DE59305980D1 - Thermoelektrische heiz- oder kühlvorrichtung - Google Patents

Thermoelektrische heiz- oder kühlvorrichtung

Info

Publication number
DE59305980D1
DE59305980D1 DE59305980T DE59305980T DE59305980D1 DE 59305980 D1 DE59305980 D1 DE 59305980D1 DE 59305980 T DE59305980 T DE 59305980T DE 59305980 T DE59305980 T DE 59305980T DE 59305980 D1 DE59305980 D1 DE 59305980D1
Authority
DE
Germany
Prior art keywords
cooling device
thermoelectric heating
thermoelectric
heating
cooling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE59305980T
Other languages
English (en)
Inventor
Rolf Kessler
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Northrop Grumman Litef GmbH
Original Assignee
Litef GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Litef GmbH filed Critical Litef GmbH
Priority to DE59305980T priority Critical patent/DE59305980D1/de
Application granted granted Critical
Publication of DE59305980D1 publication Critical patent/DE59305980D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25BREFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00Machines, plants or systems, using electric or magnetic effects
    • F25B21/02Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
    • F25B21/04Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect reversible
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/17Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
DE59305980T 1992-09-22 1993-09-22 Thermoelektrische heiz- oder kühlvorrichtung Expired - Lifetime DE59305980D1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE59305980T DE59305980D1 (de) 1992-09-22 1993-09-22 Thermoelektrische heiz- oder kühlvorrichtung

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE4231702A DE4231702C2 (de) 1992-09-22 1992-09-22 Thermoelektrische, beheizbare Kühlkammer
PCT/EP1993/002571 WO1994007094A1 (de) 1992-09-22 1993-09-22 Thermoelektrische heiz- oder kühlvorrichtung
DE59305980T DE59305980D1 (de) 1992-09-22 1993-09-22 Thermoelektrische heiz- oder kühlvorrichtung

Publications (1)

Publication Number Publication Date
DE59305980D1 true DE59305980D1 (de) 1997-04-30

Family

ID=6468544

Family Applications (2)

Application Number Title Priority Date Filing Date
DE4231702A Expired - Fee Related DE4231702C2 (de) 1992-09-22 1992-09-22 Thermoelektrische, beheizbare Kühlkammer
DE59305980T Expired - Lifetime DE59305980D1 (de) 1992-09-22 1993-09-22 Thermoelektrische heiz- oder kühlvorrichtung

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE4231702A Expired - Fee Related DE4231702C2 (de) 1992-09-22 1992-09-22 Thermoelektrische, beheizbare Kühlkammer

Country Status (5)

Country Link
US (1) US5515683A (de)
EP (1) EP0662209B1 (de)
JP (1) JP2784266B2 (de)
DE (2) DE4231702C2 (de)
WO (1) WO1994007094A1 (de)

