DE3889473T2 - Vorrichtung zum Handhaben eines Wafers. - Google Patents
Vorrichtung zum Handhaben eines Wafers.Info
- Publication number
- DE3889473T2 DE3889473T2 DE3889473T DE3889473T DE3889473T2 DE 3889473 T2 DE3889473 T2 DE 3889473T2 DE 3889473 T DE3889473 T DE 3889473T DE 3889473 T DE3889473 T DE 3889473T DE 3889473 T2 DE3889473 T2 DE 3889473T2
- Authority
- DE
- Germany
- Prior art keywords
- wafer
- handling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/682—Mask-wafer alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/136—Associated with semiconductor wafer handling including wafer orienting means
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette
- Y10S414/138—Wafers positioned vertically within cassette
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/012,538 US4846626A (en) | 1987-02-09 | 1987-02-09 | Wafer handling system |
Publications (2)
Publication Number | Publication Date |
---|---|
DE3889473D1 DE3889473D1 (de) | 1994-06-16 |
DE3889473T2 true DE3889473T2 (de) | 1994-08-25 |
Family
ID=21755440
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE3889473T Expired - Lifetime DE3889473T2 (de) | 1987-02-09 | 1988-02-08 | Vorrichtung zum Handhaben eines Wafers. |
Country Status (6)
Country | Link |
---|---|
US (1) | US4846626A (de) |
EP (1) | EP0278462B1 (de) |
JP (1) | JP2591776B2 (de) |
KR (1) | KR960010142B1 (de) |
CA (2) | CA1285335C (de) |
DE (1) | DE3889473T2 (de) |
Families Citing this family (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2729297B2 (ja) * | 1987-12-24 | 1998-03-18 | 株式会社ダイヘン | 半導体ウエハのセンタ合せ装置 |
US5277539A (en) * | 1988-09-30 | 1994-01-11 | Canon Kabushiki Kaisha | Substrate conveying apparatus |
IT1228105B (it) * | 1988-12-20 | 1991-05-28 | Sgs Thomson Microelectronics | Pinza per la movimentazione, vantaggiosamente robotizzata, di una o piu' fette di silicio e/o di un supporto di tali fette |
JP2683933B2 (ja) * | 1989-01-20 | 1997-12-03 | 信越半導体株式会社 | 半導体ウエーハの表裏および方位判定検査装置 |
US5238354A (en) * | 1989-05-23 | 1993-08-24 | Cybeq Systems, Inc. | Semiconductor object pre-aligning apparatus |
JP2642216B2 (ja) * | 1989-05-23 | 1997-08-20 | サイベック システムズ | 半導体物品の予備位置決め方法及び装置 |
EP0452041B1 (de) * | 1990-04-06 | 1996-11-27 | Canon Kabushiki Kaisha | Transportvorrichtung für Substrate und Verfahren zur Kontrolle |
JP2683208B2 (ja) * | 1993-01-28 | 1997-11-26 | アプライド マテリアルズ インコーポレイテッド | ロボット機構を用いた搬入および搬出のためのワークピース位置合わせ方法および装置 |
DE4304301A1 (de) * | 1993-02-12 | 1994-08-18 | Suess Kg Karl | Transportsystem und -verfahren für zueinander auszurichtende Objekte |
US5677758A (en) * | 1995-02-09 | 1997-10-14 | Mrs Technology, Inc. | Lithography System using dual substrate stages |
JPH08288355A (ja) * | 1995-04-12 | 1996-11-01 | Nikon Corp | 基板搬送装置 |
US5700046A (en) * | 1995-09-13 | 1997-12-23 | Silicon Valley Group, Inc. | Wafer gripper |
US5789890A (en) * | 1996-03-22 | 1998-08-04 | Genmark Automation | Robot having multiple degrees of freedom |
US6121743A (en) * | 1996-03-22 | 2000-09-19 | Genmark Automation, Inc. | Dual robotic arm end effectors having independent yaw motion |
JP3850951B2 (ja) * | 1997-05-15 | 2006-11-29 | 東京エレクトロン株式会社 | 基板搬送装置及び基板搬送方法 |
JP3850952B2 (ja) * | 1997-05-15 | 2006-11-29 | 東京エレクトロン株式会社 | 基板搬送装置及び基板搬送方法 |
US6489741B1 (en) | 1998-08-25 | 2002-12-03 | Genmark Automation, Inc. | Robot motion compensation system |
