DE60000863D1 - Filterstrukturen für schnittstellen zwischen integrierten schaltungen - Google Patents
Filterstrukturen für schnittstellen zwischen integrierten schaltungenInfo
- Publication number
- DE60000863D1 DE60000863D1 DE60000863T DE60000863T DE60000863D1 DE 60000863 D1 DE60000863 D1 DE 60000863D1 DE 60000863 T DE60000863 T DE 60000863T DE 60000863 T DE60000863 T DE 60000863T DE 60000863 D1 DE60000863 D1 DE 60000863D1
- Authority
- DE
- Germany
- Prior art keywords
- interfaces
- integrated circuits
- filter structures
- structures
- filter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
- H03H7/01—Frequency selective two-port networks
- H03H7/0115—Frequency selective two-port networks comprising only inductors and capacitors
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
- H03H7/38—Impedance-matching networks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
- H05K1/0233—Filters, inductors or a magnetic substance
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
- H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/30107—Inductance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H1/00—Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network
- H03H2001/0021—Constructional details
- H03H2001/0085—Multilayer, e.g. LTCC, HTCC, green sheets
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
- H05K1/0231—Capacitors or dielectric substances
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
- H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
- H05K1/113—Via provided in pad; Pad over filled via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09218—Conductive traces
- H05K2201/09263—Meander
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/09454—Inner lands, i.e. lands around via or plated through-hole in internal layer of multilayer PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09672—Superposed layout, i.e. in different planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09727—Varying width along a single conductor; Conductors or pads having different widths
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Power Engineering (AREA)
- Filters And Equalizers (AREA)
- Semiconductor Integrated Circuits (AREA)
- Lead Frames For Integrated Circuits (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/258,184 US6208225B1 (en) | 1999-02-25 | 1999-02-25 | Filter structures for integrated circuit interfaces |
PCT/US2000/004858 WO2000051232A1 (en) | 1999-02-25 | 2000-02-23 | Filter structures for integrated circuit interfaces |
Publications (2)
Publication Number | Publication Date |
---|---|
DE60000863D1 true DE60000863D1 (de) | 2003-01-09 |
DE60000863T2 DE60000863T2 (de) | 2003-07-17 |
Family
ID=22979461
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60040562T Expired - Lifetime DE60040562D1 (de) | 1999-02-25 | 2000-02-23 | Filterstrukturen für Schnittstellen zwischen integrierten Schaltungen |
DE60000863T Expired - Lifetime DE60000863T2 (de) | 1999-02-25 | 2000-02-23 | Filterstrukturen für schnittstellen zwischen integrierten schaltungen |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60040562T Expired - Lifetime DE60040562D1 (de) | 1999-02-25 | 2000-02-23 | Filterstrukturen für Schnittstellen zwischen integrierten Schaltungen |
Country Status (8)
Country | Link |
---|---|
US (2) | US6208225B1 (de) |
EP (2) | EP1263136B1 (de) |
JP (2) | JP2002538609A (de) |
KR (1) | KR100638755B1 (de) |
AU (1) | AU3007700A (de) |
DE (2) | DE60040562D1 (de) |
TW (1) | TWI228965B (de) |
WO (1) | WO2000051232A1 (de) |
Families Citing this family (87)
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US6018448A (en) * | 1997-04-08 | 2000-01-25 | X2Y Attenuators, L.L.C. | Paired multi-layered dielectric independent passive component architecture resulting in differential and common mode filtering with surge protection in one integrated package |
US7301748B2 (en) | 1997-04-08 | 2007-11-27 | Anthony Anthony A | Universal energy conditioning interposer with circuit architecture |
