-07 Lucent Technologies Inc. Device fabrication involving planarization
DE3808952A1 (de) * 1988-03-17 1989-10-05 Basf Ag Lichtempfindliche, photopolymerisierbare druckplatte
JPH0234984A (ja) * 1988-04-13 1990-02-05 Mitsubishi Electric Corp プリント回路基板の製造方法
US4976817A (en) * 1988-12-09 1990-12-11 Morton International, Inc. Wet lamination process and apparatus
EP0374809A3 (de) * 1988-12-23 1991-11-13 E.I. Du Pont De Nemours And Company Gedruckte Schaltkreisplatten, die blasenfrei mit einer filmartigen/flüssigen Lötstoppmaske durch Druckausübung mittels einer Flüssigkeit beschichtet werden
JPH0651360B2 (ja) * 1989-06-04 1994-07-06 ソマール株式会社 薄膜の張付方法及びその装置
US5145717A (en) * 1990-01-31 1992-09-08 E. I. Du Pont De Nemours And Company Stripping method for removing resist from a printed circuit board
JPH0484136A (ja) * 1990-07-27 1992-03-17 Mitsubishi Rayon Co Ltd パターン形成方法
US5240817A (en) * 1991-12-20 1993-08-31 E. I. Du Pont De Nemours And Company Lamination of a photopolymerizable solder mask layer to a substate containing holes using an intermediate photopolymerizable liquid layer
US5288589A (en) * 1992-12-03 1994-02-22 Mckeever Mark R Aqueous processable, multilayer, photoimageable permanent coatings for printed circuits
US5405731A (en) * 1992-12-22 1995-04-11 E. I. Du Pont De Nemours And Company Aqueous processable, multilayer, photoimageable permanent coatings for printed circuits
US5372670A (en) * 1994-02-02 1994-12-13 International Business Machines Corporation System for wet application of a dry film to a panel
US5922506A (en) * 1994-10-20 1999-07-13 Agfa-Gevaert, N.V. Imaging element comprising a hydrophobic photopolymerizable composition and method for producing lithographic plates therewith
EP0708373B1 (de) * 1994-10-20 1999-07-07 Agfa-Gevaert N.V. Hydrophobe photopolymerisierbare Zusammensetzung enthaltendes Bildelement, sowie Verfahren zur Herstellung von lithographischen Druckplatten
US6001893A (en) * 1996-05-17 1999-12-14 Datacard Corporation Curable topcoat composition and methods for use
GB2324729B (en) * 1997-04-30 2002-01-02 Bradford Hospitals Nhs Trust Lung treatment device
US6261941B1 (en) * 1998-02-12 2001-07-17 Georgia Tech Research Corp. Method for manufacturing a multilayer wiring substrate
US6002322A (en) * 1998-05-05 1999-12-14 Littelfuse, Inc. Chip protector surface-mounted fuse device
DE10260235B4 (de) * 2002-12-20 2010-10-28 Infineon Technologies Ag Verfahren zum Strukturieren einer Resistschicht und Negativ-Resistschicht
DE112005000517T5 (de) 2004-03-05 2007-03-01 Littelfuse, Inc., Des Plaines Flachprofilsicherung für Kraftfahrzeuge
US20090087774A1 (en) * 2007-08-27 2009-04-02 E.I. Du Pont De Nemours And Company Compositions and methods for wet lamination of photopolymerizable dry films onto substrates
CN101430507A (zh) * 2007-08-27 2009-05-13 E.I.内穆尔杜邦公司 基片上的可光聚合干膜的湿层叠以及与湿层叠有关的组合物
US8077007B2 (en) 2008-01-14 2011-12-13 Littlelfuse, Inc. Blade fuse
GB201207417D0 (en) 2012-04-27 2012-06-13 Electra Polymers Ltd A method for photoimaging a substrate
JP6397245B2 (ja) * 2014-07-23 2018-09-26 旭化成株式会社 レジストパターンの製造方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE525225A (de) * 1951-08-20
FR1345015A (fr) * 1961-10-16 1963-12-06 Du Pont éléments photopolymérisables et procédé de préparation
US3629036A (en) * 1969-02-14 1971-12-21 Shipley Co The method coating of photoresist on circuit boards
JPS4935448B1 (de) * 1969-05-08 1974-09-21
JPS532362B2 (de) * 1974-04-17 1978-01-27
JPS6016997B2 (ja) * 1976-10-27 1985-04-30 日本ペイント株式会社 感光性フレキソ版とゴムバツキング材の接着方法
US4069076A (en) * 1976-11-29 1978-01-17 E. I. Du Pont De Nemours And Company Liquid lamination process
US4506004A (en) * 1982-04-01 1985-03-19 Sullivan Donald F Printed wiring board
BR8103184A (pt) * 1980-05-27 1982-02-09 Du Pont Processo para laminacao de uma camada foto-sensivel suportada para a forma de uma superficie de substrato limpa
BR8103187A (pt) * 1980-05-27 1982-02-09 Du Pont Processo para laminar uma camada fotossensivel de absorcao
US4293635A (en) * 1980-05-27 1981-10-06 E. I. Du Pont De Nemours And Company Photopolymerizable composition with polymeric binder
US4522903A (en) * 1982-06-11 1985-06-11 E. I. Du Pont De Nemours And Company Sequential automatic registration and imagewise exposure of a sheet substrate

Also Published As

Publication number Publication date
EP0260590A2 (de) 1988-03-23
EP0260590A3 (en) 1989-11-08
BR8704705A (pt) 1988-04-26
CN1029426C (zh) 1995-08-02
CN87106837A (zh) 1988-06-01
KR880003744A (ko) 1988-05-30
US4698294A (en) 1987-10-06
DE3788479D1 (de) 1994-01-27
EP0260590B1 (de) 1993-12-15
JPS6374051A (ja) 1988-04-04

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