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US6054676A (en) * 1998-02-09 2000-04-25 Kryotech, Inc. Method and apparatus for cooling an integrated circuit device
US5931000A (en) * 1998-04-23 1999-08-03 Turner; William Evans Cooled electrical system for use downhole
US6134892A (en) * 1998-04-23 2000-10-24 Aps Technology, Inc. Cooled electrical system for use downhole
JP4080593B2 (ja) * 1998-05-11 2008-04-23 浜松ホトニクス株式会社 光センサ
US6086831A (en) * 1998-06-10 2000-07-11 Mettler-Toledo Bohdan, Inc. Modular reaction block assembly with thermoelectric cooling and heating
KR20000002270A (ko) * 1998-06-18 2000-01-15 김영환 펠티에 효과를 이용한 온도 제어 장치
US6864092B1 (en) 1998-08-13 2005-03-08 Symyx Technologies, Inc. Parallel reactor with internal sensing and method of using same
US6528026B2 (en) * 1998-08-13 2003-03-04 Symyx Technologies, Inc. Multi-temperature modular reactor and method of using same
US6455316B1 (en) 1998-08-13 2002-09-24 Symyx Technologies, Inc. Parallel reactor with internal sensing and method of using same
US6306658B1 (en) 1998-08-13 2001-10-23 Symyx Technologies Parallel reactor with internal sensing
US6548026B1 (en) 1998-08-13 2003-04-15 Symyx Technologies, Inc. Parallel reactor with internal sensing and method of using same
US6121539A (en) * 1998-08-27 2000-09-19 International Business Machines Corporation Thermoelectric devices and methods for making the same
JP2000274871A (ja) * 1999-03-19 2000-10-06 Matsushita Refrig Co Ltd 熱電装置、並びに、熱電マニホールド
US6994827B2 (en) * 2000-06-03 2006-02-07 Symyx Technologies, Inc. Parallel semicontinuous or continuous reactors
US6692708B2 (en) * 2001-04-05 2004-02-17 Symyx Technologies, Inc. Parallel reactor for sampling and conducting in situ flow-through reactions and a method of using same
WO2002101912A1 (fr) * 2001-06-07 2002-12-19 Kabushiki Kaisha Meidensha Dispositif a effet thermoelectrique, systeme direct de conversion d'energie, et systeme de conversion d'energie
US6715299B2 (en) * 2001-10-19 2004-04-06 Samsung Electronics Co., Ltd. Refrigerator for cosmetics and method of controlling the same
US6581388B2 (en) * 2001-11-27 2003-06-24 Sun Microsystems, Inc. Active temperature gradient reducer
JP4261890B2 (ja) * 2002-12-06 2009-04-30 義臣 近藤 熱電効果装置,エネルギー直接変換システム,エネルギー変換システム
US7932459B2 (en) * 2004-11-16 2011-04-26 Meidensha Corporation Thermal energy transfer circuit system
US7378288B2 (en) * 2005-01-11 2008-05-27 Semileds Corporation Systems and methods for producing light emitting diode array
US20060179849A1 (en) * 2005-02-14 2006-08-17 Abramov Vladimir S Peltier based heat transfer systems
DE102006050055A1 (de) 2006-10-24 2008-04-30 BSH Bosch und Siemens Hausgeräte GmbH Heizvorrichtung mit zumindest zwei in Reihe geschalteten thermoelektrischen Modulen
DE102008023299A1 (de) * 2008-05-08 2009-11-19 Micropelt Gmbh Aufnahme für eine Probe
US8637794B2 (en) 2009-10-21 2014-01-28 Lam Research Corporation Heating plate with planar heating zones for semiconductor processing
WO2011081645A2 (en) 2009-12-15 2011-07-07 Lam Research Corporation Adjusting substrate temperature to improve cd uniformity
US8791392B2 (en) 2010-10-22 2014-07-29 Lam Research Corporation Methods of fault detection for multiplexed heater array
JP5643600B2 (ja) * 2010-10-27 2014-12-17 アズビル株式会社 鏡面冷却式センサ
JP5643603B2 (ja) * 2010-10-27 2014-12-17 アズビル株式会社 鏡面冷却式センサ
JP5643601B2 (ja) * 2010-10-27 2014-12-17 アズビル株式会社 鏡面冷却式センサ
US8546732B2 (en) 2010-11-10 2013-10-01 Lam Research Corporation Heating plate with planar heater zones for semiconductor processing
US9307578B2 (en) 2011-08-17 2016-04-05 Lam Research Corporation System and method for monitoring temperatures of and controlling multiplexed heater array
US10388493B2 (en) 2011-09-16 2019-08-20 Lam Research Corporation Component of a substrate support assembly producing localized magnetic fields
US8624168B2 (en) 2011-09-20 2014-01-07 Lam Research Corporation Heating plate with diode planar heater zones for semiconductor processing
US8461674B2 (en) * 2011-09-21 2013-06-11 Lam Research Corporation Thermal plate with planar thermal zones for semiconductor processing
TWI448653B (zh) 2011-12-19 2014-08-11 Univ Nat Pingtung Sci & Tech 具有致熱及致冷之裝置
US9324589B2 (en) 2012-02-28 2016-04-26 Lam Research Corporation Multiplexed heater array using AC drive for semiconductor processing
US8809747B2 (en) 2012-04-13 2014-08-19 Lam Research Corporation Current peak spreading schemes for multiplexed heated array
US10049948B2 (en) 2012-11-30 2018-08-14 Lam Research Corporation Power switching system for ESC with array of thermal control elements
US20140356985A1 (en) 2013-06-03 2014-12-04 Lam Research Corporation Temperature controlled substrate support assembly
US9543171B2 (en) 2014-06-17 2017-01-10 Lam Research Corporation Auto-correction of malfunctioning thermal control element in a temperature control plate of a semiconductor substrate support assembly that includes deactivating the malfunctioning thermal control element and modifying a power level of at least one functioning thermal control element
BE1022871B1 (nl) * 2015-03-13 2016-09-29 Integrate (BVBA) Actief isolatiepaneel
JP6108583B1 (ja) * 2015-03-17 2017-04-05 大韓民国(国立水産科学院)Republic Of Korea(National Fisheries Research And Development Institute) 複数のペルチェ素子を利用した観賞魚用水槽及び飼育水温調節方法
CN105584921B (zh) * 2016-02-29 2017-12-22 广州广日电梯工业有限公司 一种电梯节能系统
JP6145541B1 (ja) * 2016-06-23 2017-06-14 九州電力株式会社 給湯器
US10147862B2 (en) * 2016-08-08 2018-12-04 Denso Corporation Electronic control device
WO2019236340A1 (en) * 2018-06-04 2019-12-12 Breakthrough Technologies, LLC Energy recovery from waste heat
CN109283172B (zh) * 2018-11-23 2021-05-11 大连航创科技有限公司 一种小型化no气体检测装置

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US2978875A (en) * 1960-01-04 1961-04-11 Westinghouse Electric Corp Plural-stage thermoelectric heat pump
US2998707A (en) * 1960-03-22 1961-09-05 Westinghouse Electric Corp Control apparatus and method for heat pumps
US3088288A (en) * 1960-12-21 1963-05-07 Thore M Elfving Thermoelectric refrigeration system
US3091939A (en) * 1961-10-02 1963-06-04 Allis Chalmers Mfg Co Thermoelectric cooler circuit with thermal electric feed-back arrangement
US3125860A (en) * 1962-07-12 1964-03-24 Thermoelectric cooling system
US3195344A (en) * 1963-01-28 1965-07-20 Cambridge Systems Inc Dewpoint measuring system
DE1817058B2 (de) * 1968-12-20 1971-09-02 Siemens AG, 1000 Berlin u 8000 München Schaltungsanordnung zur steuerung oder regelung einer peltier waermepumpe
US3934758A (en) * 1974-03-14 1976-01-27 Kipp Frederick M Refrigerated beverage dispenser-mixer
JPS5763290A (en) * 1980-10-02 1982-04-16 Mitsubishi Paper Mills Ltd Spot heat-sensitive paper
JPS6174885A (ja) * 1984-09-19 1986-04-17 Oji Paper Co Ltd 2色発色型感熱記録紙
US4708947A (en) * 1985-01-10 1987-11-24 Kuraray Co., Ltd. Water resistant composition and heat-sensitive recording sheet containing the same
US4671070A (en) * 1985-10-18 1987-06-09 The Coca-Cola Company Microgravity beverage can cooler
US4833889A (en) * 1988-06-17 1989-05-30 Microluminetics Thermoelectric refrigeration apparatus
JPH0321489A (ja) * 1989-06-20 1991-01-30 Fuji Photo Film Co Ltd 感熱記録材料
JP2988945B2 (ja) * 1989-10-27 1999-12-13 三井化学株式会社 感熱記録材料
GB2241378A (en) * 1990-02-27 1991-08-28 Robert Forsyth Portable electronic air-conditioner
JPH0489281A (ja) * 1990-07-31 1992-03-23 Kanzaki Paper Mfg Co Ltd 感熱記録体
JPH04175187A (ja) * 1990-11-09 1992-06-23 Oji Paper Co Ltd 感熱記録体
JPH04257490A (ja) * 1991-02-12 1992-09-11 Sanyo Chem Ind Ltd 感熱記録用増感剤および感熱記録用材料

Also Published As

Publication number Publication date
JP2784266B2 (ja) 1998-08-06
US5515683A (en) 1996-05-14
EP0662209B1 (de) 1997-03-26
EP0662209A1 (de) 1995-07-12
DE4231702C2 (de) 1995-05-24
WO1994007094A1 (de) 1994-03-31
JPH08501658A (ja) 1996-02-20
DE4231702A1 (de) 1994-03-24

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