DE502004010531D1 - Verfahren zum verschweissen von leitern - Google Patents

Verfahren zum verschweissen von leitern

Info

Publication number
DE502004010531D1
DE502004010531D1 DE502004010531T DE502004010531T DE502004010531D1 DE 502004010531 D1 DE502004010531 D1 DE 502004010531D1 DE 502004010531 T DE502004010531 T DE 502004010531T DE 502004010531 T DE502004010531 T DE 502004010531T DE 502004010531 D1 DE502004010531 D1 DE 502004010531D1
Authority
DE
Germany
Prior art keywords
conductors
welding
welded
compression chamber
ultrasound
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE502004010531T
Other languages
English (en)
Inventor
Jost Eberbach
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Schunk Sonosystems GmbH
Original Assignee
Schunk Sonosystems GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE10350809A external-priority patent/DE10350809B3/de
Priority claimed from DE10359368A external-priority patent/DE10359368A1/de
Application filed by Schunk Sonosystems GmbH filed Critical Schunk Sonosystems GmbH
Publication of DE502004010531D1 publication Critical patent/DE502004010531D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • H01R43/0207—Ultrasonic-, H.F.-, cold- or impact welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
    • B23K20/106—Features related to sonotrodes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups
    • B23K31/12—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups relating to investigating the properties, e.g. the weldability, of materials
    • B23K31/125—Weld quality monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/02—Soldered or welded connections
    • H01R4/029—Welded connections
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/38—Conductors
DE502004010531T 2003-10-29 2004-10-28 Verfahren zum verschweissen von leitern Active DE502004010531D1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE10350809A DE10350809B3 (de) 2003-10-29 2003-10-29 Verfahren zum Verschweissen von Leitern
DE10359368A DE10359368A1 (de) 2003-12-18 2003-12-18 Verfahren zum Verschweißen von Leitern
PCT/EP2004/012221 WO2005042202A1 (de) 2003-10-29 2004-10-28 Verfahren zum verschweissen von leitern

Publications (1)

Publication Number Publication Date
DE502004010531D1 true DE502004010531D1 (de) 2010-01-28

Family

ID=34553317

Family Applications (1)

Application Number Title Priority Date Filing Date
DE502004010531T Active DE502004010531D1 (de) 2003-10-29 2004-10-28 Verfahren zum verschweissen von leitern

Country Status (11)

