DE4126877C1 - Plastic microstructure prodn. for high temp. resistance - by forming poly:methyl methacrylate] mould unit, filling with plastic resin and dissolving in solvent, for high accuracy moulds - Google Patents

Plastic microstructure prodn. for high temp. resistance - by forming poly:methyl methacrylate] mould unit, filling with plastic resin and dissolving in solvent, for high accuracy moulds

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Publication number
DE4126877C1
DE4126877C1 DE19914126877 DE4126877A DE4126877C1 DE 4126877 C1 DE4126877 C1 DE 4126877C1 DE 19914126877 DE19914126877 DE 19914126877 DE 4126877 A DE4126877 A DE 4126877A DE 4126877 C1 DE4126877 C1 DE 4126877C1
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Germany
Prior art keywords
molded part
plastic
solvent
reaction
mould unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE19914126877
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German (de)
Inventor
Walter Dr. 7513 Stutensee De Bacher
Heinz 7529 Forst De Dinglreiter
Michael Dr. 7513 Stutensee De Harmening
Juergen Dr. 7519 Sulzfeld De Mohr
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Forschungszentrum Karlsruhe GmbH
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Kernforschungszentrum Karlsruhe GmbH
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Priority to DE19914126877 priority Critical patent/DE4126877C1/en
Application granted granted Critical
Publication of DE4126877C1 publication Critical patent/DE4126877C1/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/0033—Moulds or cores; Details thereof or accessories therefor constructed for making articles provided with holes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/38—Moulds or cores; Details thereof or accessories therefor characterised by the material or the manufacturing process
    • B29C33/3842—Manufacturing moulds, e.g. shaping the mould surface by machining
    • B29C33/3857—Manufacturing moulds, e.g. shaping the mould surface by machining by making impressions of one or more parts of models, e.g. shaped articles and including possible subsequent assembly of the parts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/38—Moulds or cores; Details thereof or accessories therefor characterised by the material or the manufacturing process
    • B29C33/40—Plastics, e.g. foam or rubber
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/44—Moulds or cores; Details thereof or accessories therefor with means for, or specially constructed to facilitate, the removal of articles, e.g. of undercut articles
    • B29C33/52—Moulds or cores; Details thereof or accessories therefor with means for, or specially constructed to facilitate, the removal of articles, e.g. of undercut articles soluble or fusible
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4803—Insulating or insulated parts, e.g. mountings, containers, diamond heatsinks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
    • B29K2105/24—Condition, form or state of moulded material or of the material to be shaped crosslinked or vulcanised
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2833/00—Use of polymers of unsaturated acids or derivatives thereof as mould material
    • B29K2833/04—Polymers of esters
    • B29K2833/12—Polymers of methacrylic acid esters, e.g. PMMA, i.e. polymethylmethacrylate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0014—Shaping of the substrate, e.g. by moulding

Abstract

Prodn. includes forming a mould unit of PMMA or a material contg. the latter, using a mask produced by an X-ray lithography technique, filling the mould unit with plastic and dissolving with a solvent. The plastic is a reaction resin which has a start temp. for the polymer forming reaction which is below the mould unit softening temp. The mould unit is filled under vacuum, after which the resin is heated. After heating and cooling, the unit is dissolved with e.g. ethyl acetate. ADVANTAGE - Higher temp. resistance than the mould unit moulded with accuracy.

Description

Die Erfindung betrifft ein Verfahren zur Herstellung von Mi­ krostrukturkörpern aus Kunststoff gemäß dem Oberbegriff von Anspruch 1.The invention relates to a method for producing Mi Crostructure bodies made of plastic according to the preamble of Claim 1.

