DE50005936D1 - Chipkartenmodul mit anisotrop leitfähiger trägerfolie - Google Patents

Chipkartenmodul mit anisotrop leitfähiger trägerfolie

Info

Publication number
DE50005936D1
DE50005936D1 DE50005936T DE50005936T DE50005936D1 DE 50005936 D1 DE50005936 D1 DE 50005936D1 DE 50005936 T DE50005936 T DE 50005936T DE 50005936 T DE50005936 T DE 50005936T DE 50005936 D1 DE50005936 D1 DE 50005936D1
Authority
DE
Germany
Prior art keywords
card module
anisotrop
carrier film
chip card
conductive carrier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE50005936T
Other languages
English (en)
Inventor
Erik Heinemann
Frank Pueschner
Detlef Houdeau
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Infineon Technologies AG
Original Assignee
Infineon Technologies AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Infineon Technologies AG filed Critical Infineon Technologies AG
Application granted granted Critical
Publication of DE50005936D1 publication Critical patent/DE50005936D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07743External electrical contacts

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
DE50005936T 1999-12-02 2000-12-01 Chipkartenmodul mit anisotrop leitfähiger trägerfolie Expired - Lifetime DE50005936D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP99124141 1999-12-02
PCT/DE2000/004282 WO2001041054A2 (de) 1999-12-02 2000-12-01 Chipkartenmodul mit anisotrop leitfähiger trägerfolie

Publications (1)

Publication Number Publication Date
DE50005936D1 true DE50005936D1 (de) 2004-05-06

Family

ID=8239522

Family Applications (1)

Application Number Title Priority Date Filing Date
DE50005936T Expired - Lifetime DE50005936D1 (de) 1999-12-02 2000-12-01 Chipkartenmodul mit anisotrop leitfähiger trägerfolie

Country Status (5)

Country Link
US (1) US6992898B2 (de)
EP (1) EP1234275B1 (de)
AT (1) ATE263398T1 (de)
DE (1) DE50005936D1 (de)
WO (1) WO2001041054A2 (de)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR3077676B1 (fr) * 2018-02-05 2021-05-14 Linxens Holding Procede de fabrication d’un circuit electrique comprenant au moins un connecteur pour carte a puce, et circuit electrique obtenu, notamment, par ce procede

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61123990A (ja) 1984-11-05 1986-06-11 Casio Comput Co Ltd Icカ−ド
JP2980496B2 (ja) * 1993-11-10 1999-11-22 シャープ株式会社 フレキシブル配線板の端子構造
AU704645B2 (en) * 1995-04-13 1999-04-29 Dainippon Printing Co. Ltd. IC card and IC module
JP2814477B2 (ja) * 1995-04-13 1998-10-22 ソニーケミカル株式会社 非接触式icカード及びその製造方法
JPH09148378A (ja) 1995-11-20 1997-06-06 Dainippon Printing Co Ltd Icカード用icモジュールとその製造方法および当該icモジュールを使用したicカード
US5936847A (en) * 1996-05-02 1999-08-10 Hei, Inc. Low profile electronic circuit modules
DE19632113C1 (de) 1996-08-08 1998-02-19 Siemens Ag Chipkarte, Verfahren zur Herstellung einer Chipkarte und Halbleiterchip zur Verwendung in einer Chipkarte
EP0824301A3 (de) * 1996-08-09 1999-08-11 Hitachi, Ltd. Gedruckte Schaltungsplatte, Chipkarte, und Verfahren zu deren Herstellung
FR2761497B1 (fr) * 1997-03-27 1999-06-18 Gemplus Card Int Procede de fabrication d'une carte a puce ou analogue
US6146753A (en) * 1997-05-26 2000-11-14 Dai Nippon Printing Co., Ltd. Antistatic hard coat film
CN1144155C (zh) * 1997-06-23 2004-03-31 罗姆股份有限公司 智能模块和智能卡
JPH1131784A (ja) * 1997-07-10 1999-02-02 Rohm Co Ltd 非接触icカード
JPH1140522A (ja) * 1997-07-17 1999-02-12 Rohm Co Ltd 半導体ウエハの製造方法、この方法により作製された半導体ウエハ、半導体チップの製造方法、およびこの方法により製造された半導体チップ、ならびにこの半導体チップを備えたicカード
FR2769389B1 (fr) * 1997-10-07 2000-01-28 Rue Cartes Et Systemes De Carte a microcircuit combinant des plages de contact exterieur et une antenne, et procede de fabrication d'une telle carte
JPH11163501A (ja) * 1997-12-02 1999-06-18 Rohm Co Ltd 電子部品の実装方法、およびその方法によって製造された電子回路装置
US6319594B1 (en) * 1998-03-17 2001-11-20 Dai Nippon Printing Co., Ltd. Low reflective antistatic hardcoat film

Also Published As

Publication number Publication date
US6992898B2 (en) 2006-01-31
US20020172018A1 (en) 2002-11-21
EP1234275B1 (de) 2004-03-31
WO2001041054A3 (de) 2001-12-13
EP1234275A2 (de) 2002-08-28
ATE263398T1 (de) 2004-04-15
WO2001041054A2 (de) 2001-06-07

Similar Documents

Publication Publication Date Title
ES2189461T3 (es) Procedimiento de fabricacion de tarjetas sin contacto.
ES2125649T3 (es) Elemento de soporte para circuito integrado.
ATE222387T1 (de) Chipkartenmodul und diesen umfassende chipkarte
EP1039551A3 (de) Photovoltaisches Modul
EP0797253A3 (de) Chipträger und Halbleiteranordnung mit diesem Chipträger
EP1191590A3 (de) Halbleiteranordnung und Halbleitermodul
EP1005086A3 (de) Metallfolie mit Hockerkontakten, Schaltungssubstrat mit der Metallfolie, und Halbleitervorrichtung mit dem Schaltungssubstrat
AU2002213295A1 (en) Electronic module having canopy-type carriers
BR9709319A (pt) Elemento de substrato para um chip semicondutor
ATE329329T1 (de) Tragbarer datenträger mit anzeigevorrichtung
ATE243349T1 (de) Flächiger träger mit mindestens einem halbleiterchip
KR890005859A (ko) 집적회로 칩 조립품
DE60230919D1 (de) Chip karte mit einem grossflächigen modul
ATE341799T1 (de) Datenträger mit transponderspule
EP0841699A3 (de) Filmkapazität und Halbleiterpackung oder Anordnung damit
TW373312B (en) Semiconductor device, circuit board and combination of semiconductor device and circuit board
DE69013646T2 (de) Integrierte Halbleiterschaltungsvorrichtung mit Kontaktierungsflächen am Rande des Halbleiterchips.
DE59706344D1 (de) Chipkartenmodul
DE50005936D1 (de) Chipkartenmodul mit anisotrop leitfähiger trägerfolie
WO2006066964A3 (en) An electronic device, a chip containing method and a contacting device
DE50010291D1 (de) Chipkarte
ES2171948T3 (es) Procedimiento para la fabricacion de un elemento de soporte para chips semiconductores.
TW343387B (en) Semiconductor device
WO1998048378A3 (de) Karteneinlage für chipkarten
EP0997937A3 (de) Halbleitermodul mit einem Kühlkörper

Legal Events

Date Code Title Description
8364 No opposition during term of opposition