Country Link
US (1) US7600665B2 (de)
EP (1) EP1677942B1 (de)
JP (1) JP5142527B2 (de)
KR (1) KR20060102558A (de)
AT (1) ATE451998T1 (de)
BR (1) BRPI0415993B1 (de)
DE (1) DE502004010531D1 (de)
MX (1) MXPA06004855A (de)
PL (1) PL1677942T3 (de)
PT (1) PT1677942E (de)
WO (1) WO2005042202A1 (de)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4597988B2 (ja) * 2003-08-22 2010-12-15 シュンク・ソノシステムズ・ゲーエムベーハー 導体を圧縮および／または溶接するための装置
DE102005004899A1 (de) * 2005-02-02 2006-08-03 Schunk Ultraschalltechnik Gmbh Verdichtungsraum sowie ein einen Verdichtungsraum begrenzendes Werkzeug
DE102005048368B3 (de) * 2005-10-10 2007-05-03 Schunk Ultraschalltechnik Gmbh Verfahren zum Herstellen einer Schweißverbindung zwischen elektrischen Leitern
DE102008045751B4 (de) * 2008-09-04 2020-01-30 Te Connectivity Germany Gmbh Vorrichtung und Verfahren zum Kompaktierschweißen
JP5654242B2 (ja) 2010-01-18 2015-01-14 矢崎総業株式会社 電線の端末処理方法
JP5400676B2 (ja) * 2010-03-17 2014-01-29 古河電気工業株式会社 超音波溶接方法
JP2013004406A (ja) * 2011-06-20 2013-01-07 Hitachi Cable Ltd 端子付き電線の製造方法
DE102012111734A1 (de) * 2012-12-03 2014-06-05 Schunk Sonosystems Gmbh Ultraschallschweißvorrichtung sowie Verfahren zum Verschweißen von elektrischen Leitern
DE102013107637A1 (de) * 2013-07-18 2015-01-22 Schunk Sonosystems Gmbh Verfahren zur Herstellung eines Knotens durch Schweißen
DE102013222938B3 (de) 2013-11-11 2015-04-30 Schunk Sonosystems Gmbh Vorrichtung zum Verschweißen von elektrischen Leitern
EP3260229A1 (de) * 2016-06-22 2017-12-27 Delphi Technologies, Inc. Spannsystem für eine ultraschall-schweissanlage und deren verwendung
DE102016214227B3 (de) * 2016-08-02 2017-12-07 Schunk Sonosystems Gmbh Vorrichtung und Verfahren zur Herstellung einer geprüften Schweißverbindung
DE102016218308B4 (de) * 2016-08-03 2018-04-05 Schunk Sonosystems Gmbh Vorrichtung und Verfahren zur Herstellung einer geprüften Schweißverbindung
JP6852784B2 (ja) * 2017-03-16 2021-03-31 三菱電機株式会社 板状はんだの製造装置およびその製造方法
JP6887203B2 (ja) * 2017-07-14 2021-06-16 古河電気工業株式会社 導体接続装置及び導体接続方法
JP6603692B2 (ja) 2017-08-02 2019-11-06 矢崎総業株式会社 電線接合方法
JP6655056B2 (ja) * 2017-11-28 2020-02-26 矢崎総業株式会社 電線の導体の超音波接合方法、端子付き電線の製造方法および電線
US10830316B2 (en) * 2017-12-08 2020-11-10 Gates Corporation Tensioner
CN114728367B (zh) * 2019-11-05 2023-09-19 崇德超声波有限公司 利用接合偶定位检测的超声波焊接装置

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1473400A1 (de) * 1962-05-23 1969-01-09 Deutsch Pruef Messgeraete Verfahren und Vorrichtung zur zerstoerungsfreien Pruefung von Punkt- und anderen Pressschweissungen
US3697837A (en) 1970-10-05 1972-10-10 Gen Electric Electromagnetic force system for integrated circuit fabrication
US3890831A (en) * 1973-01-19 1975-06-24 Us Navy Ultrasonic bond monitor
FR2302172A1 (fr) 1975-02-27 1976-09-24 Podselver Michel Perfectionnements aux appareils de soudage avec pression
US4746051A (en) * 1982-12-08 1988-05-24 General Motors Corporation Ultrasonic welding control
DE3335254A1 (de) * 1983-09-29 1985-04-18 Schunk Ultraschalltechnik Gmbh, 8750 Aschaffenburg Vorrichtung zum verbinden bzw. verdichten elektrischer leiter
US4631685A (en) * 1984-12-07 1986-12-23 General Motors Corporation Method and apparatus for ultrasonic plastic forming and joining
EP0208310B1 (de) * 1985-07-12 1990-01-03 Siemens Aktiengesellschaft Verfahren zum Regeln des Prozessverlaufes und zur Qualitätskontrolle beim Ultraschallschweissen von Werkstücken
DE3719083C2 (de) 1987-06-06 1994-04-28 Stapla Ultraschalltechnik Gmbh Verfahren zum Verbinden elektrischer Leiter und Vorrichtung zur Durchführung des Verfahrens
DE4335108C1 (de) * 1993-10-14 1995-01-05 Schunk Ultraschalltechnik Gmbh Verfahren und Vorrichtung zum Kompaktieren und anschließenden Schweißen von elektrischen Leitern
EP0701876B1 (de) 1994-08-22 1998-04-15 SCHUNK Ultraschalltechnik GmbH Verfahren zum Kompaktieren und anschliessenden Schweissen von elektrischen Leitern
DE4429684A1 (de) * 1994-08-22 1996-02-29 Schunk Ultraschalltechnik Gmbh Verfahren zum Kompaktieren und anschließenden Schweißen von elektrischen Leitern
US6393924B1 (en) * 1997-11-10 2002-05-28 Schunk Ultraschalltechnik Gmbh Testing method for non-destructive testing of a welded connector, a testing device and an ultrasonic welding apparatus having such a device