Aus der DE 34 40 110 C1 ist es bekannt, einem Mikrostruktur­ körper mit einem plattenförmigen Material aus Polymethyl­ metacrylat (PMMA) herzustellen, wobei das plattenförmige Mate­ rial auf einer Metallplatte angeordnet und über eine Röntgen­ maske mit energiereicher Röntgenstrahlung eines Synchrotrons partiell durchstrahlt wird. Dann werden die bestrahlten Berei­ che mit einem flüssigen Entwickler zu entfernt. Das so auf der Oberfläche der Metallplatte erzeugte, mikrostrukturierte Form­ teil kann galvanisch mit einem Metall, z. B. mit Nickel, aufge­ füllt werden, wodurch mikrostrukturierte Elemente aus Metall entstehen. Diese Elemente können auch auf einer gemeinsamen Halteplatte fixiert werden, wenn das Galvanisieren über die Höhe des plattenförmigen PMMA hinaus erfolgt. Nach dem Auflö­ sen des PMMA erhält man dann ein aus metallischen Mikrostrukturelementen und Halteplatte bestehendes Mutterwerk­ zeug, das wiederholt mit einem Gießharz auf Methacrylatbasis abgeformt werden kann. Die so entstehenden Formteile können ebenfalls galvanisch mit einem Metall aufgefüllt werden. Will man an Stelle von PMMA ein anderes Material, z. B. das tempera­ turbeständigere Polyamid, verwenden, so wird in dieser Druck­ schrift vorgeschlagen, nach dem Galvanisieren zunächst die hierfür vorgesehenen Bereiche des PMMA zu bestrahlen, heraus­ zulösen und durch das andere Material zu ersetzen. An­ schließend wird das restliche PMMA-Material durch Auflösen entfernt. Die so hergestellten Mikrostrukturkörper sollen nach der genannten Patentschriften als Vielfach-Verbindungen für den elektrischen Anschluß mikroelektronischer Bauelemente Ver­ wendung finden. From DE 34 40 110 C1 it is known a microstructure body with a plate-shaped material made of polymethyl to produce methacrylate (PMMA), the plate-shaped mate rial arranged on a metal plate and over an X-ray mask with high-energy x-ray radiation from a synchrotron is partially irradiated. Then the irradiated area with a liquid developer. That on the Surface of the metal plate created, microstructured shape part can be galvanically coated with a metal, e.g. B. with nickel, up can be filled, creating microstructured metal elements arise. These items can also be shared Holding plate to be fixed when electroplating over the Height of the plate-shaped PMMA takes place. After the dissolution The PMMA is then made of metallic Microstructure elements and retaining plate existing parent plant stuff that is repeated with a methacrylate-based casting resin can be molded. The resulting molded parts can can also be galvanically filled with a metal. Want another material instead of PMMA, e.g. B. the tempera more resistant to polyamide, so this pressure Scripture proposed, after galvanizing, the first to irradiate areas of the PMMA provided for this purpose dissolve and replace with the other material. On finally the remaining PMMA material is dissolved away. The microstructure bodies produced in this way are said to of said patents as multiple connections for the electrical connection of microelectronic components Ver find application.  

Bei der praktischen Durchführung dieses zuletzt genannten Vor­ schlags treten jedoch erhebliche Probleme auf. So greift z. B. Polyamid die Mikrostrukturen des PMMA-Formteils bereits beim Einfüllen an. Aber auch bei anderen, temperatur- und lösungsmittelbeständigen Kunststoffen ergeben sich Schwierig­ keiten, da PMMA bereits bei relativ niedrigen Temperaturen von ca. 85°-90°C seine Formbeständigkeit verliert, wodurch eine Abformung mit Kunststoffen höherer Härtungstemperatur nicht mehr ohne weiteres möglich ist.In the practical implementation of this last mentioned before However, there are significant problems. So z. B. The microstructures of the PMMA molded part are already in polyamide Fill in. But also with others, temperature and Solvent-resistant plastics are difficult because PMMA already at relatively low temperatures of approx. 85 ° -90 ° C loses its dimensional stability, resulting in a No impression with plastics with a higher curing temperature more is easily possible.

Der Erfindung liegt die Aufgabe zugrunde, das gattungsgemäße Verfahren so zu gestalten, daß sich damit Kunststoffe, die eine höhere Temperaturbeständigkeit haben als das PMMA-Form­ teil, ohne Strukturverlust und mit hoher Formgenauigkeit ab­ formen lassen.The invention has for its object the generic To design processes so that plastics have a higher temperature resistance than the PMMA form part, without loss of structure and with high dimensional accuracy let shape.

Diese Aufgabe wird mit den kennzeichnenden Merkmalen von An­ spruch 1 gelöst.This task is characterized by the characteristics of An spell 1 solved.

Mit der Erfindung gelingt es, Mikrostrukturkörper aus Reak­ tionsgießharzen mit hohen Aspektverhältnissen bei kleinsten lateralen Abmessungen im µm-Bereich herzustellen, wie dies bislang nur bei galvanischen Abformprozessen möglich war. Auch können durch mechanisches Abtragen, z. B. durch Abfräsen der über das Formteil überstehenden Schicht sogenannte "freitra­ gende" Mikrostrukturen aus Kunststoff hergestellt werden.With the invention it is possible to use microstructure bodies made from reak tion casting resins with high aspect ratios with the smallest produce lateral dimensions in the µm range, like this Until now, this was only possible with galvanic impression processes. Also can by mechanical removal, e.g. B. by milling the so-called "freitra The following "microstructures are made of plastic.

Das erfindungsgemäße Verfahren wird im folgenden anhand der Zeichnungen erläutert:
Die Fig. 1 zeigt schematisch im Schnitt und in starker Ver­ größerung ein metallisches Mutterwerkzeug 1 mit Mikrostruktu­ ren 1a, 1b. Die Strukturen 1a haben die Gestalt von dünnen, hohen Stegen, die netzförmig miteinander verbunden sind. Die Strukturen 1b haben die Gestalt von runden oder mehreckigen Zapfen, die von schmalen, tiefen Spalten umschlossen sind. Die Stege bzw. Spalten haben laterale Abmessungen von 8 µm bei ei­ ner Höhe von 200 µm. Die Netzweite bzw. Zapfenbreite beträgt ca. 80 µm. Mit diesem Mutterwerkzeug 1 wurde im Vakuumreakti­ onsgußverfahren das Formteil 2 abgeformt, dessen Mikrostruktu­ ren 2a, 2b komplementär zu den Strukturen 1a, 1b sind. Das Formteil 2 besteht aus einem Reaktionsformstoff auf PMMA- Basis, dem ein internes Formtrennmittel beigemischt wurde; der viscoelastische Bereich, und damit die Erweichungstemperatur, des PMMA-Formteils beginnt bei 85° bis 90°C.The method according to the invention is explained below with reference to the drawings:
Fig. 1 shows schematically in section and in large Ver Ver a metallic nut tool 1 with Mikrostruktu ren 1 a, 1 b. The structures 1 a have the shape of thin, high webs which are interconnected in a network. The structures 1 b have the shape of round or polygonal cones, which are enclosed by narrow, deep gaps. The webs or columns have lateral dimensions of 8 µm with a height of 200 µm. The mesh width or tenon width is approx. 80 µm. With this mother tool 1 , the molded part 2 was molded in the vacuum reaction casting process, the microstructures ren 2 a, 2 b are complementary to the structures 1 a, 1 b. The molded part 2 consists of a reaction molding material based on PMMA, to which an internal mold release agent has been added; the viscoelastic area, and thus the softening temperature, of the PMMA molded part begins at 85 ° to 90 ° C.

Gemäß Fig. 2 wird das Formteil 2 unter einem Gießrahmen 3 bei Vakuum mit einem flüssigen Epoxidharz 4 gefüllt und ca. 500 µm überschichtet. Die Starttemperatur für die Polymerbildungs­ reaktion, bei der die Verarbeitung des Epoxidharzes beginnt, liegt bei 81°C, also etwas unterhalb der Erweichungstempera­ tur des PMMA-Formteils 2. Das Epoxidharz wird anschließend mit 10° pro Stunde auf 120°C aufgeheizt. Nach einer Haltezeit von zwei Stunden bei 120°C wird die Härtungstemperatur mit 100°C pro Stunde auf 160°C erhöht und 6 Stunden bei dieser Tempera­ tur zur vollständigen Aushärtung gehalten. Anschließend wird mit ca. 20°C/pro Stunde abgekühlt. Obwohl diese Aufheizungs- und Härtungstemperaturen deutlich über dem viscoelastischen Bereich des PMMA-Formteils 2 liegen, erhält man einen form­ treuen, bis zu 150°C temperaturbeständigen Mikro­ strukturkörper aus Epoxidharz, dessen Mikrostrukturen 4a, 4b exakt denen des metallischen Mutterwerkzeugs 1 entsprechen.According to FIG. 2, the molded part 2 is filled with a liquid epoxy resin 4 under a casting frame 3 under vacuum and covered with a layer of about 500 μm. The starting temperature for the polymer formation reaction at which the processing of the epoxy resin begins is 81 ° C., i.e. slightly below the softening temperature of the PMMA molded part 2 . The epoxy resin is then heated to 120 ° C at 10 ° per hour. After a holding time of two hours at 120 ° C, the curing temperature is increased to 100 ° C per hour to 160 ° C and held for 6 hours at this temperature for complete curing. It is then cooled at about 20 ° C./hour. Although these heating and curing temperatures are clearly above the viscoelastic range of the PMMA molded part 2 , a shape-accurate, up to 150 ° C temperature-resistant microstructure body made of epoxy resin is obtained, the microstructures 4 a, 4 b of which correspond exactly to those of the metal nut tool 1 .

Wie aus Fig. 3 zu ersehen ist, kann das überstehende Epoxid­ harz durch Polierfräsen mit einem Diamantfräser 5 bis zu den Stirnflächen der Mikrostrukturen 4a, 4b abgetragen werden. An­ schließend wird das PMMA-Formteil 2 als "verlorene Form" in Ethylacetat als Lösungsmittel bei 70°C innerhalb von ca. 30 min. aufgelöst (Fig. 4). Da das Epoxidharz von diesem Lö­ sungsmittel nicht angegriffen wird, erhält man einen sogenann­ ten "freitragenden" Mikrostrukturkörper in Gestalt einer mi­ krostrukturierten Folie 6 (Fig. 5). Durch diese Methode ent­ fallen auch die sonst für das direkte Abformen mit einem me­ tallischen Formeinsatz erforderlichen Zusatzstoffe, wie z. B. interne Formtrennmittel.As can be seen from Fig. 3, the protruding epoxy resin can be removed by polishing with a diamond cutter 5 up to the end faces of the microstructures 4 a, 4 b. At closing, the PMMA molding 2 as a "lost form" in ethyl acetate as a solvent at 70 ° C within about 30 min. resolved ( Fig. 4). Since the epoxy resin is not attacked by this solvent, a so-called "self-supporting" microstructure body is obtained in the form of a microstructured film 6 ( FIG. 5). This method also eliminates the additives otherwise required for direct molding with a metallic mold insert, such as. B. internal mold release agent.

Das PMMA-Formteil 2 kann auch unmittelbar in bekannter Weise auf röntgentiefenlithografischem Wege hergestellt werden. Das Abformen mit einem Formeinsatz kann auch durch Spritzgießen oder Prägen erfolgen. Anstelle von Epoxidharz können auch an­ dere Reaktionsgießharze wie Phenolharz oder Polyurethanharz verwendet werden, deren Temperaturbeständigkeit höher liegt als die von PMMA.The PMMA molded part 2 can also be produced directly in a known manner using X-ray depth lithography. Molding with a mold insert can also be done by injection molding or stamping. Instead of epoxy resin, other reaction casting resins such as phenolic resin or polyurethane resin can be used, the temperature resistance of which is higher than that of PMMA.

Claims (4)

