DE3818192A1 - Thermoelektrische anordnung mit tunnelkontakten - Google Patents

Thermoelektrische anordnung mit tunnelkontakten

Info

Publication number
DE3818192A1
DE3818192A1 DE3818192A DE3818192A DE3818192A1 DE 3818192 A1 DE3818192 A1 DE 3818192A1 DE 3818192 A DE3818192 A DE 3818192A DE 3818192 A DE3818192 A DE 3818192A DE 3818192 A1 DE3818192 A1 DE 3818192A1
Authority
DE
Germany
Prior art keywords
leg
thermal
thermoelectric
parts
contacts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE3818192A
Other languages
German (de)
English (en)
Inventor
Reinhard Dr Dahlberg
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to DE3818192A priority Critical patent/DE3818192A1/de
Publication of DE3818192A1 publication Critical patent/DE3818192A1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00—Machines, plants or systems, using electric or magnetic effects
    • F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80—Constructional details
    • H10N10/81—Structural details of the junction
    • H10N10/813—Structural details of the junction the junction being separable, e.g. using a spring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80—Constructional details
    • H10N10/82—Connection of interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80—Constructional details
    • H10N10/85—Thermoelectric active materials
    • H10N10/851—Thermoelectric active materials comprising inorganic compositions
    • H10N10/853—Thermoelectric active materials comprising inorganic compositions comprising arsenic, antimony or bismuth
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80—Constructional details
    • H10N10/85—Thermoelectric active materials
    • H10N10/851—Thermoelectric active materials comprising inorganic compositions
    • H10N10/854—Thermoelectric active materials comprising inorganic compositions comprising only metals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80—Constructional details
    • H10N10/85—Thermoelectric active materials
    • H10N10/851—Thermoelectric active materials comprising inorganic compositions
    • H10N10/855—Thermoelectric active materials comprising inorganic compositions comprising compounds containing boron, carbon, oxygen or nitrogen
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80—Constructional details
    • H10N10/85—Thermoelectric active materials
    • H10N10/851—Thermoelectric active materials comprising inorganic compositions
    • H10N10/855—Thermoelectric active materials comprising inorganic compositions comprising compounds containing boron, carbon, oxygen or nitrogen
    • H10N10/8552—Thermoelectric active materials comprising inorganic compositions comprising compounds containing boron, carbon, oxygen or nitrogen the compounds being superconducting
DE3818192A 1988-05-28 1988-05-28 Thermoelektrische anordnung mit tunnelkontakten Withdrawn DE3818192A1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE3818192A DE3818192A1 (de) 1988-05-28 1988-05-28 Thermoelektrische anordnung mit tunnelkontakten

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE3818192A DE3818192A1 (de) 1988-05-28 1988-05-28 Thermoelektrische anordnung mit tunnelkontakten

Publications (1)

Publication Number Publication Date
DE3818192A1 true DE3818192A1 (de) 1989-12-07

Family

ID=40083620

Family Applications (1)

Application Number Title Priority Date Filing Date
DE3818192A Withdrawn DE3818192A1 (de) 1988-05-28 1988-05-28 Thermoelektrische anordnung mit tunnelkontakten

Country Status (1)

Country Link
DE (1) DE3818192A1 (fr)

Cited By (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0843323A1 (fr) * 1996-11-14 1998-05-20 The Director-General of the National Institute for Fusion Science Amenées de courant pour bobine supraconductrice formées de matériau à gradient fonctionnel
EP1166369A1 (fr) * 1999-03-11 2002-01-02 Eneco, Inc. Convertisseur thermoionique hybride et procede associe
WO2002047177A2 (fr) * 2000-12-07 2002-06-13 International Business Machines Corporation Refroidisseurs thermoélectriques à interfaces améliorées
WO2002047178A2 (fr) * 2000-12-07 2002-06-13 International Business Machines Corporation Dispositifs thermoelectriques
WO2002047176A2 (fr) * 2000-12-07 2002-06-13 International Business Machines Corporation Dispositifs de refroidissement thermoelectriques a interface amelioree
WO2004040617A2 (fr) * 2002-10-20 2004-05-13 Borealis Technical Limited Matiere thermoelectrique a filtre d'ondes de broglie integre
WO2005112139A2 (fr) * 2004-05-04 2005-11-24 Massachusetts Institute Of Technology Dispositifs thermoelectriques non equilibres couples a un plasmon de surface
WO2006035255A2 (fr) * 2004-09-29 2006-04-06 Elthom Enterprises Limited Procede de transformation de chaleur et d'activite dans des cycles thermoelectriques cycliques reversibles et transformateur thermoelectrique
WO2006081102A3 (fr) * 2005-01-26 2007-06-07 Boeing Co Procedes et appareils pour l'isolement thermique pour dispositifs thermoelectriques
WO2007081483A2 (fr) * 2005-12-15 2007-07-19 The Boeing Company Dispositif a effet de tunnel thermoelectrique
US7566897B2 (en) 2006-09-18 2009-07-28 Borealis Technical Limited Quantum interference device
US7569763B2 (en) 1999-03-11 2009-08-04 Micropower Global Limited Solid state energy converter
US7658772B2 (en) 1997-09-08 2010-02-09 Borealis Technical Limited Process for making electrode pairs
US7880079B2 (en) 2005-07-29 2011-02-01 The Boeing Company Dual gap thermo-tunneling apparatus and methods
US7935954B2 (en) 1998-06-08 2011-05-03 Borealis Technical Limited Artificial band gap
US8227885B2 (en) 2006-07-05 2012-07-24 Borealis Technical Limited Selective light absorbing semiconductor surface
US8330192B2 (en) 2005-01-24 2012-12-11 Borealis Technical Limited Method for modification of built in potential of diodes
US8574663B2 (en) 2002-03-22 2013-11-05 Borealis Technical Limited Surface pairs
US8594803B2 (en) 2006-09-12 2013-11-26 Borealis Technical Limited Biothermal power generator
US8816192B1 (en) 2007-02-09 2014-08-26 Borealis Technical Limited Thin film solar cell