US6075334A (en) * | 1999-03-15 | 2000-06-13 | Berkeley Process Control, Inc | Automatic calibration system for wafer transfer robot |
US6275742B1 (en) | 1999-04-16 | 2001-08-14 | Berkeley Process Control, Inc. | Wafer aligner system |
JP2001308003A (ja) | 2000-02-15 | 2001-11-02 | Nikon Corp | 露光方法及び装置、並びにデバイス製造方法 |
US6556281B1 (en) | 2000-05-23 | 2003-04-29 | Asml Us, Inc. | Flexible piezoelectric chuck and method of using the same |
US6509952B1 (en) | 2000-05-23 | 2003-01-21 | Silicon Valley Group, Inc. | Method and system for selective linewidth optimization during a lithographic process |
US20050122509A1 (en) * | 2002-07-18 | 2005-06-09 | Leica Microsystems Semiconductor Gmbh | Apparatus for wafer inspection |
EP1622196B1 (de) * | 2004-07-30 | 2006-08-30 | Innolas GmbH | Waferbearbeitungsvorrichtung und zugehöriges Verfahren |
US7142940B2 (en) * | 2005-03-14 | 2006-11-28 | Umci Ltd. | Method of processing semiconductor wafer |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3284964A (en) * | 1964-03-26 | 1966-11-15 | Saito Norio | Flexible beam structures |
NO137351C (no) * | 1976-01-30 | 1978-02-22 | Trallfa Nils Underhaug As | B¦yelig robotarm. |
US4228886A (en) * | 1978-12-26 | 1980-10-21 | Ppg Industries, Inc. | Position sensor |
US4425075A (en) * | 1981-04-20 | 1984-01-10 | The Perkin-Elmer Corporation | Wafer aligners |
US4433953A (en) * | 1982-03-22 | 1984-02-28 | General Motors Corporation | Industrial robot having a joint-free arm |
US4457664A (en) * | 1982-03-22 | 1984-07-03 | Ade Corporation | Wafer alignment station |
DE3219502C2 (de) * | 1982-05-25 | 1990-04-19 | Ernst Leitz Wetzlar Gmbh, 6330 Wetzlar | Vorrichtung zum automatischen Transport scheibenförmiger Objekte |
JPS6085536A (ja) * | 1983-10-17 | 1985-05-15 | Hitachi Ltd | ウエハ位置決め装置 |
US4556362A (en) * | 1983-12-21 | 1985-12-03 | At&T Technologies, Inc. | Methods of and apparatus for handling semiconductor devices |
US4539695A (en) * | 1984-01-06 | 1985-09-03 | The Perkin-Elmer Corporation | X-Ray lithography system |
JPS60192345A (ja) * | 1984-03-14 | 1985-09-30 | Hitachi Ltd | ウエハ位置決め装置 |
GB2156582A (en) * | 1984-03-29 | 1985-10-09 | Perkin Elmer Corp | Small part transport system |
US4566726A (en) * | 1984-06-13 | 1986-01-28 | At&T Technologies, Inc. | Method and apparatus for handling semiconductor wafers |
JPS61228644A (ja) * | 1985-04-02 | 1986-10-11 | Hitachi Electronics Eng Co Ltd | ウエハのアライメント装置 |
-
1987
- 1987-02-09 US US07/012,538 patent/US4846626A/en not_active Expired - Lifetime
-
1988
- 1988-02-04 CA CA000558132A patent/CA1285335C/en not_active Expired - Lifetime
- 1988-02-08 DE DE3889473T patent/DE3889473T2/de not_active Expired - Lifetime
- 1988-02-08 EP EP88101813A patent/EP0278462B1/de not_active Expired - Lifetime
- 1988-02-09 KR KR1019880001177A patent/KR960010142B1/ko not_active IP Right Cessation
- 1988-02-09 JP JP63026708A patent/JP2591776B2/ja not_active Expired - Lifetime
-
1991
- 1991-02-27 CA CA000616010A patent/CA1321661C/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US4846626A (en) | 1989-07-11 |
EP0278462A3 (en) | 1990-08-16 |
EP0278462B1 (de) | 1994-05-11 |
KR880010474A (ko) | 1988-10-10 |
CA1285335C (en) | 1991-06-25 |
DE3889473D1 (de) | 1994-06-16 |
JP2591776B2 (ja) | 1997-03-19 |
EP0278462A2 (de) | 1988-08-17 |
CA1321661C (en) | 1993-08-24 |
JPS63308339A (ja) | 1988-12-15 |
KR960010142B1 (ko) | 1996-07-26 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |