DE3888476D1 - Elektrische Kontaktstellen und damit versehene Gehäuse. - Google Patents
Elektrische Kontaktstellen und damit versehene Gehäuse.Info
- Publication number
- DE3888476D1 DE3888476D1 DE88311598T DE3888476T DE3888476D1 DE 3888476 D1 DE3888476 D1 DE 3888476D1 DE 88311598 T DE88311598 T DE 88311598T DE 3888476 T DE3888476 T DE 3888476T DE 3888476 D1 DE3888476 D1 DE 3888476D1
- Authority
- DE
- Germany
- Prior art keywords
- electrical contact
- contact points
- housings provided
- housings
- points
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
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- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
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- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
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- Y10T29/49149—Assembling terminal to base by metal fusion bonding
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Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62309805A JP2506861B2 (ja) | 1987-12-08 | 1987-12-08 | 電気的接続接点の形成方法 |
JP18493688A JPH063820B2 (ja) | 1988-07-25 | 1988-07-25 | 半導体装置の実装方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE3888476D1 true DE3888476D1 (de) | 1994-04-21 |
DE3888476T2 DE3888476T2 (de) | 1994-09-29 |
Family
ID=26502799
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE3888476T Expired - Lifetime DE3888476T2 (de) | 1987-12-08 | 1988-12-07 | Elektrische Kontaktstellen und damit versehene Gehäuse. |
Country Status (5)
Country | Link |
---|---|
US (2) | US5014111A (de) |
EP (1) | EP0320244B1 (de) |
KR (1) | KR910009780B1 (de) |
DE (1) | DE3888476T2 (de) |
HK (1) | HK89096A (de) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102004059389B4 (de) * | 2004-12-09 | 2012-02-23 | Infineon Technologies Ag | Halbleiterbauelement mit Ausgleichsmetallisierung |
Families Citing this family (138)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5476211A (en) | 1993-11-16 | 1995-12-19 | Form Factor, Inc. | Method of manufacturing electrical contacts, using a sacrificial member |
US5917707A (en) | 1993-11-16 | 1999-06-29 | Formfactor, Inc. | Flexible contact structure with an electrically conductive shell |
US5611140A (en) * | 1989-12-18 | 1997-03-18 | Epoxy Technology, Inc. | Method of forming electrically conductive polymer interconnects on electrical substrates |
US5074947A (en) * | 1989-12-18 | 1991-12-24 | Epoxy Technology, Inc. | Flip chip technology using electrically conductive polymers and dielectrics |
US5172851A (en) * | 1990-09-20 | 1992-12-22 | Matsushita Electronics Corporation | Method of forming a bump electrode and manufacturing a resin-encapsulated semiconductor device |
US5296649A (en) * | 1991-03-26 | 1994-03-22 | The Furukawa Electric Co., Ltd. | Solder-coated printed circuit board and method of manufacturing the same |
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Also Published As
Publication number | Publication date |
---|---|
KR890011037A (ko) | 1989-08-12 |
HK89096A (en) | 1996-05-31 |
US5014111A (en) | 1991-05-07 |
KR910009780B1 (ko) | 1991-11-30 |
EP0320244A3 (en) | 1990-10-10 |
DE3888476T2 (de) | 1994-09-29 |
US5090119A (en) | 1992-02-25 |
EP0320244A2 (de) | 1989-06-14 |
EP0320244B1 (de) | 1994-03-16 |
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