1. Verfahren zur Herstellung von Mikrostrukturkörpern aus Kunststoff, bei dem auf röntgentiefenlithografischem Wege mit einer energiereichen Strahlung und einer Maske aus einem dünnen die Strahlung nur schwach absorbierenden Material und einem auf die Maske aufgebrachten Absorbermuster oder durch Ab­ formen mit einem mikrostrukturierten Mutterwerkzeug (1) ein Formteil (2) aus PMMA oder PMMA-enthaltendem Material er­ zeugt wird, worauf das Formteil (2) mit dem Kunststoff ge­ füllt und anschließend mit einem Lösungsmittel aufgelöst und entfernt wird, dadurch gekennzeichnet, daß
  • a) als Kunststoff ein Reaktionsgießharz (4) verwendet wird, dessen Starttemperatur für die Polymerbildungsreaktion unterhalb und dessen Härtungstemperatur oberhalb der Erweichungstemperatur des Formteils (2) liegt, daß
  • b) das Formteil (2) mit dem Reaktionsgießharz (4) unter Va­ kuum knapp unterhalb der Erweichungstemperatur des Form­ teils gefüllt und überschichtet und
  • c) anschließend das Reaktionsgießharz (4) auf die Härtungstemperatur geheizt wird, und daß
  • d) nach dem Aushärten und Abkühlen des Reaktionsgießharzes (4) das Formteil (2) mit einem Lösungsmittel, wie Ethyl­ acetat, aufgelöst wird.
1. A process for the production of microstructure bodies made of plastic, in which an X-ray lithographic method with high-energy radiation and a mask made of a thin material which only weakly absorbs radiation and an absorber pattern applied to the mask or by molding with a microstructured mother tool ( 1 ) Molded part ( 2 ) made of PMMA or PMMA-containing material, whereupon the molded part ( 2 ) is filled with the plastic and then dissolved and removed with a solvent, characterized in that
  • a) as a plastic, a reaction casting resin ( 4 ) is used, the starting temperature for the polymer formation reaction below and the curing temperature above the softening temperature of the molded part ( 2 ) that
  • b) the molded part ( 2 ) with the reactive casting resin ( 4 ) under vacuum just below the softening temperature of the molded part and overlaid and
  • c) then the reaction casting resin ( 4 ) is heated to the curing temperature, and that
  • d) after the curing and cooling of the reaction casting resin ( 4 ), the molded part ( 2 ) is dissolved with a solvent such as ethyl acetate.
2. Verfahren nach Anspruch 1, dadurch gekennzeichnet, daß vor dem Auflösen des Formteils (2) gemäß Schritt d) die über das Formteil (2) überstehende Schicht des Reaktions­ gießharzes (4) mechanisch abgetragen wird.2. The method according to claim 1, characterized in that before the dissolving of the molded part ( 2 ) according to step d) the overlying the molded part ( 2 ) protruding layer of the reaction resin ( 4 ) is removed mechanically. 3. Verfahren nach Anspruch 2, dadurch gekennzeichnet, daß das Abtragen durch Fräsen erfolgt.3. The method according to claim 2, characterized in that the Removed by milling. 4. Verfahren nach Anspruch 1, gekennzeichnet durch die Verwen­ dung von Epoxidharzen oder Phenolharzen als Reaktionsgieß­ harz.4. The method according to claim 1, characterized by the use Formation of epoxy resins or phenolic resins as a reaction casting resin.
DE19914126877 1991-08-14 1991-08-14 Plastic microstructure prodn. for high temp. resistance - by forming poly:methyl methacrylate] mould unit, filling with plastic resin and dissolving in solvent, for high accuracy moulds Expired - Fee Related DE4126877C1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE19914126877 DE4126877C1 (en) 1991-08-14 1991-08-14 Plastic microstructure prodn. for high temp. resistance - by forming poly:methyl methacrylate] mould unit, filling with plastic resin and dissolving in solvent, for high accuracy moulds

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Application Number Priority Date Filing Date Title
DE19914126877 DE4126877C1 (en) 1991-08-14 1991-08-14 Plastic microstructure prodn. for high temp. resistance - by forming poly:methyl methacrylate] mould unit, filling with plastic resin and dissolving in solvent, for high accuracy moulds

