DE3851741T2 - Drahtverbindungen und elektrische kontakte einer integrierten schaltungsanordnung. - Google Patents
Drahtverbindungen und elektrische kontakte einer integrierten schaltungsanordnung.Info
- Publication number
- DE3851741T2 DE3851741T2 DE3851741T DE3851741T DE3851741T2 DE 3851741 T2 DE3851741 T2 DE 3851741T2 DE 3851741 T DE3851741 T DE 3851741T DE 3851741 T DE3851741 T DE 3851741T DE 3851741 T2 DE3851741 T2 DE 3851741T2
- Authority
- DE
- Germany
- Prior art keywords
- integrated circuit
- electrical contacts
- circuit arrangement
- wire connections
- connections
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
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- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
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- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49517—Additional leads
- H01L23/49524—Additional leads the additional leads being a tape carrier or flat leads
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- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49861—Lead-frames fixed on or encapsulated in insulating substrates
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- H01L24/42—Wire connectors; Manufacturing methods related thereto
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- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
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Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/049,641 US4771330A (en) | 1987-05-13 | 1987-05-13 | Wire bonds and electrical contacts of an integrated circuit device |
PCT/US1988/000235 WO1988009056A1 (en) | 1987-05-13 | 1988-01-26 | Wire bonds and electrical contacts of an integrated circuit device |
Publications (2)
Publication Number | Publication Date |
---|---|
DE3851741D1 DE3851741D1 (de) | 1994-11-10 |
DE3851741T2 true DE3851741T2 (de) | 1995-02-02 |
Family
ID=21960900
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE3851741T Expired - Fee Related DE3851741T2 (de) | 1987-05-13 | 1988-01-26 | Drahtverbindungen und elektrische kontakte einer integrierten schaltungsanordnung. |
Country Status (8)
Country | Link |
---|---|
US (1) | US4771330A (de) |
EP (1) | EP0314707B1 (de) |
JP (2) | JPH01190102A (de) |
KR (1) | KR890700925A (de) |
AU (1) | AU606386B2 (de) |
CA (1) | CA1300282C (de) |
DE (1) | DE3851741T2 (de) |
WO (1) | WO1988009056A1 (de) |
Families Citing this family (41)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4987475A (en) * | 1988-02-29 | 1991-01-22 | Digital Equipment Corporation | Alignment of leads for ceramic integrated circuit packages |
US5184207A (en) * | 1988-12-07 | 1993-02-02 | Tribotech | Semiconductor die packages having lead support frame |
US4916519A (en) * | 1989-05-30 | 1990-04-10 | International Business Machines Corporation | Semiconductor package |
US5299730A (en) * | 1989-08-28 | 1994-04-05 | Lsi Logic Corporation | Method and apparatus for isolation of flux materials in flip-chip manufacturing |
US5227663A (en) * | 1989-12-19 | 1993-07-13 | Lsi Logic Corporation | Integral dam and heat sink for semiconductor device assembly |
US5175612A (en) * | 1989-12-19 | 1992-12-29 | Lsi Logic Corporation | Heat sink for semiconductor device assembly |
JP2527828B2 (ja) * | 1990-02-27 | 1996-08-28 | 三菱電機株式会社 | 半導体パッケ―ジ |
US5173766A (en) * | 1990-06-25 | 1992-12-22 | Lsi Logic Corporation | Semiconductor device package and method of making such a package |
US5399903A (en) * | 1990-08-15 | 1995-03-21 | Lsi Logic Corporation | Semiconductor device having an universal die size inner lead layout |
US5168345A (en) * | 1990-08-15 | 1992-12-01 | Lsi Logic Corporation | Semiconductor device having a universal die size inner lead layout |