Also Published As

Publication number Publication date
MXPA06004855A (es) 2006-07-06
WO2005042202A1 (de) 2005-05-12
US7600665B2 (en) 2009-10-13
JP2007509758A (ja) 2007-04-19
BRPI0415993A (pt) 2007-01-09
PT1677942E (pt) 2010-03-17
EP1677942A1 (de) 2006-07-12
ATE451998T1 (de) 2010-01-15
US20060283912A1 (en) 2006-12-21
PL1677942T3 (pl) 2010-05-31
BRPI0415993B1 (pt) 2013-04-16
KR20060102558A (ko) 2006-09-27
EP1677942B1 (de) 2009-12-16
JP5142527B2 (ja) 2013-02-13

Similar Documents

Publication Publication Date Title
DE502004010531D1 (de) Verfahren zum verschweissen von leitern
MX2015017811A (es) Metodo para producir un nodo por soldeo con la misma anchura para dos soldaduras.
KR20160005125A (ko) 초음파 용접 후에 노드의 압축 수준을 결정하기 위한 방법
EA201000916A1 (ru) Устройство и способ импульсного гидроразрыва
CN104955604A (zh) 在使用具有超声焊极的突起部和具有对应电极的凹进部的情况下用于焊接电导体的超声波焊接设备以及方法
MY156991A (en) Micro-crosslinked gels and associated methods
JP2016526488A5 (de)
ATE371489T1 (de) Verfahren und vorrichtung zum einbringen von ultraschall in ein fliessfähiges medium
MY147671A (en) Methods and apparatus to perform pressure testing of geological formations
ATE485506T1 (de) Verfahren zum prüfen eines produktionsmaterials in einem mikrowellenfeld
ATE507922T1 (de) Verbindung und verfahren zum verbinden eines aluminiumlitzenleiters mittels torsionalem ultraschallschweissen
CN104807702A (zh) 一种煤岩体水力压裂起裂行为的实验测试方法
ATE556472T1 (de) Verfahren zum reduzieren des anlegierens von aluminium sowie ultraschallschweissvorrichtung
DE60001921D1 (de) Verfahren und vorrichtung zum crimpen von elektrischen kunststoffverbundisolatoren
DE502004005513D1 (de) Verfahren und vorrichtung zum pressschweissen mit berücksichtigen der längenabweichungen der werkstücke
EP1679147A3 (de) Verfahren, Einrichtung und Hilfsmittel zum elektrischen Pressschweissen
DE102004022313B3 (de) Vorrichtung und Verfahren zum fluiddichten Dichtschweißen eines Rohrabschnittes
KR101814020B1 (ko) 변환젠더가 구비된 이방성 삼축 압축 상태 모사가 가능한 수압파쇄 성능 평가 실험장치 및 이를 이용한 원통형 시편의 수압파쇄 성능 평가 실험방법
DK1554638T3 (da) Fremgangsmåde til at overvåge og analysere en proces
ATE356452T1 (de) Vorrichtung zum verschweissen der adern von litzen
ATE515047T1 (de) Verfahren zum schweissen von kontaktplatten und nach diesem verfahren erhaltene kontaktelemente
ATE556177T1 (de) Verfahren und anordnung zum einbringen von langgestreckten profilen in einen baugrund
WO2003023687A3 (en) An advanced method for profile analysis of continuous data
DE602008001335D1 (de) Verfahren zur Erkennung von defekten Elektroden in einer Mikroelektrodenmatrix
DE50309419D1 (de) Verfahren zum elektrisch leitenden verbinden von lackierten drähten

Legal Events

Date Code Title Description
8364 No opposition during term of opposition