DE3909244A1 - Method for producing customer-specific printed circuits - Google Patents

Abstract

The present invention relates to a method for producing customer-specific (application-specific) printed circuits and an electrical circuit which is produced in accordance with the method. The provision of at least two standard conductor track plane designs (1, 2), which can be used irrespective of the customer wishes, the individual conductor tracks of the two standard conductor track plane designs, at least partially overlapping in the case of conductor track planes which lie one above the other. A first conductor track plane is produced first. Subsequently, at least one individual insulation layer is deposited, that is to say a layer which conforms to the respective client's wish. This insulation layer can be deposited either in the form of an unperforated film, the definition of the circuit being carried out by positioning of the passages in the insulation layer or the passages in the film for definition of the circuit can be produced in advance, the depositing of the insulation layer onto the first layer being carried out subsequently. The passages are provided between the conductor tracks (3, 4) of the standard conductor track plane designs instead of the conductor track crossings and/or conductor track overlaps. Subsequently, a second conductor track plane is deposited by means of a screen-printing method, the passages in the insulator plane being filled with screen-printing material in order to avoid separate through-plating measures. Further insulator and [lacuna] can possibly ... Original abstract incomplete. <IMAGE>

Description

The present invention relates to a method of manufacture len customized multi-level printed circuits wiring, d. H. Vias between at least two that can always be used regardless of customer requirements Standard trace level designs.

In the field of trace technology, it is known two-dimensional wiring structures in the form of thin metal layers in one or more layers on insulation board ten such that these wiring structures the electrical connections of the circuit components below form each other. It is also in the so-called multi Layer technology known, circuit boards with multiple conductor tracks to use levels whose conductor tracks are metallized Holes are conductively connected, d. H. a through contact tion is provided, z. B. chemical-galvanic plated-through holes between the individual conductor layers ten are provided. Those consisting of the conductor tracks Wiring patterns themselves are made according to the prior art either by etching a copper clad plate, by Screen printing or by electroplating copper testifies.

It is also in the field of integrated scarf known, customer-specific for special areas of application to develop fish IC’s. Such developments are ever yet very time consuming and usually require one Period of one to two years as a development and test time, which usually increases costs in the order of magnitude  Ren DM 100 000.00 incurred. As a result, such are Special developments from IC’s are only worthwhile if they are are large quantities.

So-called "uncommitted logic arrays" (ULA) are also known or "gate arrays" which are integrated scarves lines with an arrangement of the same basic cells, so that by special laying and programming of conductors customer-specific circuits can be freely defined and are producible, making application-specific very specific Integrated circuits can be produced and consequently spe zial circuit tasks are solvable. However, too here the developments to be made are still relatively time and costly, so that at least here by the customer 10,000-20,000 pieces of such IC's must be removed so that work can be carried out to cover costs at all.

An object of the present invention is therefore to provide a method for the manufacture of customized printed circuits to create, which offers the possibility of three-dimensional Circuits using standardized conductor tracks levels according to individual customer-specific ideas in easier and cheaper to manufacture.

This goal is achieved by the techni shown in claim 1 cal doctrine solved. The inventive method has the Advantage that the realization of customized printed Circuits with little effort and with short developments delivery times can be guaranteed. This will create a Production of application-oriented, individually designed circuits were profitable even in small quantities. Also separate through-connection measures by the avoided method according to the invention.  

A particularly simple implementation of the The method according to the invention is characterized in that the insulation layer or the film out as an adhesive film forms is. This allows the insulation layer in surprisingly simple way on the conductor track level bring. This embodiment of the Ver driving is also simply automation accessible. Applying the insulation layer in shape an adhesive film layer is also simple in terms of equipment to realize.

The design of the method according to the invention Saying 3 has the advantage that you are, as it were, next to the Stan a standardized, d. H. with a uniform pattern of Isola provided with contact windows application layer, and this insulation layer subsequently by specifically closing individual contact windows the respective requirements set by the user that can adapt. This will increase the flexibility of Ver driving increased.

To specifically close certain contact windows in perform the insulation layer in a simple manner NEN according to a further embodiment of the invention Process open contact window in the applied isola tion layer be closed by a dispenser, wel cher over the insulation layer to the contact window locations is performed and with which insulation layer material in the closing contact window is injected. This leaves in a simple way to meet the requirements of each Produce appropriate contact window samples for customers.  

A different direction of the inventions The inventive method is characterized in that the Targeted contact window in the applied insulation layer for example by photo and / or laser and / or x-ray beam and / or ion beam technology and / or a similar one Technology. This configuration also offers the advantage of simple automation of the process step of forming contact windows in the Isola tion layer.

Another useful embodiment of the invention The method is characterized in that the thickness of the at least one other applied by screen printing Standard conductor track level design in the area of the contacts is dimensioned such that the conductor material Contact window of the underlying insulation layer full filled in content and thus the interconnect levels who contacted. This can be done in a simple manner Application of the relevant conductor level at the same time Realize through-plating. Consequently, are separate Through-connection measures advantageously not necessary.

The fact that the contact window in the insulation layer with respect to its diameter - according to a further embodiment of the method according to the invention - are made smaller than the width of the conductor tracks, the advantage is created that one cannot recognize a finished printed circuit board from the contact window insulation layers, where their contact windows are, since they are so small that they are covered by the conductor tracks.

Neither through X-ray optics, light optics or the like The ferti is possible or only possible with difficulty to analyze customer-specific circuitry afterwards.

The manufactured kun The specific circuit therefore guarantees for the order type of circuit counterfeiting protection.

Another useful embodiment of the invention The method is characterized in that one template each for the production of individual contact window insulation layer (s) using CAD technology or programming is posed. The advantage here is that a customer-specific specific variation per circuit board can take place that customer-specific through a CAD system, as it were, an image of the individual contact window insulation layer is, so that with given standard conductor levels with Correspondingly defined conductor track grids only It must be defined which conductor crossing and / or -have overlap points open or closed Need to become.

For example, by means of a computer or customer-specific programs via a plotter the layout will be created, based on which then a sieve print mask as an individual contact window insulation layer is prepared. In the same way it can Computer picture of course also directly with one of the in Techniques set out in claim 7 are combined, which creates the possibility of using the computer with the help of said techniques directly on the To act insulation layer.  

Another useful embodiment of the invention The method is characterized in that preferably the top standard conductor level of the circuit on one or several predetermined surface areas with one or more ren specified, complete, especially integrated Circuits (IC's) is populated, preferably according to Art hybrid technology. Hereby For example, the possibility is opened two or three to connect conventional IC's together, the complete Then shed the circuit and as it were a hybrid scarf to offer the user.

Further expedient process variants result from the Claims 10 and 11.

Another useful embodiment of the invention The procedure is that a template for populating the Printed circuit board or a program created using CAD technology becomes. This makes it possible to load the am topmost standard conductor track layout with the components, cells, assembly intended for the circuit pen, IC's or the like. Using CAD technology or with the help of a To perform placement machines. Here, for example se the program of such a placement machine is not customer-specific, it is sufficient if the automaton knows that a very specific circuit component te or a component or the like. At a predetermined location the standard conductor layout must be placed.

It is useful as an insulating support for the conductors board a common circuit board material, such as Use hard paper or plastic. With material-specific  special requirements is also useful as insulating support a glass or ceramic plate can be used.

The individual standard conductor tracks are expedient designs with the interposition of the insulation layer on at least one surface of the Carrier applied one after the other.

The finished, manufactured by the inventive method te circuit or circuit board is conveniently with shed one or more potting compounds.

According to a further embodiment of the invention The procedure is carried out using the SMD (Sur face mounted devices) technology. Another expedient embodiment of the method according to the invention is described in subclaim 19.

According to sub-claim 20, the present invention does not include only the inventive method, but also an elek trical circuit that according to the method according to one of the Claims 1-19 is made.

The function of the electrical circuit is expedient or a customized circuit board through the selection the circuit components, cells, assemblies, IC's, hybrids or the like can be determined individually.

For a more detailed explanation of the invention, its further feature le and advantages is the attached drawing, in which Embodiments of according to the inventive method Printed circuit boards are shown. Same parts  and elements are always with the same reference number referred to distant.

It shows:

Fig. 1 shows schematically a two standard interconnect layers, a contact window insulation layer and an insulating support existing arrangement in a not yet stacked condition ;,

Fig. 2 is a schematic plan view of a finished circuit board, in which the electrical connections of the circuit components or assemblies u. the like. are not yet carried out among each other;

Fig. 3 is a view corresponding to Figure 2 of a circuit board, which is equipped with two integrated circuits BE, now the electrical connec tions of the circuit components with each other are already carried out by means of two-level wiring. and

Fig. 4 is a block diagram of a programmable frequency divider with the two integrated circuits, which are arranged on the circuit board according to FIG. 3.