Cited By (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0843323A1 (fr) * 1996-11-14 1998-05-20 The Director-General of the National Institute for Fusion Science Amenées de courant pour bobine supraconductrice formées de matériau à gradient fonctionnel
US6069395A (en) * 1996-11-14 2000-05-30 The Director-General Of The National Institute Of Fusion Science Current leads adapted for use with superconducting coil and formed of functionally gradient material
US7658772B2 (en) 1997-09-08 2010-02-09 Borealis Technical Limited Process for making electrode pairs
US7935954B2 (en) 1998-06-08 2011-05-03 Borealis Technical Limited Artificial band gap
US7569763B2 (en) 1999-03-11 2009-08-04 Micropower Global Limited Solid state energy converter
EP1166369A4 (fr) * 1999-03-11 2006-12-27 Eneco Inc Convertisseur thermoionique hybride et procede associe
EP1166369A1 (fr) * 1999-03-11 2002-01-02 Eneco, Inc. Convertisseur thermoionique hybride et procede associe
WO2002047178A3 (fr) * 2000-12-07 2003-09-12 Ibm Dispositifs thermoelectriques
WO2002047177A3 (fr) * 2000-12-07 2002-12-05 Ibm Refroidisseurs thermoélectriques à interfaces améliorées
WO2002047178A2 (fr) * 2000-12-07 2002-06-13 International Business Machines Corporation Dispositifs thermoelectriques
WO2002047176A2 (fr) * 2000-12-07 2002-06-13 International Business Machines Corporation Dispositifs de refroidissement thermoelectriques a interface amelioree
US6740600B2 (en) 2000-12-07 2004-05-25 International Business Machines Corporation Enhanced interface thermoelectric coolers with all-metals tips
WO2002047177A2 (fr) * 2000-12-07 2002-06-13 International Business Machines Corporation Refroidisseurs thermoélectriques à interfaces améliorées
US6608250B2 (en) 2000-12-07 2003-08-19 International Business Machines Corporation Enhanced interface thermoelectric coolers using etched thermoelectric material tips
WO2002047176A3 (fr) * 2000-12-07 2002-12-05 Ibm Dispositifs de refroidissement thermoelectriques a interface amelioree
US8574663B2 (en) 2002-03-22 2013-11-05 Borealis Technical Limited Surface pairs
WO2004040617A3 (fr) * 2002-10-20 2004-08-19 Borealis Tech Ltd Matiere thermoelectrique a filtre d'ondes de broglie integre
WO2004040617A2 (fr) * 2002-10-20 2004-05-13 Borealis Technical Limited Matiere thermoelectrique a filtre d'ondes de broglie integre
WO2005112139A3 (fr) * 2004-05-04 2006-05-18 Massachusetts Inst Technology Dispositifs thermoelectriques non equilibres couples a un plasmon de surface
WO2005112139A2 (fr) * 2004-05-04 2005-11-24 Massachusetts Institute Of Technology Dispositifs thermoelectriques non equilibres couples a un plasmon de surface
US7508110B2 (en) 2004-05-04 2009-03-24 Massachusetts Institute Of Technology Surface plasmon coupled nonequilibrium thermoelectric devices
WO2006035255A3 (fr) * 2004-09-29 2007-10-04 Elthom Entpr Ltd Procede de transformation de chaleur et d'activite dans des cycles thermoelectriques cycliques reversibles et transformateur thermoelectrique
WO2006035255A2 (fr) * 2004-09-29 2006-04-06 Elthom Enterprises Limited Procede de transformation de chaleur et d'activite dans des cycles thermoelectriques cycliques reversibles et transformateur thermoelectrique
US8330192B2 (en) 2005-01-24 2012-12-11 Borealis Technical Limited Method for modification of built in potential of diodes
US7557487B2 (en) 2005-01-26 2009-07-07 The Boeing Company Methods and apparatus for thermal isolation for thermoelectric devices
WO2006081102A3 (fr) * 2005-01-26 2007-06-07 Boeing Co Procedes et appareils pour l'isolement thermique pour dispositifs thermoelectriques
EP2369654A3 (fr) * 2005-01-26 2013-10-23 The Boeing Company Procédés et appareil pour l'isolation thermique de dispositifs thermo-électriques
US7880079B2 (en) 2005-07-29 2011-02-01 The Boeing Company Dual gap thermo-tunneling apparatus and methods
WO2007081483A3 (fr) * 2005-12-15 2008-07-03 Boeing Co Dispositif a effet de tunnel thermoelectrique
WO2007081483A2 (fr) * 2005-12-15 2007-07-19 The Boeing Company Dispositif a effet de tunnel thermoelectrique
US8227885B2 (en) 2006-07-05 2012-07-24 Borealis Technical Limited Selective light absorbing semiconductor surface
US8594803B2 (en) 2006-09-12 2013-11-26 Borealis Technical Limited Biothermal power generator
US7566897B2 (en) 2006-09-18 2009-07-28 Borealis Technical Limited Quantum interference device
US8816192B1 (en) 2007-02-09 2014-08-26 Borealis Technical Limited Thin film solar cell

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Legal Events

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