US5142450A (en) * | 1991-04-12 | 1992-08-25 | Motorola, Inc. | Non-contact lead design and package |
GB2257827B (en) * | 1991-07-17 | 1995-05-03 | Lsi Logic Europ | Support for semiconductor bond wires |
US5451813A (en) * | 1991-09-05 | 1995-09-19 | Rohm Co., Ltd. | Semiconductor device with lead frame having different thicknesses |
JP2970111B2 (ja) * | 1991-09-19 | 1999-11-02 | 日本電気株式会社 | リードフレーム、半導体装置及びその製造方法 |
US5434750A (en) * | 1992-02-07 | 1995-07-18 | Lsi Logic Corporation | Partially-molded, PCB chip carrier package for certain non-square die shapes |
JPH0653277A (ja) * | 1992-06-04 | 1994-02-25 | Lsi Logic Corp | 半導体装置アセンブリおよびその組立方法 |
US5854085A (en) * | 1992-06-04 | 1998-12-29 | Lsi Logic Corporation | Multi-layer tab tape having distinct signal, power and ground planes, semiconductor device assembly employing same, apparatus for and method of assembling same |
US5801432A (en) * | 1992-06-04 | 1998-09-01 | Lsi Logic Corporation | Electronic system using multi-layer tab tape semiconductor device having distinct signal, power and ground planes |
US5340772A (en) * | 1992-07-17 | 1994-08-23 | Lsi Logic Corporation | Method of increasing the layout efficiency of dies on a wafer and increasing the ratio of I/O area to active area per die |
US5532934A (en) * | 1992-07-17 | 1996-07-02 | Lsi Logic Corporation | Floorplanning technique using multi-partitioning based on a partition cost factor for non-square shaped partitions |
US5561086A (en) * | 1993-06-18 | 1996-10-01 | Lsi Logic Corporation | Techniques for mounting semiconductor dies in die-receiving areas having support structure having notches |
JPH0714976A (ja) * | 1993-06-24 | 1995-01-17 | Shinko Electric Ind Co Ltd | リードフレーム及び半導体装置 |
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JPH11233531A (ja) * | 1998-02-17 | 1999-08-27 | Nec Corp | 電子部品の実装構造および実装方法 |
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US20070031996A1 (en) * | 2003-04-26 | 2007-02-08 | Chopin Sheila F | Packaged integrated circuit having a heat spreader and method therefor |
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USRE31967E (en) * | 1975-07-07 | 1985-08-13 | National Semiconductor Corporation | Gang bonding interconnect tape for semiconductive devices and method of making same |
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JPS622626A (ja) * | 1985-06-28 | 1987-01-08 | Nec Corp | 半導体装置 |
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-
1987
- 1987-05-13 US US07/049,641 patent/US4771330A/en not_active Expired - Lifetime
-
1988
- 1988-01-26 WO PCT/US1988/000235 patent/WO1988009056A1/en active IP Right Grant
- 1988-01-26 JP JP63015015A patent/JPH01190102A/ja active Pending
- 1988-01-26 AU AU11874/88A patent/AU606386B2/en not_active Ceased
- 1988-01-26 DE DE3851741T patent/DE3851741T2/de not_active Expired - Fee Related
- 1988-01-26 JP JP63501588A patent/JP2583597B2/ja not_active Expired - Lifetime
- 1988-01-26 EP EP88901390A patent/EP0314707B1/de not_active Expired - Lifetime
- 1988-05-11 CA CA000566450A patent/CA1300282C/en not_active Expired - Lifetime
- 1988-12-28 KR KR1019880701746A patent/KR890700925A/ko not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
KR890700925A (ko) | 1989-04-28 |
WO1988009056A1 (en) | 1988-11-17 |
EP0314707A4 (en) | 1990-09-19 |
JP2583597B2 (ja) | 1997-02-19 |
DE3851741D1 (de) | 1994-11-10 |
EP0314707B1 (de) | 1994-10-05 |
AU1187488A (en) | 1988-12-06 |
JPH01190102A (ja) | 1989-07-31 |
EP0314707A1 (de) | 1989-05-10 |
JPH01503184A (ja) | 1989-10-26 |
CA1300282C (en) | 1992-05-05 |
US4771330A (en) | 1988-09-13 |
AU606386B2 (en) | 1991-02-07 |
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