As can be seen from FIG. 1, a multilayer printed circuit board manufactured according to the method according to the invention consists, for example, of two standard conductor level designs or standard conductor levels 1 and 2 , an insulation layer, ie contact window insulation layer 5 and an insulating support 6 . The one conductor level 1 has in a predetermined arrangement a number of non-intersecting, essentially mutually parallel conductor tracks 3 , while the other conductor level 2 with a wide ren number of likewise non-intersecting, substantially mutually parallel conductor tracks 4 in predetermined ner Arrangement is provided in such a way that these conductor tracks 4 of the conductor track level 2 are essentially at right angles or at least approximately at right angles to the alignment of the conductor tracks 3 on the conductor track level 1 . The alignment of the conductor tracks can also be different, such as. B. above or next to each other in the ratio of the conductor track planes to each other.

The individual contact window insulation layer 5 arranged between the two standard conductor track levels 1 and 2 is provided with contact windows 8 at points 9 (see FIG. 2) of the conductor track crossings and the conductor track overlaps between the respective conductor tracks 3 and 4 , so that through these contact windows 8 through a two-level wiring for the purpose of connecting the components provided for the circuit, cells, assemblies, IC's or the like can be made.

These points 9 of the conductor crossings and conductor overlaps are selected in accordance with the customer-specific circuit function desired, in which case the individual contact window insulation layer 5 required for this purpose is produced, for example, using CAD technology.

The contact window insulation layer 5 is formed as a film, which is applied to the standard coating layer 1 to produce the layer already described above as a result. This application is preferably carried out by gluing. In a special embodiment of the present invention, a film provided with an adhesive layer (self-adhesive film) can be used.

Fig. 1 shows schematically the order of the stacking of the standard interconnect levels 1 and 2 and the contact window insulation layer 5 on a surface 7 of the insulating support 6 , the interconnect level 1 represents the lower, immediately reaching the surface 7 level , The contact window insulation layer 5, the subsequent level and the conductor level 2 ultimately forms the upper level, which is equipped with the components, cells, modules or the like provided for the circuit.

For this purpose, the conductor track level 2 has surface areas 10 between its conductor tracks 4 for placing the circuit components and the like.

In order to prevent the places of the plated-through holes 9 '(see FIG. 2) from the outside of the conductor crossing and = overlap, the contact windows 8 in the contact window insulation layer 5 have diameters which are always smaller than the width of the conductor tracks 4 in the conductor track plane 2 .

In Fig. 2 is a plan view of a finished circuit board with two standard conductor levels 1 and 2 Darge, of which one level has predetermined surface areas 10 , which is used to populate the circuit board with given integrated circuits 11 , as in can be seen in more detail from FIG. 3.

As FIGS. 2 and 3 also show, for example the conductor tracks 4 of the standard conductor track levels 2 have interruptions 12 at predetermined locations in order to keep the conductor track length (coupling) short. These interruptions 12 via bridging couplings additionally serve to increase the flexibility in the use of conductor tracks 1 and 2 in the manufacture of the printed circuit board.

The integrated circuits 11 with which the printed circuit board according to FIG. 3 is equipped are, for example, integrated circuits IC1 and IC2 for a customer-specific, programmable frequency divider, the block diagram of which is shown in FIG. 4, on the latter detailed description, however, should be omitted.

The positions 9 of the conductor crossings and conductor overlap between the respective conductor paths 3 and 4 of the standard conductor level 1 and 2 and thus the corresponding points of the plated-through holes 9 'through the contact window 8 of the contact window insulation layer 5 (see FIG. 1) represent those places where the electrical connections between the integrated circuits IC1 and IC2 and other circuit components and the like should be made more.

These electrical connection points are designated in FIGS. 3 and 4 with a, b, c, e, f, j, k, l, m, n, o and p .

Claims (21)

1. Method for manufacturing customized printed circuits by means of

• I. Provision of at least two standard interconnect level designs ( 1 , 2 ) which can always be used independently of the customer's wishes, of which one interconnect level design ( 1 ) in a predetermined arrangement a number of non-intersecting interconnect designs ( 3 ) and the other interconnect level design ( 2 ) in a given arrangement contains a further number of non-crossing conductor tracks ( 4 ) which are to be arranged, at least partially overlapping with the conductor tracks ( 3 ), on one conductor track level;
• II. Establishing the first conductor track level;
• III. Application of at least one individual insulation layer, ie insulation layer corresponding to the respective customer request
  • a) either applying an unperforated film to the first conductor level and defining the circuit by placing the bushings in the insulation layer, or
  • b) Define the circuit by placing the bushings in the film before application to the first conductor level and subsequent application to the first layer, the bushings at points of the conductor crossings and / or conductor overlaps between the conductor paths ( 3 , 4 ) of the standard conductor path level designs be provided;
• IV. Applying the second conductor track level by screen printing, the bushings in the insulator level being filled with screen printing material to avoid separate through-contact measures;
• V. If necessary, add further layers of insulator and conductor tracks in alternating order.