US9054094B2 (en) | 1997-04-08 | 2015-06-09 | X2Y Attenuators, Llc | Energy conditioning circuit arrangement for integrated circuit |
US7336468B2 (en) | 1997-04-08 | 2008-02-26 | X2Y Attenuators, Llc | Arrangement for energy conditioning |
US7321485B2 (en) | 1997-04-08 | 2008-01-22 | X2Y Attenuators, Llc | Arrangement for energy conditioning |
US6034533A (en) * | 1997-06-10 | 2000-03-07 | Tervo; Paul A. | Low-current pogo probe card |
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US6218910B1 (en) * | 1999-02-25 | 2001-04-17 | Formfactor, Inc. | High bandwidth passive integrated circuit tester probe card assembly |
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JP2001202400A (ja) * | 2000-01-21 | 2001-07-27 | Nec Corp | 電源デカップリング回路生成システム及び電源デカップリング回路生成方法 |
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US7531077B2 (en) | 2003-02-04 | 2009-05-12 | Microfabrica Inc. | Electrochemical fabrication process for forming multilayer multimaterial microprobe structures |
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US9244101B2 (en) * | 2003-02-04 | 2016-01-26 | University Of Southern California | Electrochemical fabrication process for forming multilayer multimaterial microprobe structures |
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US9671429B2 (en) | 2003-05-07 | 2017-06-06 | University Of Southern California | Multi-layer, multi-material micro-scale and millimeter-scale devices with enhanced electrical and/or mechanical properties |
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FR2860316B1 (fr) * | 2003-09-26 | 2006-05-19 | Cit Alcatel | Systeme de connexion de type bus, notamment pour fond de panier |
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US8067997B2 (en) * | 2005-11-10 | 2011-11-29 | The Arizona Board Of Regents On Behalf Of The University Of Arizona | Apparatus and method of selecting components for a reconfigurable impedance match circuit |
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US9646947B2 (en) * | 2009-12-22 | 2017-05-09 | Lenovo Enterprise Solutions (Singapore) Pte. Ltd. | Integrated circuit with inductive bond wires |
JP6128756B2 (ja) * | 2012-05-30 | 2017-05-17 | キヤノン株式会社 | 半導体パッケージ、積層型半導体パッケージ及びプリント回路板 |
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-
1999
- 1999-02-25 US US09/258,184 patent/US6208225B1/en not_active Expired - Fee Related
-
2000
- 2000-02-22 TW TW089103016A patent/TWI228965B/zh not_active IP Right Cessation
- 2000-02-23 EP EP02010250A patent/EP1263136B1/de not_active Expired - Lifetime
- 2000-02-23 DE DE60040562T patent/DE60040562D1/de not_active Expired - Lifetime
- 2000-02-23 WO PCT/US2000/004858 patent/WO2000051232A1/en active IP Right Grant
- 2000-02-23 KR KR1020017010807A patent/KR100638755B1/ko not_active IP Right Cessation
- 2000-02-23 JP JP2000601733A patent/JP2002538609A/ja active Pending
- 2000-02-23 AU AU30077/00A patent/AU3007700A/en not_active Abandoned
- 2000-02-23 EP EP00908800A patent/EP1157459B1/de not_active Expired - Lifetime
- 2000-02-23 DE DE60000863T patent/DE60000863T2/de not_active Expired - Lifetime
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2001
- 2001-03-23 US US09/816,889 patent/US6606014B2/en not_active Expired - Fee Related
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2007
- 2007-02-22 JP JP2007043027A patent/JP2007173858A/ja active Pending
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US20010054938A1 (en) | 2001-12-27 |
DE60040562D1 (de) | 2008-11-27 |
EP1263136B1 (de) | 2008-10-15 |
TWI228965B (en) | 2005-03-01 |
EP1263136A3 (de) | 2003-05-07 |
KR100638755B1 (ko) | 2006-10-26 |
KR20010104352A (ko) | 2001-11-24 |
EP1263136A2 (de) | 2002-12-04 |
US6208225B1 (en) | 2001-03-27 |
WO2000051232A1 (en) | 2000-08-31 |
US6606014B2 (en) | 2003-08-12 |
EP1157459A1 (de) | 2001-11-28 |
EP1157459B1 (de) | 2002-11-27 |
DE60000863T2 (de) | 2003-07-17 |
JP2002538609A (ja) | 2002-11-12 |
AU3007700A (en) | 2000-09-14 |
JP2007173858A (ja) | 2007-07-05 |
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