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Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4222856C1 (en) * 1992-07-11 1993-05-27 Buerkert Gmbh
EP0620092A1 (en) * 1993-03-12 1994-10-19 MICROPARTS GESELLSCHAFT FÜR MIKROSTRUKTURTECHNIK mbH Bodies having microstructure and process for the production thereof
DE19519561A1 (en) * 1995-05-27 1996-11-28 Inst Mikrotechnik Mainz Gmbh Micro-structured object mfr. and equipment for intermittent and continuous prodn.
DE10118529C1 (en) * 2001-03-14 2002-10-17 Fraunhofer Ges Forschung Process for structuring a flat substrate made of glass-like material
DE10005484B4 (en) * 2000-02-08 2004-07-29 Rwe Schott Solar Gmbh Process for forming a thin crystallized layer
US7416961B2 (en) 2001-03-14 2008-08-26 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Method for structuring a flat substrate consisting of a glass-type material
WO2012030570A1 (en) * 2010-08-30 2012-03-08 Advanced Technologies And Regenerative Medicine, Llc Adhesive structure with stiff protrusions on adhesive surface
US8926881B2 (en) 2012-04-06 2015-01-06 DePuy Synthes Products, LLC Super-hydrophobic hierarchical structures, method of forming them and medical devices incorporating them
US8969648B2 (en) 2012-04-06 2015-03-03 Ethicon, Inc. Blood clotting substrate and medical device
US9211176B2 (en) 2010-08-30 2015-12-15 Ethicon Endo-Surgery, Inc. Adhesive structure with stiff protrusions on adhesive surface
US9492952B2 (en) 2010-08-30 2016-11-15 Endo-Surgery, Inc. Super-hydrophilic structures
US10278701B2 (en) 2011-12-29 2019-05-07 Ethicon, Inc. Adhesive structure with tissue piercing protrusions on its surface
US10625463B2 (en) 2012-07-03 2020-04-21 3M Innovative Properties Company Method of making structured hybrid adhesive articles including lightning strike protection sheets

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3440110C1 (en) * 1984-11-02 1986-05-28 Kernforschungszentrum Karlsruhe Gmbh, 7500 Karlsruhe Process for producing mechanically separable multiple connections for the electrical connection of microelectronic components

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3440110C1 (en) * 1984-11-02 1986-05-28 Kernforschungszentrum Karlsruhe Gmbh, 7500 Karlsruhe Process for producing mechanically separable multiple connections for the electrical connection of microelectronic components

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4222856C1 (en) * 1992-07-11 1993-05-27 Buerkert Gmbh
EP0620092A1 (en) * 1993-03-12 1994-10-19 MICROPARTS GESELLSCHAFT FÜR MIKROSTRUKTURTECHNIK mbH Bodies having microstructure and process for the production thereof
DE19519561A1 (en) * 1995-05-27 1996-11-28 Inst Mikrotechnik Mainz Gmbh Micro-structured object mfr. and equipment for intermittent and continuous prodn.
DE10005484B4 (en) * 2000-02-08 2004-07-29 Rwe Schott Solar Gmbh Process for forming a thin crystallized layer
DE10118529C1 (en) * 2001-03-14 2002-10-17 Fraunhofer Ges Forschung Process for structuring a flat substrate made of glass-like material
US7416961B2 (en) 2001-03-14 2008-08-26 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Method for structuring a flat substrate consisting of a glass-type material
WO2012030570A1 (en) * 2010-08-30 2012-03-08 Advanced Technologies And Regenerative Medicine, Llc Adhesive structure with stiff protrusions on adhesive surface
CN103459529A (en) * 2010-08-30 2013-12-18 伊西康内外科公司 Adhesive structure with stiff protrusions on adhesive surface
US9211176B2 (en) 2010-08-30 2015-12-15 Ethicon Endo-Surgery, Inc. Adhesive structure with stiff protrusions on adhesive surface
US9492952B2 (en) 2010-08-30 2016-11-15 Endo-Surgery, Inc. Super-hydrophilic structures
US10278701B2 (en) 2011-12-29 2019-05-07 Ethicon, Inc. Adhesive structure with tissue piercing protrusions on its surface
US8926881B2 (en) 2012-04-06 2015-01-06 DePuy Synthes Products, LLC Super-hydrophobic hierarchical structures, method of forming them and medical devices incorporating them
US8969648B2 (en) 2012-04-06 2015-03-03 Ethicon, Inc. Blood clotting substrate and medical device
US10625463B2 (en) 2012-07-03 2020-04-21 3M Innovative Properties Company Method of making structured hybrid adhesive articles including lightning strike protection sheets

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