2. The method according to claim 1, characterized in that the insulation layer ( 5 ) or the film is designed as an adhesive film. 3. The method according to claims 1 or 2, characterized in that the insulation layer after application to the first standard conductor level design at all points ( 9 ) of the conductor crossings and / or conductor overlaps between the conductor tracks ( 3 and 4 ) of the two standard conductor level designs with contact window ( 8 ) are seen and the contact windows ( 8 ) are selectively closed in an intermediate process step. 4. The method according to any one of the preceding claims, characterized, that open contact window in the applied Iso lation layer can be closed by a dispenser, the over the insulation layer to the contact window len is performed and with which insulation layer material injected into the contact window to be closed becomes.   5. The method according to any one of the preceding claims, characterized, that the contact window in the applied insulation layer specifically by photo and / or Laser and / or X-ray and / or ion beam technology nik and / or a similar technology can be produced. 6. The method according to any one of the preceding claims, characterized in that the thickness of at least one further standard printed conductor plane design ( 2 ) applied by screen printing is dimensioned in the region of the contact window ( 8 ) in such a way that the printed conductor material fully contacts the contact window ( 8 ) of the underlying insulation layer filled in content and thus contacted the interconnect levels ( 1 , 2 ) with each other. 7. The method according to any one of the preceding claims, characterized in that the contact windows ( 8 ) in the insulation layer ( 5 ) are formed with respect to their diameter smaller than the width of the conductor tracks ( 1 , 2 ) and thus level the locations of the vias between the conductor track ( 1 , 2 ) with light-optical or X-ray optical or the like means are difficult or difficult to determine. 8. The method according to any one of the preceding claims, characterized in that a template for producing the individual contact window insulation layer (s) ( 5 ) is produced by means of CAD technology or programming. 9. The method according to any one of the preceding claims, characterized in that preferably the uppermost standard conductor level ( 2 ) of the circuit on one or more predetermined surface areas ( 10 ) with one or more predetermined, complete, in particular integrated circuits (IC's) ( 11 ) is loaded, which are preferably connected to each other in the manner of hybrid technology. 10. The method according to claim 9, characterized in that the IC's ( 11 ) are themselves programmable. 11. The method according to any one of the preceding claims, characterized in that preferably the uppermost standard conductor level ( 2 ) of the circuit on one or more predetermined surface areas ( 10 ) with one or more unencapsulated, integrated circuits in the form of chips is equipped, the are preferably bonded directly on the relevant conductor track level ( 2 ). 12. The method according to any one of the preceding claims, characterized, that a template for populating the circuit board or a Program is created using CAD technology. 13. The method according to any one of the preceding claims, characterized, that the assembly of the circuit board by a machine he follows. 14. The method according to any one of the preceding claims, characterized in that a conventional conductor plate material, such as hard paper or plastic is used as the insulating carrier ( 6 ). 15. The method according to any one of the preceding claims, characterized in that a glass or ceramic plate is used as the insulating support ( 6 ). 16. The method according to any one of the preceding claims, characterized in that the individual standard conductor levels ( 1 , 2 ) with the interposition of the insulation layer ( 5 ) by means of screen printing technology on at least one surface of the carrier ( 6 ) are successively applied. 17. The method according to any one of the preceding claims, characterized in that the finished, from standard conductor levels ( 1 , 2 ), contact window insulation layer (s) ( 5 ), insulating support ( 6 ) and the circuit components, cells, assemblies, IC's, hybrid circuits or the like be existing circuit or circuit board with potting compound (s) is shed. 18. The method according to any one of the preceding claims, characterized, that it is using SMD (Surface mounted Devices) technology is carried out. 19. The method according to any one of the preceding claims, characterized, that two or more of these circuits or circuit boards ten are interconnected.   20. Electrical circuit, especially multi-layer circuit board with plated-through holes between at least two Conductor levels that according to the method according to one of the Claims 1-19 is made. 21. Custom printed circuit board according to claim 20, characterized, that their function by the selection of the circuit comp elements, cells, assemblies, IC's, hybrids or the like Chen can be determined individually.