DE3851163D1 - Kontakt in einer Bohrung in einem Halbleiter und Verfahren zu seiner Herstellung. - Google Patents

Kontakt in einer Bohrung in einem Halbleiter und Verfahren zu seiner Herstellung.

Info

Publication number
DE3851163D1
DE3851163D1 DE3851163T DE3851163T DE3851163D1 DE 3851163 D1 DE3851163 D1 DE 3851163D1 DE 3851163 T DE3851163 T DE 3851163T DE 3851163 T DE3851163 T DE 3851163T DE 3851163 D1 DE3851163 D1 DE 3851163D1
Authority
DE
Germany
Prior art keywords
contact
layer
adhesion
barrier layer
silicon
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE3851163T
Other languages
English (en)
Other versions
DE3851163T2 (de
Inventor
Pankaj Dixit
Jack Sliwa
Richard K Klein
Craig S Sander
Mohammad Farnaam
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Advanced Micro Devices Inc
Original Assignee
Advanced Micro Devices Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=21777082&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE3851163(D1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Advanced Micro Devices Inc filed Critical Advanced Micro Devices Inc
Publication of DE3851163D1 publication Critical patent/DE3851163D1/de
Application granted granted Critical
Publication of DE3851163T2 publication Critical patent/DE3851163T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/76841—Barrier, adhesion or liner layers
    • H01L21/76843—Barrier, adhesion or liner layers formed in openings in a dielectric
    • H01L21/76846—Layer combinations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/76841—Barrier, adhesion or liner layers
    • H01L21/76843—Barrier, adhesion or liner layers formed in openings in a dielectric
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/76877—Filling of holes, grooves or trenches, e.g. vias, with conductive material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/76877—Filling of holes, grooves or trenches, e.g. vias, with conductive material
    • H01L21/76879—Filling of holes, grooves or trenches, e.g. vias, with conductive material by selective deposition of conductive material in the vias, e.g. selective C.V.D. on semiconductor material, plating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S257/00—Active solid-state devices, e.g. transistors, solid-state diodes
    • Y10S257/915—Active solid-state devices, e.g. transistors, solid-state diodes with titanium nitride portion or region
DE3851163T 1987-02-19 1988-02-11 Kontakt in einer Bohrung in einem Halbleiter und Verfahren zu seiner Herstellung. Expired - Lifetime DE3851163T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/016,429 US4884123A (en) 1987-02-19 1987-02-19 Contact plug and interconnect employing a barrier lining and a backfilled conductor material

Publications (2)

Publication Number Publication Date
DE3851163D1 true DE3851163D1 (de) 1994-09-29
DE3851163T2 DE3851163T2 (de) 1995-03-16

Family

ID=21777082

Family Applications (1)

Application Number Title Priority Date Filing Date
DE3851163T Expired - Lifetime DE3851163T2 (de) 1987-02-19 1988-02-11 Kontakt in einer Bohrung in einem Halbleiter und Verfahren zu seiner Herstellung.

Country Status (6)

Country Link
US (1) US4884123A (de)
EP (1) EP0279588B1 (de)
JP (1) JP2645345B2 (de)
AT (1) ATE110495T1 (de)
DE (1) DE3851163T2 (de)
ES (1) ES2056911T3 (de)

Families Citing this family (171)

* Cited by examiner, † Cited by third party
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JPS63205951A (ja) 1988-08-25
US4884123A (en) 1989-11-28
EP0279588B1 (de) 1994-08-24
ATE110495T1 (de) 1994-09-15
EP0279588A3 (de) 1991-01-16
DE3851163T2 (de) 1995-03-16

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