DE3882477T2 - Perlenförmiges zusammengesetztes Element. - Google Patents

Perlenförmiges zusammengesetztes Element.

Info

Publication number
DE3882477T2
DE3882477T2 DE88309366T DE3882477T DE3882477T2 DE 3882477 T2 DE3882477 T2 DE 3882477T2 DE 88309366 T DE88309366 T DE 88309366T DE 3882477 T DE3882477 T DE 3882477T DE 3882477 T2 DE3882477 T2 DE 3882477T2
Authority
DE
Germany
Prior art keywords
pearl
composite element
shaped composite
shaped
composite
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE88309366T
Other languages
English (en)
Other versions
DE3882477D1 (de
Inventor
Yoshinori Sasaki
Sumio Takahashi
Toshihiro Kuroshima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Corp
Original Assignee
TDK Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TDK Corp filed Critical TDK Corp
Application granted granted Critical
Publication of DE3882477D1 publication Critical patent/DE3882477D1/de
Publication of DE3882477T2 publication Critical patent/DE3882477T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H1/00Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • H05K1/0216Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0233Filters, inductors or a magnetic substance
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341Surface mounted components
    • H05K3/3431Leadless components
    • H05K3/3442Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0306Inorganic insulating substrates, e.g. ceramic, glass
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/14Structural association of two or more printed circuits
    • H05K1/141One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/16Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/165Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • H05K1/182Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/183Components mounted in and supported by recessed areas of the printed circuit board
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/08Magnetic details
    • H05K2201/083Magnetic materials
    • H05K2201/086Magnetic materials for inductive purposes, e.g. printed inductor with ferrite core
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09009Substrate related
    • H05K2201/09036Recesses or grooves in insulating substrate
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10015Non-printed capacitor
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227Other objects, e.g. metallic pieces
    • H05K2201/1028Thin metal strips as connectors or conductors
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621Components characterised by their electrical contacts
    • H05K2201/10636Leadless chip, e.g. chip capacitor or resistor
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742Details of leads
    • H05K2201/10886Other details
    • H05K2201/10916Terminals having auxiliary metallic piece, e.g. for soldering
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007Surface contacts, e.g. bumps
    • H05K3/4015Surface contacts, e.g. bumps using auxiliary conductive elements, e.g. pieces of metal foil, metallic spheres
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product
DE88309366T 1987-10-08 1988-10-07 Perlenförmiges zusammengesetztes Element. Expired - Lifetime DE3882477T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987153344U JPH0158909U (de) 1987-10-08 1987-10-08

Publications (2)

Publication Number Publication Date
DE3882477D1 DE3882477D1 (de) 1993-08-26
DE3882477T2 true DE3882477T2 (de) 1994-02-03

Family

ID=15560420

Family Applications (1)

Application Number Title Priority Date Filing Date
DE88309366T Expired - Lifetime DE3882477T2 (de) 1987-10-08 1988-10-07 Perlenförmiges zusammengesetztes Element.

Country Status (4)

Country Link
US (1) US4845452A (de)
EP (1) EP0311418B1 (de)
JP (1) JPH0158909U (de)
DE (1) DE3882477T2 (de)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5224878A (en) * 1992-03-31 1993-07-06 Amp Incorporated Connector filter with integral surge protection
CN1053760C (zh) * 1992-10-12 2000-06-21 松下电器产业株式会社 电子元件及其制造方法
JPH07201592A (ja) * 1993-12-28 1995-08-04 Murata Mfg Co Ltd 積層型lc複合部品
US5455552A (en) * 1994-05-03 1995-10-03 Steward, Inc. Ferrite common mode choke adapted for circuit board mounting
KR0168961B1 (ko) * 1995-06-07 1999-03-20 이형도 포면실장 부품용 라인필터
JP3127792B2 (ja) 1995-07-19 2001-01-29 株式会社村田製作所 Lc共振器およびlcフィルタ
US6566731B2 (en) * 1999-02-26 2003-05-20 Micron Technology, Inc. Open pattern inductor
US6240622B1 (en) * 1999-07-09 2001-06-05 Micron Technology, Inc. Integrated circuit inductors
US6447615B2 (en) * 1999-08-10 2002-09-10 National Starch And Chemical Investment Holding Corporation Sago fluidity starch and use thereof
JP3301415B2 (ja) * 1999-08-19 2002-07-15 株式会社村田製作所 チップ状電子部品
JP4217438B2 (ja) * 2002-07-26 2009-02-04 Fdk株式会社 マイクロコンバータ
US7612641B2 (en) * 2004-09-21 2009-11-03 Pulse Engineering, Inc. Simplified surface-mount devices and methods
US7495926B2 (en) * 2004-10-05 2009-02-24 Sony Ericsson Mobile Communications Ab Interface module for electronic devices
KR101296238B1 (ko) * 2005-10-28 2013-08-13 히타치 긴조쿠 가부시키가이샤 Dc―dc 컨버터
EP2140489A1 (de) * 2007-04-17 2010-01-06 Nxp B.V. Verfahren zur herstellung eines elements mit elektrisch leitfähigen teilen zur anwendung für ein mikroelektronisches gehäuse
US8824165B2 (en) 2008-02-18 2014-09-02 Cyntec Co. Ltd Electronic package structure
US9001527B2 (en) * 2008-02-18 2015-04-07 Cyntec Co., Ltd. Electronic package structure
TWI355068B (en) * 2008-02-18 2011-12-21 Cyntec Co Ltd Electronic package structure
JP5915778B2 (ja) * 2013-01-22 2016-05-11 株式会社村田製作所 Lc複合部品
KR101525689B1 (ko) * 2013-11-05 2015-06-03 삼성전기주식회사 적층 세라믹 전자 부품 및 적층 세라믹 전자 부품의 실장 기판
JP6358132B2 (ja) * 2015-03-03 2018-07-18 オムロン株式会社 立体回路構造体
US9673179B1 (en) 2016-07-20 2017-06-06 International Business Machines Corporation Discrete electronic device embedded in chip module
US20180151291A1 (en) * 2016-11-29 2018-05-31 Qualcomm Incorporated Inductor with embedded diode
US20180218828A1 (en) * 2017-01-27 2018-08-02 Toyota Motor Engineering & Manufacturing North America, Inc. Inductor with variable permeability core
JP7231340B2 (ja) 2018-06-05 2023-03-01 太陽誘電株式会社 セラミック電子部品およびその製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58266Y2 (ja) * 1977-09-30 1983-01-06 株式会社村田製作所 同調装置
US4342069A (en) * 1979-07-02 1982-07-27 Mostek Corporation Integrated circuit package
US4328530A (en) * 1980-06-30 1982-05-04 International Business Machines Corporation Multiple layer, ceramic carrier for high switching speed VLSI chips
US4563659A (en) * 1982-07-28 1986-01-07 Murata Manufacturing Co., Ltd. Noise filter
JPS6041312A (ja) * 1983-08-16 1985-03-05 Tdk Corp 回路素子

Also Published As

Publication number Publication date
EP0311418A2 (de) 1989-04-12
US4845452A (en) 1989-07-04
DE3882477D1 (de) 1993-08-26
EP0311418B1 (de) 1993-07-21
JPH0158909U (de) 1989-04-13
EP0311418A3 (en) 1990-03-28

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Legal Events

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8364 No opposition during term of opposition